NC7NP34K8X

TinyLogic ULP-A Triple Buffer NC7NP34 The NC7NP34 is a triple buffer in tiny footprint packages. The device is designed to operate for VCC = 0.9 V to 3.6 V. www.onsemi.com Features • • • • • • • Designed for 0.9 V to 3.6 V VCC Operation 2.7 ns tPD at 3.3 V (Typ) Inputs/Outputs Over−Voltage Tolerant up to 3.6 V IOFF Supports Partial Power Down Protection Source/Sink 2.6 mA at 3.3 V Available in US8 and MicroPak™ Packages These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS Compliant A1 1 8 VCC Y3 2 7 Y1 A2 3 6 A3 GND 4 5 Y2 Y3 6 A1 7 GND 4 2 A3 3 Y2 UQFN8 US8 CCKK XYZ XXXX ALYW A2 5 VCC 8 1 Y1 MARKING DIAGRAMS CC,XXX KK XY Z A L YW Figure 1. Pinout Diagrams (Top Views) A1 1 Y1 A2 1 Y2 A3 1 Y3 = Specific Device Code = 2−Digit Date Code Traceability Code = 2−Digit Date Code Format = Assembly Plant Code = Assembly Site = Wafer Lot Number = Assembly Start Week ORDERING INFORMATION See detailed ordering, marking and shipping information on page 6 of this data sheet. Figure 2. Logic Symbol PIN ASSIGNMENT FUNCTION TABLE Pin US8 UQFN8 A Input Y Output 1 A1 Y1 L L 2 Y3 A3 H H 3 A2 Y2 4 GND GND 5 Y2 A2 6 A3 Y3 7 Y1 A1 8 VCC VCC © Semiconductor Components Industries, LLC, 2005 February, 2021 − Rev. 1 1 Publication Order Number: NC7NP34/D NC7NP34 MAXIMUM RATINGS Symbol Value Unit VCC DC Supply Voltage −0.5 to +4.3 V VIN DC Input Voltage −0.5 to +4.3 V −0.5 to VCC + 0.5 −0.5 to +4.3 −0.5 to +4.3 V VIN < GND −50 mA VOUT < GND −50 mA VOUT Characteristics DC Output Voltage Active−Mode (High or Low State) Tri−State Mode (Note 1) Power−Down Mode (VCC = 0 V) IIK DC Input Diode Current IOK DC Output Diode Current IOUT DC Output Source/Sink Current ±50 mA DC Supply Current per Supply Pin or Ground Pin ±50 mA ICC or IGND TSTG −65 to +150 °C TL Storage Temperature Range Lead Temperature, 1 mm from Case for 10 Seconds 260 °C TJ Junction Temperature Under Bias +150 °C qJA Thermal Resistance (Note 2) US8 MicroPak 250 210 °C/W PD Power Dissipation in Still Air US8 MicroPak 500 595 mW Level 1 − MSL Moisture Sensitivity FR Flammability Rating Oxygen Index: 28 to 34 UL 94 V−0 @ 0.125 in − ESD Withstand Voltage (Note 3) Human Body Model Charged Device Model 2000 1000 V ±100 mA VESD ILatchup Latchup Performance (Note 4) Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality should not be assumed, damage may occur and reliability may be affected. 1. Applicable to devices with outputs that may be tri−stated. 2. Measured with minimum pad spacing on an FR4 board, using 10 mm−by−1 inch, 2 ounce copper trace no air flow per JESD51−7. 3. HBM tested to EIA / JESD22−A114−A. CDM tested to JESD22−C101−A. JEDEC recommends that ESD qualification to EIA/JESD22−A115A (Machine Model) be discontinued. 4. Tested to EIA/JESD78 Class II. RECOMMENDED OPERATING CONDITIONS Symbol Parameter VCC Positive DC Supply Voltage VIN DC Input Voltage VOUT TA tr , tf DC Output Voltage Active−Mode (High or Low State) Tri−State Mode (Note 1) Power−Down Mode (VCC = 0 V) Operating Temperature Range Input Transition Rise and Fall Time VCC = 3.3 V ± 0.3 V Min Max Unit 0.9 3.6 V 0 3.6 V 0 0 0 VCC 3.6 3.6 −40 +85 °C 0 10 ns/V Functional operation above the stresses listed in the Recommended Operating Ranges is not implied. Extended exposure to stresses beyond the Recommended Operating Ranges limits may affect device reliability. www.onsemi.com 2 NC7NP34 DC ELECTRICAL CHARACTERISTICS TA = 255C Symbol VIH VIL VOH VOL Parameter Condition High−Level Input Voltage Low−Level Input Voltage High−Level Output Voltage Low−Level Output Voltage TA = −405C to +855C Min Typ Max Min Max 0.9 − 0.5 Unit − − − V 1.1 to 1.3 0.65 x VCC − − 0.65 x VCC − 0.65 x VCC − − 0.65 x VCC − 1.65 to 1.95 0.65 x VCC 1.4 to 1.6 − − 0.65 x VCC − VCC (V) 2.3 to 2.7 1.6 − − 1.6 − 3.0 to 3.6 2.1 − − 2.1 − 0.9 − 0.5 − − − 1.1 to 1.3 − − 0.35 x VCC − 0.35 x VCC 1.4 to 1.6 − − 0.35 x VCC − 0.35 x VCC 1.65 to 1.95 − − 0.35 x VCC − 0.35 x VCC 2.3 to 2.7 − − 0.7 − 0.7 3.0 to 3.6 − − 0.9 − 0.9 0.9 − VCC − 0.1 − − − 1.1 to 1.3 VCC − 0.1 − − VCC − 0.1 − 1.4 to 1.6 VCC − 0.1 − − VCC − 0.1 − 1.65 to 1.95 VCC − 0.1 − − VCC − 0.1 − 2.3 to 2.7 VCC − 0.1 − − VCC − 0.1 − VIN = VIH or VIL IOH = −20 mA V V 3.0 to 3.6 VCC − 0.1 − − VCC − 0.1 − IOH = −0.5 mA 1.1 to 1.3 0.75 x VCC − − 0.70 x VCC − IOH = −1 mA 1.4 to 1.6 1.07 − − 0.99 − IOH = −1.5 mA 1.65 to 1.95 1.24 − − 1.22 − IOH = −2.1 mA 2.3 to 2.7 1.95 − − 1.87 − IOH = −2.6 mA 3.0 to 3.6 2.61 − − 2.55 − VIN = VIH or VIL V 0.9 − 0.1 − − − 1.1 to 1.3 − − 0.1 − 0.1 1.4 to 1.6 − − 0.1 − 0.1 1.65 to 1.95 − − 0.1 − 0.1 2.3 to 2.7 − − 0.1 − 0.1 3.0 to 3.6 − − 0.1 − 0.1 IOL = 0.5 mA 1.1 to 1.3 − − 0.3 x VCC − 0.3 x VCC IOL = 1 mA 1.4 to 1.6 − − 0.31 − 0.37 IOL = 1.5 mA 1.65 to 1.95 − − 0.31 − 0.35 IOL = 2.1 mA 2.3 to 2.7 − − 0.31 − 0.33 IOL = 2.6 mA 3.0 to 3.6 − − 0.31 − 0.33 Input Leakage Current VIN = 0 V to 3.6 V 0.9 to 3.6 − − ±0.1 − ±0.5 mA IOFF Power Off Leakage Current VIN = 0 V to 3.6 V or VOUT = 0 V to 3.6 V 0 − − 0.5 − 0.5 mA ICC Quiescent Supply Current VIN = VCC or GND 0.9 to 3.6 − − 0.9 − 0.9 mA IIN IOL = 20 mA Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product performance may not be indicated by the Electrical Characteristics if operated under different conditions. www.onsemi.com 3 NC7NP34 ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎ ÎÎÎÎÎÎÎ ÎÎÎÎÎÎ ÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎ ÎÎÎÎÎÎ ÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎ ÎÎÎÎÎÎ AC ELECTRICAL CHARACTERISTICS TA = 25°C Symbol Parameter tPLH, tPHL Propagation Delay, A to Y (Figures 3 and 4) tPLH, tPHL Propagation Delay, A to Y (Figures 3 and 4) tPLH, tPHL Propagation Delay, A to Y (Figures 3 and 4) Condition VCC (V) Min Typ RL = 1 MW, CL = 10 pF TA = −405C to +855C Max Min Max Unit ns 0.9 − 45.0 − − − 1.10 to 1.30 − 11.9 25.9 − 34.3 1.40 to 1.60 − 6.2 14.8 − 15.0 1.65 to 1.95 − 4.4 12.0 − 12.2 2.3 to 2.7 − 3.3 9.4 − 9.9 3.0 to 3.6 − 2.7 8.3 − 9.0 0.9 − 46.6 − − − 1.10 to 1.30 − 12.5 27.3 − 37.3 1.40 to 1.60 − 6.7 15.5 − 16.5 1.65 to 1.95 − 4.8 12.6 − 13.6 2.3 to 2.7 − 3.5 9.9 − 10.8 3.0 to 3.6 − 2.9 8.7 − 9.5 0.9 − 51.3 − − − 1.10 to 1.30 − 14.5 31.6 − 46.3 1.40 to 1.60 − 8.2 17.8 − 18.2 1.65 to 1.95 − 5.9 14.4 − 15.9 2.3 to 2.7 − 4.2 11.3 − 12.8 3.0 to 3.6 − 3.4 9.2 − 10.7 RL = 1 MW, CL = 15 pF RL = 1 MW, CL = 30 pF ns ns CAPACITIVE CHARACTERISTICS Symbol CIN Parameter Test Condition Typical (TA = 25°C) Unit Input Capacitance VCC = 0 V 2.0 pF COUT Output Capacitance VCC = 0 V 4.0 pF CPD Power Dissipation Capacitance (Note 5) f = 10 MHz, VCC = 0.9 to 3.6 V, VIN = 0 V or VCC 6.0 pF 5. CPD is defined as the value of the internal equivalent capacitance which is calculated from the operating current consumption without load. Average operating current can be obtained by the equation ICC(OPR) = CPD  VCC  fin + ICC. CPD is used to determine the no−load dynamic power consumption: PD = CPD  VCC2  fin + ICC  VCC. www.onsemi.com 4 NC7NP34 OPEN 2 x VCC GND R1 INPUT OUTPUT DUT RL RT Test Switch Position tPLH / tPHL Open tPLZ / tPZL 2 x VCC tPHZ / tPZH GND CL * CL includes probe and jig capacitance RT is ZOUT of pulse generator (typically 50 W) f = 1 MHz Figure 3. Test Circuit tr = 3 ns tf = 3 ns 90% 90% Vmi INPUT Vmi INPUT Vmi 10% 10% tPHL Vmi GND GND tPZL tPLH Vmo OUTPUT VCC VCC tPLZ VOH Vmo OUTPUT Vmo VOL + VY VOL VOL tPLH tPHL Vmo OUTPUT tPZH VOH Vmo ~VCC tPHZ VOH VOH − VY Vmo OUTPUT VOL ~0 V VCC, V Vmi, V Vmo, V VY, V 0.9 VCC / 2 VCC / 2 0.1 1.1 to 1.3 VCC / 2 VCC / 2 0.1 1.4 to 1.6 VCC / 2 VCC / 2 0.1 1.65 to 1.95 VCC / 2 VCC / 2 0.15 2.3 to 2.7 VCC / 2 VCC / 2 0.15 3.0 to 3.6 1.5 1.5 0.3 Figure 4. Switching Waveforms www.onsemi.com 5 NC7NP34 ORDERING INFORMATION Package Marking Pin 1 Orientation (See below) Shipping† NC7NP34K8X US8 NP34 Q4 3000 / Tape & Reel NC7NP34L8X MicroPak, UQFN8 X7 Q4 5000 / Tape & Reel Device †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. Pin 1 Orientation in Tape and Reel MicroPak is trademark of Semiconductor Components Industries, LLC (SCILLC) or its subsidiaries in the United States and/or other countries. www.onsemi.com 6 MECHANICAL CASE OUTLINE PACKAGE DIMENSIONS UQFN8 1.6X1.6, 0.5P CASE 523AY ISSUE O 0.05 C A 1.60 DATE 31 AUG 2016 0.40 (6X) 1.60 B 0.45 (2X) 2X 1.60 TOP VIEW PIN#1 IDENT 0.05 1.61 C 0.50 RECOMMENDED LAND PATTERN 0.50±0.05 0.05 C 0.05 C 0.25 (8X) NOTES: SEATING PLANE 0.025±0.025 A. PACKAGE CONFORMS TO JEDEC MO−255 VARIATION UAAD. C B. DIMENSIONS ARE IN MILLIMETERS. SIDE VIEW C. DIMENSIONS AND TOLERANCES PER ASME Y14.5M, 2009. 1.60±0.05 (0.10) D. LAND PATTERN RECOMMENDATION IS EXISTING INDUSTRY LAND PATTERN. (0.20)3X DETAIL A 1 2 3 (0.20) (0.09) 4 8 1.60±0.05 0.30±0.05 0.30±0.05 (7X) 7 6 5 0.50 1.00±0.05 (0.15) 0.20±0.05 (8X) BOTTOM VIEW DOCUMENT NUMBER: DESCRIPTION: 98AON13591G UQFN8 1.6X1.6, 0.5P 0.30±0.05 0.10 C 0.05 C A B DETAIL A SCALE : 2X Electronic versions are uncontrolled except when accessed directly from the Document Repository. Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red. PAGE 1 OF 1 ON Semiconductor and are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries. ON Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. ON Semiconductor does not convey any license under its patent rights nor the rights of others. © Semiconductor Components Industries, LLC, 2019 www.onsemi.com MECHANICAL CASE OUTLINE PACKAGE DIMENSIONS US8 CASE 846AN ISSUE O DOCUMENT NUMBER: DESCRIPTION: 98AON13778G US8 DATE 31 DEC 2016 Electronic versions are uncontrolled except when accessed directly from the Document Repository. Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red. PAGE 1 OF 1 ON Semiconductor and are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries. ON Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. 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