TinyLogic ULP-A Triple
Buffer
NC7NP34
The NC7NP34 is a triple buffer in tiny footprint packages.
The device is designed to operate for VCC = 0.9 V to 3.6 V.
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Features
•
•
•
•
•
•
•
Designed for 0.9 V to 3.6 V VCC Operation
2.7 ns tPD at 3.3 V (Typ)
Inputs/Outputs Over−Voltage Tolerant up to 3.6 V
IOFF Supports Partial Power Down Protection
Source/Sink 2.6 mA at 3.3 V
Available in US8 and MicroPak™ Packages
These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS
Compliant
A1 1
8 VCC
Y3 2
7 Y1
A2 3
6 A3
GND 4
5 Y2
Y3
6
A1
7
GND
4
2
A3
3
Y2
UQFN8
US8
CCKK
XYZ
XXXX
ALYW
A2
5
VCC
8
1
Y1
MARKING
DIAGRAMS
CC,XXX
KK
XY
Z
A
L
YW
Figure 1. Pinout Diagrams (Top Views)
A1
1
Y1
A2
1
Y2
A3
1
Y3
= Specific Device Code
= 2−Digit Date Code Traceability Code
= 2−Digit Date Code Format
= Assembly Plant Code
= Assembly Site
= Wafer Lot Number
= Assembly Start Week
ORDERING INFORMATION
See detailed ordering, marking and shipping information on
page 6 of this data sheet.
Figure 2. Logic Symbol
PIN ASSIGNMENT
FUNCTION TABLE
Pin
US8
UQFN8
A Input
Y Output
1
A1
Y1
L
L
2
Y3
A3
H
H
3
A2
Y2
4
GND
GND
5
Y2
A2
6
A3
Y3
7
Y1
A1
8
VCC
VCC
© Semiconductor Components Industries, LLC, 2005
February, 2021 − Rev. 1
1
Publication Order Number:
NC7NP34/D
NC7NP34
MAXIMUM RATINGS
Symbol
Value
Unit
VCC
DC Supply Voltage
−0.5 to +4.3
V
VIN
DC Input Voltage
−0.5 to +4.3
V
−0.5 to VCC + 0.5
−0.5 to +4.3
−0.5 to +4.3
V
VIN < GND
−50
mA
VOUT < GND
−50
mA
VOUT
Characteristics
DC Output Voltage
Active−Mode (High or Low State)
Tri−State Mode (Note 1)
Power−Down Mode (VCC = 0 V)
IIK
DC Input Diode Current
IOK
DC Output Diode Current
IOUT
DC Output Source/Sink Current
±50
mA
DC Supply Current per Supply Pin or Ground Pin
±50
mA
ICC or IGND
TSTG
−65 to +150
°C
TL
Storage Temperature Range
Lead Temperature, 1 mm from Case for 10 Seconds
260
°C
TJ
Junction Temperature Under Bias
+150
°C
qJA
Thermal Resistance (Note 2)
US8
MicroPak
250
210
°C/W
PD
Power Dissipation in Still Air
US8
MicroPak
500
595
mW
Level 1
−
MSL
Moisture Sensitivity
FR
Flammability Rating
Oxygen Index: 28 to 34
UL 94 V−0 @ 0.125 in
−
ESD Withstand Voltage (Note 3)
Human Body Model
Charged Device Model
2000
1000
V
±100
mA
VESD
ILatchup
Latchup Performance (Note 4)
Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality
should not be assumed, damage may occur and reliability may be affected.
1. Applicable to devices with outputs that may be tri−stated.
2. Measured with minimum pad spacing on an FR4 board, using 10 mm−by−1 inch, 2 ounce copper trace no air flow per JESD51−7.
3. HBM tested to EIA / JESD22−A114−A. CDM tested to JESD22−C101−A. JEDEC recommends that ESD qualification to EIA/JESD22−A115A
(Machine Model) be discontinued.
4. Tested to EIA/JESD78 Class II.
RECOMMENDED OPERATING CONDITIONS
Symbol
Parameter
VCC
Positive DC Supply Voltage
VIN
DC Input Voltage
VOUT
TA
tr , tf
DC Output Voltage
Active−Mode (High or Low State)
Tri−State Mode (Note 1)
Power−Down Mode (VCC = 0 V)
Operating Temperature Range
Input Transition Rise and Fall Time
VCC = 3.3 V ± 0.3 V
Min
Max
Unit
0.9
3.6
V
0
3.6
V
0
0
0
VCC
3.6
3.6
−40
+85
°C
0
10
ns/V
Functional operation above the stresses listed in the Recommended Operating Ranges is not implied. Extended exposure to stresses beyond
the Recommended Operating Ranges limits may affect device reliability.
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2
NC7NP34
DC ELECTRICAL CHARACTERISTICS
TA = 255C
Symbol
VIH
VIL
VOH
VOL
Parameter
Condition
High−Level Input
Voltage
Low−Level Input
Voltage
High−Level Output
Voltage
Low−Level Output
Voltage
TA = −405C to +855C
Min
Typ
Max
Min
Max
0.9
−
0.5
Unit
−
−
−
V
1.1 to 1.3
0.65 x VCC
−
−
0.65 x VCC
−
0.65 x VCC
−
−
0.65 x VCC
−
1.65 to 1.95 0.65 x VCC
1.4 to 1.6
−
−
0.65 x VCC
−
VCC (V)
2.3 to 2.7
1.6
−
−
1.6
−
3.0 to 3.6
2.1
−
−
2.1
−
0.9
−
0.5
−
−
−
1.1 to 1.3
−
−
0.35 x VCC
−
0.35 x VCC
1.4 to 1.6
−
−
0.35 x VCC
−
0.35 x VCC
1.65 to 1.95
−
−
0.35 x VCC
−
0.35 x VCC
2.3 to 2.7
−
−
0.7
−
0.7
3.0 to 3.6
−
−
0.9
−
0.9
0.9
−
VCC −
0.1
−
−
−
1.1 to 1.3
VCC − 0.1
−
−
VCC − 0.1
−
1.4 to 1.6
VCC − 0.1
−
−
VCC − 0.1
−
1.65 to 1.95
VCC − 0.1
−
−
VCC − 0.1
−
2.3 to 2.7
VCC − 0.1
−
−
VCC − 0.1
−
VIN = VIH or VIL
IOH = −20 mA
V
V
3.0 to 3.6
VCC − 0.1
−
−
VCC − 0.1
−
IOH = −0.5 mA
1.1 to 1.3
0.75 x VCC
−
−
0.70 x VCC
−
IOH = −1 mA
1.4 to 1.6
1.07
−
−
0.99
−
IOH = −1.5 mA
1.65 to 1.95
1.24
−
−
1.22
−
IOH = −2.1 mA
2.3 to 2.7
1.95
−
−
1.87
−
IOH = −2.6 mA
3.0 to 3.6
2.61
−
−
2.55
−
VIN = VIH or VIL
V
0.9
−
0.1
−
−
−
1.1 to 1.3
−
−
0.1
−
0.1
1.4 to 1.6
−
−
0.1
−
0.1
1.65 to 1.95
−
−
0.1
−
0.1
2.3 to 2.7
−
−
0.1
−
0.1
3.0 to 3.6
−
−
0.1
−
0.1
IOL = 0.5 mA
1.1 to 1.3
−
−
0.3 x VCC
−
0.3 x VCC
IOL = 1 mA
1.4 to 1.6
−
−
0.31
−
0.37
IOL = 1.5 mA
1.65 to 1.95
−
−
0.31
−
0.35
IOL = 2.1 mA
2.3 to 2.7
−
−
0.31
−
0.33
IOL = 2.6 mA
3.0 to 3.6
−
−
0.31
−
0.33
Input Leakage
Current
VIN = 0 V to 3.6 V
0.9 to 3.6
−
−
±0.1
−
±0.5
mA
IOFF
Power Off Leakage
Current
VIN = 0 V to 3.6 V or
VOUT = 0 V to 3.6 V
0
−
−
0.5
−
0.5
mA
ICC
Quiescent Supply
Current
VIN = VCC or GND
0.9 to 3.6
−
−
0.9
−
0.9
mA
IIN
IOL = 20 mA
Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product
performance may not be indicated by the Electrical Characteristics if operated under different conditions.
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3
NC7NP34
ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ
ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ
ÎÎÎÎ
ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ
ÎÎÎÎ
ÎÎÎÎÎÎÎ
ÎÎÎÎÎÎ
ÎÎÎ
ÎÎÎÎÎÎÎÎÎÎÎ
ÎÎÎÎÎÎÎÎÎÎÎÎÎÎ
ÎÎÎÎÎÎÎÎÎÎÎÎ
ÎÎÎÎÎÎÎÎ
ÎÎÎÎÎÎ
ÎÎÎÎÎÎ
ÎÎÎÎÎÎÎ
ÎÎÎÎÎÎÎ
ÎÎÎÎÎÎ
AC ELECTRICAL CHARACTERISTICS
TA = 25°C
Symbol
Parameter
tPLH, tPHL Propagation Delay,
A to Y
(Figures 3 and 4)
tPLH, tPHL Propagation Delay,
A to Y
(Figures 3 and 4)
tPLH, tPHL Propagation Delay,
A to Y
(Figures 3 and 4)
Condition
VCC (V)
Min
Typ
RL = 1 MW, CL = 10 pF
TA = −405C to +855C
Max
Min
Max
Unit
ns
0.9
−
45.0
−
−
−
1.10 to 1.30
−
11.9
25.9
−
34.3
1.40 to 1.60
−
6.2
14.8
−
15.0
1.65 to 1.95
−
4.4
12.0
−
12.2
2.3 to 2.7
−
3.3
9.4
−
9.9
3.0 to 3.6
−
2.7
8.3
−
9.0
0.9
−
46.6
−
−
−
1.10 to 1.30
−
12.5
27.3
−
37.3
1.40 to 1.60
−
6.7
15.5
−
16.5
1.65 to 1.95
−
4.8
12.6
−
13.6
2.3 to 2.7
−
3.5
9.9
−
10.8
3.0 to 3.6
−
2.9
8.7
−
9.5
0.9
−
51.3
−
−
−
1.10 to 1.30
−
14.5
31.6
−
46.3
1.40 to 1.60
−
8.2
17.8
−
18.2
1.65 to 1.95
−
5.9
14.4
−
15.9
2.3 to 2.7
−
4.2
11.3
−
12.8
3.0 to 3.6
−
3.4
9.2
−
10.7
RL = 1 MW, CL = 15 pF
RL = 1 MW, CL = 30 pF
ns
ns
CAPACITIVE CHARACTERISTICS
Symbol
CIN
Parameter
Test Condition
Typical (TA = 25°C)
Unit
Input Capacitance
VCC = 0 V
2.0
pF
COUT
Output Capacitance
VCC = 0 V
4.0
pF
CPD
Power Dissipation Capacitance (Note 5)
f = 10 MHz, VCC = 0.9 to 3.6 V, VIN = 0 V or VCC
6.0
pF
5. CPD is defined as the value of the internal equivalent capacitance which is calculated from the operating current consumption without load.
Average operating current can be obtained by the equation ICC(OPR) = CPD VCC fin + ICC. CPD is used to determine the no−load dynamic
power consumption: PD = CPD VCC2 fin + ICC VCC.
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4
NC7NP34
OPEN
2 x VCC
GND
R1
INPUT
OUTPUT
DUT
RL
RT
Test
Switch Position
tPLH / tPHL
Open
tPLZ / tPZL
2 x VCC
tPHZ / tPZH
GND
CL *
CL includes probe and jig capacitance
RT is ZOUT of pulse generator (typically 50 W)
f = 1 MHz
Figure 3. Test Circuit
tr = 3 ns
tf = 3 ns
90%
90%
Vmi
INPUT
Vmi
INPUT
Vmi
10%
10%
tPHL
Vmi
GND
GND
tPZL
tPLH
Vmo
OUTPUT
VCC
VCC
tPLZ
VOH
Vmo
OUTPUT
Vmo
VOL + VY
VOL
VOL
tPLH
tPHL
Vmo
OUTPUT
tPZH
VOH
Vmo
~VCC
tPHZ
VOH
VOH − VY
Vmo
OUTPUT
VOL
~0 V
VCC, V
Vmi, V
Vmo, V
VY, V
0.9
VCC / 2
VCC / 2
0.1
1.1 to 1.3
VCC / 2
VCC / 2
0.1
1.4 to 1.6
VCC / 2
VCC / 2
0.1
1.65 to 1.95
VCC / 2
VCC / 2
0.15
2.3 to 2.7
VCC / 2
VCC / 2
0.15
3.0 to 3.6
1.5
1.5
0.3
Figure 4. Switching Waveforms
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5
NC7NP34
ORDERING INFORMATION
Package
Marking
Pin 1 Orientation
(See below)
Shipping†
NC7NP34K8X
US8
NP34
Q4
3000 / Tape & Reel
NC7NP34L8X
MicroPak, UQFN8
X7
Q4
5000 / Tape & Reel
Device
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specifications Brochure, BRD8011/D.
Pin 1 Orientation in Tape and Reel
MicroPak is trademark of Semiconductor Components Industries, LLC (SCILLC) or its subsidiaries in the United States and/or other countries.
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6
MECHANICAL CASE OUTLINE
PACKAGE DIMENSIONS
UQFN8 1.6X1.6, 0.5P
CASE 523AY
ISSUE O
0.05
C
A
1.60
DATE 31 AUG 2016
0.40
(6X)
1.60
B
0.45
(2X)
2X
1.60
TOP VIEW
PIN#1 IDENT
0.05
1.61
C
0.50
RECOMMENDED
LAND PATTERN
0.50±0.05
0.05
C
0.05
C
0.25
(8X)
NOTES:
SEATING
PLANE
0.025±0.025
A. PACKAGE CONFORMS TO JEDEC MO−255
VARIATION UAAD.
C
B. DIMENSIONS ARE IN MILLIMETERS.
SIDE VIEW
C. DIMENSIONS AND TOLERANCES PER
ASME Y14.5M, 2009.
1.60±0.05
(0.10)
D. LAND PATTERN RECOMMENDATION IS
EXISTING INDUSTRY LAND PATTERN.
(0.20)3X
DETAIL A
1
2
3
(0.20)
(0.09)
4
8
1.60±0.05
0.30±0.05
0.30±0.05 (7X)
7
6
5
0.50
1.00±0.05
(0.15)
0.20±0.05 (8X)
BOTTOM VIEW
DOCUMENT NUMBER:
DESCRIPTION:
98AON13591G
UQFN8 1.6X1.6, 0.5P
0.30±0.05
0.10
C
0.05
C
A
B
DETAIL A
SCALE : 2X
Electronic versions are uncontrolled except when accessed directly from the Document Repository.
Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red.
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ON Semiconductor and
are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries.
ON Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regarding
the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically
disclaims any and all liability, including without limitation special, consequential or incidental damages. ON Semiconductor does not convey any license under its patent rights nor the
rights of others.
© Semiconductor Components Industries, LLC, 2019
www.onsemi.com
MECHANICAL CASE OUTLINE
PACKAGE DIMENSIONS
US8
CASE 846AN
ISSUE O
DOCUMENT NUMBER:
DESCRIPTION:
98AON13778G
US8
DATE 31 DEC 2016
Electronic versions are uncontrolled except when accessed directly from the Document Repository.
Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red.
PAGE 1 OF 1
ON Semiconductor and
are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries.
ON Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regarding
the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically
disclaims any and all liability, including without limitation special, consequential or incidental damages. ON Semiconductor does not convey any license under its patent rights nor the
rights of others.
© Semiconductor Components Industries, LLC, 2019
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, and other names, marks, and brands are registered and/or common law trademarks of Semiconductor Components Industries, LLC dba “onsemi” or its affiliates
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provided by onsemi. “Typical” parameters which may be provided in onsemi data sheets and/or specifications can and do vary in different applications and actual performance may
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