NLX2G66DMUTCG

ON Semiconductor Is Now To learn more about onsemi™, please visit our website at www.onsemi.com onsemi and       and other names, marks, and brands are registered and/or common law trademarks of Semiconductor Components Industries, LLC dba “onsemi” or its affiliates and/or subsidiaries in the United States and/or other countries. onsemi owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. A listing of onsemi product/patent coverage may be accessed at www.onsemi.com/site/pdf/Patent-Marking.pdf. onsemi reserves the right to make changes at any time to any products or information herein, without notice. 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All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. onsemi does not convey any license under any of its intellectual property rights nor the rights of others. onsemi products are not designed, intended, or authorized for use as a critical component in life support systems or any FDA Class 3 medical devices or medical devices with a same or similar classification in a foreign jurisdiction or any devices intended for implantation in the human body. Should Buyer purchase or use onsemi products for any such unintended or unauthorized application, Buyer shall indemnify and hold onsemi and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that onsemi was negligent regarding the design or manufacture of the part. onsemi is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner. Other names and brands may be claimed as the property of others. NLX2G66 Dual Bilateral Analog Switch / Digital Multiplexer The NLX2G66 is a dual single pole, single throw (SPST) analog switch / digital multiplexer. This single supply voltage IC is designed with a sub−micron CMOS technology to provide low propagation delays (tpd) and ON resistance (RON), while maintaining low power dissipation. This bi−lateral switch can be used with either analog or digital signals that may vary across the full power supply range from VCC to GND. www.onsemi.com MARKING DIAGRAMS • • • • • • • • UDFN8 MU SUFFIX CASE 517BZ 8 Features Wide VCC Operating Range: 1.65 V to 5.5 V OVT up to +5.5 V for Control Pin RON: Typically 5.5 W at VCC = 4.5 V and IS = 32 mA Rail−to−Rail Input/Output High On−Off Output Voltage Ratio High Degree of Linearity Ultra−Small Pb−Free, Halide−Free, RoHS−Compliant Packages ESD Performance: > 5000 V HBM, > 400 V MM 1 UDFN8 MU SUFFIX CASE 517CA 8 1 XX M G • Cell Phones, PDAs, MP3 and other Portable Media Players 1A 1 XXM G 1 = Specific Device Code = Date Code = Pb−Free Package WLCSP8 FC SUFFIX CASE 567MR 8 Typical Applications XXM G 1 XXXX AYWW A = Assembly Location Y = Year WW = Work Week 1B 1C PIN ASSIGNMENTS 2A 2B Figure 1. Analog Symbol PIN ASSIGNMENTS GND D1D2 2A 1C 2C C1C2 2B 6 2B 1B B1 B2 1C 5 2A 1A A1 A2 VCC 1A 1 8 VCC 1B 2 7 2C 3 GND 4 2C UDFN8 (Top View) WLCSP8 (Bottom View) UDFN8 WLCSP8 Description 1 A1 1A 2 B1 1B 3 C1 2C Control Input (C) Switch 4 D1 GND L OFF 5 D2 2A H ON 6 C2 2B 7 B2 1C ORDERING INFORMATION VCC See detailed ordering and shipping information in the package dimensions section on page 5 of this data sheet. 8 A2 FUNCTION TABLE This document contains information on some products that are still under development. ON Semiconductor reserves the right to change or discontinue these products without notice. © Semiconductor Components Industries, LLC, 2016 May, 2016 − Rev. 5 1 Publication Order Number: NLX2G66/D NLX2G66 Table 1. MAXIMUM RATINGS Symbol VCC Rating Value Unit −0.5 to +7.0 V −0.5 to + VCC + 0.5 V −0.5 to +7.0 V Positive DC Supply Voltage VS Switch Input / Output Voltage VI Digital Control Input Voltage IOK I/O port diode current ±50 mA IIK Control input diode current −50 mA II/O Continuous DC Current Through Analog Switch ±100 mA IL Latch−up Current, (Above VCC and below GND at 125°C) ±100 mA Ts Storage Temperature −65 to +150 °C ≥ 5000 > 400 V VESD ESD Withstand Voltage: (Pins 1A, 1B, 2A and 2B) (Pins 1C and 2C) Human Body Model (HBM) Machine Model (MM) Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality should not be assumed, damage may occur and reliability may be affected. Table 2. RECOMMENDED OPERATING CONDITIONS Symbol VCC Parameter Min Max Unit 1.65 5.5 V (Pins 1A, 2A, 1B and 2B) GND VCC V (Pins 1C and 2C) GND 5.5 V −55 +125 °C VCC = < 3.0 V 0 20 ns/V VCC = ≥ 3.0 V 0 10 Positive DC Supply Voltage VS Switch Input / Output Voltage VI Digital Control Input Voltage TA Operating Temperature Range tr, tf Input Transition Rise or Fall Time (ON/OFF Control Input) Table 3. ELECTRICAL CHARACTERISTICS Guaranteed Limit 255C Symbol VIH VIL Parameter Condition High−Level Input Voltage, Control Input Low−Level Input Voltage, Control Input VCC Min −555 to 1255C Max Min 1.65 to 1.95 VCC x 0.65 2.3 to 5.5 VCC x 0.7 Max Unit V 1.65 to 1.95 VCC x 0.35 2.3 to 5.5 VCC x 0.30 V II Input Leakage Current, Control Input VI = VCC or GND 5.5 ±0.1 ±1 mA IS(ON) ON−State Switch Leakage Current VIS = VCC or GND, VI = VIH, VOS = Open 5.5 ±0.1 ±1 mA IS(OFF) OFF−State Switch Leakage Current VIS = VCC and VOS = GND, or VIS = GND and VOS = VCC GND, VI = VIL, 5.5 ±0.1 ±1 mA Quiescent Supply Current VI = VCC or GND 5.5 1.0 10 mA Supply Current Change VI = VCC – 0.6 5.5 500 mA 5 3.0 pF ICC ΔICC CI Control Input Capacitance CI/O(Off) Switch OFF Input / Output Capacitance See Figure 3 5 6.0 pF CI/O(On) Switch ON Input / Output Capacitance See Figure 4 5 13 pF www.onsemi.com 2 NLX2G66 Table 4. SWITCHING CHARACTERISTICS Guaranteed Limit −555 to 1255C Symbol tPLH, tPHL Parameter Condition Propagation Delay, A to B, B to A CL = 30 pF, RL = 1 kΩ CL = 50 pF, RL = 500 Ω tEN (tPZL, tPZH) tDIS (tPLZl, tPHZ) Enable Time, C to Analog Output (A or B) Disable Time, C to Analog Output (A or B) Min Max Unit 1.8 6.5 ns 2.5 3.3 3.3 2.5 5.0 2.2 1.8 10 2.5 6.5 3.3 5.5 5.0 4.9 1.8 9.0 2.5 7.2 3.3 6.5 5.0 6.0 VCC CL = 50 pF, RL = 500 Ω See Figure 6 CL = 50 pF, RL = 500 Ω See Figure 6 ns ns Table 5. ANALOG SWITCH CHARACTERISTICS Symbol RON RON(peak) DRON BW Parameter On−Resistance Peak On−Resistance On−Resistance Mismatch between Switches Bandwidth (f−3dB) VIS = GND to VCC; VI = VIH, See Figure 2 VIS = GND to VCC; VI = VIH, See Figure 2 Min VCC Typ Max Unit 1.65 12 30 W IS = 8 ma 2.3 9 20 IS = 24 ma 3.0 7.5 15 IS = 32 ma 4.5 5.5 13 IS = 4 ma 1.65 74.5 220 IS = 8 ma 2.3 20 75 IS = 24 ma 3.0 11.5 25 IS = 32 ma 4.5 7.5 17 IS = 4 ma 1.65 8.0 IS = 8 ma 2.3 5.0 IS = 24 ma 3.0 3.0 IS = 32 ma 4.5 2.0 1.65 > 270 2.3 > 270 3.0 > 270 4.5 > 270 RL = 50 W, CL = 5 pF, fIN = Sine Wave See Figure 8 www.onsemi.com 3 −555 to 1255C IS = 4 ma Conditions VIS = VCC or GND, VI = VIH, See Figure 2 255C W W MHz NLX2G66 Table 5. ANALOG SWITCH CHARACTERISTICS (continued) 255C Symbol ISOOff Parameter Off−Channel Feedthrough Isolation Conditions RL = 600 Ω, CL = 50 pF, fIN = 1 MHz Sine Wave See Figure 9 RL = 50 Ω, CL = 5 pF, fIN = 1 MHz Sine Wave See Figure 9 XTalk Crosstalk Between Switches RL = 600 Ω, CL = 50 pF, fIN = 1 MHz Sine Wave See Figure 10 RL = 50 Ω, CL = 5 pF, fIN = 1 MHz Sine Wave See Figure 10 Feedthrough Noise, Control to Switch THD Total Harmonic Distortion RL = 600 Ω, CL = 50 pF, fIN = 1 MHz Square Wave, tr = tf = 2 ns, See Figure 11 CL = 50 pF, RL = 50 Ω, fIN = 600 Hz to 20 KHz Sine Wave, See Figure 12 VCC Typ Unit 1.65 −70 dB 2.3 −70 3.0 −70 4.5 −70 1.65 −60 2.3 −60 3.0 −60 4.5 −60 1.65 −100 2.3 −100 3.0 −100 4.5 −100 1.65 −90 2.3 −90 3.0 −90 dB 4.5 −90 1.65 10 2.3 10 3.0 10 4.5 15 2.3 0.025 3.0 0.015 4.5 0.01 mVpp % Table 6. POWER DISSIPATION CHARACTERISTICS 255C Symbol Parameter Conditions VCC Typ Unit CPD Power Dissipation Capacitance f = 10 MHz 1.65 8.0 pF 2.3 8.9 3.0 9.6 4.5 10.9 www.onsemi.com 4 NLX2G66 Table 7. DEVICE ORDERING INFORMATION Package Shipping† NLX2G66DMUTAG UDFN8−0.5P, 1.95 mm x 1.0 mm (Pb−Free) 3000 / Tape & Reel NLX2G66DMUTCG UDFN8−0.5P, 1.95 mm x 1.0 mm (Pb−Free) 3000 / Tape & Reel NLX2G66MU3TCG (In Development) UDFN8−0.35P, 1.45 mm x 1.0 mm (Pb−Free) 3000 / Tape & Reel NLX2G66FCTAG WLCSP8, 1.888 mm x 0.888 mm (Pb−Free) 3000 / Tape & Reel Device Order Number †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. www.onsemi.com 5 NLX2G66 PLOTTER POWER SUPPLY - COMPUTER DC PARAMETER ANALYZER + VCC VCC VCC VCC VCC VIH VCC GND VIL A GND Figure 2. On Resistance Test Set−Up VCC Figure 3. Maximum Off−Channel Leakage Current Test Set−Up VCC A VCC VCC N/C VCC VIH TEST POINT GND VCC GND Figure 4. Maximum On−Channel Leakage Current Test Set−Up Figure 5. Propagation Delay Test Set−Up Switch to Position 2 when testing tPLZ and tPZL Switch to Position 1 when testing tPHZ and tPZH VCC TEST POINT VCC VCC 1 A N/C VCC 2 VCC RL N/C VCC 1 CL* GND GND 2 *Includes all probe and jig capacitance. Figure 6. Propagation Delay Output Enable/Disable Test Set−Up Figure 7. Power Dissipation Capacitance Test Set−Up www.onsemi.com 6 NLX2G66 VIS VOS VCC 0.1 mF fin VCC 0.1 mF fin VCC dB Meter VOS VCC dB Meter GND RL GND *Includes all probe and jig capacitance. *Includes all probe and jig capacitance. Figure 8. Maximum On−Channel Bandwidth Test Set−Up Figure 9. Off−Channel Feedthrough Isolation Test Set−Up Figure 10. Crosstalk (between Switches) (VCC)/2 VCC RL RL VCC V VOS IS IN v 1 MHz t r + t + 2 ns f VCC GND GND *Includes all probe and jig capacitance. Figure 11. Feedthrough Noise, ON/OFF Control to Analog Out, Test Set−Up www.onsemi.com 7 NLX2G66 To Distortion Meter (VCC)/2 VIS VCC 0.1 mF RL fin VCC VOS GND *Includes all probe and jig capacitance. Figure 12. Total Harmonic Distortion Test Set−Up VCC XA 50% VCC 50% tPLH tPHL VOH YA 50% VCC VOL Figure 13. Propagation Delay, Analog In to Analog Out Waveforms tr Control tf 90% 50% VCC 10% tPZL VCC tPLZ High Impedance 50% VCC 10% Analog Out 90% 50% VCC tPHZ tPZH VOL VOH High Impedance Figure 14. Propagation Delay, ON/OFF Control www.onsemi.com 8 NLX2G66 PACKAGE DIMENSIONS UDFN8 1.45x1.0, 0.35P CASE 517BZ ISSUE O PIN ONE REFERENCE 0.10 C 2X 2X 0.10 C NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: MILLIMETERS. 3. DIMENSION b APPLIES TO PLATED TERMINAL AND IS MEASURED BETWEEN 0.15 AND 0.20 MM FROM TERMINAL TIP. 4. PACKAGE DIMENSIONS EXCLUSIVE OF BURRS AND MOLD FLASH. A B D ÉÉ ÉÉ ÉÉ E DIM A A1 A3 b D E e L L1 TOP VIEW A3 0.05 C A 0.05 C A1 SIDE VIEW C RECOMMENDED SOLDERING FOOTPRINT* SEATING PLANE 7X 0.48 e/2 e 1 7X MILLIMETERS MIN MAX 0.45 0.55 0.00 0.05 0.13 REF 0.15 0.25 1.45 BSC 1.00 BSC 0.35 BSC 0.25 0.35 0.30 0.40 8X 0.22 L 4 L1 1.18 8 5 BOTTOM VIEW 8X 0.53 b 0.10 M C A B 0.05 M C 1 PKG OUTLINE NOTE 3 DIMENSIONS: MILLIMETERS *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. www.onsemi.com 9 0.35 PITCH NLX2G66 PACKAGE DIMENSIONS UDFN8 1.95x1.0, 0.5P CASE 517CA ISSUE O PIN ONE REFERENCE 0.10 C 2X 2X ÉÉÉ ÉÉÉ ÉÉÉ 0.10 C NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: MILLIMETERS. 3. DIMENSION b APPLIES TO PLATED TERMINAL AND IS MEASURED BETWEEN 0.15 AND 0.20 MM FROM TERMINAL TIP. 4. PACKAGE DIMENSIONS EXCLUSIVE OF BURRS AND MOLD FLASH. A B D E DIM A A1 A3 b D E e L L1 TOP VIEW A3 0.05 C A 0.05 C A1 SIDE VIEW C RECOMMENDED SOLDERING FOOTPRINT* SEATING PLANE 7X e/2 0.49 e 7X MILLIMETERS MIN MAX 0.45 0.55 0.00 0.05 0.13 REF 0.15 0.25 1.95 BSC 1.00 BSC 0.50 BSC 0.25 0.35 0.30 0.40 L 8X 0.30 4 1 L1 1.24 8 5 BOTTOM VIEW 8X b 0.10 M C A B 0.05 M C 0.54 NOTE 3 0.50 PITCH DIMENSIONS: MILLIMETERS *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. www.onsemi.com 10 1 PKG OUTLINE NLX2G66 PACKAGE DIMENSIONS WLCSP8, 1.888x0.888 CASE 567MR ISSUE O ÈÈ ÈÈ E PIN A1 REFERENCE A NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: MILLIMETERS. 3. COPLANARITY APPLIES TO SPHERICAL CROWNS OF SOLDER BALLS. B D DIM A A1 b D E e TOP VIEW MILLIMETERS MIN MAX −−− 0.50 0.15 0.19 0.21 0.25 1.858 1.918 0.858 0.918 0.50 BSC A 0.05 C A1 SIDE VIEW NOTE 3 C RECOMMENDED SOLDERING FOOTPRINT* SEATING PLANE A1 8X e/2 b PACKAGE OUTLINE e 0.15 C A B 0.03 C 0.50 PITCH e/2 D e C 8X 0.50 PITCH B A 1 2 BOTTOM VIEW 0.20 DIMENSIONS: MILLIMETERS *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. ON Semiconductor and the are registered trademarks of Semiconductor Components Industries, LLC (SCILLC) or its subsidiaries in the United States and/or other countries. SCILLC owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. A listing of SCILLC’s product/patent coverage may be accessed at www.onsemi.com/site/pdf/Patent−Marking.pdf. SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. “Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer. 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