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NLAS8252MUTAG

NLAS8252MUTAG

  • 厂商:

    ONSEMI(安森美)

  • 封装:

    UFQFN12

  • 描述:

    IC SWITCH DP3T 12UQFN

  • 数据手册
  • 价格&库存
NLAS8252MUTAG 数据手册
NLAS8252 DP3T Switch for USB/UART/Data Multiplexing Brief Description http://onsemi.com The NLAS8252 is a DP3T switch for combined UART and USB 2.0 full speed data applications. It allows portable systems to use a single external port to transmit and receive signals to and from three separate locations within the portable system. It is comprised of two switches, each with a single common I/O that alternates between 3 terminals. They are operated together to allow three data sources, such as a USB or UART transceiver, to pass differential data through a shared USB connector port. The NLAS8252 features low RON− 4 W (max) at 4.2 V VCC, 5 W (typ) at a 3.3 V VCC. It also features low CON, < 30 pF (max) across the supply voltage range. This performance makes it ideal for USB full speed applications that require both low RON and CON for effective signal transmission. The NLAS8252 is capable of accepting control input signals down to 1.4 V, over a range of VCC supply voltages with minimal leakage current. The NLAS8252 is offered in a lead−free, 12 pin, 1.7 x 2.0 x 0.5 mm, UQFN package. MARKING DIAGRAM 1 52 = Specific Device Code M = Date Code G = Pb−Free Package (Note: Microdot may be in either location) APPLICATION DIAGRAM NLAS8252 USB Connector RON: 4 W Max @ VCC = 4.2 V CON: < 20 pF @ VCC = 3.3 V OVT Protection up to 5.25 V on Common Pins VCC Range: 1.65 V to 4.5 V 3 kV ESD Protection 1.7 x 2.0 x 0.5 mm UQFN12 Package This is a Pb−Free Device D+ R D− L USB XCVR Remote Data Rx Tx IN[1:0] Typical Applications • • • • D+ D− Features • • • • • • • 52 MG G UQFN12 MU SUFFIX CASE 523AE USB/UART/Data Multiplexing Shared USB Connector Mobile Phones Portable Devices UART XCVR From Baseband ORDERING INFORMATION Device NLAS8252MUTAG Package Shipping† UQFN12 (Pb−Free) 3000 / Tape & Reel †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specification Brochure, BRD8011/D. © Semiconductor Components Industries, LLC, 2010 April, 2010 − Rev. 1 1 Publication Order Number: NLAS8252/D NLAS8252 FUNCTIONAL BLOCK DIAGRAM AND PINOUT 1S1 1S2 1 1S3 2 VCC 3 2S3 4 2S2 12 Control Logic 5 6 PIN DESCRIPTIONS IN1 11 10 COM1 9 GND 8 COM2 IN2 7 2S1 Pin# Name Direction Description 1 1S2 I/O Switch #1 Position 2 Signal Line 2 1S3 I/O Switch #1 Position 3 Signal Line 3 VCC Input 4 2S3 I/O Switch #2 Position 3 Signal Line 5 2S2 I/O Switch #2 Position 2 Signal Line 6 2S1 I/O Switch #2 Position 1 Signal Line 7 IN2 Input 8 COM2 I/O 9 GND Input 10 COM1 I/O 11 IN1 Input 12 1S1 I/O (Top View) Figure 1. Functional Block Diagram Power Supply Bit 1 Control Input Select Line Switch #2 Common Signal Line Ground Switch #1 Common Signal Line Bit 0 Control Input Select Line Switch #1 Position 1 Signal Line FUNCTION TABLE IN1 [0] IN2 [1] COM1 Closed to: COM2 Closed to: 0 0 No Connect No Connect 1 0 1S1 2S1 0 1 1S2 2S2 1 1 1S3 2S3 http://onsemi.com 2 NLAS8252 OPERATING CONDITIONS MAXIMUM RATINGS Symbol Pins VCC VCC VIS 1Sx, 2Sx Parameter Value Positive DC Supply Voltage Analog Signal Voltage COMx Condition Unit −0.5 to +5.5 V −0.5 to VCC + 0.3 V −0.5 to 5.3 VIN IN1, IN2 ICC VCC IIS_CON 1Sx, 2Sx COMx Analog Signal Continuous Current $300 Closed Switch mA IIS_PK 1Sx, 2Sx COMx Analog Signal Peak Current $500 10% Duty Cycle mA IIN IN1, IN2 Control Input Current $20 mA −65 to 150 °C TSTG Control Input Voltage Positive DC Supply Current Storage Temperature Range −0.5 to 4.6 V 50 mA Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability. RECOMMENDED OPERATING CONDITIONS Symbol Pins VCC VCC VIS 1Sx, 2Sx Parameter Value Positive DC Supply Voltage Analog Signal Voltage COMx VIN IN1, IN2 TA Condition Unit 1.65 to 4.5 V GND to VCC V GND to 4.5 Control Input Voltage Operating Temperature Range GND to VCC V −40 to 85 °C Minimum and maximum values are guaranteed through test or design across the Recommended Operating Conditions, where applicable. Typical values are listed for guidance only and are based on the particular conditions listed for each section, where applicable. These conditions are valid for all values found in the characteristics tables unless otherwise specified in the test conditions. ESD PROTECTION Pins All Pins Description Human Body Model http://onsemi.com 3 Minimum Voltage 3 kV NLAS8252 DC ELECTRICAL CHARACTERISTICS CONTROL INPUT (TYPICAL: T = 255C; VCC = 3.3 V) Symbol Pins Test Conditions VCC Min VIH INx Control Input High Parameter Figures 2 2.7 V 3.3 V 4.2 V 1.25 1.35 1.50 VIL INx Control Input Low Figures 2 2.7 V 3.3 V 4.2 V IIN INx Control Input Leakage VIS = GND Typ Max Unit V 0.4 0.4 0.5 V $1.0 mA Max Unit $1.0 mA $1.0 mA SUPPLY CURRENT AND LEAKAGE (TYPICAL: T = 255C; VCC = 3.3 V, VIN = VCC or GND) Symbol Pins INO/NC (OFF) NC, NO OFF State Leakage ICOM (ON) COM ON State Leakage ICC VCC Quiescent Supply VIS = VCC or GND, ID = 0; 1.0 mA Power OFF Leakage VIS = GND 1.0 mA Typ Max Unit 5 4 3.5 6 5 4.5 W 1.3 1.4 1.6 W IOFF Parameter Test Conditions VCC Min Typ VCOM = 3.6 V VNC = 1.0 V ON RESISTANCE (TYPICAL: T = 255C; VCC = 3.3 V) Symbol RON Pins Parameter Test Conditions VCC 1Sx, 2Sx COMx ON Resistance ION = −8 mA, VIS = 0 to VCC; 2.7 V 3.3 V 4.2 V RFLAT 1Sx, 2Sx COMx RON Flatness ION = −8 mA, VIS = 0 to VCC; 2.7 V 3.3 V 4.2 V DRON 1Sx, 2Sx COMx RON Matching ION = −8 mA, VIS = 0 to VCC; 2.7 V 3.3 V 4.2 V http://onsemi.com 4 Min 0.35 W NLAS8252 AC ELECTRICAL CHARACTERISTICS TIMING/FREQUENCY (TYPICAL: T = 255C; VCC = 3.3 V, RL = 50 W, CL = 5 pF, f = 1 MHz) Symbol Pins Parameter Test Conditions BW −3 dB Bandwidth THD Total Harmonic Distortion Min 20 Hz to 20 kHz, 1.0 VPP Typ Max Unit 200 MHz 0.01 % tON 1Sx to 1Sy, 2Sx to 2Sy Turn On Time 13 30 nS tOFF 1Sy to 1Sx, 2Sy to 2Sx Turn Off Time 12 25 nS tBBM 1Sx to 1Sy, 2Sx to 2Sy Break Before Make 2.0 nS CROSSTALK: (TYPICAL: T = 255C; VCC = 3.3V, RL = 50 W, CL = 35 pF, f = 1MHz) Symbol Pins OIRR 1Sx or 2Sx Xtalk Parameter Off Isolation Test Conditions Min VIN = 0 COMx to COMy Non−Adjacent Channel Typ Max Unit −60 dB −60 dB CAPACITANCE (TYPICAL: T = 255C; VCC = 3.3V, RL = 50 W, CL = 5 pF, f = 1 MHz) Symbol Pins CIN INx CON 1Sx or 2Sx to COM COFF Parameter Test Conditions Min Typ Control Input VCC = 0 V 3 Through Switch VCC = 3.3 V, VIN = 0 V 16 VCC = VIN = 3.3 V 8 1Sx, 2Sx COMx Unselected Port http://onsemi.com 5 Max Unit pF 20 pF pF NLAS8252 Detailed Description switch, a signal can pass from the common pin to any of three terminals. Whenever COM1 is closed to terminal 1S2, COM2 will respectively be closed to terminal 2S2. The select logic is controlled by two inputs, IN1 and IN2, connecting the common pins to the terminals according to the function table found on page 2. Since there are four possible control states but only 3 possible terminals, the first combination results in a open connection for all three terminals. The NLAS8252 is a DP3T switch designed for applications where a single USB connector is used for multiple data applications within a portable system. Two differential signals from a USB connector can be routed to 3 different end locations. The first, channel 1, is optimized for a full speed, USB 2.0 transceiver. The second and third, channels 2 and 3, are optimized for UART or remote data applications. Control Inputs Select Logic The NLAS8252 is made up of two, 3−throw switches operating off of the same internal enable signal. For each VIH and VIL Levels 200 190 180 170 VCC = 4.2 V 160 150 140 130 ICC (mA) 120 110 100 90 V = 3.3 V CC 80 70 60 50 40 30 VCC = 2.7 V 20 10 0 0 0.4 0.8 1.2 1.6 2.0 VIN (V) 2.4 Figure 2. ICC Leakage Current vs. VIN http://onsemi.com 6 2.8 3.2 NLAS8252 4.5 5 4.5 85°C 4 4 25°C 3.5 25°C 3 3 −40°C RON (W) RON (W) 3.5 85°C 2.5 2 −40°C 2.5 2 1.5 1.5 1 1 0.5 0.5 0 0 0.5 1 1.5 2 0 2.5 0 0.5 1 1.5 VIN (V) 0 −1 25°C 3 −2 −40°C BW (dB) RON (W) 2.5 2 1.5 −3 −4 −5 1 −6 0.5 0 0 0.5 1 1.5 2 2.5 3 3.5 −7 1E06 4 1E07 VIN (V) 1E09 Figure 6. Bandwidth vs. Frequency 0 0.009 −10 0.008 −20 0.007 −30 0.006 THD (%) −40 −50 −60 0.005 0.004 0.003 −70 −80 0.002 −90 0.001 −100 10000 1E08 FREQUENCY (Hz) Figure 5. On−Resistance vs. Input Voltage @ VCC = 4.2 V MAGNITUDE (dB) 3 Figure 4. On−Resistance vs. Input Voltage @ VCC = 3.3 V 85°C 3.5 2.5 VIN (V) Figure 3. On−Resistance vs. Input Voltage @ VCC = 2.7 V 4 2 100000 1E06 1E07 1E08 1E09 0 10 100 1000 10000 100000 FREQUENCY (Hz) FREQUENCY (Hz) Figure 7. Cross Talk vs. Frequency @ 255C Figure 8. Total Harmonic Distortion vs. Frequency http://onsemi.com 7 MECHANICAL CASE OUTLINE PACKAGE DIMENSIONS UQFN12 1.7x2.0, 0.4P CASE 523AE−01 ISSUE A DATE 11 JUN 2007 1 SCALE 4:1 A B D ÉÉÉ ÉÉÉ ÉÉÉ PIN 1 REFERENCE 2X 0.10 C 2X 0.10 C L1 DETAIL A E NOTE 5 TOP VIEW DETAIL B A 0.05 C 12X 0.05 C A1 A3 8X C SIDE VIEW SEATING PLANE DIM A A1 A3 b D E e K L L1 L2 MILLIMETERS MIN MAX 0.45 0.55 0.00 0.05 0.127 REF 0.15 0.25 1.70 BSC 2.00 BSC 0.40 BSC 0.20 ---0.45 0.55 0.00 0.03 0.15 REF K 5 GENERIC MARKING DIAGRAM* 7 DETAIL A e 1 12X DETAIL B OPTIONAL CONSTRUCTION NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: MILLIMETERS 3. DIMENSION b APPLIES TO PLATED TERMINAL AND IS MEASURED BETWEEN 0.15 AND 0.30 MM FROM TERMINAL TIP. 4. MOLD FLASH ALLOWED ON TERMINALS ALONG EDGE OF PACKAGE. FLASH 0.03 MAX ON BOTTOM SURFACE OF TERMINALS. 5. DETAIL A SHOWS OPTIONAL CONSTRUCTION FOR TERMINALS. 11 L L2 12X XXM G b 0.10 M C A B 0.05 M C BOTTOM VIEW NOTE 3 XX = Specific Device Code M = Date Code G = Pb−Free Package *This information is generic. Please refer to device data sheet for actual part marking. Pb−Free indicator, “G” or microdot “ G”, may or may not be present. MOUNTING FOOTPRINT SOLDERMASK DEFINED 2.00 1 0.40 PITCH 0.32 2.30 11X 0.22 12X 0.69 DIMENSIONS: MILLIMETERS DOCUMENT NUMBER: DESCRIPTION: 98AON23418D UQFN12 1.7 X 2.0, 0.4P Electronic versions are uncontrolled except when accessed directly from the Document Repository. Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red. PAGE 1 OF 1 ON Semiconductor and are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries. ON Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. ON Semiconductor does not convey any license under its patent rights nor the rights of others. © Semiconductor Components Industries, LLC, 2019 www.onsemi.com onsemi, , and other names, marks, and brands are registered and/or common law trademarks of Semiconductor Components Industries, LLC dba “onsemi” or its affiliates and/or subsidiaries in the United States and/or other countries. onsemi owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. A listing of onsemi’s product/patent coverage may be accessed at www.onsemi.com/site/pdf/Patent−Marking.pdf. onsemi reserves the right to make changes at any time to any products or information herein, without notice. The information herein is provided “as−is” and onsemi makes no warranty, representation or guarantee regarding the accuracy of the information, product features, availability, functionality, or suitability of its products for any particular purpose, nor does onsemi assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. Buyer is responsible for its products and applications using onsemi products, including compliance with all laws, regulations and safety requirements or standards, regardless of any support or applications information provided by onsemi. “Typical” parameters which may be provided in onsemi data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. onsemi does not convey any license under any of its intellectual property rights nor the rights of others. onsemi products are not designed, intended, or authorized for use as a critical component in life support systems or any FDA Class 3 medical devices or medical devices with a same or similar classification in a foreign jurisdiction or any devices intended for implantation in the human body. Should Buyer purchase or use onsemi products for any such unintended or unauthorized application, Buyer shall indemnify and hold onsemi and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that onsemi was negligent regarding the design or manufacture of the part. onsemi is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner. PUBLICATION ORDERING INFORMATION LITERATURE FULFILLMENT: Email Requests to: orderlit@onsemi.com onsemi Website: www.onsemi.com ◊ TECHNICAL SUPPORT North American Technical Support: Voice Mail: 1 800−282−9855 Toll Free USA/Canada Phone: 011 421 33 790 2910 Europe, Middle East and Africa Technical Support: Phone: 00421 33 790 2910 For additional information, please contact your local Sales Representative
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