NLX2G32
Dual 2-Input OR Gate
The NLX2G32 is a high performance dual 2−input OR Gate
operating from a 1.65 V to 5.5 V supply.
Features
•
•
•
•
•
•
•
•
•
•
Extremely High Speed: tPD 2.5 ns (typical) at VCC = 5 V
Designed for 1.65 V to 5.5 V VCC Operation
Over Voltage Tolerant Inputs
LVTTL Compatible − Interface Capability With 5 V TTL Logic with
VCC = 3 V
LVCMOS Compatible
24 mA Balanced Output Sink and Source Capability
Near Zero Static Supply Current Substantially Reduces System
Power Requirements
Replacement for NC7WZ32
Chip Complexity: FET = 120
These are Pb−Free Devices
http://onsemi.com
MARKING
DIAGRAMS
YM
1
ULLGA8
1.45 x 1.0
CASE 613AA
1
ULLGA8
1.6 x 1.0
CASE 613AB
ATM
G
ULLGA8
1.95 x 1.0
CASE 613AC
ATM
G
1
A1
8
1
VCC
B1
2
7
Y1
Y2
3
6
B2
GND
4
5
A2
A1
B1
w1
Y2
XM
XM
1
XX
M
G
= Specific Device Code
= Date Code
= Pb−Free Package
ORDERING INFORMATION
Function
1
A1
2
B1
3
Y2
4
GND
A
B
Y
5
A2
L
L
L
6
B2
L
H
H
7
Y1
H
L
H
8
VCC
H
H
H
July, 2012 − Rev. 1
1
Figure 2. Logic Symbol
Pin
© Semiconductor Components Industries, LLC, 2012
UDFN8
1.6 x 1.0
CASE 517BY
XM
Y1
A2
B2
PIN ASSIGNMENT
1
UDFN8
1.95 x 1.0
CASE 517CA
IEEE/IEC
Figure 1. Pinout
UDFN8
1.45 x 1.0
CASE 517BZ
FUNCTION TABLE
Input
See detailed ordering and shipping information in the
package dimensions section on page 4 of this data sheet.
Output
Y=A+B
1
Publication Order Number:
NLX2G32/D
NLX2G32
MAXIMUM RATINGS
Symbol
Parameter
Value
Unit
VCC
DC Supply Voltage
*0.5 to )7.0
V
VI
DC Input Voltage
*0.5 to )7.0
V
VO
DC Output Voltage
*0.5 to )7.0
V
IIK
DC Input Diode Current
VI < GND
*50
mA
IOK
DC Output Diode Current
VO < GND
*50
mA
IO
DC Output Sink Current
$50
mA
ICC
DC Supply Current per Supply Pin
$100
mA
IGND
DC Ground Current per Ground Pin
$100
mA
TSTG
Storage Temperature Range
*65 to )150
°C
TL
Lead Temperature, 1 mm from Case for 10 Seconds
TJ
Junction Temperature under Bias
qJA
Thermal Resistance
PD
Power Dissipation in Still Air at 85°C
MSL
Moisture Sensitivity
FR
Flammability Rating
VESD
ESD Withstand Voltage
Human Body Model (Note 2)
Machine Model (Note 3)
Charged Device Model (Note 4)
> 2000
> 200
N/A
V
ILatch−Up
Latch−Up Performance
Above VCC and Below GND at 85°C (Note 5)
$500
mA
(Note 1)
260
°C
)150
°C
250
°C/W
250
mW
Level 1
Oxygen Index: 28 to 34
UL 94 V−0 @ 0.125 in
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the
Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect
device reliability.
1. Measured with minimum pad spacing on an FR4 board, using 10 mm−by−1 inch, 2−ounce copper trace with no air flow.
2. Tested to EIA/JESD22−A114−A.
3. Tested to EIA/JESD22−A115−A.
4. Tested to JESD22−C101−A.
5. Tested to EIA/JESD78.
RECOMMENDED OPERATING CONDITIONS
Symbol
Parameter
VCC
Supply Voltage
VI
Input Voltage
VO
Output Voltage
TA
Operating Free−Air Temperature
Dt/DV
Input Transition Rise or Fall Rate
Min
Max
Unit
1.65
1.5
5.5
5.5
V
(Note 6)
0
5.5
V
(HIGH or LOW State)
0
VCC
V
*40
)85
°C
0
0
0
0
20
20
10
5
ns/V
Operating
Data Retention Only
VCC = 1.8 V $0.15 V
VCC = 2.5 V $0.2 V
VCC = 3.0 V $0.3 V
VCC = 5.0 V $0.5 V
6. Unused inputs may not be left open. All inputs must be tied to a high−logic voltage level or a low−logic input voltage level.
http://onsemi.com
2
NLX2G32
DC ELECTRICAL CHARACTERISTICS
VCC
Symbol
Parameter
Condition
(V)
Min
0.75 VCC
0.7 VCC
VIH
HIGH Level Input Voltage
1.65 to 1.95
VIL
LOW Level Input Voltage
1.65 to 1.95
2.3 to 5.5
VOH
HIGH Level Output Voltage
VIN = VIH
VOL
Low−Level Output Voltage
VIN = VIL
TA = −405C to
+855C
TA = +255C
Typ
Max
Min
0.75 VCC
0.7 VCC
0.3 VCC
1.65
2.3
3.0
4.5
1.55
2.2
2.9
4.4
1.65
2.3
3.0
4.5
1.55
2.2
2.9
4.4
IOH = −4 mA
IOH = −8 mA
IOH = −16 mA
IOH = −24 mA
IOH = −32 mA
1.65
2.3
3.0
3.0
4.5
1.29
1.9
2.4
2.3
3.8
1.52
2.15
2.8
2.68
4.2
1.20
1.9
2.4
2.3
3.8
IOL = 100 mA
1.65
2.3
3.0
4.5
0
0
0
0
0.1
0.1
0.1
0.1
IOH = 4 mA
IOH = 8 mA
IOH = 16 mA
IOH = 24 mA
IOH = 32 mA
1.65
2.3
3.0
3.0
4.5
0.08
0.1
0.15
0.22
0.22
0.24
0.3
0.4
0.55
0.55
Input Leakage Current
VIN = VCC or GND
IOFF
Power OFF Leakage Current
ICC
Quiescent Supply Current
Unit
V
0.3 VCC
IOH = −100 mA
IIN
Max
V
V
V
0 to 5.5
$0.1
$1.0
VIN or VOUT = 5.5 V
0.0
1.0
10
VIN = VCC or GND
5.5
1.0
10
mA
mA
AC ELECTRICAL CHARACTERISTICS tR = tF = 3.0 ns
VCC
Symbol
tPLH
Parameter
Propagation Delay
(Figure 3 and 4)
tPHL
TA = 255C
*405C v TA v 855C
Condition
(V)
Min
Typ
Max
Min
Max
Unit
RL = 1 MW, CL = 15 pF
1.8 $ 0.15
2.5 $ 0.2
2.0
1.0
8.0
3.5
9.5
5.8
2.0
1.0
10.5
6.2
ns
RL = 1 MW, CL = 15 pF
3.3 $ 0.3
0.8
2.6
3.9
0.8
4.3
1.2
3.2
4.8
1.2
5.2
0.5
1.9
3.1
0.5
3.3
0.8
2.5
3.7
0.8
4.0
RL = 500 W, CL = 50 pF
RL = 1 MW, CL = 15 pF
5.0 $ 0.5
RL = 500 W, CL = 50 pF
CAPACITIVE CHARACTERISTICS
Symbol
Parameter
Condition
Typical
Unit
CIN
Input Capacitance
VCC = 5.5 V, VI = 0 V or VCC
2.5
pF
CPD
Power Dissipation Capacitance
(Note 7)
10 MHz, VCC = 3.3 V, VI = 0 V or VCC
9
pF
10 MHz, VCC = 5.5 V, VI = 0 V or VCC
11
7. CPD is defined as the value of the internal equivalent capacitance which is calculated from the operating current consumption without load.
Average operating current can be obtained by the equation: ICC(OPR) = CPD VCC fin + ICC. CPD is used to determine the no−load dynamic
power consumption; PD = CPD VCC2 fin + ICC VCC.
http://onsemi.com
3
NLX2G32
tf = 3 ns
tf = 3 ns
90%
INPUT
A and B
50%
VCC
90%
50%
10%
10%
tPHL
INPUT
OUTPUT
GND
RL
tPLH
CL
VOH
OUTPUT Y
50%
50%
A 1−MHz square input wave is recommended for
propagation delay tests.
VOL
Figure 3. Switching Waveform
Figure 4. Test Circuit
DEVICE ORDERING INFORMATION
Package Type
Tape and Reel Size†
NLX2G32AMX1TCG
ULLGA, 1.95x1
(Pb−Free)
178 mm, 3000 Units / Tape & Reel
NLX2G32BMX1TCG
ULLGA, 1.6x1
(Pb−Free)
178 mm, 3000 Units / Tape & Reel
NLX2G32CMX1TCG
ULLGA, 1.45x1
(Pb−Free)
178 mm, 3000 Units / Tape & Reel
NLX2G32DMUTCG
UDFN8, 1.95 x 1.0, 0.5P
(Pb−Free)
3000 Units / Tape & Reel
NLX2G32EMUTCG
UDFN8, 1.6 x 1.0, 0.4P
(Pb−Free)
3000 Units / Tape & Reel
NLX2G32FMUTCG
UDFN8, 1.45 x 1.0, 0.35P
(Pb−Free)
3000 Units / Tape & Reel
Device Order Number
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specifications Brochure, BRD8011/D.
http://onsemi.com
4
NLX2G32
PACKAGE DIMENSIONS
UDFN8 1.6x1.0, 0.4P
CASE 517BY
ISSUE O
PIN ONE
REFERENCE
2X
0.10 C
2X
ÉÉÉ
ÉÉÉ
0.10 C
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSION b APPLIES TO PLATED
TERMINAL AND IS MEASURED BETWEEN
0.15 AND 0.20 MM FROM TERMINAL TIP.
4. PACKAGE DIMENSIONS EXCLUSIVE OF
BURRS AND MOLD FLASH.
A B
D
E
DIM
A
A1
A3
b
D
E
e
L
L1
TOP VIEW
A3
0.05 C
A
0.05 C
A1
SIDE VIEW
C
RECOMMENDED
SOLDERING FOOTPRINT*
SEATING
PLANE
7X
e/2
0.49
e
1
7X
MILLIMETERS
MIN
MAX
0.45
0.55
0.00
0.05
0.13 REF
0.15
0.25
1.60 BSC
1.00 BSC
0.40 BSC
0.25
0.35
0.30
0.40
L
8X
0.26
4
L1
1.24
8
5
BOTTOM VIEW
8X
b
0.10
M
C A B
0.05
M
C
0.53
NOTE 3
0.40
PITCH
DIMENSIONS: MILLIMETERS
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
http://onsemi.com
5
1
PKG
OUTLINE
NLX2G32
PACKAGE DIMENSIONS
UDFN8 1.45x1.0, 0.35P
CASE 517BZ
ISSUE O
PIN ONE
REFERENCE
2X
0.10 C
2X
0.10 C
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSION b APPLIES TO PLATED
TERMINAL AND IS MEASURED BETWEEN
0.15 AND 0.20 MM FROM TERMINAL TIP.
4. PACKAGE DIMENSIONS EXCLUSIVE OF
BURRS AND MOLD FLASH.
A B
D
ÉÉ
ÉÉ
E
DIM
A
A1
A3
b
D
E
e
L
L1
TOP VIEW
A3
0.05 C
A
0.05 C
A1
SIDE VIEW
C
RECOMMENDED
SOLDERING FOOTPRINT*
SEATING
PLANE
7X
0.48
e/2
e
1
7X
MILLIMETERS
MIN
MAX
0.45
0.55
0.00
0.05
0.13 REF
0.15
0.25
1.45 BSC
1.00 BSC
0.35 BSC
0.25
0.35
0.30
0.40
L
8X
0.22
4
L1
1.18
8
5
BOTTOM VIEW
8X
0.53
b
0.10
M
C A B
0.05
M
C
NOTE 3
0.35
PITCH
DIMENSIONS: MILLIMETERS
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
http://onsemi.com
6
1
PKG
OUTLINE
NLX2G32
PACKAGE DIMENSIONS
UDFN8 1.95x1.0, 0.5P
CASE 517CA
ISSUE O
PIN ONE
REFERENCE
2X
0.10 C
2X
ÉÉÉ
ÉÉÉ
0.10 C
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSION b APPLIES TO PLATED
TERMINAL AND IS MEASURED BETWEEN
0.15 AND 0.20 MM FROM TERMINAL TIP.
4. PACKAGE DIMENSIONS EXCLUSIVE OF
BURRS AND MOLD FLASH.
A B
D
E
DIM
A
A1
A3
b
D
E
e
L
L1
TOP VIEW
A3
0.05 C
A
0.05 C
A1
SIDE VIEW
C
RECOMMENDED
SOLDERING FOOTPRINT*
SEATING
PLANE
7X
e/2
0.49
e
7X
MILLIMETERS
MIN
MAX
0.45
0.55
0.00
0.05
0.13 REF
0.15
0.25
1.95 BSC
1.00 BSC
0.50 BSC
0.25
0.35
0.30
0.40
L
8X
0.30
4
1
L1
1.24
8
5
BOTTOM VIEW
8X
b
0.10
M
C A B
0.05
M
C
0.54
NOTE 3
0.50
PITCH
DIMENSIONS: MILLIMETERS
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
http://onsemi.com
7
1
PKG
OUTLINE
NLX2G32
PACKAGE DIMENSIONS
ULLGA8 1.45x1.0, 0.35P
CASE 613AA
ISSUE A
ÉÉÉ
ÉÉÉ
ÉÉÉ
PIN ONE
REFERENCE
0.10 C
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSION b APPLIES TO PLATED TERMINAL
AND IS MEASURED BETWEEN 0.15 AND
0.30 mm FROM THE TERMINAL TIP.
4. A MAXIMUM OF 0.05 PULL BACK OF THE
PLATED TERMINAL FROM THE EDGE OF THE
PACKAGE IS ALLOWED.
A
B
D
E
DIM
A
A1
b
D
E
e
L
L1
TOP VIEW
0.10 C
0.05 C
A
8X
0.05 C
SEATING
PLANE
SIDE VIEW
MOUNTING FOOTPRINT
SOLDERMASK DEFINED*
C
A1
MILLIMETERS
MIN
MAX
−−−
0.40
0.00
0.05
0.15
0.25
1.45 BSC
1.00 BSC
0.35 BSC
0.25
0.35
0.30
0.40
7X
0.48
8X
0.22
e/2
e
1
7X
L
NOTE 4
4
1.18
L1
0.53
8
5
8X
b
0.05 C
PKG
OUTLINE
0.35
PITCH
DIMENSIONS: MILLIMETERS
0.10 C A B
BOTTOM VIEW
1
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
NOTE 3
http://onsemi.com
8
NLX2G32
PACKAGE DIMENSIONS
ULLGA8 1.6x1.0, 0.4P
CASE 613AB
ISSUE A
PIN ONE
REFERENCE
0.10 C
0.10 C
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSION b APPLIES TO PLATED TERMINAL
AND IS MEASURED BETWEEN 0.15 AND
0.30 mm FROM THE TERMINAL TIP.
4. A MAXIMUM OF 0.05 PULL BACK OF THE
PLATED TERMINAL FROM THE EDGE OF THE
PACKAGE IS ALLOWED.
A
B
D
ÉÉÉ
ÉÉÉ
ÉÉÉ
E
DIM
A
A1
b
D
E
e
L
L1
TOP VIEW
0.05 C
A
8X
0.05 C
SEATING
PLANE
SIDE VIEW
MOUNTING FOOTPRINT
SOLDERMASK DEFINED*
C
A1
MILLIMETERS
MIN
MAX
−−−
0.40
0.00
0.05
0.15
0.25
1.60 BSC
1.00 BSC
0.40 BSC
0.25
0.35
0.30
0.40
7X
0.49
e/2
e
1
4
8
5
7X
L
NOTE 4
1.24
L1
0.53
8X
b
0.05 C
1
PKG
OUTLINE
0.40
PITCH
DIMENSIONS: MILLIMETERS
0.10 C A B
BOTTOM VIEW
8X
0.26
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
NOTE 3
http://onsemi.com
9
NLX2G32
PACKAGE DIMENSIONS
ULLGA8 1.95x1.0, 0.5P
CASE 613AC
ISSUE A
PIN ONE
REFERENCE
0.10 C
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSION b APPLIES TO PLATED TERMINAL
AND IS MEASURED BETWEEN 0.15 AND
0.30 mm FROM THE TERMINAL TIP.
4. A MAXIMUM OF 0.05 PULL BACK OF THE
PLATED TERMINAL FROM THE EDGE OF THE
PACKAGE IS ALLOWED.
A
B
D
ÉÉÉÉ
ÉÉÉÉ
ÉÉÉÉ
E
DIM
A
A1
b
D
E
e
L
L1
TOP VIEW
0.10 C
0.05 C
MILLIMETERS
MIN
MAX
−−−
0.40
0.00
0.05
0.15
0.25
1.95 BSC
1.00 BSC
0.50 BSC
0.25
0.35
0.30
0.40
A
8X
0.05 C
MOUNTING FOOTPRINT
SOLDERMASK DEFINED*
SEATING
PLANE
SIDE VIEW
7X
C
A1
0.49
8X
0.30
e/2
e
7X
L
NOTE 4
4
1
1.24
L1
0.53
8
5
8X
BOTTOM VIEW
b
0.10 C A B
0.05 C
1
PKG
OUTLINE
0.50
PITCH
DIMENSIONS: MILLIMETERS
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
NOTE 3
ON Semiconductor and
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC owns the rights to a number of patents, trademarks,
copyrights, trade secrets, and other intellectual property. A listing of SCILLC’s product/patent coverage may be accessed at www.onsemi.com/site/pdf/Patent−Marking.pdf. SCILLC
reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any
particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without
limitation special, consequential or incidental damages. “Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications
and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC
does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for
surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where
personal injury or death may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and
its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly,
any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture
of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.
PUBLICATION ORDERING INFORMATION
LITERATURE FULFILLMENT:
Literature Distribution Center for ON Semiconductor
P.O. Box 5163, Denver, Colorado 80217 USA
Phone: 303−675−2175 or 800−344−3860 Toll Free USA/Canada
Fax: 303−675−2176 or 800−344−3867 Toll Free USA/Canada
Email: orderlit@onsemi.com
N. American Technical Support: 800−282−9855 Toll Free
USA/Canada
Europe, Middle East and Africa Technical Support:
Phone: 421 33 790 2910
Japan Customer Focus Center
Phone: 81−3−5817−1050
http://onsemi.com
10
ON Semiconductor Website: www.onsemi.com
Order Literature: http://www.onsemi.com/orderlit
For additional information, please contact your local
Sales Representative
NLX2G32/D
工商网监
湘ICP备2023018690号
