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SP385EEA

SP385EEA

  • 厂商:

    SIPEX(迈凌)

  • 封装:

  • 描述:

    SP385EEA - Enhanced 3V or 5V RS-232 Line Driver/Receiver - Sipex Corporation

  • 数据手册
  • 价格&库存
SP385EEA 数据手册
® SP385E Enhanced +3V or +5V RS-232 Line Driver/Receiver s Operates from 3.3V or 5V Power Supply s Meets All EIA-232D and V.28 Specifications at 5V s Meets EIA-562 Specifications at 3.3V s Two Drivers and Receivers s Operates with 0.1µF to 10µF Capacitors s High Data Rate — 120kbps Under Load s Low Power Shutdown ≤1µA s 3-State TTL/CMOS Receiver Outputs s Low Power CMOS — 5mA Operation s Improved ESD Specifications: +15kV Human Body Model +15kV IEC1000-4-2 Air Discharge +8kV IEC1000-4-2 Contact Discharge DESCRIPTION… The Sipex SP385E is an enhanced version of the Sipex SP200 family of RS232 line drivers/ receivers. The SP385E offers +3.3V operation for EIA-562 and EIA-232 applications. The SP385E maintains the same performance features offered in its predecessors. The SP385E is available in plastic SOIC or SSOP packages operating over the commercial and industrial temperature ranges. The SP385E is pin compatible to the LTC1385 EIA-562 transceiver, except the drivers in the SP385E can only be disabled with the ON/OFF pin. RS232 OUTPUTS RS232 INPUTS CHARGE PUMP T1 T2 R 1 R 2 TTL/CMOS INPUTS TTL/CMOS OUTPUTS Rev. 10/22/01 SP385E Enhanced +3V to +5V RS-232 Line Driver/Receiver © Copyright 2001 Sipex Corporation 1 ABSOLUTE MAXIMUM RATINGS This is a stress rating only and functional operation of the device at these or any other conditions above those indicated in the operation sections of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods of time may affect reliability. Vcc ................................................................................................................................................................. +6V V+ .................................................................................................................... (Vcc-0.3V) to +13.2V V- .............................................................................................................................................................. 13.2V Input Voltages TIN ......................................................................................................................... -0.3 to (Vcc +0.3V) RIN ............................................................................................................................................................ ±15V Output Voltages TOUT .................................................................................................... (V+, +0.3V) to (V-, -0.3V) ROUT ................................................................................................................ -0.3V to (Vcc +0.3V) Short Circuit Duration TOUT ......................................................................................................................................... Continuous Power Dissipation CERDIP .............................................................................. 675mW (derate 9.5mW/°C above +70°C) Plastic DIP .......................................................................... 375mW (derate 7mW/°C above +70°C) Small Outline ...................................................................... 375mW (derate 7mW/°C above +70°C) SPECIFICATIONS VCC = +3.3V ± 10%; cap on (V+) and (V-) = 1.0µF, C1 = C2 = 0.1µF; TMIN to TMAX unless otherwise noted. PARAMETERS TTL INPUT Logic Threshold Low High Logic Pullup Current Maximum Data Rate TTL OUTPUT TTL/CMOS Output Voltage, Low Voltage, High Leakage Current; TA = +25°C VCC EIA-562 OUTPUT Output Voltage Swing MIN. TYP. MAX. UNITS CONDITIONS 0.8 2.0 15 120 200 Volts Volts µA kbps TIN ; ON/OFF Vcc = 3.3V TIN ; ON/OFF Vcc = 3.3V TIN = 0V CL = 2500pF, RL= 3kΩ 0.5 2.4 0.05 ±10 Volts Volts µA IOUT = 3.2mA; Vcc = 3.3V IOUT = -1.0mA ON/OFF=0V, 0V ≤ VOUT ≤ ±3.7 ±4.2 ±10 +15 1.2 1.7 0.5 5 4.0 1.5 30 10 300 1000 3 6 8 5 2.4 1.0 7 Volts Ω mA Volts Volts Volts Volts kΩ µs µs V/µs V/µs ns ns mA Power-Off Output Resistance 300 Output Short Circuit Current EIA-562 INPUT Voltage Range -15 Voltage Threshold Low 0.8 High Hysteresis 0.2 Resistance 3 DYNAMIC CHARACTERISTICS Driver Propagation Delay Receiver Propagation Delay Instantaneous Slew Rate Transition Region Slew Rate Output Enable Time Output Disable Time POWER REQUIREMENTS VCC Power Supply Current 3.3V 3kΩ Shutdown Supply Current All transmitter outputs loaded with 3kΩ to ground VCC = 0V; VOUT = ±2V Infinite duration VCC = 3.3V, TA = +25°C VCC = 3.3V, TA = +25°C VCC = 3.3V, TA = +25°C VIN = 15V to –15V TTL to RS-562 RS-562 to TTL CL = 10pF, RL= 3kΩ - 7kΩ; TA = +25°C CL = 2500pF, RL= 3kΩ; measured from +2V to -2V or -2V to +2V No load, TA= +25°C; VCC = mA All transmitters RL = TA = +25°C VCC = 3.3V, TA = +25°C 0.010 µA Rev. 10/22/01 SP385E Enhanced +3V to +5V RS-232 Line Driver/Receiver © Copyright 2001 Sipex Corporation 2 SPECIFICATIONS VCC = +3.3V ± 10%; cap on (V+) and (V-) = 1.0µF, C1 = C2 = 0.1µF; TMIN to TMAX unless otherwise noted. PARAMETERS TTL INPUT Logic Threshold Low High Logic Pullup Current Maximum Data Rate TTL OUTPUT TTL/CMOS Output Voltage, Low Voltage, High Leakage Current; TA = +25°C EIA-232 OUTPUT Output Voltage Swing MIN. TYP. MAX. UNITS CONDITIONS 0.8 2.0 15 120 200 Volts Volts µA kbps TIN ; ON/OFF TIN ; ON/OFF TIN = 0V CL = 2500pF, RL= 3kΩ 0.4 3.5 0.05 ±5 ±9 ±18 +15 1.2 1.7 0.5 5 1.5 30 10 400 250 10 25 1 15 10 2.4 1.0 7 ±10 Volts Volts µA Volts Ω mA Volts Volts Volts Volts kΩ µs V/µs V/µs ns ns mA mA µA IOUT = 3.2mA; Vcc = +5V IOUT = -1.0mA EN = VCC, 0V ≤ VOUT ≤ VCC All transmitter outputs loaded with 3kΩ to ground VCC = 0V; VOUT = ±2V Infinite duration Power-Off Output Resistance 300 Output Short Circuit Current EIA-232 INPUT Voltage Range -15 Voltage Threshold Low 0.8 High Hysteresis 0.2 Resistance 3 DYNAMIC CHARACTERISTICS Propagation Delay, RS-232 to TTL Instantaneous Slew Rate Transition Region Slew Rate Output Enable Time Output Disable Time POWER REQUIREMENTS VCC Power Supply Current Shutdown Supply Current VCC = 5V, TA = +25°C VCC = 5V, TA = +25°C VCC = 5V, TA = +25°C VIN = 15V to –15V CL = 10pF, RL= 3kΩ - 7kΩ; TA =+25°C CL = 2500pF, RL= 3kΩ; measured from +3V to -3V or -3V to +3V No load, TA= +25°C; VCC = 5V All transmitters RL = 3kΩ; TA = +25°C VCC = 5V, TA = +25°C PERFORMANCE CURVES -11 -10 -9 12 30 8.4 8.2 10 VCC = 6V VCC = 5V VCC = 4V 6 25 20 VCC = 6V VOH (Volts) 8.0 7.8 7.6 7.4 7.2 7.0 Load current = 0mA TA = 25°C V– Voltage (Volts) V+ (Volts) -8 -7 -6 -5 -4 -3 VCC = 6V VCC = 5V 8 ICC (mA) 15 VCC = 5V 10 VCC = 4V 5 VCC = 3V 4 VCC = 4V 2 0 0 2 4 6 8 10 12 14 0 5 10 15 20 25 30 35 40 0 -55 -40 0 25 70 85 125 6.8 4.5 4.75 5.0 VCC (Volts) 5.25 5.5 Load Current (mA) Load Current (mA) Temperature (°C) Rev. 10/22/01 SP385E Enhanced +3V to +5V RS-232 Line Driver/Receiver © Copyright 2001 Sipex Corporation 3 PINOUT N/C N/C C1+ V+ C1 C 2+ C 2VT2 OUT R2 IN 1 2 3 4 20 19 18 17 ON/OFF VCC GND T1 OUT R1 IN R1 OUT T1 IN T2 IN R2OUT N/C 1 2 3 4 18 17 16 15 ON/OFF VCC GND T 1 OUT R 1 IN R 1 OUT T 1 IN T 2 IN R 2 OUT C1+ V+ C 1C2+ C 2VT2OUT R2 IN SP385E 5 6 7 8 9 16 15 14 13 12 11 SP385E 5 6 7 8 9 14 13 12 11 10 N/C 10 18-pin SOIC TYPICAL OPERATING CIRCUIT 20-pin SSOP +5V INPUT +5V INPUT 10µF + 17 0.1µF 16V 10µF + 19 0.1µF 16V 2 1.0µF + 6.3V 4 5 C+ 1 V CC C 1C+ 2 +5V to +10V Voltage Doubler V+ 3+ 2 1.0µF + 6.3V 4 5 C+ 1 V CC C 1C+ 2 +5V to +10V Voltage Doubler V+ 3+ 1.0µF + 16V 6 C 2- +10V to -10V Voltage Inverter 400kΩ V- 7 + 0.1µF 16V 1.0µF + 16V 6 C 2- +10V to -10V Voltage Inverter 400kΩ V- 7 + 0.1µF 16V TTL/CMOS INPUTS T1 IN T 1OUT T1 IN 400kΩ T2 IN 11 T1 400kΩ T 1OUT T2 8 T 2OUT T2 IN 13 T2 8 T 2OUT TTL/CMOS OUTPUTS RS232 INPUTS 5kΩ R 2OUT 10 5kΩ R 2OUT 12 R2 5kΩ 9 R2 IN R2 5kΩ 9 R2 IN SP311E SP385E GND 16 18 ON/OFF SP311E SP385E GND 18 20 ON/OFF SOIC Package SSOP Package Rev. 10/22/01 SP385E Enhanced +3V to +5V RS-232 Line Driver/Receiver © Copyright 2001 Sipex Corporation 4 RS232 INPUTS R 1OUT 13 R1 14 TTL/CMOS OUTPUTS R1 IN R 1OUT 15 R1 16 R1 IN RS232 OUTPUTS T1 RS232 OUTPUTS 12 15 TTL/CMOS INPUTS 14 17 FEATURES… The Sipex SP385E is a +3V to +5V EIA-232/EIA562 line transceiver. It is a pin-for-pin alternative for the SP310A and will operate in the same socket with capacitors ranging from 0.1µF to 10µF, either polarized or non–polarized, in +3V supplies. The SP385E offers the same features such as 120kbps guaranteed transmission rate, increased drive current for longer and more flexible cable configurations, low power dissipation and overall ruggedized construction for commercialandindustrialenvironments. TheSP385E also includes a shutdown feature that tri-states the drivers and the receivers. The SP385E includes a charge pump voltage converter which allows it to operate from a single +3.3V or +5V supply. These converters double the VCC voltage input in order to generate the EIA-232 or EIA562 output levels. For +5V operation, the SP385E driver outputs adhere to all EIA-232D and CCITT V.28 specifications. While at +3.3V operation, the outputs adhere to EIA-562 specifications. Due to Sipex's efficient charge pump design, the charge pump levels and the driver outputs are less noisy than other 3V EIA-232 transceivers. The SP385E has a single control line which simultaneously shuts down the internal DC/DC converter and puts all transmitter and receiver outputs into a high impedance state. The SP385E is available in 18-pin plastic SOIC and 20-pin plastic SSOP packages for operation over commercial and industrial temperature ranges. Please consult the factory for surfacemount packaged parts supplied on tape-on-reel as well as parts screened to MIL-M-38510. The SP385E is ideal for +3.3V battery applications requiring low power operation. The charge pump strength allows the drivers to provide ±4.0V signals, plenty for typical EIA-232 applications since the EIA-232 receivers have input sensitivity levels of less than ±3V. THEORY OF OPERATION The SP385E device is made up of three basic circuit blocks — 1) a driver/transmitter, 2) a receiver and 3) a charge pump. Driver/Transmitter The drivers are inverting transmitters, which accept TTL or CMOS inputs and output the RS-232 signals with an inverted sense relative to the input logic levels. Typically the RS-232 output voltage swing is ±9V for 5V supply and ±4.2V for 3.3V supply. Even under worst case loading conditions of 3kΩ and 2500pF, the output is guaranteed to be ±5V for a 5V supply and ±3.7V for a 3.3V supply which adheres to EIA-232 and EIA-562 specifications, respectively. The transmitter outputs are protected against infinite short-circuits to ground without degradation in reliability. The instantaneous slew rate of the transmitter output is internally limited to a maximum of 30V/ µs in order to meet the standards [EIA 232-D 2.1.7, Paragraph (5)]. However, the transition region slew rate of these enhanced products is typically 10V/µs. The smooth transition of the loaded output from VOL to VOH clearly meets the monotonicity requirements of the standard [EIA 232-D 2.1.7, Paragraphs (1) & (2)]. Receivers The receivers convert RS-232 input signals to inverted TTL signals. Since the input is usually from a transmission line, where long cable lengths and system interference can degrade the signal, the inputs have a typical hysteresis margin of 500mV. This ensures that the receiver is virtually immune to noisy transmission lines. The input thresholds are 0.8V minimum and 2.4V maximum, again well within the ±3V RS-232 requirements. The receiver inputs are also protected against voltages up to ±15V. Should an input be left unconnected, a 5kΩ pull-down resistor to ground will commit the output of the receiver to a high state. In actual system applications, it is quite possible for signals to be applied to the receiver inputs before power is applied to the receiver circuitry. This occurs for example when a PC user attempts to print only to realize the printer wasn’t turned on. In this case an RS-232 signal from the PC will appear on the receiver input at the printer. When the printer power is turned on, the receiver will operate normally. All of these enhanced devices are fully protected. Rev. 10/22/01 SP385E Enhanced +3V to +5V RS-232 Line Driver/Receiver © Copyright 2001 Sipex Corporation 5 CHARGE PUMP The charge pump is a Sipex–patented design (5,306,954) and uses a unique approach compared to older less–efficient designs. The charge pump still requires four external capacitors, but uses a four–phase voltage shifting technique to attain symmetrical 10V power supplies. There is a free–running oscillator that controls the four phases of the voltage shifting. A description of each phase follows. Phase 1 — VSS charge storage —During this phase of the clock cycle, the positive side of capacitors C1 and C2 are initially charged to +5V. Cl+ is then switched to ground and the charge in C1– is transferred to C2–. Since C2+ is connected to +5V, the voltage potential across capacitor C2 is now 10V. Phase 2 — VSS transfer — Phase two of the clock connects the negative terminal of C2 to the VSS storage capacitor and the positive terminal of C2 to ground, and transfers the generated –l0V to C3. Simultaneously, the positive side of capacitor C 1 is switched to +5V and the negative side is connected to ground. Phase 3 — VDD charge storage — The third phase of the clock is identical to the first phase — the charge transferred in C1 produces –5V in the negative terminal of C1, which is applied to the negative side of capacitor C2. Since C2+ is at +5V, the voltage potential across C2 is l0V. Phase 4 — VDD transfer — The fourth phase of the clock connects the negative terminal of C2 to ground, and transfers the generated l0V across C2 to C4, the VDD storage capacitor. Again, simultaneously with this, the positive side of capacitor C1 is switched to +5V and the negative side is connected to ground, and the cycle begins again. Since both V+ and V– are separately generated from VCC; in a no–load condition V+ and V– will be symmetrical. Older charge pump approaches that generate V– from V+ will show a decrease in the magnitude of V– compared to V+ due to the inherent inefficiencies in the design. The clock rate for the charge pump typically operates at 15kHz. The external capacitors can be as low as 0.1µF with a 16V breakdown voltage rating. VCC = +5V +5V C1 + – C4 + – + C2 + – – VDD Storage Capacitor VSS Storage Capacitor –5V –5V C3 Figure 1. Charge Pump — Phase 1 VCC = +5V C4 + – + C1 + – C2 + – – VDD Storage Capacitor VSS Storage Capacitor –10V C3 Figure 2. Charge Pump — Phase 2 +10V a) C2+ GND GND b) C2– –10V Figure 3. Charge Pump Waveforms Rev. 10/22/01 SP385E Enhanced +3V to +5V RS-232 Line Driver/Receiver © Copyright 2001 Sipex Corporation 6 VCC = +5V +5V C1 + – C4 + – + C2 + – – VDD Storage Capacitor VSS Storage Capacitor –5V –5V C3 Figure 4. Charge Pump — Phase 3 VCC = +5V The Human Body Model has been the generally accepted ESD testing method for semiconductors. This method is also specified in MIL-STD-883, Method 3015.7 for ESD testing. The premise of this ESD test is to simulate the human body’s potential to store electro-static energy and discharge it to an integrated circuit. The simulation is performed by using a test model as shown in Figure 6. This method will test the IC’s capability to withstand an ESD transient during normal handling such as in manufacturing areas where the ICs tend to be handled frequently. The IEC-1000-4-2, formerly IEC801-2, is generally used for testing ESD on equipment and systems. For system manufacturers, they must guarantee a certain amount of ESD protection since the system itself is exposed to the outside environment and human presence. The premise with IEC1000-4-2 is that the system is required to withstand an amount of static electricity when ESD is applied to points and surfaces of the equipment that are accessible to personnel during normal usage. The transceiver IC receives most of the ESD current when the ESD source is applied to the connector pins. The test circuit for IEC1000-4-2 is shown on Figure 7. There are two methods within IEC1000-4-2, the Air Discharge method and the Contact Discharge method. RC C SW1 SW1 DC Power Source +10V C1 + – C4 + – + C2 + – – VDD Storage Capacitor VSS Storage Capacitor C3 Figure 5. Charge Pump — Phase 4 Shutdown (ON/OFF) The SP385E has a shut-down/standby mode to conserve power in battery-powered systems. To activate the shutdown mode, which stops the operation of the charge pump, a logic "0" is applied to the appropriate control line. The shutdown mode is controlled on the SP385E by a logic "0" on the ON/OFF control line (pin 18 for the SOIC and pin 20 for the SSOP packages); this puts the transmitter outputs in a tri-state mode. ESD Tolerance The SP385E device incorporates ruggedized ESD cells on all driver output and receiver input pins. The ESD structure is improved over our previous family for more rugged applications and environments sensitive to electro-static discharges and associated transients. The improved ESD tolerance is at least ±15KV without damage nor latch-up. There are different methods of ESD testing applied: a) MIL-STD-883, Method 3015.7 b) IEC1000-4-2 Air-Discharge c) IEC1000-4-2 Direct Contact RS S SW2 SW2 CS CS Device Under Test Figure 6. ESD Test Circuit for Human Body Model Contact-Discharge Module RC C SW1 DC Power Source RS S RV SW2 CS S Device Under Test RS and RV add up to 330Ω for IEC1000-4-2. Figure 7. ESD Test Circuit for IEC1000-4-2 Rev. 10/22/01 SP385E Enhanced +3V to +5V RS-232 Line Driver/Receiver © Copyright 2001 Sipex Corporation 7 30A 15A 0A t=0ns t=30ns The Contact Discharge Method applies the ESD current directly to the EUT. This method was devised to reduce the unpredictability of the ESD arc. The discharge current rise time is constant since the energy is directly transferred without the air-gap arc. In situations such as hand held systems, the ESD charge can be directly discharged to the equipment from a person already holding the equipment. The current is transferred on to the keypad or the serial port of the equipment directly and then travels through the PCB and finally to the IC. t¥ i¥ Figure 8. ESD Test Waveform for IEC1000-4-2 With the Air Discharge Method, an ESD voltage is applied to the equipment under test (EUT) through air. This simulates an electrically charged person ready to connect a cable onto the rear of the system only to find an unpleasant zap just before the person touches the back panel. The high energy potential on the person discharges through an arcing path to the rear panel of the system before he or she even touches the system. This energy, whether discharged directly or through air, is predominantly a function of the discharge current rather than the discharge voltage. Variables with an air discharge such as approach speed of the object carrying the ESD potential to the system and humidity will tend to change the discharge current. For example, the rise time of the discharge current varies with the approach speed. The circuit models in Figures 6 and 7 represent the typical ESD testing circuit used for all three methods. The CS is initially charged with the DC power supply when the first switch (SW1) is on. Now that the capacitor is charged, the second switch (SW2) is on while SW1 switches off. The voltage stored in the capacitor is then applied through RS, the current limiting resistor, onto the device under test (DUT). In ESD tests, the SW2 switch is pulsed so that the device under test receives a duration of voltage. For the Human Body Model, the current limiting resistor (RS) and the source capacitor (CS) are 1.5kΩ an 100pF, respectively. For IEC-1000-42, the current limiting resistor (RS) and the source capacitor (CS) are 330Ω an 150pF, respectively. The higher CS value and lower RS value in the IEC1000-4-2 model are more stringent than the Human Body Model. The larger storage capacitor injects a higher voltage to the test point when SW2 is switched on. The lower current limiting resistor increases the current charge onto the test point. IEC1000-4-2 Direct Contact ±8kV ±8kV SP385E Family Driver Outputs Receiver Inputs HUMAN BODY MODEL ±15kV ±15kV Air Discharge ±15kV ±15kV Level 4 4 Table 1. Transceiver ESD Tolerance Levels Rev. 10/22/01 SP385E Enhanced +3V to +5V RS-232 Line Driver/Receiver © Copyright 2001 Sipex Corporation 8 PACKAGE: PLASTIC SMALL OUTLINE (SOIC) (WIDE) E H D A Ø e B A1 L DIMENSIONS (Inches) Minimum/Maximum (mm) A A1 B D E e H L Ø 18–PIN 0.093/0.104 (2.352/2.649) 0.004/0.012 (0.102/0.300) 0.013/0.020 (0.330/0.508) 0.447/0.463 (11.35/11.74) 0.291/0.299 (7.402/7.600) 0.050 BSC (1.270 BSC) 0.394/0.419 (10.00/10.64) 0.016/0.050 (0.406/1.270) 0°/8° (0°/8°) Rev. 10/22/01 SP385E Enhanced +3V to +5V RS-232 Line Driver/Receiver © Copyright 2001 Sipex Corporation 9 PACKAGE: PLASTIC SHRINK SMALL OUTLINE (SSOP) E H D A Ø e B A1 L DIMENSIONS (Inches) Minimum/Maximum (mm) A A1 B D E e H L Ø 20–PIN 0.068/0.078 (1.73/1.99) 0.002/0.008 (0.05/0.21) 0.010/0.015 (0.25/0.38) 0.278/0.289 (7.07/7.33) 0.205/0.212 (5.20/5.38) 0.026 BSC (0.065 BSC) 0.301/0.311 (7.65/7.90) 0.022/0.037 (0.55/0.95) 0°/8° (0°/8°) Rev. 10/22/01 SP385E Enhanced +3V to +5V RS-232 Line Driver/Receiver © Copyright 2001 Sipex Corporation 10 ORDERING INFORMATION Model ....................................................................................... Temperature Range ................................................................................ Package SP385ECA ..................................................................................... 0°C to +70°C ............................................................................... 20–pin SSOP SP385EEA ................................................................................... –40°C to +85°C ............................................................................. 20–pin SSOP SP385ECT ..................................................................................... 0°C to +70°C ................................................................................ 18–pin SOIC SP385EET ................................................................................... –40°C to +85°C .............................................................................. 18–pin SOIC CT and ET packages available Tape–on–Reel. Please consult the factory for pricing and availability for this option, and for parts screened to MIL–STD–883. Corporation SIGNAL PROCESSING EXCELLENCE Sipex Corporation Headquarters and Sales Office 22 Linnell Circle Billerica, MA 01821 TEL: (978) 667-8700 FAX: (978) 670-9001 e-mail: sales@sipex.com Sales Office 233 South Hillview Drive Milpitas, CA 95035 TEL: (408) 934-7500 FAX: (408) 935-7600 Sipex Corporation reserves the right to make changes to any products described herein. Sipex does not assume any liability arising out of the application or use of any product or circuit described herein; neither does it convey any license under its patent rights nor the rights of others. Rev. 10/22/01 SP385E Enhanced +3V to +5V RS-232 Line Driver/Receiver © Copyright 2001 Sipex Corporation 11
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