NLX3G16DMUTCG

ON Semiconductor Is Now To learn more about onsemi™, please visit our website at www.onsemi.com onsemi and       and other names, marks, and brands are registered and/or common law trademarks of Semiconductor Components Industries, LLC dba “onsemi” or its affiliates and/or subsidiaries in the United States and/or other countries. onsemi owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. A listing of onsemi product/patent coverage may be accessed at www.onsemi.com/site/pdf/Patent-Marking.pdf. onsemi reserves the right to make changes at any time to any products or information herein, without notice. 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All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. onsemi does not convey any license under any of its intellectual property rights nor the rights of others. onsemi products are not designed, intended, or authorized for use as a critical component in life support systems or any FDA Class 3 medical devices or medical devices with a same or similar classification in a foreign jurisdiction or any devices intended for implantation in the human body. Should Buyer purchase or use onsemi products for any such unintended or unauthorized application, Buyer shall indemnify and hold onsemi and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that onsemi was negligent regarding the design or manufacture of the part. onsemi is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner. Other names and brands may be claimed as the property of others. Triple Non-Inverting Buffer NLX3G16 The NLX3G16 MiniGatet is an advanced high−speed CMOS triple non−inverting buffer in ultra−small footprint. The NLX3G16 input and output structures provide protection when voltages up to 7.0 V are applied, regardless of the supply voltage. www.onsemi.com Features • • • • • • • • High Speed: tPD = 1.8 ns (Typ) @ VCC = 5.0 V Designed for 1.65 V to 5.5 V VCC Operation Low Power Dissipation: ICC = 1 mA (Max) at TA = 25°C 24 mA Balanced Output Source and Sink Capability Balanced Propagation Delays Overvoltage Tolerant (OVT) Input and Output Pins Ultra−Small Packages These are Pb−Free Devices IN A1 1 8 VCC OUT Y3 2 7 OUT Y1 IN A2 3 GND 4 6 5 IN A3 OUT Y2 Figure 1. Pinout (Top View) MARKING DIAGRAMS UDFN8 1.45 x 1.0 CASE 517BZ 1 UDFN8 1.6 x 1.0 CASE 517BY 1 UDFN8 1.95 x 1.0 CASE 517CA IN A1 1 OUT Y1 IN A2 1 OUT Y2 IN A3 1 OUT Y3 Figure 2. Logic Symbol XM XX M XX M 1 X or XX = Specific Device Code M = Date Code G = Pb−Free Package ORDERING INFORMATION See detailed ordering, marking and shipping information in the package dimensions section on page 5 of this data sheet. PIN ASSIGNMENT FUNCTION TABLE 1 IN A1 A Y 2 OUT Y3 3 IN A2 L H L H 4 GND 5 OUT Y2 6 IN A3 7 OUT Y1 8 VCC © Semiconductor Components Industries, LLC, 2016 November, 2019 − Rev. 3 1 Publication Order Number: NLX3G16/D NLX3G16 MAXIMUM RATINGS Symbol Value Unit VCC DC Supply Voltage −0.5 to +7.0 V VIN DC Input Voltage −0.5 to +7.0 V DC Output Voltage −0.5 to +7.0 V VIN < GND −50 mA VOUT < GND −50 mA VOUT Parameter IIK DC Input Diode Current IOK DC Output Diode Current IO DC Output Source/Sink Current ±50 mA ICC DC Supply Current Per Supply Pin ±100 mA IGND DC Ground Current per Ground Pin ±100 mA TSTG Storage Temperature Range −65 to +150 °C TL Lead Temperature, 1 mm from Case for 10 Seconds 260 °C TJ Junction Temperature Under Bias 150 °C MSL FR ILATCHUP Moisture Sensitivity Level 1 Flammability Rating Oxygen Index: 28 to 34 UL 94 V−0 @ 0.125 in Latchup Performance Above VCC and Below GND at 125 °C (Note 5) mA ±500 Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality should not be assumed, damage may occur and reliability may be affected. 1. Measured with minimum pad spacing on an FR4 board, using 10 mm−by−1 inch, 2 ounce copper trace no air flow. 2. Tested to EIA/JESD22−A114−A. 3. Tested to EIA/UESD22−A115−A. 4. Tested to JESD22−C101−A. 5. Tested to EIA / JESD78. RECOMMENDED OPERATING CONDITIONS Symbol Parameter Min Max Unit 1.65 5.5 V Digital Input Voltage 0 5.5 V Output Voltage 0 5.5 V −55 +125 °C 0 0 0 0 20 20 10 5 ns/V VCC Positive DC Supply Voltage VIN VOUT TA Operating Free−Air Temperature Dt/DV Input Transition Rise or Fall Rate VCC = 1.8 V ± 0.18 VCC = 2.5 V ± 0.2 V VCC = 3.3 V ± 0.3 V VCC = 5.0 V ± 0.5 V www.onsemi.com 2 NLX3G16 DC ELECTRICAL CHARACTERISTICS VCC (V) Min Low−Level Input Voltage 1.65 to 5.5 0.70 x VCC VIL Low−Level Input Voltage 1.65 to 5.5 VOH High− Level Output Voltage Symbol Parameter VIH VOL Low−Level Output Voltage Conditions VIN = VIH or VIL IOH = −100 mA VIN = VIH or VIL IOH = −4 mA IOH = −8 mA IOH = −12 mA IOH = −16 mA IOH = −24 mA IOH = −32 mA VIN = VIH or VIL IOL = 100 mA TA = +855C TA = 25 5C Typ Max Min Max TA = −555C to +1255C Min Max 0.70 x VCC 0.30 x VCC V 0.30 x VCC 0.30 x VCC 1.65 to .5 VCC − 0.1 VCC VCC − 0.1 VCC − 0.1 1.65 2.3 2.7 3.0 3.0 4.5 1.4 1.9 2.2 2.4 2.3 3.8 1.50 2.1 2.4 2.7 2.5 4.0 1.4 1.9 2.2 2.4 2.3 3.8 1.4 1.9 2.2 2.4 2.3 3.8 1.65 − 5.5 Unit V V 0.1 0.1 0.1 0.24 0.3 0.4 0.4 0.55 0.55 0.24 0.3 0.4 0.4 0.55 0.55 0.24 0.3 0.4 0.4 0.55 0.55 V VIN = VIH or VIL IOH = 4 mA IOH = 8 mA IOH = 12 mA IOH = 16 mA IOH = 24 mA IOH = 32 mA 1.65 2.3 2.7 3.0 3.0 4.5 Input Leakage Current 0 v VIN v 5.5 V 0 to 5.5 ±0.1 ±1.0 ±1.0 mA IOFF Power−Off Output Leakage Current VIN or VOUT = 5.5 V 0 1.0 10 10 mA ICC Quiescent Supply Current 0 v VIN v VCC 5.5 1.0 10 10 mA IIN 0.2 0.2 0.22 0.28 0.38 0.42 www.onsemi.com 3 NLX3G16 AC ELECTRICAL CHARACTERISTICS (Input tr = tf = 3.0 nS) Symbol tPLH, tPHL Parameter Propagation Delay Input A to Output VCC (V) Test Condition 1.65−1.95 TA = 25 5C TA = +855C TA = −555C to +1255C Min Typ Max Min Max Min Max Unit RL = 1 MW, CL = 15 pF 1.8 6.0 7.9 1.8 8.8 1.8 12 ns 2.3−2.7 RL = 1 MW, CL = 15 pF 1.0 3.0 5.2 1.0 5.8 1.0 9.1 3.0−3.6 RL = 1 MW, CL = 15 pF 0.8 2.3 3.6 0.8 4.0 0.8 6.5 RL = 500 W, CL = 50 pF 1.2 3.0 4.6 1.2 5.1 1.2 7.6 RL = 1 MW, CL = 15 pF 0.5 1.8 2.9 0.5 3.2 0.5 5.5 RL = 500 W, CL = 50 pF 0.8 2.4 3.8 0.8 4.2 0.8 6.4 4.5−5.5 CIN Input Capacitance 5.5 VIN = 0 V or VCC 7.0 pF CPD Power Dissipation Capacitance (Note 6) 3.3 5.5 10 MHz VIN = 0 V or VCC 9 11 pF 6. CPD is defined as the value of the internal equivalent capacitance which is calculated from the dynamic operating current consumption without load. Average operating current can be obtained by the equation ICC(OPR) = CPD • VCC • fin + ICC. CPD is used to determine the no−load dynamic power consumption: PD = CPD • VCC2 • fin + ICC • VCC. A VCC 50% GND tPLH Y tPHL 50% VCC PROPAGATION DELAYS tR = tF = 2.5 ns, 10% to 90%; f = 1 MHz; tW = 500 ns Figure 3. Switching Waveforms VCC PULSE GENERATOR DUT RT CL RT = ZOUT of pulse generator (typically 50 W) Figure 4. Test Circuit www.onsemi.com 4 RL NLX3G16 ORDERING INFORMATION Package Marking Package Shipping† NLX3G16DMUTCG AC UDFN8, 1.95 x 1.0, 0.5P (Pb−Free) 3000 / Tape & Reel NLX3G16EMUTCG AE UDFN8, 1.6 x 1.0, 0.4P (Pb−Free) 3000 / Tape & Reel NLX3G16FMUTCG E UDFN8, 1.45 x 1.0, 0.35P (Pb−Free) 3000 / Tape & Reel Device †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. www.onsemi.com 5 NLX3G16 PACKAGE DIMENSIONS UDFN8 1.6x1.0, 0.4P CASE 517BY ISSUE O PIN ONE REFERENCE 2X 0.10 C 2X ÉÉÉ ÉÉÉ ÉÉÉ 0.10 C NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: MILLIMETERS. 3. DIMENSION b APPLIES TO PLATED TERMINAL AND IS MEASURED BETWEEN 0.15 AND 0.20 MM FROM TERMINAL TIP. 4. PACKAGE DIMENSIONS EXCLUSIVE OF BURRS AND MOLD FLASH. A B D E DIM A A1 A3 b D E e L L1 TOP VIEW A3 0.05 C A 0.05 C A1 SIDE VIEW C RECOMMENDED SOLDERING FOOTPRINT* SEATING PLANE 7X e/2 0.49 e 1 7X MILLIMETERS MIN MAX 0.45 0.55 0.00 0.05 0.13 REF 0.15 0.25 1.60 BSC 1.00 BSC 0.40 BSC 0.25 0.35 0.30 0.40 L 8X 0.26 4 L1 1.24 8 5 BOTTOM VIEW 8X b 0.10 M C A B 0.05 M C 0.53 NOTE 3 0.40 PITCH DIMENSIONS: MILLIMETERS *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. www.onsemi.com 6 1 PKG OUTLINE NLX3G16 PACKAGE DIMENSIONS UDFN8 1.45x1.0, 0.35P CASE 517BZ ISSUE O PIN ONE REFERENCE 2X 0.10 C 2X 0.10 C NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: MILLIMETERS. 3. DIMENSION b APPLIES TO PLATED TERMINAL AND IS MEASURED BETWEEN 0.15 AND 0.20 MM FROM TERMINAL TIP. 4. PACKAGE DIMENSIONS EXCLUSIVE OF BURRS AND MOLD FLASH. A B D ÉÉ ÉÉ ÉÉ E DIM A A1 A3 b D E e L L1 TOP VIEW A3 0.05 C A 0.05 C A1 SIDE VIEW C RECOMMENDED SOLDERING FOOTPRINT* SEATING PLANE 7X 0.48 e/2 e 1 7X MILLIMETERS MIN MAX 0.45 0.55 0.00 0.05 0.13 REF 0.15 0.25 1.45 BSC 1.00 BSC 0.35 BSC 0.25 0.35 0.30 0.40 L 8X 0.22 4 L1 1.18 8 5 BOTTOM VIEW 8X 0.53 b 0.10 M C A B 0.05 M C NOTE 3 PKG OUTLINE 0.35 PITCH DIMENSIONS: MILLIMETERS *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. www.onsemi.com 7 1 NLX3G16 PACKAGE DIMENSIONS UDFN8 1.95x1.0, 0.5P CASE 517CA ISSUE O PIN ONE REFERENCE 2X 0.10 C 2X ÉÉÉ ÉÉÉ ÉÉÉ 0.10 C NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: MILLIMETERS. 3. DIMENSION b APPLIES TO PLATED TERMINAL AND IS MEASURED BETWEEN 0.15 AND 0.20 MM FROM TERMINAL TIP. 4. PACKAGE DIMENSIONS EXCLUSIVE OF BURRS AND MOLD FLASH. A B D E DIM A A1 A3 b D E e L L1 TOP VIEW A3 0.05 C A 0.05 C A1 SIDE VIEW C RECOMMENDED SOLDERING FOOTPRINT* SEATING PLANE 7X e/2 0.49 e 7X MILLIMETERS MIN MAX 0.45 0.55 0.00 0.05 0.13 REF 0.15 0.25 1.95 BSC 1.00 BSC 0.50 BSC 0.25 0.35 0.30 0.40 L 8X 0.30 4 1 L1 1.24 8 5 BOTTOM VIEW 8X b 0.10 M C A B 0.05 M C 0.54 NOTE 3 1 PKG OUTLINE 0.50 PITCH DIMENSIONS: MILLIMETERS *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. MiniGate is a trademark of Semiconductor Components Industries, LLC (SCILLC). ON Semiconductor and are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries. ON Semiconductor owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. A listing of ON Semiconductor’s product/patent coverage may be accessed at www.onsemi.com/site/pdf/Patent−Marking.pdf. ON Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. Buyer is responsible for its products and applications using ON Semiconductor products, including compliance with all laws, regulations and safety requirements or standards, regardless of any support or applications information provided by ON Semiconductor. “Typical” parameters which may be provided in ON Semiconductor data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. ON Semiconductor does not convey any license under its patent rights nor the rights of others. ON Semiconductor products are not designed, intended, or authorized for use as a critical component in life support systems or any FDA Class 3 medical devices or medical devices with a same or similar classification in a foreign jurisdiction or any devices intended for implantation in the human body. Should Buyer purchase or use ON Semiconductor products for any such unintended or unauthorized application, Buyer shall indemnify and hold ON Semiconductor and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that ON Semiconductor was negligent regarding the design or manufacture of the part. ON Semiconductor is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner. 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