NLAS7213MUTAG

NLAS7213 High-Speed USB 2.0 (480 Mbps) DPST Switch The NLAS7213 is a DPST switch optimized for high−speed USB 2.0 applications within portable systems. It features ultra−low off capacitance, COFF = 3.0 pF (typ), and a bandwidth above 1118 MHz. It is optimized for applications that use a single USB interface connector to route multiple signal types. The CON and RON of both switches are suitably low to allow the NLAS7213 to pass any speed USB data or audio signals going to a moderately resistive terminal such as an external headset. The NLAS7213 is protected on all pins with 8 kV Human Body Model ESD protection. It is offered in a 1.5 x 1.5 mm UQFN8 package. Features • • • • • • • • www.onsemi.com MARKING DIAGRAM 1 8 UQFN8 (1.5 x 1.5 mm) CASE 523AH 1 AA MG G AA = Specific Device Code M = Date Code G = Pb−Free Package RON: 8.5  Max @ VCC = 3.3 V COFF: 3.0 pF Typ @ VCC = 3.3 V VCC Operating Range: 1.65 V to 4.5 V > 1118 MHz Bandwidth OVT up to 5.25 V on D+/D− Pins 1.5 x 1.5 x 0.55 mm UQFN8 8 kV ESD Protection on All Pins This is a Pb−Free Device (Note: Microdot may be in either location) ORDERING INFORMATION See detailed ordering and shipping information in the package dimensions section on page 8 of this data sheet. Typical Applications • High Speed USB 2.0 Data • Mobile Phones • Portable Devices USB CONNECTOR NLAS7213 FS USB XCVR or AUDIO AMP HS USB XCVR Figure 1. Application Diagram © Semiconductor Components Industries, LLC, 2014 November, 2014 − Rev. 5 1 Publication Order Number: NLAS7213/D NLAS7213 NC HSD− D− 7 6 5 Table 1. PIN DESCRIPTION Pin Function OE Control Input Select Line VCC CONTROL HSD+, HSD−, D+, D− 8 Data Ports Table 2. TRUTH TABLE GND 4 1 2 3 OE HSD+ D+ OE Both Switches 1 0 OPEN CLOSED Figure 2. Pin Connections and Logic Diagram (Top View) MAXIMUM RATINGS Symbol Pins VCC VCC VIS HSD+, HSD− Parameter Value Unit −0.5 to +4.6 V −0.5 to VCC + 0.3 V Positive DC Supply Voltage Analog Signal Voltage D+, D− −0.5 to +5.25 VIN OE Control Input Voltage ICC VCC Positive DC Supply Current TS Storage Temperature −0.5 to +4.6 V 50 mA −65 to +150 °C IIS_CON HSD+, HSD−, D+, D− Analog Signal Continuous Current−Closed Switch $300 mA IIS_PK HSD+, HSD−, D+, D− Analog Signal Continuous Current 10% Duty Cycle $500 mA Control Input Current $20 mA IIN OE Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality should not be assumed, damage may occur and reliability may be affected. RECOMMENDED OPERATING CONDITIONS Symbol Pins VCC VIS HSD+, HSD− Parameter Min Max Unit Positive DC Supply Voltage 1.65 4.5 V Analog Signal Voltage GND VCC V GND 4.5 GND VCC V −40 +85 °C D+, D− VIN OE TA Digital Select Input Voltage Operating Temperature Range Functional operation above the stresses listed in the Recommended Operating Ranges is not implied. Extended exposure to stresses beyond the Recommended Operating Ranges limits may affect device reliability. ESD PROTECTION Symbol ESD Parameter Human Body Model − All Pins www.onsemi.com 2 Value Unit 8.0 kV NLAS7213 DC ELECTRICAL CHARACTERISTICS CONTROL INPUT (Typical: T = 25°C, VCC = 3.3 V) −40°C to +85°C Symbol Pins Parameter Test Conditions VCC (V) Min Typ Max Unit VIH OE Control Input HIGH Voltage 2.7 3.3 4.2 1.3 1.3 1.4 − − V VIL OE Control Input LOW Voltage 2.7 3.3 4.2 − − 0.4 0.4 0.4 V IIN OE Control Input Leakage Current 1.65 − 4.5 − − ±1.0 A VIS = GND SUPPLY CURRENT AND LEAKAGE (Typical: T = 25°C, VCC = 3.3 V, VIN = VCC or GND) −40°C to +85°C Symbol ICC INC(OFF) Pins VCC HSD+, HSD− IOFF Test Conditions VCC (V) Min Quiescent Supply Current VIS = VCC or GND; ID = 0 A 1.65 − 4.5 − − 1.0 A OFF State Leakage Current VCOM = 3.6 V, VNC = 1.0 V 1.65 − 4.5 − − ±1.0 A Power OFF Leakage Current VIS = GND 0 − − ±1.0 A Parameter Typ Max Unit ON RESISTANCE (Typical: T = 25°C, VCC = 3.3 V) −40°C to +85°C Symbol Pins Parameter Test Conditions VCC (V) Min Typ Max Unit RON On−Resistance ION = −8 mA VIS = 0 to 0.4 V 2.7 3.3 4.2 − 9.0 8.0 7.2 9.5 8.5 7.5  RFLAT On−Resistance Flatness ION = −8 mA VIS = 0 to 0.4 V 2.7 3.3 4.2 − 0.8 0.5 0.3 −  RON On−Resistance Matching ION = −8 mA VIS = 0 to 0.4 V 2.7 3.3 4.2 − 0.07 0.07 0.04 −  Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product performance may not be indicated by the Electrical Characteristics if operated under different conditions. www.onsemi.com 3 NLAS7213 AC ELECTRICAL CHARACTERISTICS TIMING/FREQUENCY (Typical: T = 25°C, VCC = 3.3 V, RL = 50 , CL = 35 pF, f = 1 MHz) −405C to +855C Symbol Pins Parameter Test Conditions VCC (V) Min Typ Max Unit tON Turn−ON Time (Figures 6, 7) 1.65 − 4.5 − 13.0 30.0 ns tOFF Turn−OFF Time (Figures 6, 7) 1.65 − 4.5 − 12.0 25.0 ns tPD Propagation Delay 1.65 − 4.5 − 0.25 − ns BW −3 dB Bandwidth 1.65 − 4.5 − 1118 − MHz CL = 5 pF ISOLATION (Typical: T = 25°C, VCC = 3.3 V, RL = 50 , CL = 5 pF) −405C to +855C Symbol Pins Parameter Test Conditions Min Typ Max Unit OIRR Open OFF−Isolation f = 240 MHz − −20 − dB XTALK HSD+, HSD− Non−Adjacent Channel Crosstalk f = 240 MHz − −30 − dB CAPACITANCE (Typical: T = 25°C, VCC = 3.3 V, f = 1 MHz) −405C to +855C Min Typ Max Unit Control Pin Input Capacitance VIS = 3.3 Vp−p, VCC = 0 V − 2.0 − pF I/O to GND ON Capacitance VIS = 3.3 Vp−p, OE = 0 V − 3.0 − pF I/O to GND OFF Capacitance VIS = 3.3 Vp−p, OE = 3.3 V − 3.0 − pF Symbol Pins CIN OE CON COFF Parameter Test Conditions www.onsemi.com 4 NLAS7213 0.0007 0.0001 0.00009 0.0006 VCC 4.3 V 0.00008 VCC 4.3 V 0.00007 0.0004 0.0003 VCC 3.6 V 0.0002 VCC 3.0 V ICC (A) ICC (A) 0.0005 0.00006 VCC 3.6 V 0.00005 0.00004 0.00003 VCC 3.0 V 0.00002 0.0001 0.0000 0 0.00001 0.4 0.8 1.2 1.6 2 2.4 2.8 3.2 3.6 0 0 4 0.4 0.8 1.2 1.6 2.0 2.4 2.8 3.2 3.6 4.0 Vin (V) Vin (V) Figure 3. ICC vs. Vin Figure 4. ICC vs. Vin VCC DUT VCC Input Output GND VOUT 0.1 F 50  35 pF tBMM Output 50 % OF DROOP VOLTAGE DROOP Switch Select Pin Figure 5. tBBM (Time Break−Before−Make) VCC Input DUT VCC 0.1 F 50% Output VOUT Open 50% 0V 50  VOH 90% 35 pF 90% Output VOL Input tON Figure 6. tON/tOFF VCC VCC Input DUT Output 50  50% 50% 0V VOUT Open tOFF VOH 35 pF Output Input Figure 7. tON/tOFF www.onsemi.com 5 10% 10% VOL tOFF tON NLAS7213 50  Reference DUT Transmitted Input Output 50  Generator 50  Channel switch control/s test socket is normalized. Off isolation is measured across an off channel. On loss is the bandwidth of an On switch. VISO, Bandwidth and VONL are independent of the input signal direction. ǒVVOUT Ǔ for VIN at 100 kHz IN VOUT Ǔ for VIN at 100 kHz to 50 MHz VONL = On Channel Loss = 20 Log ǒ VIN VISO = Off Channel Isolation = 20 Log Bandwidth (BW) = the frequency 3 dB below VONL VCT = Use VISO setup and test to all other switch analog input/outputs terminated with 50  Figure 8. Off Channel Isolation/On Channel Loss (BW)/Crosstalk (On Channel to Off Channel)/VONL www.onsemi.com 6 NLAS7213 Figure 9. Signal Quality Figure 10. Near End Eye Diagram www.onsemi.com 7 NLAS7213 Near End Test Data Std. NO Consecutive Jitter Range −44.80 76.30 ps Paired JK Jitter Range −63.59 56.33 ps Paired KJ Jitter Range −44.15 45.68 ps Consecutive Jitter Range −58.40 90.58 ps Paired JK Jitter Range −65.90 70.64 ps Paired KJ Jitter Range −52.43 55.14 ps Min Max −200 ps +200 ps −200 ps +200 ps ORDERING INFORMATION Device NLAS7213MUTBG Package Shipping† UQFN8 (Pb−Free) 3000 / Tape & Reel †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. www.onsemi.com 8 MECHANICAL CASE OUTLINE PACKAGE DIMENSIONS UQFN8, 1.5x1.5, 0.5P CASE 523AH−01 ISSUE O 1 8 SCALE 4:1 A B D PIN ONE REFERENCE 2X 0.10 C ÉÉ ÉÉ DATE 08 NOV 2007 NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: MILLIMETERS. 3. DIMENSION b APPLIES TO PLATED TERMINAL AND IS MEASURED BETWEEN 0.15 AND 0.30 mm FROM TERMINAL. L L1 E DETAIL A OPTIONAL CONSTRUCTION 2X 0.10 C EXPOSED Cu TOP VIEW (A3) DETAIL B A 0.05 C 8X A1 C A1 ÉÉ ÉÉ A3 DETAIL B OPTIONAL CONSTRUCTION 0.05 C SIDE VIEW MOLD CMPD SEATING PLANE DIM A A1 A3 b D E e L L1 L4 MILLIMETERS MIN MAX 0.45 0.55 0.00 0.05 0.13 REF 0.15 0.25 1.50 BSC 1.50 BSC 0.50 BSC 0.30 0.40 0.00 0.03 0.10 REF GENERIC MARKING DIAGRAM* 1 DETAIL A 8X L L XX MG e 5 3 1 XX = Specific Device Code M = Date Code G = Pb−Free Package 7 8 8X b L4 0.10 C A B BOTTOM VIEW 0.05 C NOTE 3 SOLDERING FOOTPRINT* 0.50 PITCH 1 0.45 7X 0.30 8X 0.55 *This information is generic. Please refer to device data sheet for actual part marking. Pb−Free indicator, “G” or microdot “ G”, may or may not be present. 1.80 1.80 DIMENSIONS: MILLIMETERS *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. DOCUMENT NUMBER: DESCRIPTION: 98AON25688D 8 PIN UQFN, 1.5X1.5, 0.5P Electronic versions are uncontrolled except when accessed directly from the Document Repository. Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red. PAGE 1 OF 1 ON Semiconductor and are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries. ON Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. 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