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NCP81142MNTXG

NCP81142MNTXG

  • 厂商:

    ONSEMI(安森美)

  • 封装:

    WFQFN32_EP

  • 描述:

    ICREGVRCTLR4PHASE32QFN

  • 数据手册
  • 价格&库存
NCP81142MNTXG 数据手册
NCP81142 Multiple-Phase Controller with SVID Interface for Desktop and Notebook CPU Applications The NCP81142 Multi−Phase buck solution is optimized for Intel® VR12.5 compatible CPUs with user configurations of 4/3/2/1 phases. The controller combines true differential voltage sensing, differential inductor DCR current sensing, input voltage feed−forward, and adaptive voltage positioning to provide accurately regulated power for both Desktop and Notebook applications. The control system is based on Dual−Edge pulse−width modulation (PWM) combined with DCR current sensing providing the fastest initial response to dynamic load events at reduced system cost. It has the capability to shed to single phase during light load operation and can auto frequency scale in light load conditions while maintaining excellent transient performance. High performance operational error amplifiers are provided to simplify compensation of the system. Patented Dynamic Reference Injection further simplifies loop compensation by eliminating the need to compromise between closed−loop transient response and Dynamic VID performance. Patented Total Current Summing provides highly accurate digital current monitoring. www.onsemi.com MARKING DIAGRAM NCP 81142 ALYWG G 1 QFN32 CASE 485CD A L Y W G = Assembly Location = Wafer Lot = Year = Work Week = Pb−Free Package (Note: Microdot may be in either location) ORDERING INFORMATION See detailed ordering and shipping information in the package dimensions section on page 19 of this data sheet. Features • Meets Intel VR12.5 Specifications • Current Mode Dual Edge Modulation for Fastest Initial Response to • • • • • • • • • • • Transient Loading High Performance Operational Error Amplifier Digital Soft Start Ramp Dynamic Reference Injection Accurate Total Summing Current Amplifier Dual High Impedance Differential Voltage and Total Current Sense Amplifiers Phase−to−Phase Dynamic Current Balancing “Lossless” DCR Current Sensing for Current Balancing True Differential Current Balancing Sense Amplifiers for Each Phase Adaptive Voltage Positioning (AVP) Switching Frequency Range of 290 kHz – 590 kHz Startup into Pre−Charged Loads While Avoiding False OVP © Semiconductor Components Industries, LLC, 2015 August, 2018 − Rev. 3 • Power Saving Phase Shedding • Vin Feed Forward Ramp Slope • Over Voltage Protection (OVP) & Under Voltage Protection (UVP) • Over Current Protection (OCP) • VR−RDY Output with Internal Delays • These are Pb−Free Devices Applications • Desktop and Notebook Processors 1 Publication Order Number: NCP81142/D VSN + DAC CSCOMP CSREF CSSUM ILIM IOUT CS Amp Current Measurement & Limit − Error Amp DIFFAMP GND COMP FB DIFFOUT NCP81142 VSP CSREF VSP TSENSE Thermal Monitor VSN OVP OVP VRHOT SDIO ALERT SVID Interface Data Registers ADC MUX SCLK VSP−VSN TSENSE VBOOT IOUT IMAX ADDR CSN4 DAC DAC CSP4 CSN2 CSP2 Enable IPH4 VSP VSN DAC CSN3 IPH3 Current Balance IPH2 CSP3 IPH1 CSN1 RAMP1 RAMP2 RAMP3 RAMP4 CSP1 OVP PWM Generators COMP Enable Enable GND Ramp Generators UVLO & EN VCC ENABLE Power State Stage DRON PWM2/IMAX PWM1/INT_SEL PWM4/ROSC NCP81142 PWM3/VBOOT Enable VRMP VRDY VR Ready Comparator Figure 1. Block Diagram for NCP81142 www.onsemi.com 2 VSP VSN DIFFOUT FB COMP VRMP IOUT ILIM NCP81142 32 31 30 29 28 27 26 25 ENABLE 1 24 CSCOMP VCC 2 23 CSSUM VR_HOT# 3 22 CSREF SDIO 4 21 CSN4 NCP81142 18 CSP2 TSENSE 8 17 CSN3 9 10 11 12 13 14 15 16 CSP3 7 CSN1 VR_RDY CSP1 19 CSN2 DRON 6 PWM1/INT_SEL SCLK PWM3/IMAX 20 CSP4 PWM2/VBOOT 5 PWM4/ROSC ALERT# Figure 2. NCP81142 Pin Configurations NCP81142 PIN DESCRIPTIONS Pin No. Symbol Description 1 ENABLE 2 VCC 3 VR_HOT# 4 SDIO 5 ALERT# 6 SCLK 7 VR_RDY Open drain output. High indicates that the output is regulating 8 TSENSE Temp Sense input for the multiphase converter 9 PWM4/ROSC 10 PWM2/VBOOT Phase 2 PWM output. Also as VBOOT input pin to adjust the boot−up voltage. During start up it is used to program VBOOT with a resistor to ground 11 PWM3/IMAX Phase 3 PWM output. Also as ICC_MAX Input Pin. During start up it is used to program ICC_MAX with a resistor to ground 12 PWM1/INT_SEL 13 DRON Bidirectional gate drive enable output 14 CSP1 Non−inverting input to current balance sense amplifier for phase 1 15 CSN1 Inverting input to current balance sense amplifier for phase 1 16 CSP3 Non−inverting input to current balance sense amplifier for phase 3 Logic input. Logic high enables the output and logic low disables the output. Power for the internal control circuits. A decoupling capacitor is connected from this pin to ground Thermal logic output for over temperature Serial VID data interface Serial VID ALERT#. Serial VID clock Phase 4 PWM output. A resistance from this pin to ground programs the oscillator frequency Phase 1 PWM output. Also as Int_sel program pin. A resistor to ground on this pin programs the INT_Select value www.onsemi.com 3 NCP81142 NCP81142 PIN DESCRIPTIONS Pin No. Symbol Description 17 CSN3 Inverting input to current balance sense amplifier for phase 3. Pull this Pin to VCC, configure as 1−phase operation 18 CSP2 Non−inverting input to current balance sense amplifier for phase 2 19 CSN2 Inverting input to current balance sense amplifier for phase 2. Pull this Pin to VCC, configure as 2−phase operation 20 CSP4 Non−inverting input to current balance sense amplifier for phase 4 21 CSN4 Inverting input to current balance sense amplifier. Pull this Pin to VCC, configure as 3−phase operation 22 CSREF Total output current sense amplifier reference voltage input, a capacitor on this pin is used to ensure CSREF voltage signal integrity 23 CSSUM Inverting input of total current sense amplifier 24 CSCOMP Output of total current sense amplifier 25 ILIM Over current shutdown threshold setting. Resistor to CSCOMP to set threshold 26 IOUT Total output current monitor. 27 VRMP Feed−forward input of Vin for the ramp slope compensation. The current fed into this pin is used to control the ramp of PWM slope 28 COMP Output of the error amplifier and the inverting inputs of the PWM comparators 29 FB 30 DIFFOUT 31 VSN Inverting input to differential remote sense amplifier 32 VSP Non−inverting input to the differential remote sense amplifier 33 FLAG / GND Error amplifier voltage feedback Output of the differential remote sense amplifier Power supply return (QFN Flag) www.onsemi.com 4 NCP81142 ABSOLUTE MAXIMUM RATINGS ELECTRICAL INFORMATION Pin Symbol VMAX VMIN COMP VCC + 0.3 V −0.3 V CSCOMP VCC + 0.3 V −0.3 V VSN GND + 300 mV GND – 300 mV DIFFOUT VCC + 0.3 V −0.3 V VR_RDY VCC + 0.3 V −0.3 V VCC 6.5 V −0.3 V IOUT 2.0 V −0.3 V VRMP +25 V −0.3 V All Other Pins VCC + 0.3 V −0.3 V *All signals referenced to GND unless noted otherwise. THERMAL INFORMATION Description Thermal Characteristic QFN Package (Note 1) Operating Junction Temperature Range (Note 2) Symbol Typ Unit RqJA 68 _C/W TJ −40 to +125 _C −40 to +100 _C TSTG −40 to +150 _C Pd 110 to 131 mW MSL 1 Operating Ambient Temperature Range Maximum Storage Temperature Range Max Power Dissipation Moisture Sensitivity Level QFN Package *The maximum package power dissipation must be observed. 1. JESD 51−5 (1S2P Direct−Attach Method) with 0 LFM 2. JESD 51−7 (1S2P Direct−Attach Method) with 0 LFM www.onsemi.com 5 NCP81142 ELECTRICAL CHARACTERISTICS Unless otherwise stated: −40°C < TA < 100°C; VCC = 5 V; CVCC = 0.1 mF Parameter Test Conditions Min @ 1.3 V −27 Typ Max Unit 27 mA ERROR AMPLIFIER Input Bias Current Open Loop DC Gain CL = 20 pF to GND, RL = 10 kW to GND 80 dB Open Loop Unity Gain Bandwidth CL = 20 pF to GND, RL = 10 kW to GND 20 MHz DVin = 100 mV, G = −10 V/V, DVout = 1.5 V – 2.5 V, CL = 20 pF to GND, DC Load = 10k to GND 20 V/ms Slew Rate Maximum Output Voltage ISOURCE = 2.0 mA Minimum Output Voltage ISINK = 2.0 mA 3.5 V 1 V −15 15 uA VSP Input Voltage Range −0.3 3.0 V VSN Input Voltage Range −0.3 0.3 V DIFFERENTIAL SUMMING AMPLIFIER Input Bias Current −3dB Bandwidth Closed Loop DC gain VSP, VSN = 1.3 V CL = 20 pF to GND, RL = 10 kW to GND VS+ to VS− = 0.5 to 1.3 V 10 MHz 1.0 V/V CURRENT SUMMING AMPLIFIER Offset Voltage (Vos) Input Bias Current CSSUM = CSREF= 1 V −300 300 mV −10 10 mA Open Loop Gain Current Sense Unity Gain Bandwidth CL = 20 pF to GND, RL = 10 kW to GND 80 dB 10 MHz CURRENT BALANCE AMPLIFIER Maximum CSCOMP Output Voltage Isource = 2 mA Minimum CSCOMP Output Voltage Isink = 500 mA Input Bias Current 3.5 V 0.1 CSP1−4 = CSN1−4 = 1.2 V nA −50 50 Common Mode Input Voltage Range CSPx = CSNx 0 2.3 V Differential Mode Input Voltage Range CSNx = 1.2 V −100 100 mV Input Offset Voltage Matching CSPx = CSNx = 1.2 V, Measured from the average −1.5 1.5 mV Current Sense Amplifier Gain 0 V < CSPx − CSNx < 0.1 V, 5.7 6.3 V/V Multiphase Current Sense Gain Matching CSP−CSN = 10 mV to 30 mV −3 3 % −3dB Bandwidth 6.0 8 MHz INPUT SUPPLY 4.75 Supply Voltage Range VCC Quiescent Current 5.25 V EN = high, PS0,1,2 Mode 25 mA EN = high, PS3 Mode 15 mA EN = low 30 mA 3. Guaranteed by design or characterization data, not in production test. www.onsemi.com 6 NCP81142 ELECTRICAL CHARACTERISTICS Unless otherwise stated: −40°C < TA < 100°C; VCC = 5 V; CVCC = 0.1 mF Parameter Test Conditions Min Typ Max Unit 4.5 V INPUT SUPPLY UVLO Threshold VCC rising VCC falling 4 VCC UVLO Hysteresis V 160 UVLO Threshold VRMP rising VRMP failing mV 4.2 3 V V DAC SLEW RATE Soft Start Slew Rate 5 mv/ms Slew Rate Slow 5 mv/ms Slew Rate Fast 20 mv/ms ENABLE INPUT Enable High Input Leakage Current External 1k pull−up to 3.3 V Upper Threshold VUPPER Lower Threshold VLOWER Total Hysteresis VUPPER – VLOWER Enable Delay Time 1.0 0.8 mA V 0.3 90 Measure time from Enable transitioning HI to when DRON goes high V mV 5 ms DRON Output High Voltage Sourcing 500 mA V Sinking 500 mA Output Low Voltage Rise Time 3.0 0.1 CL (PCB) = 20 pF, DVo = 10% to 90% Fall Time Internal Pull Down Resistance EN = Low V 156 ns 55 ns 70 kW IOUT OUTPUT Ilimit to CSREF Input Referred Offset Voltage Output Source Current Current Gain −3.5 Ilimit sink current = 80 mA (IOUTCURRENT) / (ILIMITCURRENT), RILIM = 20k, RIOUT = 5.0k , DAC = 0.8 V, 1.25 V, 1.52 V 9.5 10 3.5 mV 850 mA 10.5 OSCILLATOR 290 Switching Frequency Range 4 Phase Operation 590 KHz 600 kHz OUTPUT OVER VOLTAGE & UNDER VOLTAGE PROTECTION (OVP & UVP) CSREF 2.75 2.9 3 V VSP rising 350 400 425 mV Absolute Over Voltage Threshold During Soft Start Over Voltage Threshold Above DAC Over Voltage Delay VSP rising to PWMx low 50 ns Under Voltage Ckt in development 300 mV Under−voltage Delay Ckt in development 5 ms 3. Guaranteed by design or characterization data, not in production test. www.onsemi.com 7 NCP81142 ELECTRICAL CHARACTERISTICS Unless otherwise stated: −40°C < TA < 100°C; VCC = 5 V; CVCC = 0.1 mF Parameter Test Conditions Min Typ Max Unit ILIM Threshold Current (OCP shutdown after 50 ms delay) (PS0) Rlim = 20k 9.0 10 11.0 mA ILIM Threshold Current (immediate OCP shutdown) (PS0) Rlim = 20k 13.5 15 16.5 mA ILIM Threshold Current (OCP shutdown after 50 ms delay) (PS1, PS2, PS3) Rlim = 20k, N = number of phases in PS0 mode 10/N mA ILIM Threshold Current (immediate OCP shutdown) (PS1, PS2, PS3) Rlim = 20k, N = number of phases in PS0 mode 15/N mA COMP voltage when the PWM outputs remain LO 1.3 V 100% Duty Cycle COMP voltage when the PWM outputs remain HI VRMP = 12.0 V 2.5 V PWM Ramp Duty Cycle Matching COMP = 2 V, PWM Ton matching 1 % PWM Phase Angle Error Between adjacent phases at 25° OVERCURRENT PROTECTION MODULATORS (PWM Comparators) 0% Duty Cycle Ramp Feed−forward Voltage range 5 5 deg 20 V 0.3 V 1.0 mA VR_HOT# Output Low Voltage Output Leakage Current I_VRHOT = −4 mA High Impedance State −1.0 TSENSE Alert# Assert Threshold 491 mV Alert# De−assert Threshold 513 mV VRHOT Assert Threshold 472 mV VRHOT Rising Threshold 494 mV TSENSE Bias Current 115 120 125 mA ADC Voltage Range 0 2 V Total Unadjusted Error (TUE) −1 +1 % 1 LSB Differential Nonlinearity (DNL) 8−bit Power Supply Sensitivity ±1 % Conversion Time 30 ms Round Robin 90 ms VR_RDY, (Power Good) OUTPUT IVR_RDY = 4 mA Output Low Saturation Voltage 0.3 V Rise Time External pull−up of 1 kW to 3.3 V, CTOT = 45 pF, DVo = 10% to 90% 100 ns Fall Time External pull−up of 1 kW to 3.3 V, CTOT = 45 pF, DVo = 90% to 10% 10 ns Output Voltage at Power−up VR_RDY pulled up to 5 V via 2 kW 1.0 V Output Leakage Current When High VR_RDY = 5.0 V −1.0 1.0 mA VR_RDY Delay (rising) DAC=TARGET to VR_RDY 5 ms VR_RDY Delay (falling) From OCP or OVP 5 ms 3. Guaranteed by design or characterization data, not in production test. www.onsemi.com 8 NCP81142 ELECTRICAL CHARACTERISTICS Unless otherwise stated: −40°C < TA < 100°C; VCC = 5 V; CVCC = 0.1 mF Parameter Test Conditions Min Typ Max Unit Output High Voltage Sourcing 500 mA VCC – 0.2V − − V Output Mid Voltage No Load, SetPS = 02 1.9 2.0 2.1 V Output Low Voltage Sinking 500 mA 0.7 V Rise and Fall Time CL (PCB) = 50 pF, DVo = GND to VCC PWM OUTPUTS 10 ns CSN Pin Threshold Voltage 4.5 V Phase Detect Timer 50 ms PHASE DETECTION 3. Guaranteed by design or characterization data, not in production test. STATE TRUTH TABLE STATE VR_RDY Pin Error AMP Comp Pin OVP & UVP DRON Pin POR 0 < VCC < UVLO N/A N/A N/A Resistive pull down Disabled EN < threshold UVLO > threshold Low Low Disabled Low Start up Delay & Calibration EN > threshold UVLO > threshold Low Low Disabled Low DRON Fault EN > threshold UVLO > threshold DRON < threshold Low Low Disabled Resistive pull up Soft Start EN > threshold UVLO > threshold DRON > High Low Operational Active / No latch High Normal Operation EN > threshold UVLO >threshold DRON > High High Operational Active / Latching High Over Voltage Low N/A DAC + 150 mV High Over Current Low Operational Last DAC Code Low VOUT = 0 V Low: if Reg34h:bit0 = 0; High:if Reg34h:bit0 = 1 Clamped at 0.9 V Disabled High, PWM outputs in low state www.onsemi.com 9 Method of Reset Driver must release DRON to high N/A NCP81142 (VCCANDVRMP) > UVLO Disable Controller POR EN = 1 VCC < UVLO OR VRMP < UVLO Calibrate Cal Done Phase Detection and Power On Configuration POC done Set DRVON High VCCP > UVLO and DRVON High EN = 0 Check VBoot VBoot > 0V DRVON Latch off Turn off Drive VBoot = 0 V DRVON Pulled Low Wait for SVID command DRVON Pulled Low DRVON Pulled Low EN = 0 First VID code programmed EN = 0 Boost Cap Refresh Boost cap done OVP Latch off. VR_RDY = Low Ramp output to 0V then force LS ON CSREF OVP occurs Soft Start Ramp Current Limit Occurs Soft start done Turn off Drive VR_RDY = Low. Maintain DAC voltage and monitor for OVP Current Limit Occurs (DAC + 400mV) OVP or CSREF OVP occurs Normal Operation, VR_RDY = High DAC = VID/offset programmed. Power state = PS programmed (DAC + 400mV) OVP or CSREF OVP occurs DRVON Pulled Low EN = 0 UVP Occurs VR_RDY = Low DAC = VID/offset programmed. Power state = PS programmed Figure 3. www.onsemi.com 10 NCP81142 General The NCP81142 is a four phase dual edge modulated multiphase PWM controller, designed to meet the Intel VR12.5 specifications with a serial SVID control interface. It is designed to work in notebook, desktop, and server applications. Serial VID interface (SVID) For SVID Interface communication details please contact Intel Inc. BOOT VOLTAGE PROGRAMMING The NCP81142 has a Vboot voltage that can be externally programmed. The Boot voltage for the NCP81142 is set using VBOOT pin on power up. A 10uA current is sourced from the VBoot pin and the resulting voltage is measured. This is compared with the thresholds in table below. This value is set on power up and cannot be changed after the initial power up sequence is complete. BOOT VOLTAGE TABLE R VBoot Phase Number in PS1 30.1k 0V 1 49.9k 1.65 V 1 69.8k 1.70 V 1 90.9k 1.75 V 1 130k 0V 2 150k 1.65 V 2 169k 1.70 V 2 Open 1.75 V 2 Remote Sense Amplifier A high performance high input impedance true differential amplifier is provided to accurately sense the output voltage of the regulator. The VSP and VSN inputs should be connected to the regulator’s output voltage sense points. The remote sense amplifier takes the difference of the output voltage with the DAC voltage and adds the droop voltage to V DIFOUT + ǒV VSP * V VSNǓ ) ǒ1.3 V * V DACǓ ) ǒV DROOP * V CSREFǓ This signal then goes through a standard error compensation network and into the inverting input of the error amplifier. The non−inverting input of the error amplifier is connected to the same 1.3 V reference used for the differential sense amplifier output bias. High Performance Voltage Error Amplifier The Remote Sense Amplifier output is applied to a Type 3 compensation network formed by the error amplifier and external tuning components. The non−inverting input of the error amplifier is connected to the same reference voltage used to bias the Remote Sense Amplifier output. The integrating function of the Type 3 feedback compensation is performed internally and does not require external capacitor Cf1 (see below). Rf Rin2 Vbias + _ Cin Cf Rin1 Cf1 Cin Rin2 COMP ERROR Vbias Figure 4. Traditional Type 3 External Compensation Rf + _ Cf Rin1 COMP ERROR Figure 5. NCP81142 Modified Type 3 External Compensation Initial tuning should be based on traditional Type 3 compensation. When ideal Type 3 component values have been determined, the closest setting for the internal integrator is should be chosen based on the following table and Rin value used. www.onsemi.com 11 NCP81142 Rin1 = 1k, Rf = 3k IN NEW CONTROLLER Address Resistor Divider Gain from Digital Integrator Equivalent Cf1 in Type III Network Equivalent Rf in Type III Network 10k 1 0.079n 3000 22k 2 0.157n 3000 26k 4 0.32n 3000 51k 8 0.63n 3000 68k 10 0.79n 3000 91k 12 0.95n 3000 120k 16 1.26n 3000 160k 32 2.52n 3000 220k 64 5.04n 3000 Address Resistor Divider Gain from Digital Integrator Equivalent Cf1 in Type III Network Equivalent Rf in Type III Network 10k 1 0.047n 5000 22k 2 0.094n 5000 26k 4 0.19n 5000 51k 8 0.38n 5000 68k 10 0.47n 5000 91k 12 0.57n 5000 120k 16 0.76n 5000 160k 32 1.51n 5000 220k 64 3.02n 5000 Address Resistor Divider Gain from Digital Integrator Equivalent Cf1 in Type III Network Equivalent Rf in Type III Network 10k 1 0.031n 7500 22k 2 0.063n 7500 26k 4 0.13n 7500 51k 8 0.25n 7500 68k 10 0.32n 7500 91k 12 0.38n 7500 120k 16 0.50n 7500 160k 32 1.01n 7500 220k 64 2.02n 7500 Address Resistor Divider Gain from Digital Integrator Equivalent Cf1 in Type III Network Equivalent Rf in Type III Network 10k 1 0.024n 10000 22k 2 0.047n 10000 26k 4 0.09n 10000 Rin1 = 1k, Rf = 5k IN NEW CONTROLLER Rin1 = 1k, Rf = 7.5k IN NEW CONTROLLER Rin1 = 1k, Rf = 10k IN NEW CONTROLLER www.onsemi.com 12 NCP81142 Rin1 = 1k, Rf = 10k IN NEW CONTROLLER Address Resistor Divider Gain from Digital Integrator Equivalent Cf1 in Type III Network Equivalent Rf in Type III Network 51k 8 0.19n 10000 68k 10 0.24n 10000 91k 12 0.28n 10000 120k 16 0.38n 10000 160k 32 0.76n 10000 220k 64 1.51n 10000 Optimization of the traditional Type 3 compensation should be rechecked using the closest Type 3 Cf1 equivalent in order to determine if readjustment of other component values is needed. Differential Current Feedback Amplifiers CSNx RCSN CSPx Each phase has a low offset differential amplifier to sense that phase current for current balance. The inputs to the CSNx and CSPx pins are high impedance inputs. It is recommended that any external filter resistor RCSN does not exceed 10 kW to avoid offset issues with leakage current. It is also recommended that the voltage sense element be no less than 0.5 mW for accurate current balance. Fine tuning of this time constant is generally not required. The individual phase current is summed into the PWM comparator feedback this way current is balanced via a current mode control approach. CCSN R CSN + SWNx VOUT DCR L PHASE C CSN * DCR LPHASE 1 2 Figure 6. Total Current Sense Amplifier The NCP81142 uses a patented approach to sum the phase currents into a single temperature compensated total current signal. This signal is then used to generate the output voltage droop, total current limit, and the output current monitoring functions. The total current signal is floating with respect to CSREF. The current signal is the difference between CSCOMP and CSREF. The Ref(n) resistors sum the signals from the output side of the inductors to create a low impedance virtual ground, the capacitor is used to ensure that the CSREF voltage signal integrity. The amplifier actively filters and gains up the voltage applied across the inductors to recover the voltage drop across the inductor series resistance (DCR). Rth is placed near an inductor to sense the temperature of the inductor. This allows the filter time constant and gain to be a function of the Rth NTC resistor and compensate for the change in the DCR with temperature. www.onsemi.com 13 NCP81142 Rref1 10 CSN1 Rref2 10 Rfer3 10 Rref4 10 Cref 1nF CSN2 0 CSN3 U1A CSN4 CSREF + CSSUM CSCOMP − Ccs1 Rph1 SWN1 Ccs2 Rph2 SWN2 R10 R9 Rph3 SWN3 R R Rph4 SWN4 t RT1 100k Figure 7. The DC gain equation for the current sensing: Rcs1*Rth V CSCOMP−CSREF + Rcs2 ) Rcs1)Rth Rph * ǒIout Total * DCRǓ Set the gain by adjusting the value of the Rph resistors. The DC gain should be set to the output voltage droop. If the voltage from CSCOMP to CSREF is less than 100 mV at ICCMAX then it is recommend increasing the gain of the CSCOMP amp. This is required to provide a good current signal to offset voltage ratio for the ILIMIT pin. When no droop is needed, the gain of the amplifier should be set to provide ~100mV across the current limit programming resistor at full load. The values of Rcs1 and Rcs2 are set based on the 100k NTC and the temperature effect of the inductor and should not need to be changed. The NTC should be placed near the closest inductor. The output voltage droop should be set with the droop filter divider. The pole frequency in the CSCOMP filter should be set equal to the zero from the output inductor. This allows the circuit to recover the inductor DCR voltage drop current signal. Ccs1 and Ccs2 are in parallel to allow for fine tuning of the time constant using commonly available values. It is best to fine tune this filter during transient testing. Fz + DCR@25° C 2 * PI * L Phase Programming the Current Limit The current limit thresholds are programmed with a resistor between the ILIMIT and CSCOMP pins. The ILIMIT pin mirrors the voltage at the CSREF pin and mirrors the sink current internally to IOUT (reduced by the IOUT Current Gain) and the current limit comparators. The 100% current limit trips if the ILIMIT sink current exceeds 10 mA for 50 ms. The 150% current limit trips with minimal delay if the ILIMIT sink current exceeds 15 mA. Set the value of the current limit resistor based on the CSCOMP−CSREF voltage as shown below. Rcs1*Rth Rcs2)Rcs1)Rth R LIMIT + Rph * ǒIout LIMIT * DCRǓ 10m or R LIMIT + lV CSCOMP−CSREF@ILIMIT 10m Programming IOUT The IOUT pin sources a current in proportion to the ILIMIT sink current. The voltage on the IOUT pin is monitored by the internal A/D converter and should be scaled with an external resistor to ground such that a load equal to ICCMAX generates a 2 V signal on IOUT. A pull−up resistor from 5 V VCC can be used to offset the IOUT signal positive if needed. 2.0 V * R LIMIT R IOUT + Rcs1*Rth Rcs1)Rth Rph Rcs2) 10 * * ǒIout ICC_MAX * DCRǓ www.onsemi.com 14 NCP81142 Programming ICC_MAX A resistor to Ground is monitored on startup and this sets the ICC_MAX value. 10 mA is sourced from these pins to generate a voltage on the program resistor. The resistor value should be no less than 10k. ICC_MAX + R * 10 mA * 256 A 2V Programming TSENSE A temperature sense inputs are provided. A precision current is sourced out the output of the TSENSE pin to generate a voltage on the temperature sense network. The voltage on the temperature sense input is sampled by the internal A/D converter. A 100k NTC similar to the VISHAY ERT−J1VS104JA should be used. Rcomp1 is mainly used for noise. See the specification table for the thermal sensing voltage thresholds and source current. TSENSE Rcomp1 0.0 Cfilter 0.1uF Rcomp2 8.2K AGND RNTC 100K AGND Figure 8. Precision Oscillator A programmable precision oscillator is provided. The clock oscillator serves as the master clock to the ramp generator circuit. This oscillator is programmed by a resistor to ground on the ROSC pin. The oscillator frequency range is between 280 kHz to 650 kHz on the NCP81142 The graph below lists the resistor options and associated frequency setting. NCP81142 Operating Frequency vs. Rosc Figure 9. NCP81142 Rosc vs. Frequency www.onsemi.com 15 NCP81142 The oscillator generates triangle ramps that are 0.5~2.5 V in amplitude depending on the VRMP pin voltage to provide input voltage feed forward compensation. The ramps are equally spaced out of phase with respect to each other. Programming the Ramp Feed−Forward Circuit The ramp generator circuit provides the ramp used by the PWM comparators. The ramp generator provides voltage feed−forward control by varying the ramp magnitude with respect to the VRMP pin voltage. The VRMP pin also has a 4 V UVLO function. The VRMP UVLO is only active after the controller is enabled. The VRMP pin is high impedance input when the controller is disabled. The PWM ramp time is changed according to the following, V RAMPpkäpkPP + 0.1 * V VRMP Vin Vramp_pp Comp−IL Duty PWM Comparators The noninverting input of the comparator for each phase is connected to the summed output of the error amplifier (COMP) and each phase current (IL*DCR*Phase Balance Gain Factor). The inverting input is connected to the oscillator ramp voltage with a 1.3 V offset. The operating input voltage range of the comparators is from 0 V to 3.0 V and the output of the comparator generates the PWM output. During steady state operation, the duty cycle is centered on the valley of the sawtooth ramp waveform. The steady state duty cycle is still calculated by approximately Vout/Vin. During a transient event, the controller will operate in a hysteretic mode with the duty cycles pull in for all phases as the error amp signal increases with respect to all the ramps. PHASE DETECTION SEQUENCE During start−up, the number of operational phases and their phase relationship is determined by the internal circuitry monitoring the CSN Pins. Normally, NCP81142 operates as a 4−phase Vcore PWM controller. Connecting CSN4 pin to VCC programs 3−phase operation, connecting CSN2 and CSN4 pin to VCC programs 2−phase operation, connecting CSN2, CSN3 and CSN4 pin to VCC programs 1−phase operation. Prior to soft start, while ENABLE is high, CSN4 to CSN2 pins sink approximately 50 mA. An internal comparator checks the voltage of each pin versus a threshold of 4.5 V. If the pin is tied to VCC, its voltage is above the threshold. Otherwise, an internal current sink pulls the pin to GND, which is below the threshold. PWM1 is low during the phase detection interval, which takes 30 ms. After this time, if the remaining CSN outputs are not pulled to VCC, the 50 mA current sink is removed, and NCP81142 functions as normal 4 phase controller. If the CSNs are pulled to VCC, the 50 mA current source is removed, and the outputs are driven into a high impedance state. The PWM outputs are logic−level devices intended for driving fast response external gate drivers such as the NCP5901 and NCP5911 .Because each phase is monitored independently, operation approaching 100% duty cycle is possible. In addition, more than one PWM output can be on at the same time to allow overlapping phases. PROTECTION FEATURES Under voltage Lockouts There are several under voltage monitors in the system. Hysteresis is incorporated within the comparators. NCP81142 monitors the VCC Shunt supply. The gate driver monitors both the gate driver VCC and the BST voltage. When the voltage on the gate driver is insufficient it will pull DRON low and prevents the controller from being enabled. The gate driver will hold DRON low for a minimum period of time to allow the controller to hold off it’s startup sequence. In this case the PWM is set to the MID state to begin soft start. Gate Driver UVLO Restart www.onsemi.com 16 NCP81142 Figure 10. Soft Start Soft start is implemented internally. A digital counter steps the DAC up from zero to the target voltage based on the predetermined rate in the spec table. The PWM signals will start out open with a test current to collect data on phase count and for setting internal registers. After the configuration data is collected, if the controller is enabled the PWMs will be set to 2.0 V MID state to indicate that the drivers should be in diode mode. DRON will then be asserted. As the DAC ramps the PWM outputs will begin to fire. Each phase will move out of the MID state when the first PWM pulse is produced. When the controller is disabled the PWM signal will return to the MID state. Figure 11. Over Current Latch− Off Protection The NCP81142 compares a programmable current−limit set point to the voltage from the output of the current−summing amplifier. The level of current limit is set with the resistor from the ILIM pin to CSCOMP. The current through the external resistor connected between ILIM and CSCOMP is then compared to the internal current limit current ICL. If the current generated through this resistor into the ILIM pin (Ilim) exceeds the internal current−limit threshold current (ICL), an internal latch−off counter starts, and the controller shuts down if the fault is not removed after 50 ms (shut down immediately for 150% load current) after which the outputs will remain disabled until the VCC voltage or EN is toggled. www.onsemi.com 17 NCP81142 On startup a clim1/clim2 current limit protection is enabled once the output voltage has exceeded 250 mV or if the internal DAC voltage has increased above 300 mV, this allow for protection again a Vout short to ground. This is necessary because the voltage swing of CSCOMP cannot go below ground. This limits the voltage drop across the DCR through the current balance circuitry. The over−current limit is programmed by a resistor on the ILIM pin. The resistor value can be calculated by the following equation: R ILIM + I LIM * DCR * R CSńR PH I CL Where ICL = 10 mA CSSUM RCS RPH RPH RPH RPH CSCOMP RLIM ILIM CSREF Figure 12. Under Voltage Monitor The output voltage is monitored at the output of the differential amplifier for UVLO. If the output falls more than 300mV below the DAC−DROOP voltage the UVLO comparator will trip sending the VR_RDY signal low. Over Voltage Protection The output voltage is also monitored at the output of the differential amplifier for OVP. During normal operation, if the output voltage exceeds the DAC voltage by 400 mV, the VR_RDY flag goes low, and the DAC will be ramped down to 0 V. At the same time, the high side gate drivers are all turned off and the low side gate drivers are all turned on until the voltage falls to new DAC voltage 0.2 V. The part will stay in this mode until the VCC voltage or EN is toggled. OVP Threshold Behavior VCC UVLO RISING OVP Threshold DAC + ~400 mV 2.9 V DAC DRON Figure 13. OVP Threshold Behavior www.onsemi.com 18 NCP81142 OVP Behavior at Startup OVP Threshold 2.9 V Vout DAC DRON PWM Figure 14. OVP Behavior at Startup OVP Threshold DAC VSP_VSN OVP Triggered Latch Off PWM Figure 15. OVP During Normal Operation Mode During start up, the OVP threshold is set to 2.9 V. This allows the controller to start up without false triggering the OVP. ORDERING INFORMATION Device NCP81142MNTXG Package Shipping† QFN32 (Pb−Free) 4000 / Tape & Reel †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. Intel is a registered trademark of Intel Corporation in the U.S. and/or other countries. www.onsemi.com 19 MECHANICAL CASE OUTLINE PACKAGE DIMENSIONS QFN32 4x4, 0.4P CASE 485CD ISSUE A 1 DATE 09 OCT 2012 SCALE 2:1 ÇÇÇ ÇÇÇ ÇÇÇ ÇÇÇ PIN ONE REFERENCE B A D L L L1 DETAIL A E ALTERNATE TERMINAL CONSTRUCTIONS EXPOSED Cu TOP VIEW A 0.05 C MOLD CMPD DETAIL B ALTERNATE CONSTRUCTION A3 GENERIC MARKING DIAGRAM* 0.05 C DETAIL B NOTE 4 A1 SIDE VIEW SEATING PLANE C XXXXXX XXXXXX ALYWG G 0.10 C A B DETAIL A D2 9 K 4X K2 XXXXX A L Y W G 17 32X L DETAIL C CORNER LEAD CONSTRUCTION E2 1 DETAIL C e BOTTOM VIEW 32X b 0.07 M C A B 0.05 M C = Specific Device Code = Assembly Location = Wafer Lot = Year = Work Week = Pb−Free Package (Note: Microdot may be in either location) *This information is generic. Please refer to device data sheet for actual part marking. Pb−Free indicator, “G”, may or not be present. 0.10 C A B 25 MILLIMETERS MIN MAX 0.80 1.00 0.00 0.05 0.20 REF 0.15 0.25 4.00 BSC 2.60 2.80 4.00 BSC 2.60 2.80 0.40 BSC 0.30 REF 0.45 REF 0.25 0.45 −−− 0.15 DIM A A1 A3 b D D2 E E2 e K K2 L L1 ÉÉ ÉÉ 0.10 C 0.10 C NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: MILLIMETERS. 3. DIMENSION b APPLIES TO PLATED TERMINAL AND IS MEASURED BETWEEN 0.15 AND 0.30 MM FROM TERMINAL TIP. 4. COPLANARITY APPLIES TO THE EXPOSED PAD AS WELL AS THE TERMINALS. RECOMMENDED MOUNTING FOOTPRINT NOTE 3 4.30 2.80 PACKAGE OUTLINE 32X 0.58 1 2.80 8X 4.30 C0.08 0.40 PITCH DOCUMENT NUMBER: DESCRIPTION: 98AON66248E QFN32 4X4, 0.4P 32X 0.25 DIMENSIONS: MILLIMETERS Electronic versions are uncontrolled except when accessed directly from the Document Repository. Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red. 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