FEDD51V17400F-03
Issue Date: Nov. 27, 2014
MSM51V17400F
4,194,304-Word × 4-Bit DYNAMIC RAM : FAST PAGE MODE TYPE
DESCRIPTION
The MSM51V17400F is a 4,194,304-word × 4-bit dynamic RAM fabricated in LAPIS Semiconductor’s
silicon-gate CMOS technology. The MSM51V17400F achieves high integration, high-speed operation,
and low-power consumption because LAPIS Semiconductor manufactures the device in a
quadruple-layer polysilicon/double-layer metal CMOS process. The MSM51V17400F is available in a
26/24-pin plastic TSOP.
FEATURES
· 4,194,304-word × 4-bit configuration
· Single 3.3V power supply, ±0.3V tolerance
· Input : LVTTL compatible, low input capacitance
· Output : LVTTL compatible, 3-state
· Refresh : 2048 cycles/32ms
· Fast page mode, read modify write capability
· CAS before RAS refresh, hidden refresh, RAS-only refresh capability
· Packages:
26/24-pin 300mil plastic TSOP (P-TSOP(2)26/24-300-1.27-Z3K)
PRODUCT FAMILY
Access Time (Max.)
Family
MSM51V17400F-60
tRAC
tAA
tCAC
tOEA
Cycle Time
(Min.)
60ns
30ns
15ns
15ns
110ns
Power Dissipation
Operating
(Max.)
Standby
(Max.)
324mW
1.8mW
1/15
FEDD51V17400F-03
MSM51V17400F
PIN CONFIGURATION (TOP VIEW)
VCC 1
26 VSS
DQ1 2
25 DQ4
DQ2 3
24 DQ3
WE 4
23 CAS
RAS 5
22 OE
NC 6
21 A9
A10 8
19 A8
A0 9
18 A7
A1 10
17 A6
A2 11
16 A5
A3 12
15 A4
VCC 13
14 VSS
26/24-Pin Plastic TSOP
(K Type)
Pin Name
Function
A0–A10
Address Input
RAS
Row Address Strobe
CAS
Column Address Strobe
DQ1–DQ4
Data Input/Data Output
OE
Output Enable
WE
Write Enable
VCC
Power Supply (3.3V)
VSS
Ground (0V)
NC
No Connection
Note : The same power supply voltage must be provided to every VCC pin, and the same GND voltage level must
be provided to every VSS pin.
2/15
FEDD51V17400F-03
MSM51V17400F
ELECTRICAL CHARACTERISTICS
ABSOLUTE MAXIMUM RATINGS
Parameter
Symbol
Value
Unit
Voltage on Any Pin Relative to VSS
VIN, VOUT
–0.5 to VCC+ 0.5
V
Voltage VCC Supply relative to VSS
VCC
–0.5 to 4.6
V
Short Circuit Output Current
IOS
50
mA
Power Dissipation
PD*
1
W
Operating Temperature
Topr
0 to 70
°C
Storage Temperature
Tstg
–55 to 150
°C
*: Ta = 25°C
RECOMMENDED OPERATING CONDITIONS
(Ta = 0 to 70°C)
Parameter
Power Supply Voltage
Symbol
Min.
Typ.
Max.
Unit
VCC
3.0
3.3
3.6
V
VSS
0
0
0
Input High Voltage
VIH
2.0
⎯
Input Low Voltage
VIL
− 0.3*2
⎯
V
*1
VCC + 0.3
0.8
V
V
Notes: *1. The input voltage is VCC + 1.0V when the pulse width is less than 20ns (the pulse width is with respect
to the point at which VCC is applied).
*2. The input voltage is VSS − 1.0V when the pulse width is less than 20ns (the pulse width respect to the
point at which VSS is applied).
PIN CAPACITANCE
(Vcc = 3.3V ± 0.3V, Ta = 25°C, f = 1 MHz)
Parameter
Symbol
Min.
Min.
Unit
CIN1
—
5
pF
(RAS, CAS, WE, OE)
CIN2
—
7
pF
Output Capacitance (DQ1 – DQ4)
CI/O
—
7
pF
Input Capacitance (A0 – A10)
Input Capacitance
3/15
FEDD51V17400F-03
MSM51V17400F
DC CHARACTERISTICS
(VCC = 3.3V ± 0.3V, Ta = 0 to 70°C)
Parameter
Symbol
2.4
VCC
V
0
0.4
V
− 10
10
μA
− 10
10
μA
⎯
90
mA
1,2
RAS, CAS = VIH
⎯
2
RAS, CAS
≥ VCC − 0.2V
⎯
mA
1
0.5
⎯
90
mA
1,2
⎯
5
mA
1
⎯
90
mA
1,2
⎯
70
mA
1,3
IOH = −2.0mA
Output Low Voltage
VOL
IOL = 2.0mA
0V ≤ VI ≤ VCC +0.3V;
Input Leakage
Current
ILI
Output Leakage
Current
ILO
Average Power
Supply Current
ICC1
(Operating)
ICC2
(Standby)
ICC3
(CAS before RAS
Refresh)
Average Power
Supply Current
(Fast Page Mode)
DQ disable
0V ≤ VO ≤ VCC
RAS, CAS cycling,
tRC = Min.
CAS = VIH,
tRC = Min.
RAS = VIH,
ICC5
(Standby)
Average Power
Supply Current
All other pins not
under test = 0V
RAS cycling,
(RAS-only Refresh)
Power Supply
Current
Note
Max.
VOH
Average Power
Supply Current
Unit
Min.
Output High Voltage
Power Supply
Current
MSM51V17400
F-60
Condition
CAS = VIL,
DQ = enable
ICC6
RAS = cycling,
CAS before RAS
RAS = VIL,
ICC7
CAS cycling,
tPC = Min.
Notes: 1. ICC Max. is specified as ICC for output open condition.
2. The address can be changed once or less while RAS = VIL.
3. The address can be changed once or less while CAS = VIH.
4/15
FEDD51V17400F-03
MSM51V17400F
AC CHARACTERISTICS (1/2)
(VCC = 3.3V ± 0.3V, Ta = 0 to 70°C) Note1,2,3,11,12
Parameter
MSM51V17400
F-60
Symbol
Unit
Note
Min.
Max.
tRC
110
⎯
ns
tRWC
155
⎯
ns
tPC
40
⎯
ns
Fast Page Mode Read Modify Write
tPRWC
Cycle Time
85
⎯
ns
Access Time from RAS
tRAC
⎯
60
ns
4, 5, 6
Access Time from CAS
tCAC
⎯
15
ns
4, 5
Access Time from Column Address
tAA
⎯
30
ns
4, 6
Access Time from CAS Precharge
tCPA
⎯
35
ns
4
Access Time from OE
tOEA
⎯
15
ns
4
Output Low Impedance Time from
CAS
tCLZ
0
⎯
ns
4
CAS to Data Output Buffer Turnoff Delay Time
tOFF
0
15
ns
7
OE to Data Output Buffer Turn-off
Delay Time
tOEZ
0
15
ns
7
Transition Time
tT
3
50
ns
3
Refresh Period
tREF
⎯
32
ms
RAS Precharge Time
tRP
40
⎯
ns
RAS Pulse Width
tRAS
60
10,000
ns
RAS Pulse Width (Fast Page Mode) tRASP
60
100,000
ns
RAS Hold Time
tRSH
15
⎯
ns
RAS Hold Time referenced to OE
tROH
15
⎯
ns
CAS Precharge Time
(Fast Page Mode)
tCP
10
⎯
ns
CAS Pulse Width
tCAS
15
10,000
ns
CAS Hold Time
tCSH
60
⎯
ns
CAS to RAS Precharge Time
tCRP
5
⎯
ns
RAS Hold Time from CAS Precharge tRHCP
35
⎯
ns
RAS to CAS Delay Time
tRCD
20
45
ns
5
RAS to Column Address Delay Time
tRAD
15
30
ns
6
Row Address Set-up Time
tASR
0
⎯
ns
Random Read or Write Cycle Time
Read Modify Write Cycle Time
Fast Page Mode Cycle Time
5/15
FEDD51V17400F-03
MSM51V17400F
AC CHARACTERISTICS (2/2)
(VCC = 3.3V ± 0.3V ,Ta = 0 to 70°C) Note1,2,3,11,12
Parameter
MSM51V17400
F-60
Symbol
Unit
Min.
Max.
Note
Row Address Hold Time
tRAH
10
⎯
ns
Column Address Set-up Time
tASC
0
⎯
ns
Column Address Hold Time
tCAH
10
⎯
ns
Column Address to RAS Lead Time
tRAL
30
⎯
ns
Read Command Set-up Time
tRCS
0
⎯
ns
Read Command Hold Time
tRCH
0
⎯
ns
8
Read Command Hold Time
referenced to RAS
tRRH
0
⎯
ns
8
Write Command Set-up Time
tWCS
0
⎯
ns
9
Write Command Hold Time
tWCH
10
⎯
ns
Write Command Pulse Width
tWP
10
⎯
ns
OE Command Hold Time
tOEH
15
⎯
ns
Write Command to RAS Lead Time
tRWL
15
⎯
ns
Write Command to CAS Lead Time
tCWL
15
⎯
ns
Data-in Set-up Time
tDS
0
⎯
ns
10
Data-in Hold Time
tDH
10
⎯
ns
10
OE to Data-in Delay Time
tOED
15
⎯
ns
CAS to WE Delay Time
tCWD
40
⎯
ns
9
Column Address to WE Delay Time
tAWD
55
⎯
ns
9
RAS to WE Delay Time
tRWD
85
⎯
ns
9
tCPWD
60
⎯
ns
9
CAS Active Delay Time from RAS
Precharge
tRPC
5
⎯
ns
RAS to CAS Set-up Time
(CAS before RAS)
tCSR
10
⎯
ns
RAS to CAS Hold Time
(CAS before RAS)
tCHR
10
⎯
ns
WE to RAS Precharge Time
(CAS before RAS)
tWRP
10
⎯
ns
WE Hold Time from RAS
(CAS before RAS)
tWRH
10
⎯
ns
RAS to WE Set-up Time (Test Mode)
tWTS
10
⎯
ns
RAS to WE Hold Time (Test Mode)
tWTH
10
⎯
ns
CAS Precharge WE Delay Time
6/15
FEDD51V17400F-03
MSM51V17400F
Notes: 1. A start-up delay of 200μs is required after power-up, followed by a minimum of eight initialization
cycles (RAS-only refresh or CAS before RAS refresh) before proper device operation is achieved.
2. The AC characteristics assume tT = 5ns.
3. VIH (Min.) and VIL (Max.) are reference levels for measuring input timing signals. Transition times (tT)
are measured between VIH and VIL.
4. This parameter is measured with a load circuit equivalent to 1TTL load and 100pF.
5. Operation within the tRCD (Max.) limit ensures that tRAC (Max.) can be met.
tRCD (Max.) is specified as a reference point only. If tRCD is greater than the specified tRCD (Max.) limit,
then the access time is controlled by tCAC.
6. Operation within the tRAD (Max.) limit ensures that tRAC (Max.) can be met.
tRAD (Max.) is specified as a reference point only. If tRAD is greater than the specified tRAD (Max.) limit,
then the access time is controlled by tAA.
7. tOFF (Max.) and tOEZ (Max.) define the time at which the output achieved the open circuit condition and
are not referenced to output voltage levels.
8. tRCH or tRRH must be satisfied for a read cycle.
9. tWCS, tCWD, tRWD, tAWD and tCPWD are not restrictive operating parameters. They are included in the data
sheet as electrical characteristics only. If tWCS ≥ tWCS (Min.), then the cycle is an early write cycle and
the data out will remain open circuit (high impedance) throughout the entire cycle. If tCWD ≥ tCWD
(Min.), tRWD ≥ tRWD(Min.), tAWD ≥ tAWD (Min.) and tCPWD ≥ tCPWD (Min.), then the cycle is a read modify
write cycle and data out will contain data read from the selected cell; if neither of the above sets of
conditions is satisfied, then the condition of the data out (at access time) is indeterminate.
10. These parameters are referenced to the CAS, leading edges in an early write cycle, and to the WE
leading edge in an OE control write cycle, or a read modify write cycle.
11. The test mode is initiated by performing a WE and CAS before RAS refresh cycle. This mode is
latched and remains in effect until the exit cycle is generated. In a test CA9 and CA10 are not used and
each DQ pin now access 4-bit locations. Since all 4 DQ pins are used, a total 16 data bits can be written
in parallel into the memory array. In a read cycle, if 4 data bits are equal, the DQ pin will indicate a
high level. If the 4 data bits are not equal, the DQ pin will indicate a low level. The test mode is cleared
and the memory device returned to its normal operating state by performing a RAS-only refresh cycle
or a CAS before RAS refresh cycle.
12. In a test mode read cycle, the value of access time parameter is delayed for 5ns for the specified value.
These parameters should be specified in test mode cycle by adding the above value to the specified
value in this data sheet.
7/15
FEDD51V17400F-03
MSM51V17400F
TIMING CHART
Read Cycle
RAS
tRC
tRAS
VIH
tRP
VIL
tCSH
tCRP
CAS
WE
tCRP
tRSH
tCAS
VIH
tRAD
VIL
tRAL
tASR
Address
tRCD
VIH
VIL
tRAH
tASC
Row
tCAH
Column
tRRH
tRCS
VIH
tAA
VIL
tRCH
tROH
tOEA
OE
VIH
VIL
tCAC
tRAC
DQ
tOFF
tOEZ
tCLZ
VOH
Valid Data-out
Open
VOL
“H” or “L”
Write Cycle (Early Write)
RAS
tRC
tRAS
VIH
tRP
VIL
tCSH
tCRP
CAS
tRAD
VIL
tRAL
VIH
VIL
tRAH
tASC
Row
tCAH
Column
tCWL
tWCS
tWP
WE
OE
DQ
tCRP
tRSH
tCAS
VIH
tASR
Address
tRCD
tWCH
VIH
VIL
tRWL
VIH
VIL
VIH
VIL
tDS
tD
Valid Data-in
Open
“H” or “L”
8/15
FEDD51V17400F-03
MSM51V17400F
Read Modify Write Cycle
tRWC
tRAS
RAS
VIH
tRP
VIL
tCSH
tCRP
CAS
tRAD
VIL
VIH
VIL
tCRP
tRSH
tCAS
VIH
tASR
Address
tRCD
tRAH
tASC
Row
tCWL
tRWL
tCAH
Colum
tRCS
tCWD
tWP
tRWD
WE
OE
VIH
VIL
tAWD
tAA
tOEH
tOE
VIH
tOED
VIL
tCAC
tDH
tRAC
DQ
VI/OH
VI/OL
tOEZ
tCLZ
Valid
Data-out
tDS
Valid
Data-in
“H” or “L”
9/15
FEDD51V17400F-03
MSM51V17400F
Fast Page Mode Read Cycle
tRASP
RAS
VIH
VIL
tRCD
tCRP
CAS
tCP
tCP
tRAD
tCSH
VIL
VIH
VIL
tRAH
Row
tASC
tCAH
Column
tCAH
tASC
Column
tRCH
tCAH
Column
tRCS
tRCH
tRCS
tRCH
VIH
VIL
tAA
tAA
tAA
tOEA
tRRH
tOEA
VIH
VIL
tRAC
tCAC
DQ
tCRP
tRAL
tASC
tOEA
OE
tRSH
tCAS
tCAS
VIH
tRCS
WE
tRHCP
tCAS
tASR
Address
tRP
tPC
tCAC
tCPA
tOFF
tOEZ
Valid
Data-out
Valid
Data-out
VOL
tOFF
tCAC
tOEZ t
CLZ
tCLZ
tCLZ
VOH
tCPA
tOFF
tOEZ
Valid
Data-out
“H” or “L”
Fast Page Mode Write Cycle (Early Write)
tRP
tRASP
RAS
VIH
VIL
tCRP
tCP
tRCD
tCP
tCAS
CAS
tCAS
VIH
VIH
VIL
tRAH tASC
Row
tCSH
tCAH
tASC
Column
tCRP
tASC
tRAL
tCAH
Column
tRWL
tWCS
tWCH
tWP
tCWL
tWCS
VIH
tWCH
tWP
tCWL
tWCS
tWP
tWCH
VIL
tDS
VIH
DQ
tCAH
Column
tCWL
WE
tRSH
tCAS
tRAD
VIL
tASR
Address
tRHPC
tPC
VIL
tDH
Valid *
Data-in
tDS
tDH
Valid *
Data-in
tDS
tDH
Valid *
Data-in
Note: OE = “H” or “L”
“H” or “L”
10/15
FEDD51V17400F-03
MSM51V17400F
Fast Page Mode Read Modify Write Cycle
tRASP
tCSH
tPRWC
tRP
tRSH
VIH
RAS
VIL
tRCD
tCP
tCAS
tRAH
tASR
VIH
VIL
tCAH
tRAD
VIL
Address
tCR
tCAS
tCAH
VIH
CAS
tCP
tCAS
tCAH
tCWL
tASC
Row
tASC
Column
Column
tRCS
tRWD
tCWD
tRCS
tASC
tRAL
tCWL
Column
tRC
tCPWD
tCWL
tCPWD
tCWD
tCWD
tAWD
tAWD
tRWL
VIH
WE
tAWD
VIL
tWP
tRAC
tAA
tDH
tOEA
VIH
OE
tCAC
tAA
VI/OL
Out
tCLZ
tCAC
tDS
tOED
tOEZ
tDS tCAC
Out
In
tDH
tOEA
tOED
tOEZ
tOEZ
VI/OH
DQ
tCPA
tOEA
tOED
VIL
tROH
tDH
tAA
tDS
tWP
tWP
tCPA
In
Out
In
tCLZ
tCLZ
Note: In = Valid Data-in, Out = Valid Data-out
“H” or “L”
RAS-only Refresh Cycle
tRC
tRAS
RAS
VIH
tRP
VIL
tCRP
CAS
Address
DQ
tRPC
VIH
VIL
VIH
VIL
VOH
VOL
tASR
tRA
Row
tOFF
Open
Note: WE, OE = “H” or “L”
“H” or “L”
11/15
FEDD51V17400F-03
MSM51V17400F
CAS before RAS Refresh Cycle
tRP
RAS
tRC
tRAS
VIH
tRPC
tCP
VIL
tRP
tCSR
tRPC
tCHR
CAS
WE
VIH
VIL
tWRP
tWRH
tWRP
VIH
VIL
tOFF
DQ
VOH
Open
VOL
Note: OE, Address = “H” or “L”
“H” or “L”
Hidden Refresh Read Cycle
tRC
tRC
tRAS
RAS
tRAS
VIH
VIL
tCRP
tRCD
tRSH
tRP
tRP
tCHR
CAS
VIH
tRAD
VIL
tASR
Address
VIH
VIL
tRAH
tASC
Row
tCAH
Column
tRCS
WE
tCAC
VIH
VIL
tRAL
tAA
tROH
OE
DQ
VIL
VOL
tWRP tWRH
tOFF
tOEA
VIH
VOH
tRRH
tRAC
tOEZ
tCLZ
Open
Valid Data-out
“H” or “L”
12/15
FEDD51V17400F-03
MSM51V17400F
Hidden Refresh Write Cycle
tRC
tRC
tRAS
RAS
tRAS
VIH
VIL
tCRP
tRCD
tRSH
tRP
tRP
tCHR
CAS
VIH
tRAD
VIL
tASR
Address
VIH
VIL
tRAH
tASC
Row
tCAH
Column
tRAL
tRWL
tWP
WE
VIH
VIL
tWCH
tWCS
OE
DQ
tWRP
tWRH
VIH
VIL
tDS
VIH
tDH
Valid Data-in
VIL
“H” or “L”
Test Mode-in Cycle
tRC
tRP
RAS
tRAS
VIH
VIL
tRPC
tCP
tCSR
CAS
VIL
tWTS
WE
DQ
tCHR
VIH
tWTH
VIH
VIL
VIH
VIL
tOFF
Open
Note: OE, Address = “H” or “L”
“H” or “L”
13/15
FEDD51V17400F-03
MSM51V17400F
REVISION HISTORY
Page
Previous Current
Edition
Edition
Document
No.
Date
FEDD51V17400F-01
Mar.23, 2004
–
–
FEDD51V17400F-02
Feb.01, 2012
1,2
1
3
1,2
1
–
FEDD51V17400F-03
Nov. 27, 2014
1
1
Description
Final edition 1 from FEDD5117400F-04
Deleted SOJ26/24
Changed pb-free device name
Deleted Block diagram
Changed package code(Cu frame)
Added ROHM logo mark
Changed company Logo
14/15
FEDD51V17400F-03
MSM51V17400F
NOTES
No copying or reproduction of this document, in part or in whole, is permitted without the consent of LAPIS
Semiconductor Co., Ltd.
The content specified herein is subject to change for improvement without notice.
Examples of application circuits, circuit constants and any other information contained herein illustrate the
standard usage and operations of the Products. The peripheral conditions must be taken into account when
designing circuits for mass production.
Great care was taken in ensuring the accuracy of the information specified in this document. However, should you
incur any damage arising from any inaccuracy or misprint of such information, LAPIS Semiconductor shall bear
no responsibility for such damage.
The technical information specified herein is intended only to show the typical functions of and examples of
application circuits for the Products. LAPIS Semiconductor does not grant you, explicitly or implicitly, any license
to use or exercise intellectual property or other rights held by LAPIS Semiconductor and other parties. LAPIS
Semiconductor shall bear no responsibility whatsoever for any dispute arising from the use of such technical
information.
The Products specified in this document are intended to be used with general-use electronic equipment or devices
(such as audio visual equipment, office-automation equipment, communication devices, electronic appliances and
amusement devices).
The Products specified in this document are not designed to be radiation tolerant.
While LAPIS Semiconductor always makes efforts to enhance the quality and reliability of its Products, a Product
may fail or malfunction for a variety of reasons.
Please be sure to implement in your equipment using the Products safety measures to guard against the possibility
of physical injury, fire or any other damage caused in the event of the failure of any Product, such as derating,
redundancy, fire control and fail-safe designs. LAPIS Semiconductor shall bear no responsibility whatsoever for
your use of any Product outside of the prescribed scope or not in accordance with the instruction manual.
The Products are not designed or manufactured to be used with any equipment, device or system which requires an
extremely high level of reliability the failure or malfunction of which may result in a direct threat to human life or
create a risk of human injury (such as a medical instrument, transportation equipment, aerospace machinery,
nuclear-reactor controller, fuel-controller or other safety device). LAPIS Semiconductor shall bear no
responsibility in any way for use of any of the Products for the above special purposes. If a Product is intended to
be used for any such special purpose, please contact a ROHM sales representative before purchasing.
If you intend to export or ship overseas any Product or technology specified herein that may be controlled under
the Foreign Exchange and the Foreign Trade Law, you will be required to obtain a license or permit under the Law.
Copyright 2004 – 2014 LAPIS Semiconductor Co., Ltd.
2-4-8 Shinyokohama, Kouhoku-ku,
Yokohama 222-8575, Japan
http://www.lapis-semi.com/en/
15/15