NCP3066, NCV3066
Constant Current Buck
Boost Inverting Switching
Regulator for HB-LEDs with
Enable
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1.5 A
The NCP3066 is a monolithic switching regulator designed to
deliver constant current for powering high brightness LEDs. The
device has a very low feedback voltage of 235 mV (nominal) which is
used to regulate the average current of the LED string. In addition, the
NCP3066 has a wide input voltage up to 40 V to allow it to operate
from a 12 Vac or a 12−36 Vdc supply, commonly used for lighting
applications as well as unregulated supplies such as rechargeable
batteries. The NCP3066 switching regulator can be configured in
Step−Down (Buck), Step−Up (Boost) and Voltage−Inverting
topologies with a minimum number of external components. The
ON/OFF pin provides PWM dimming capability or a low power
shutdown mode.
MARKING DIAGRAMS
3066
ALYWG
G
8
1
1
SOIC−8
D SUFFIX
CASE 751
NCP3066
AWL
YYWWG
Features
•
•
•
•
•
•
•
•
•
•
•
Integrated 1.5 A Switch
Input Voltage Range from 3.0 V to 40 V
Logic Level Shutdown Capability
Low Feedback Voltage of 235 mV
Cycle−by−Cycle Current Limit
No Control Loop Compensation Required
Frequency of Operation Adjustable up to 250 kHz
Analog and Digital PWM Dimming Capability
Internal Thermal Shutdown with Hysteresis
NCV Prefix for Automotive and Other Applications Requiring Site
and Control Changes
These are Pb−Free Devices
Applications
Rsense
VCC
Ç
Ç
Ç
Ç
SWC
Ipk
SWE
NCP3066
VCC
CIN
ÇÇ
ÇÇ
ÇÇ
ÇÇ
ON/OFF
COMP
DFN8
MN SUFFIX
CASE 488AF
L1
LED+
LED1
COUT
D1
CT
3066
ALYWG
G
1
PDIP−8
P, P1 SUFFIX
CASE 626
1
• Automotive and Marine Lighting
• Constant Current Source, High Brightness LED Driver
• Low Voltage and Landscape Lighting
ON/OFF
8
LEDn
GND
LED−
CT
NCP3066
A
L, WL
Y, YY
W, WW
G or G
=
=
=
=
=
=
Specific Device Code
Assembly Location
Wafer Lot
Year
Work Week
Pb−Free Package
(Note: Microdot may be in either location)
Rs
GND
ORDERING INFORMATION
See detailed ordering and shipping information in the package
dimensions section on page 17 of this data sheet.
Figure 1. Typical Buck Application Circuit
© Semiconductor Components Industries, LLC, 2009
August, 2019 − Rev. 4
1
Publication Order Number:
NCP3066/D
NCP3066, NCV3066
SOIC−8/PDIP−8
1
Switch Collector
Switch Emitter
2
DFN8
8
ON/OFF
7
Ipk Sense
Timing Capacitor
3
6
GND
4
5
ÇÇ
ÇÇ
ÇÇ
ÇÇ
Switch Collector
Switch Emitter
Timing Capacitor
VCC
GND
Comparator
Inverting
Input
(Top View)
NOTE:
Figure 2. Pin Connections
(Top View)
ON/OFF
Ipk Sense
VCC
Comparator
Inverting
Input
EP Flag must be tied to GND Pin 4 on PCB
Figure 3. Pin Connections
8
TSD
ON/OFF
ON/OFF
EP Flag
Ç
Ç
Ç
Ç
1
Switch Collector
Bias
R
S
7
Q
Comparator
−
+
Ipk Sense
S
R
2
Q
Switch Emitter
0.2 V
Oscillator
6
CT
3
Timing Capacitor
VCC
Comparator
0.235V
Reference
Regulator
+
−
5
4
GND
Comparator Inverting Input
Figure 4. Block Diagram
PIN DESCRIPTION
Pin No.
PDIP8
DFN8
Pin Name
1
1
Switch Collector
2
2
Switch Emitter
3
3
Timing Capacitor
4
4, EP Flag
GND
5
5
Comparator Inverting Input
6
6
VCC
7
7
Ipk Sense
Peak Current Sense Input to monitor the voltage drop across an external
resistor to limit the peak current through the circuit.
8
8
ON/OFF
ON/OFF Pin. To disable the device, this input should be pulled below
0.8 V. If the pin is left floating, it will be disabled.
Description
Internal Darlington switch collector.
Internal Darlington switch emitter.
Timing Capacitor to control the switching frequency.
Ground pin for all internal circuits.
Inverting input pin of internal comparator.
Voltage Supply
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2
NCP3066, NCV3066
MAXIMUM RATINGS (measured vs. Pin 4, unless otherwise noted)
Symbol
Value
Unit
VCC Pin 6
VCC
0 to +42
V
Comparator Inverting Input Pin 5
VCII
−0.3 to + VCC
V
Darlington Switch Collector Pin 1
VSWC
−0.3 to + 42
V
Darlington Switch Emitter Pin 2 (Transistor OFF)
VSWE
−0.6 to + VCC
V
Darlington Switch Collector to Emitter Pins 1−2
VSWCE
−0.3 to + 42
V
Rating
Darlington Switch Current
ISW
1.5
A
Ipk Sense Pin 7
VIPK
−0.3 to VCC+ 0.3
V
Timing Capacitor Pin Voltage (Pin 3)
VTC
−0.2 to +1.4
V
Moisture Sensitivity Level
MSL
1
−
Lead Temperature Soldering
TSLD
260
°C
VON/OFF
(−0.3 to +25) < VCC
V
ON/OFF Pin voltage
POWER DISSIPATION AND THERMAL CHARACTERISTICS
PDIP−8 (Note 5)
Thermal Resistance Junction−to−Air
RqJA
SOIC−8 (Note 5)
Thermal Resistance Junction−to−Air
RqJA
100
180
°C/W
°C/W
DFN−8 (Note 5)
Thermal Resistance Junction−to−Air
Thermal Resistance Junction−to−Case
RqJA
RqJC
78
14
Storage Temperature Range
TSTG
−65 to +150
°C
Maximum Junction Temperature
TJMAX
+150
°C
Operating Junction Temperature Range (Note 3)
NCP3066
NCV3066
TJ
0 to +85
−40 to +125
°C/W
°C
Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality
should not be assumed, damage may occur and reliability may be affected.
1. This device series contains ESD protection and exceeds the following tests:
Pin 1−8: Human Body Model 2000 V per AEC Q100−002; 003 or JESD22/A114; A115
Machine Model Method 200 V
2. This device contains latch−up protection and exceeds 100 mA per JEDEC Standard JESD78.
3. The relation between junction temperature, ambient temperature and Total Power dissipated in IC is TJ = TA + Rq • PD.
4. The pins which are not defined may not be loaded by external signals.
5. 35 mm copper, 10 cm2 copper area.
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3
NCP3066, NCV3066
ELECTRICAL CHARACTERISTICS (VCC = 5.0 V, −40°C < TJ < +125°C for NCV3066, 0°C < TJ < +85°C for NCP3066 unless
otherwise specified)
Characteristic
Symbol
Conditions
Min
Typ
Max
Unit
(VPin5 = 0 V, CT = 2.2 nF,
TJ = 25°C)
110
150
190
kHz
(Pin 7 to VCC, TJ = 25°C)
5.5
6.0
6.5
−
OSCILLATOR
fOSC
Frequency
IDISCHG/ICHG Discharge to Charge Current Ratio
IDISCHG
Capacitor Discharging Current
(Pin 7 to VCC, TJ = 25°C)
1650
mA
ICHG
Capacitor Charging Current
(Pin 7 to VCC, TJ = 25°C)
275
mA
VIPK(Sense)
Current Limit Sense Voltage
(TJ = 25°C) (Note 7)
165
200
235
mV
(ISW = 1.0 A, TJ = 25°C)
(Note 6)
1.0
1.3
V
(VCE = 40 V)
1.0
10
mA
TJ = 25°C
235
OUTPUT SWITCH (Note 6)
VSWCE(DROP) Darlington Switch Collector to
Emitter Voltage Drop
IC(OFF)
Collector Off−State Current
COMPARATOR
VTH
REGLiNE
ICII in
Threshold Voltage
Threshold Voltage Line Regulation
Input Bias Current
mV
TJ = 0°C to 85°C
−5%
235
+5%
TJ = −40°C to +125°C
−10%
235
+10%
(VCC = 3.0 V to 40 V)
−6.0
2.0
6.0
mV
(Vin = Vth)
−1000
−100
1000
nA
ON/OFF FEATURE
VIH
ON/OFF Pin Logic Input Level High
VOUT = 0 V
TJ = 25°C
TJ = 0°C to +85°C
2.2
2.4
−
−
−
−
V
VIL
ON/OFF Pin Logic Input Level Low
VOUT = Nominal Output Voltage
J = 25°C
TJ = 0°C to +85°C
−
−
−
−
1.0
0.8
V
IIH
ON/OFF Pin Input Current
ON/OFF Pin = 5 V (ON)
TJ = 25°C
15
mA
IIL
ON/OFF Pin Input Current
ON/OFF Pin = 0 V (OFF)
TJ = 25°C
1.0
mA
ON/OFF Pin Minimum Width
TJ = 25°C
50
ms
TON_MIN
TOTAL DEVICE
Supply Current
(VCC = 5.0 V to 40 V,
CT = 2.2 nF, Pin 7 = VCC,
VPin 5 > Vth, Pin 2 = GND,
remaining pins open)
ISTBY
Standby Quiescent Current
ON/OFF Pin = 5.0 V (OFF)
TJ = 25°C
TJ = −40°C to +125°C
TSHD
Thermal Shutdown Threshold
160
°C
Hysteresis
10
°C
ICC
TSHDHYS
7.0
85
120
120
mA
mA
Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product
performance may not be indicated by the Electrical Characteristics if operated under different conditions.
6. Low duty cycle pulse techniques are used during test to maintain junction temperature as close to ambient temperature as possible.
7. The VIPK (Sense) Current Limit Sense Voltage is specified at static conditions. In dynamic operation the sensed current turn−off value
depends on comparator response time and di/dt current slope. See the Operating Description section for details.
8. NCV prefix is for automotive and other applications requiring site and change control and extended operating temperature conditions.
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4
350
150
300
145
250
FREQUENCY (kHz)
FREQUENCY (kHz)
NCP3066, NCV3066
200
150
100
0
2
4
6
8
10
12
14
16
18
10
15
20
25
30
35
Figure 5. Oscillator Frequency vs.
Timing Capacitor
Figure 6. Oscillator Frequency vs. Supply
Voltage
40
1.3
ICE = 1.25 A
1.2
VOLTAGE DROP (V)
ICE = 1 A
ICE = 0.75 A
1.7
1.5
ICE = 0.5 A
ICE = 0.25 A
0.9
−40 −20
0
20
40
ICE = 1.25 A
60
80
100
120
ICE = 0.75 A
1.0
0.9
0.8
ICE = 0.5 A
ICE = 0.25 A
0.6
−40 −20
140
ICE = 1 A
1.1
0.7
0
20
40
60
80
100
120 140
TJ, JUNCTION TEMPERATURE (°C)
TJ, JUNCTION TEMPERATURE (°C)
Figure 7. Voltage Drop in Emitter Follower
Configuration
Figure 8. Common Emitter Configuration Output
Darlington Switch Voltage Drop vs. Temperature
0.240
0.238
0.236
0.234
0.232
0.230
−40 −20
0
20
40
60
80
100
120
140
Vipk, CURRENT LIMIT SENSE VOLTAGE (V)
VOLTAGE DROP (V)
5
VIN, INPUT VOLTAGE (V)
1.1
REFERENCE VOLTAGE (V)
0
Ct, CAPACITANCE (nF)
1.9
1.3
130
120
20
2.3
2.1
135
125
50
0
140
0.200
0.195
0.190
0.185
0.180
0.175
0.170
−40 −20
0
20
40
60
80
100
120 140
TJ, JUNCTION TEMPERATURE (°C)
TJ, JUNCTION TEMPERATURE (°C)
Figure 9. Vth vs. Temperature
Figure 10. Current Limit Sense Voltage vs.
Temperature
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NCP3066, NCV3066
STANDBY SUPPLY CURRENT (mA)
450
400
350
300
250
200
150
100
50
0
0
5
10
15
20
25
30
Vin, INPUT VOLTAGE (V)
35
40
Figure 11. Standby Supply Current vs. Supply Voltage
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6
NCP3066, NCV3066
INTRODUCTION
The NCP3066 is a monolithic power switching regulator
optimized for LED Driver applications. Its flexible
architecture enables the system designer to directly
implement step−up, step−down, and voltage−inverting
converters with a minimum number of external components
for driving LEDs. A representative block diagram is shown
in Figure 3.
comparator value, the output switch cycle is inhibited. When
the load current causes the output voltage to fall below the
nominal value feedback comparator enables switching
immediately. Under these conditions, the output switch
conduction can be enabled for a partial oscillator cycle, a
partial cycle plus a complete cycle, multiple cycles, or a
partial cycle plus multiple cycles.
Operating Description
Oscillator
The NCP3066 operates as a fixed oscillator frequency
output voltage ripple gated regulator. In general, this mode
of operation is somewhat analogous to a capacitor charge
pump and does not require dominant pole loop
compensation for converter stability. The typical operating
waveforms are shown in Figure 12. The output voltage
waveform is shown for a step−down converter with the
ripple and phasing exaggerated for clarity. During initial
converter startup, the feedback comparator senses that the
output voltage level is below nominal. This causes the
output switch to turn on and off at a frequency and duty cycle
controlled by the oscillator, thus pumping up the output filter
capacitor. When the output voltage level reaches nominal
The oscillator frequency and off−time of the output switch
are programmed by the value of the timing capacitor CT. The
capacitor CT is charged and discharged by a 1 to 6 ratio
internal current source and sink, generating a positive going
sawtooth waveform at Pin 3. This ratio sets the maximum
tON/(tON + tOFF) of the switching converter as 6/(6+1) or
85.7% (typical). The oscillator peak and valley voltage
difference is 500 mV typically. To calculate the CT capacitor
value for required oscillator frequency, use the equations
found in Figure 15. An online NCP3066 design tool can be
found at www.onsemi.com, which aids in selecting
component values.
Figure 12. Typical Operating Waveforms
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7
NCP3066, NCV3066
Peak Current Sense Comparator
Darlington Switch is enabled again when the chip
temperature decreases under the low threshold. This feature
is provided to prevent catastrophic failures from accidental
device overheating. It is not intended to be used as a
replacement for proper heatsinking.
Under normal conditions, the output switch conduction is
initiated by the Voltage Feedback comparator and
terminated by the oscillator. Abnormal operating conditions
occur when the converter output is overloaded or when
feedback voltage sensing is lost. Under these conditions, the
Ipk Current Sense comparator will protect the Darlington
output Switch. The switch current is converted to a voltage
by inserting a fractional ohm resistor, RSense, in series with
VCC and Darlington output switch. The voltage drop across
RSense is monitored by the Current Sense comparator. If the
voltage drop exceeds 200 mV (nom) with respect to VCC, the
comparator will set the latch and terminate the output switch
conduction on a cycle−by−cycle basis.
Real
Vturn−off on
Rs Resistor
Vipk(sense)
Output Switch
The output switch is designed in Darlington
configuration. This allows the application designer to
operate at all conditions at high switching speed and low
voltage drop. The Darlington Output Switch is designed to
switch a maximum of 40 V collector to emitter voltage and
current up to 1.5 A.
ON/OFF Function
The ON/OFF function provides interruption of switching
and puts the circuitry into the low consumption mode. This
feature is applicable for digital dimming of the LEDs as
well. The ON/OFF signal inhibits switching of the regulator
and reduces the average current through the LEDs. The
frequency of this pulse width−modulated signal with the
duty cycle can range from less than 1% to 100% is limited
by the value of 1 kHz.
Pulling this pin below 0.8 V or leaving it opened turns the
regulator off. In this state the consumption of the device is
reduced below 100 uA. Pulling this pin above 2.4 V (up to
max. 25 V) allows the regulator running in normal state. If
the ON/OFF feature is not needed, the ON/OFF pin can be
wired to VCC, provided this voltage does not exceed 25 V.
I1
di/dt slope
Io
I through the
Darlington
Switch
t_delay
Figure 13. Current Sense Waveform
The VIPK(Sense) Current Limit Sense Voltage threshold is
specified at static conditions. In dynamic operation the
sensed current turn−off value depends on comparator
response time and di/dt current slope.
Real Vturn−off on Rsc resistor
Vturn_off = Vipk(sense) + RSense*(tdelay*di/dt)
Typical Ipk comparator response time tdelay is 350 ns. The
di/dt current slope is dependent on the voltage difference
across the inductor and the value of the inductor. Increasing
the value of the inductor will reduce the di/dt slope.
It is recommended to verify the actual peak current in the
application at worst conditions to be sure that the max peak
current will never get over the 1.5 A Darlington Switch
Current max rating.
No Output Capacitor Operation
A traditional buck topology includes an inductor followed
by an output capacitor which filters the ripple. The capacitor
is placed in parallel with the LED or array of LEDs to lower
the ripple current. A constant current buck regulator such as
the NCP3066 focuses on the control of the current through
the load, not the voltage across it. The switching frequency
of the NCP3066 is in the range of 100−250 kHz which is
much higher than the human eye can detect. By configuring
the NCP3066 in a continuous conduction buck
configuration with low peak to peak ripple the output filter
capacitor can be eliminated. The important design
parameter is to keep the peak current below the maximum
current rating of the LED. Using 15−40% peak to peak ripple
results in a good compromise between achieving max
average output current without exceeding the maximum
limit. This saves space and reduces part count for
applications.
Thermal Shutdown
Internal thermal shutdown circuitry is provided to protect
the IC in the event that the maximum junction temperature
is exceeded. When activated, typically at 160°C, the
Darlington Output Switch is disabled. The temperature
sensing circuit is designed with some hysteresis. The
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8
NCP3066, NCV3066
APPLICATIONS
Figures 15 through 24 show the simplicity and flexibility
of the NCP3066. Two main converter topologies are
demonstrated with actual test data shown below each of the
circuit diagrams. The demo boards have an input for a digital
dimming signal. You can provide a PWM signal to change
the average output current and reduce the LED brightness.
Figure 14 gives the relevant design equations for the key
parameters. Additionally, a complete application design aid
for the NCP3066 can be found at www.onsemi.com.
Parameter
Step−Down
Step−Up
ǒtton
Ǔ
off
Vout ) VF
Vin * VSWCE * Vout
Vout ) VF * Vin
Vin * VSWCE
ton
ton
toff
ton
toff
ǒtton
) 1Ǔ
off
f
CT
f
CT + 381.6 @ 10
fosc
*6
* 343
ǒtton
) 1Ǔ
off
10 *12
ǒtton
) 1Ǔ
off
IL(avg)
Iout
Ipk (Switch)
DI
IL(avg) ) L
2
DI
IL(avg) ) L
2
RSC
0.20
Ipk (Switch)
0.20
Ipk (Switch)
L
* Vout
ǒVin * VSWCE
Ǔ
DIL
Vripple(pp)
DIL
Iout
Iout
Ǹǒ
1
8 f CO
ton
Ǔ ) (ESR)
2
2
ǒVin *DIVLSWCEǓ
ton Iout
) DIL
CO
V ref
V ref
Rs
Rs
ton
ESR
9. VSWCE − Darlington Switch Collector to Emitter Voltage Drop, refer to Figures 7 and 8.
10. VF − Output rectifier forward voltage drop. Typical value for 1N5819 Schottky barrier rectifier is 0.4 V.
11. The calculated ton/toff must not exceed the minimum guaranteed oscillator charge to discharge ratio.
Figure 14. Design Equations
The Following Converter Characteristics Must Be Chosen:
Vin − Nominal operating input voltage.
Vout − Desired output voltage.
Iout − Desired output current.
DIL − Desired peak−to−peak inductor ripple current. For maximum output current it is suggested that DIL be chosen to be
less than 10% of the average inductor current IL(avg). This will help prevent Ipk (Switch) from reaching the current limit threshold
set by RSC. If the design goal is to use a minimum inductance value, let DIL = 2(IL(avg)). This will proportionally reduce
converter output current capability.
f − Maximum output switch frequency.
Vripple(pp) − Desired peak−to−peak output ripple voltage. For best performance the ripple voltage should be kept to a low
value since it will directly affect line and load regulation. Capacitor CO should be a low equivalent series resistance (ESR)
electrolytic designed for switching regulator applications.
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9
NCP3066, NCV3066
Q1
L1
+LED
Input
ON/OFF
R11
1k0
R1 ... R9
−LED
D2
R10
10k
...
VIN +
ON/OFF
SWC
Ipk
SWE
NCP3066
SOIC
VCC
9 x 0R15
R15
1k0
R12
12k
CT
COMP
C1
C9
100p
Q2
R16
R68
GND
+
IC1
C2
220 mF
R17
R33
0.1 mF
C10
R19
C5
2n2
1k0
1n8
C8
C7
m15
100nF
D1
GND
Figure 15. Buck Demoboard with External Switch Application Schematic
Table 1. BILL OF MATERIALS
Designator
Qty
Description
Value
Tolerance
Footprint
Manufacturer
Manufacturer
Part Number
R1;R2;
R3;R4
4
Resistor
0.15R
1%
1206
Susumu
RL1632R-R150-F
R10
1
Resisitor
10k
1%
1206
Rohm
MCR18EZHF1002
R11;
R15
2
Resisitor
1k
1%
1206
Rohm
MCR18EZPF1001
R12
NU
Resistor
12k
1%
1206
Rohm
MCR18EZHF1202
R16
1
Resistor
0.68R
5%
1210
Panasonic - ECG
ERJ-14RQJR68U
R17
OPTION
Resistor
0.33R
5%
1210
Panasonic - ECG
ERJ-14RQJR33U
R19
1
Resistor
1k
5%
1210
Panasonic - ECG
ERJ-14YJ102U
C1
1
Capacitor
220mF/35V
20%
10x12.5
Panasonic
EEUFC1V221
C2;C7
2
Capacitor
100nF
10%
1206
Kemet
C1206C104K5RACTU
C5
1
Capacitor
1.8nF
10%
1206
Kemet
C1206C182K5RACTU
C8
1
Capacitor
150mF/16V
20%
F8
SANYO
16SP150M
C9
1
Capacitor
100pF
10%
1206
Vishay/Vitramon
VJ1206Y101KXEAT5Z
C10
1
Capacitor
2.2nF
10%
1206
Kemet
C1206C222K5RACTU
Q1
1
Power MOSFET
−25A, -30V
NTD18P03L
-
DPAK
ON Semiconductor
NTD18P03L
Q2
1
Switching NPN
Transistor
MMBT489LT1G
-
SOT-23
ON Semiconductor
MMBT489LT1G
D2
1
1A, 30V Schottky
Rectifier
MBR130T1G
-
SOD123
ON Semiconductor
MBR130T1G
IC1
1
Switching
Regulator
NCP3066DR2G
-
SOIC-8
ON Semiconductor
NCP3066DR2G
D1
1
3A, 30V Schottky
Rectifier
MBRS330T3G
-
SMC
ON Semiconductor
MBRS330T3G
L1
1
Inductor
47 mH
20%
Wurth
Elektronik
Wurth Elektronik
WE−PD4 74457147
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10
NCP3066, NCV3066
Figure 16. Buck with External Switch Demoboard Layout
90
700 mA 4 LED
(Vout = 12.8 V)
EFFICIENCY (%)
80
75
70
65
700 mA 2 LED
(Vout = 6.4 V)
60
350 mA 2 LED
(Vout = 6.4 V)
55
50
10
Figure 15, Buck Demoboard With External Switch
Application Schematic illustrates the NCP3066 being used
as a PFET controller. Table 1. Bill Of Materials shows the
small number of additional parts which are necessary to
assemble mentioned demoboard. The demoboard based on
two layer PCB and the layout is mentioned in Figure 16.
Buck Demoboard Layout. The Line regulation is mentioned
in Figure 20, Line Regulation. The Figure 21, Dimming
characteristic shows behavior of circuitry in case the square
wave signal with 5 V amplitude and 300 Hz frequency was
delivered into ON/OFF pin of device.
350 mA 4 LED
(Vout = 12.8 V)
85
15
20
25
30
Figure 17. Buck with External Switch Demoboard
Photo
35
INPUT VOLTAGE (V)
Figure 18. Efficiency of Buck LED Driver
95
90
EFFICIENCY (%)
85
3 A 4 LED
(Vout = 12.8 V)
80
75
70
3 A 2 LED
(Vout = 6.4 V)
65
60
55
10
15
20
25
30
35
INPUT VOLTAGE (V)
Figure 19. Efficiency of Buck LED Driver at Iout = 3 A
www.onsemi.com
11
NCP3066, NCV3066
0.70
0.35
Iout = 600 mA
0.30
Iout = 450 mA
0.50
0.40
Iout = 300 mA
0.30
0.20
Vin = 25 V
0.25
Pled (W)
OUTPUT CURRENT (A)
0.60
0.20
Vin = 10 V − 15 V
0.15
0.10
Iout = 150 mA
0.10
0.05
0
8
10
12
14
16 18 20 22 24
INPUT VOLTAGE (V)
26
28
30
0
5 10
Figure 20. Line Regulation
20
30
40
50
60
70
80
ON/OFF PIN DUTY CYCLE (%)
90
Figure 21. Dimming Characteristic
Table 2. TEST RESULTS
Line Regulation
Vin = 12 V to 35 V, Iout = 3000 mA
250 mA
Output Ripple
Vin = 12 V, Iout = 3000 mA
320 mA
Efficiency
Vin = 12 V, Iout = 3000 mA
80%
www.onsemi.com
12
100
NCP3066, NCV3066
Input
ON/OFF
D1
L1
+LED
100mH
R6
10k
R1
R15
R2
100R
VIN +
ON/OFF
SWC
Ipk
SWE
VCC
C1
m18
C2
100n
NCP3066
SOIC
COMP
D2
−LED
CT
GND
R3
1k0
C4
C5
R5
C6 R68
R4
100R
C3
IC1
2n2
GND
3 x 100mF
Figure 22. Boost demoboard Application Schematic
Table 3. BILL OF MATERIALS
Designator
Qty
Description
Value
Tolerance
Footprint
Manufacturer
Manufacturer
Part Number
R1
1
Resistor
0.15R
1%
1206
Susumu
RL1632R-R150-F
R2;R4
NU
Resisitor
100R
1%
1206
Vishay/Dale
CRCW1206100RFKEA
R3
1
Resisitor
1k
1%
1206
Rohm
MCR18EZPF1001
R5
1
Resistor
0.68R
5%
1210
Panasonic - ECG
ERJ-14RQJR68U
R6
1
Resistor
10k
1%
1206
Rohm
MCR18EZHF1002
C1
1
Capacitor
180mF
20%
F8
SANYO
16SVPS180M
C2
1
Capacitor
100nF
10%
1206
Kemet
C1206C104K5RACTU
C3
1
Capacitor
2.2nF
10%
1206
Kemet
C1206C222K5RACTU
C4,C5,C6
3
Capacitor
100mF
20%
1210
TDK
C4532Y5V1A107Z
C10
1
Capacitor
2.2nF
10%
1206
Kemet
C1206C222K5RACTU
IC1
1
Switching
Regulator
NCP3066DR2G
-
SOIC-8
ON Semiconductor
NCP3066DR2G
D1
1
Diode
MBRS1540T3G
-
SMB
ON Semiconductor
MBRS1540T3G
D2
1
Zener Diode
BZX84B18VLT1G
-
SOT-23
ON Semiconductor
BZX84B18VLT1G
L2
1
Inductor
100mH
20%
Coilcraft
Coilcraft
DO3316P-104MLB
www.onsemi.com
13
NCP3066, NCV3066
Figure 23. Boost Demoboard Layout
Figure 24. Boost Demonstration Photo
95
Figure 22, Boost Demoboard Application Schematic,
illustrates the basic circuitry in boost topology, which allows
supplying string up to eight LEDs up to 150 mA
consumption. Table 3, Bill of Materials shows the small
number of additional parts which are necessary to assembly
mentioned demoboard. The demoboard based on one layer
PCB and the layout is shown in Figure 23, Buck Demoboard
Layout. The photo of this demoboard is mentioned in
Figure 24, Boost Demoboard Photo. Figure 26, Dimming
Characteristic shows behavior of circuitry in case the square
wave signal with 5 V amplitude and 300 Hz frequency was
delivered into ON/OFF pin of device. There was tested eight
LEDs string with 150 mA consumption and VIN = 10 V at
room temperature.
The efficiency of this demoboard is mentioned in
Figure 25. Efficiency of Boost LED Driver.
EFFICIENCY (%)
90
150 mA 6 LED
(19.2 V)
85
150 mA 8 LED
(25.6 V)
80
75
70
65
60
5
7
9
11
13
15
17
19
INPUT VOLTAGE (V)
Figure 25. Boost LED Driver Efficiency
3.50
LED POWER (W)
3.0
2.50
2.0
1.50
1.0
0.50
0
0
10
20
30
40
50
60
70
80
90
100
ON/OFF DUTY CYCLE (%)
Figure 26. Dimming Characteristic
Table 4. TEST RESULTS
Line Regulation
Vin = 10 V to 20 V, Vout = 19.2 V, Iout = 350 mA
25 mA
Output Ripple
Vin = 10 V to 20 V, Vout = 19.2 V, Iout = 350 mA
55 mA
Efficiency
Vin = 12 V, Vout = 19.2 V, Iout = 350 mA
www.onsemi.com
14
85%
NCP3066, NCV3066
Input
ON/OFF
L1
NCP3066
R6
R1
R2
100R
R15
10k
VIN
SOIC
ON/OFF
SWC
Ipk
SWE
−LED
D1
R4
R3
C2
IC1
0.1 mF
330 mF
D2
12k
GND
COMP
C1
47 mH
R7
CT
Vcc
+LED
1k0
C10
C3
C4
C5
R6
R68
100R
2n2
GND
3 x 100 mF
Figure 27. Buck Demoboard Application Schematic
Table 5. BILL OF MATERIALS
Designator
Qty.
Description
Value
Tolerance
Footprint
Manufacturer
Manufacturer Part
Number
R1
1
Resistor
0.15R
1%
1206
Susumu
RL1632R-R150-F
R2; R5
NU
Resisitor
100R
1%
1206
Vishay/Dale
CRCW1206100RFKEA
R3
1
Resisitor
1k
1%
1206
Rohm
MCR18EZPF1001
R4
1
Resistor
0.68R
5%
1210
Panasonic - ECG
ERJ-14RQJR68U
R6
1
Resisitor
10 k
1%
1206
Rohm
MCR18EZHF1002
R7
NU
Resisitor
12 k
1%
1206
Rohm
MCR18EZPF1202
C1
1
Capacitor
330 mF
20%
F8
PANASONIC
EEEFK1E331GP
C2
1
Capacitor
100 nF
10%
1206
Kemet
C1206C104K5RACTU
C3
1
Capacitor
2.2 nF
10%
1206
Kemet
C1206C222K5RACTU
C4, C5, C6
3
Capacitor
100 mF
20%
1210
TDK
C4532Y5V1A107Z
IC1
1
Switching
Regulator
NCP3066
-
SOIC8
ON Semiconductor
NCP3066DR2G
D1
1
Diode
MBRS1504
-
SMB
ON Semiconductor
MBRS1504T3G
D2
1
Zener Diode
BZX84C8V2
-
SOT23
ON Semiconductor
BZX84C8V2LT1G
L1
1
Inductor
47 mH
20%
DO3316
CoilCraft
DO3316P-473MLB
www.onsemi.com
15
NCP3066, NCV3066
Figure 29. Buck Demonstration Photo
Figure 28. Buck Demoboard Layout
mentioned demoboard. The demoboard based on one layer
PCB and the layout is mentioned in Figure 28 Buck
Demoboard Layout. The Line regulation is mentioned in
Figure 30 Line Regulation. The Figure 31 shows efficiency
of Buck LED Driver.
The Figure 27 Buck demoboard Application schematic
illustrates the basic circuitry in buck topology, which allows
supplying one or two LEDs up to 350 mA consumption. The
TABLE 5 BILL OF MATERIALS shows the small number
of additional parts which are necessary to assembly
80
0.40
0.25
0.20
1 LED 100 mA
0.10
65
60
55
50
1 LED 100 mA
45
1 LED 350 mA
40
0.05
0
2 LED 100 mA
70
0.30
0.15
2 LED 350 mA
75
1 LED 350 mA
EFFICIENCY (%)
OUTPUT CURRENT (mA)
0.35
5
10
15
20
25
30
35
30
35
5
10
15
20
25
30
INPUT VOLTAGE (V)
INPUT VOLTAGE (V)
Figure 30. Line Regulation
Figure 31. Efficiency of Buck LED Driver
Table 6. TEST RESULTS
Line Regulation
Vin = 8 V to 20 V, Vout = 3.2 V, Iout = 350 mA
19 mA
Output Ripple
Vin = 8 V to 20 V, Vout = 3.2 V, Iout = 350 mA
32 mA
Efficiency
Vin = 12 V, Vout = 3.2 V, Iout = 350 mA
www.onsemi.com
16
62%
35
NCP3066, NCV3066
R
ON/OFF
10k
IC1
Rsense
R15
ON/OFF
SWC
Ipk
SWE
NCP3066
VIN
VCC
+
COMP
CT
GND
Figure 32. ONOFF Serial Resistor Connection
This resistor shifts the ON/OFF threshold by about
200 mV to higher value, but the TTL logic compatibility is
kept in full range of input voltage and operating temperature
range.
If the application allows ON/OFF pin to be biased by
voltage and the power supply is not connected to Vcc pin at
the same time, then it is recommended to limit ON/OFF
current by resistor with value 10 kW to protect the NCP3066
device. This situation is mentioned in Figure 32, ON/OFF
Serial Resistor Connection.
ORDERING INFORMATION
Package
Shipping†
NCP3066MNTXG
DFN−8
(Pb−Free)
4000 / Tape & Reel
NCP3066PG
PDIP−8
(Pb−Free)
50 Units / Rail
NCP3066DR2G
SOIC−8
(Pb−Free)
2500 / Tape & Reel
NCV3066MNTXG
DFN−8
(Pb−Free)
4000 / Tape & Reel
NCV3066PG
PDIP−8
(Pb−Free)
50 Units / Rail
NCV3066DR2G
SOIC−8
(Pb−Free)
2500 / Tape & Reel
Device
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specifications Brochure, BRD8011/D.
www.onsemi.com
17
MECHANICAL CASE OUTLINE
PACKAGE DIMENSIONS
DFN8, 4x4
CASE 488AF−01
ISSUE C
1
SCALE 2:1
A
B
D
PIN ONE
REFERENCE
2X
0.15 C
2X
0.15 C
0.10 C
8X
ÉÉ
ÉÉ
ÉÉ
0.08 C
DETAIL A
E
OPTIONAL
CONSTRUCTIONS
EXPOSED Cu
DETAIL B
ÇÇÇÇ
(A3)
A
A1
C
D2
ÇÇÇÇ
e
8X
SEATING
PLANE
ÉÉÉ
ÉÉÉ
ÇÇÇ
A3
A1
ALTERNATE
CONSTRUCTIONS
8X
MILLIMETERS
MIN
MAX
0.80
1.00
0.00
0.05
0.20 REF
0.25
0.35
4.00 BSC
1.91
2.21
4.00 BSC
2.09
2.39
0.80 BSC
0.20
−−−
0.30
0.50
−−−
0.15
XXXXXX
XXXXXX
ALYWG
G
E2
5
DIM
A
A1
A3
b
D
D2
E
E2
e
K
L
L1
GENERIC
MARKING DIAGRAM*
L
4
ÇÇÇÇ
8
MOLD CMPD
DETAIL B
SIDE VIEW
K
ÇÇÇ
ÇÇÇ
ÉÉÉ
TOP VIEW
1
NOTES:
1. DIMENSIONS AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSION b APPLIES TO PLATED
TERMINAL AND IS MEASURED BETWEEN
0.15 AND 0.30MM FROM TERMINAL TIP.
4. COPLANARITY APPLIES TO THE EXPOSED
PAD AS WELL AS THE TERMINALS.
5. DETAILS A AND B SHOW OPTIONAL CONSTRUCTIONS FOR TERMINALS.
L
L
L1
NOTE 4
DETAIL A
DATE 15 JAN 2009
b
XXXX = Specific Device Code
A
= Assembly Location
L
= Wafer Lot
Y
= Year
W
= Work Week
G
= Pb−Free Package
(Note: Microdot may be in either location)
0.10 C A B
0.05 C
NOTE 3
BOTTOM VIEW
SOLDERING FOOTPRINT*
2.21
8X
*This information is generic. Please refer to
device data sheet for actual part marking.
Pb−Free indicator, “G” or microdot “ G”,
may or may not be present.
0.63
4.30 2.39
PACKAGE
OUTLINE
8X
0.35
0.80
PITCH
DIMENSIONS: MILLIMETERS
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
DOCUMENT NUMBER:
DESCRIPTION:
98AON15232D
DFN8, 4X4, 0.8P
Electronic versions are uncontrolled except when accessed directly from the Document Repository.
Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red.
PAGE 1 OF 1
ON Semiconductor and
are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries.
ON Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regarding
the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically
disclaims any and all liability, including without limitation special, consequential or incidental damages. ON Semiconductor does not convey any license under its patent rights nor the
rights of others.
© Semiconductor Components Industries, LLC, 2019
www.onsemi.com
MECHANICAL CASE OUTLINE
PACKAGE DIMENSIONS
PDIP−8
CASE 626−05
ISSUE P
DATE 22 APR 2015
SCALE 1:1
D
A
E
H
8
5
E1
1
4
NOTE 8
b2
c
B
END VIEW
TOP VIEW
WITH LEADS CONSTRAINED
NOTE 5
A2
A
e/2
NOTE 3
L
SEATING
PLANE
A1
C
D1
M
e
8X
SIDE VIEW
b
0.010
eB
END VIEW
M
C A
M
B
M
NOTES:
1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: INCHES.
3. DIMENSIONS A, A1 AND L ARE MEASURED WITH THE PACKAGE SEATED IN JEDEC SEATING PLANE GAUGE GS−3.
4. DIMENSIONS D, D1 AND E1 DO NOT INCLUDE MOLD FLASH
OR PROTRUSIONS. MOLD FLASH OR PROTRUSIONS ARE
NOT TO EXCEED 0.10 INCH.
5. DIMENSION E IS MEASURED AT A POINT 0.015 BELOW DATUM
PLANE H WITH THE LEADS CONSTRAINED PERPENDICULAR
TO DATUM C.
6. DIMENSION eB IS MEASURED AT THE LEAD TIPS WITH THE
LEADS UNCONSTRAINED.
7. DATUM PLANE H IS COINCIDENT WITH THE BOTTOM OF THE
LEADS, WHERE THE LEADS EXIT THE BODY.
8. PACKAGE CONTOUR IS OPTIONAL (ROUNDED OR SQUARE
CORNERS).
DIM
A
A1
A2
b
b2
C
D
D1
E
E1
e
eB
L
M
INCHES
MIN
MAX
−−−−
0.210
0.015
−−−−
0.115 0.195
0.014 0.022
0.060 TYP
0.008 0.014
0.355 0.400
0.005
−−−−
0.300 0.325
0.240 0.280
0.100 BSC
−−−−
0.430
0.115 0.150
−−−−
10 °
MILLIMETERS
MIN
MAX
−−−
5.33
0.38
−−−
2.92
4.95
0.35
0.56
1.52 TYP
0.20
0.36
9.02
10.16
0.13
−−−
7.62
8.26
6.10
7.11
2.54 BSC
−−−
10.92
2.92
3.81
−−−
10 °
NOTE 6
GENERIC
MARKING DIAGRAM*
STYLE 1:
PIN 1. AC IN
2. DC + IN
3. DC − IN
4. AC IN
5. GROUND
6. OUTPUT
7. AUXILIARY
8. VCC
XXXXXXXXX
AWL
YYWWG
XXXX
A
WL
YY
WW
G
= Specific Device Code
= Assembly Location
= Wafer Lot
= Year
= Work Week
= Pb−Free Package
*This information is generic. Please refer to
device data sheet for actual part marking.
Pb−Free indicator, “G” or microdot “ G”,
may or may not be present.
DOCUMENT NUMBER:
DESCRIPTION:
98ASB42420B
PDIP−8
Electronic versions are uncontrolled except when accessed directly from the Document Repository.
Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red.
PAGE 1 OF 1
ON Semiconductor and
are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries.
ON Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regarding
the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically
disclaims any and all liability, including without limitation special, consequential or incidental damages. ON Semiconductor does not convey any license under its patent rights nor the
rights of others.
© Semiconductor Components Industries, LLC, 2019
www.onsemi.com
MECHANICAL CASE OUTLINE
PACKAGE DIMENSIONS
SOIC−8 NB
CASE 751−07
ISSUE AK
8
1
SCALE 1:1
−X−
DATE 16 FEB 2011
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSION A AND B DO NOT INCLUDE
MOLD PROTRUSION.
4. MAXIMUM MOLD PROTRUSION 0.15 (0.006)
PER SIDE.
5. DIMENSION D DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL BE 0.127 (0.005) TOTAL
IN EXCESS OF THE D DIMENSION AT
MAXIMUM MATERIAL CONDITION.
6. 751−01 THRU 751−06 ARE OBSOLETE. NEW
STANDARD IS 751−07.
A
8
5
S
B
0.25 (0.010)
M
Y
M
1
4
−Y−
K
G
C
N
X 45 _
SEATING
PLANE
−Z−
0.10 (0.004)
H
M
D
0.25 (0.010)
M
Z Y
S
X
J
S
8
8
1
1
IC
4.0
0.155
XXXXX
A
L
Y
W
G
IC
(Pb−Free)
= Specific Device Code
= Assembly Location
= Wafer Lot
= Year
= Work Week
= Pb−Free Package
XXXXXX
AYWW
1
1
Discrete
XXXXXX
AYWW
G
Discrete
(Pb−Free)
XXXXXX = Specific Device Code
A
= Assembly Location
Y
= Year
WW
= Work Week
G
= Pb−Free Package
*This information is generic. Please refer to
device data sheet for actual part marking.
Pb−Free indicator, “G” or microdot “G”, may
or may not be present. Some products may
not follow the Generic Marking.
1.270
0.050
SCALE 6:1
INCHES
MIN
MAX
0.189
0.197
0.150
0.157
0.053
0.069
0.013
0.020
0.050 BSC
0.004
0.010
0.007
0.010
0.016
0.050
0 _
8 _
0.010
0.020
0.228
0.244
8
8
XXXXX
ALYWX
G
XXXXX
ALYWX
1.52
0.060
0.6
0.024
MILLIMETERS
MIN
MAX
4.80
5.00
3.80
4.00
1.35
1.75
0.33
0.51
1.27 BSC
0.10
0.25
0.19
0.25
0.40
1.27
0_
8_
0.25
0.50
5.80
6.20
GENERIC
MARKING DIAGRAM*
SOLDERING FOOTPRINT*
7.0
0.275
DIM
A
B
C
D
G
H
J
K
M
N
S
mm Ǔ
ǒinches
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
STYLES ON PAGE 2
DOCUMENT NUMBER:
DESCRIPTION:
98ASB42564B
SOIC−8 NB
Electronic versions are uncontrolled except when accessed directly from the Document Repository.
Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red.
PAGE 1 OF 2
ON Semiconductor and
are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries.
ON Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regarding
the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically
disclaims any and all liability, including without limitation special, consequential or incidental damages. ON Semiconductor does not convey any license under its patent rights nor the
rights of others.
© Semiconductor Components Industries, LLC, 2019
www.onsemi.com
SOIC−8 NB
CASE 751−07
ISSUE AK
DATE 16 FEB 2011
STYLE 1:
PIN 1. EMITTER
2. COLLECTOR
3. COLLECTOR
4. EMITTER
5. EMITTER
6. BASE
7. BASE
8. EMITTER
STYLE 2:
PIN 1. COLLECTOR, DIE, #1
2. COLLECTOR, #1
3. COLLECTOR, #2
4. COLLECTOR, #2
5. BASE, #2
6. EMITTER, #2
7. BASE, #1
8. EMITTER, #1
STYLE 3:
PIN 1. DRAIN, DIE #1
2. DRAIN, #1
3. DRAIN, #2
4. DRAIN, #2
5. GATE, #2
6. SOURCE, #2
7. GATE, #1
8. SOURCE, #1
STYLE 4:
PIN 1. ANODE
2. ANODE
3. ANODE
4. ANODE
5. ANODE
6. ANODE
7. ANODE
8. COMMON CATHODE
STYLE 5:
PIN 1. DRAIN
2. DRAIN
3. DRAIN
4. DRAIN
5. GATE
6. GATE
7. SOURCE
8. SOURCE
STYLE 6:
PIN 1. SOURCE
2. DRAIN
3. DRAIN
4. SOURCE
5. SOURCE
6. GATE
7. GATE
8. SOURCE
STYLE 7:
PIN 1. INPUT
2. EXTERNAL BYPASS
3. THIRD STAGE SOURCE
4. GROUND
5. DRAIN
6. GATE 3
7. SECOND STAGE Vd
8. FIRST STAGE Vd
STYLE 8:
PIN 1. COLLECTOR, DIE #1
2. BASE, #1
3. BASE, #2
4. COLLECTOR, #2
5. COLLECTOR, #2
6. EMITTER, #2
7. EMITTER, #1
8. COLLECTOR, #1
STYLE 9:
PIN 1. EMITTER, COMMON
2. COLLECTOR, DIE #1
3. COLLECTOR, DIE #2
4. EMITTER, COMMON
5. EMITTER, COMMON
6. BASE, DIE #2
7. BASE, DIE #1
8. EMITTER, COMMON
STYLE 10:
PIN 1. GROUND
2. BIAS 1
3. OUTPUT
4. GROUND
5. GROUND
6. BIAS 2
7. INPUT
8. GROUND
STYLE 11:
PIN 1. SOURCE 1
2. GATE 1
3. SOURCE 2
4. GATE 2
5. DRAIN 2
6. DRAIN 2
7. DRAIN 1
8. DRAIN 1
STYLE 12:
PIN 1. SOURCE
2. SOURCE
3. SOURCE
4. GATE
5. DRAIN
6. DRAIN
7. DRAIN
8. DRAIN
STYLE 13:
PIN 1. N.C.
2. SOURCE
3. SOURCE
4. GATE
5. DRAIN
6. DRAIN
7. DRAIN
8. DRAIN
STYLE 14:
PIN 1. N−SOURCE
2. N−GATE
3. P−SOURCE
4. P−GATE
5. P−DRAIN
6. P−DRAIN
7. N−DRAIN
8. N−DRAIN
STYLE 15:
PIN 1. ANODE 1
2. ANODE 1
3. ANODE 1
4. ANODE 1
5. CATHODE, COMMON
6. CATHODE, COMMON
7. CATHODE, COMMON
8. CATHODE, COMMON
STYLE 16:
PIN 1. EMITTER, DIE #1
2. BASE, DIE #1
3. EMITTER, DIE #2
4. BASE, DIE #2
5. COLLECTOR, DIE #2
6. COLLECTOR, DIE #2
7. COLLECTOR, DIE #1
8. COLLECTOR, DIE #1
STYLE 17:
PIN 1. VCC
2. V2OUT
3. V1OUT
4. TXE
5. RXE
6. VEE
7. GND
8. ACC
STYLE 18:
PIN 1. ANODE
2. ANODE
3. SOURCE
4. GATE
5. DRAIN
6. DRAIN
7. CATHODE
8. CATHODE
STYLE 19:
PIN 1. SOURCE 1
2. GATE 1
3. SOURCE 2
4. GATE 2
5. DRAIN 2
6. MIRROR 2
7. DRAIN 1
8. MIRROR 1
STYLE 20:
PIN 1. SOURCE (N)
2. GATE (N)
3. SOURCE (P)
4. GATE (P)
5. DRAIN
6. DRAIN
7. DRAIN
8. DRAIN
STYLE 21:
PIN 1. CATHODE 1
2. CATHODE 2
3. CATHODE 3
4. CATHODE 4
5. CATHODE 5
6. COMMON ANODE
7. COMMON ANODE
8. CATHODE 6
STYLE 22:
PIN 1. I/O LINE 1
2. COMMON CATHODE/VCC
3. COMMON CATHODE/VCC
4. I/O LINE 3
5. COMMON ANODE/GND
6. I/O LINE 4
7. I/O LINE 5
8. COMMON ANODE/GND
STYLE 23:
PIN 1. LINE 1 IN
2. COMMON ANODE/GND
3. COMMON ANODE/GND
4. LINE 2 IN
5. LINE 2 OUT
6. COMMON ANODE/GND
7. COMMON ANODE/GND
8. LINE 1 OUT
STYLE 24:
PIN 1. BASE
2. EMITTER
3. COLLECTOR/ANODE
4. COLLECTOR/ANODE
5. CATHODE
6. CATHODE
7. COLLECTOR/ANODE
8. COLLECTOR/ANODE
STYLE 25:
PIN 1. VIN
2. N/C
3. REXT
4. GND
5. IOUT
6. IOUT
7. IOUT
8. IOUT
STYLE 26:
PIN 1. GND
2. dv/dt
3. ENABLE
4. ILIMIT
5. SOURCE
6. SOURCE
7. SOURCE
8. VCC
STYLE 29:
PIN 1. BASE, DIE #1
2. EMITTER, #1
3. BASE, #2
4. EMITTER, #2
5. COLLECTOR, #2
6. COLLECTOR, #2
7. COLLECTOR, #1
8. COLLECTOR, #1
STYLE 30:
PIN 1. DRAIN 1
2. DRAIN 1
3. GATE 2
4. SOURCE 2
5. SOURCE 1/DRAIN 2
6. SOURCE 1/DRAIN 2
7. SOURCE 1/DRAIN 2
8. GATE 1
DOCUMENT NUMBER:
DESCRIPTION:
98ASB42564B
SOIC−8 NB
STYLE 27:
PIN 1. ILIMIT
2. OVLO
3. UVLO
4. INPUT+
5. SOURCE
6. SOURCE
7. SOURCE
8. DRAIN
STYLE 28:
PIN 1. SW_TO_GND
2. DASIC_OFF
3. DASIC_SW_DET
4. GND
5. V_MON
6. VBULK
7. VBULK
8. VIN
Electronic versions are uncontrolled except when accessed directly from the Document Repository.
Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red.
PAGE 2 OF 2
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