EMIF02-MIC07F3

EMIF02-MIC07F3 EMI filter and ESD protection Features ■ EMI symmetrical (I/O) low-pass filter ■ High efficiency in EMI/ESD protection ■ Lead-free package ■ Very thin package ■ High reliability offered by monolithic integration ■ High reduction of parasitic elements through integration and wafer level packaging Lead-free Flip-Chip package (8 bumps) Complies with the following standards ■ ■ Figure 1. IEC 61000-4-2 level 4 (on external pins B1 and C1): – +15 kV (air discharge) – +8 kV (contact discharge) IEC 61000-4-2 level 1 (on external pins): – +2 kV (air discharge) – +2 kV (contact discharge) Applications Pin configuration (bump side) 3 2 1 MIC Bias Acc_Det Op Gnd Mic2p B On Gnd Mic2n C A Where EMI filtering in ESD sensitive equipment is required: ■ Mobile phones and communication systems ■ Computers, printers and MCU Boards Description The EMIF02-MIC07F3 chip is a highly integrated audio filter device designed to suppress EMI/RFI noise in all systems subjected to electromagnetic interference. This filter includes ESD protection circuitry, which prevents damage to the protected device when subjected to ESD surges up to 15 kV. TM: IPAD is a trademark of STMicroelectronics. September 2011 Doc ID 17052 Rev 3 1/8 www.st.com 8 Characteristics 1 EMIF02-MIC07F3 Characteristics Figure 2. Configuration Acc_Det GND A2 GND Mic Bias A3 C11 B1 R11 R31 GND C21 R21 C31 B3 Mic2p C32 Mic2n R22 C1 C12 GND R12 GND to ASIC C3 C22 GND GND B2 and C2 are ground bumps and must be connected together Acc_Det pin connection The Acc_Det pin (accessory detection) is an input pin for the audio pre-amplifier chip which detects the voltage of the microphone line MIC2P in case the user presses the on-hook/offhook button on the headset. When the user selects off-hook using the headset button, the MIC2P is shorted to MIC2N which is grounded. If your design does not support the Acc_Det feature, the Acc_Det pin must be left open (not connected). Table 1. Symbol VPP 2/8 Absolute ratings (limiting values) Parameter and test conditions Pins B1 and C1, ESD discharge IEC 61000-4-2, level 4: air discharge contact discharge Pins A2, A3, B3, C3, ESD discharge IEC 61000-4-2, level 1 air discharge contact discharge PD Power dissipation at Tamb = 25 °C Top Tstg Value 15 8 Unit kV 2 2 60 mW Operating temperature range - 40 to + 85 °C Storage temperature range - 55 to + 150 °C Doc ID 17052 Rev 3 EMIF02-MIC07F3 Characteristics Figure 3. Electrical characteristics (definitions) Symbol VBR VCL IRM VRM IF IPP IR VF Rd aT Table 2. = = = = = = = = = = Parameter Breakdown voltage Clamping voltage Leakage current @ VRM Stand-off voltage Forward current Peak pulse current Breakdown current Forward voltage drop Dynamic impedance Voltage temperature Electrical characteristics - values (Tamb = 25 °C) Symbol Test conditions VBR IR = 1 mA IRM VRM = 3 V per line Min. Typ. Max. 7 V 50 200 R11 1900 2000 2100 R12 800 1000 1200 R21, R22 1760 2200 2640 R31 20 25 30 C11, C12 0.66 0.83 1 1 1.25 1.5 7 8.75 10.5 Vline = 0 V, Vosc = 30 mV, F = 1 MHz C21, C22 (measured under zero light conditions and with bumps B2 and C2 connected together) C31, C32 Table 3. nA Ω nF Dynamics characteristics (Tamb = 25° C)(1) Symbol Ripple Unit Condition Between 5 Khz and 20 kHz THD+N -21dBV fully differential between MICn and MICp 1kHz Max. Value Unit 2 dB 0.009 % 1. Dynamics characteristics are guaranteed by design and not production tested Doc ID 17052 Rev 3 3/8 Characteristics Figure 4. -20 EMIF02-MIC07F3 Attenuation versus frequency Figure 5. S21 (dB) S21 (dB) 0 VBIAS = 0 V Attenuation simulation with2 kΩ input and 47 kΩ output Input: 2 kΩ Output: 47 kΩ AC Simulations -10 -25 -20 -30 -30 Mic2p -35 -40 Mic2n -40 -50 -45 -60 -70 -50 -80 -55 -90 F (Hz) -60 100k Figure 6. 0 1M 10M 100M F (Hz) -100 1G 10 Analog crosstalk measurement 100 Figure 7. Crosstalk (dB) 1k 10k 100k 1M 10M 100M 1G ESD response to IEC 61000-4-2 on one input V(in) and on one output V(out) -15 kV air discharge VBIAS = 0 V -10 5 V/Div C2 IN -20 -30 -40 -50 -60 100 ns/Div -70 2 V/Div C3 -80 OUT -90 -100 -110 -120 F (Hz) -130 100k Figure 8. 1M 10M 100M 100 ns/Div 1G ESD response to IEC 61000-4-2 on one input V(in) and on one output V(out) +15 kV air discharge Figure 9. 1000 Line capacitance versus applied voltage (C11) C (pF) 5 V/Div 800 IN 600 C2 100 ns/Div 2 V/Div 400 OUT 200 C3 100 ns/Div 4/8 Vr (V) 0 0 Doc ID 17052 Rev 3 2 4 6 EMIF02-MIC07F3 2 Ordering information scheme Ordering information scheme Figure 10. Ordering information scheme EMIF yy - xxx zz Fx EMI filter Number of lines Information x = resistance value (Ohms) z = capacitance value / 10 (pF) or 3 letters = application 2 digits = version Package F = Flip Chip x = 3: lead-free, pitch = 400 µm Doc ID 17052 Rev 3 5/8 Package information 3 EMIF02-MIC07F3 Package information In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK® packages, depending on their level of environmental compliance. ECOPACK® specifications, grade definitions and product status are available at: www.st.com. ECOPACK® is an ST trademark. Figure 11. Flip-Chip package dimensions 605 µm ± 55 255 µm ± 40 185 µm 1.17 mm ± 30 µm Figure 12. Footprint recommendations Copper pad Diameter: 220µm recommended 260µm maxim um Solder mask opening: 300µm minimum Solder stencil opening: 220µm recommended 6/8 185 µm 1.17 mm ± 30 µm 400 µm ± 50 400 µm ± 40 Figure 13. Marking Dot, ST logo ECOPAK status xx = marking z = manufacturing location yww = datecode (y = year ww = week) Doc ID 17052 Rev 3 x x z y ww EMIF02-MIC07F3 Ordering information Figure 14. Flip-Chip tape and reel specification Dot identifying Pin A1 location 2.0 Ø 1.55 4.0 xxz yww ST xxz yww ST xxz yww ST 8.0 3.5 1.29 1.75 0.22 4.0 1.29 0.69 All dimensions are typical values in mm 4 Ordering information Table 4. Note: User direction of unreeling Ordering information Order code Marking Package Weight Base qty Delivery mode EMIF02-MIC07F3 JE Flip Chip 1.8 mg 5000 Tape and reel 7” More information is available in the application notes AN2348: “Flip Chip: Package description and recommendations for use” AN1751: “EMI Filters: Recommendations and measurements” 5 Revision history Table 5. Document revision history Date Revision Changes 16-Mar-2010 1 Initial release. 12-Oct-2010 2 Added Table 3. 23-Sep-2011 3 Added Acc_Det pin connection on page 2. Doc ID 17052 Rev 3 7/8 EMIF02-MIC07F3 Please Read Carefully: Information in this document is provided solely in connection with ST products. STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, modifications or improvements, to this document, and the products and services described herein at any time, without notice. All ST products are sold pursuant to ST’s terms and conditions of sale. Purchasers are solely responsible for the choice, selection and use of the ST products and services described herein, and ST assumes no liability whatsoever relating to the choice, selection or use of the ST products and services described herein. No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted under this document. If any part of this document refers to any third party products or services it shall not be deemed a license grant by ST for the use of such third party products or services, or any intellectual property contained therein or considered as a warranty covering the use in any manner whatsoever of such third party products or services or any intellectual property contained therein. UNLESS OTHERWISE SET FORTH IN ST’S TERMS AND CONDITIONS OF SALE ST DISCLAIMS ANY EXPRESS OR IMPLIED WARRANTY WITH RESPECT TO THE USE AND/OR SALE OF ST PRODUCTS INCLUDING WITHOUT LIMITATION IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE (AND THEIR EQUIVALENTS UNDER THE LAWS OF ANY JURISDICTION), OR INFRINGEMENT OF ANY PATENT, COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT. UNLESS EXPRESSLY APPROVED IN WRITING BY TWO AUTHORIZED ST REPRESENTATIVES, ST PRODUCTS ARE NOT RECOMMENDED, AUTHORIZED OR WARRANTED FOR USE IN MILITARY, AIR CRAFT, SPACE, LIFE SAVING, OR LIFE SUSTAINING APPLICATIONS, NOR IN PRODUCTS OR SYSTEMS WHERE FAILURE OR MALFUNCTION MAY RESULT IN PERSONAL INJURY, DEATH, OR SEVERE PROPERTY OR ENVIRONMENTAL DAMAGE. ST PRODUCTS WHICH ARE NOT SPECIFIED AS "AUTOMOTIVE GRADE" MAY ONLY BE USED IN AUTOMOTIVE APPLICATIONS AT USER’S OWN RISK. Resale of ST products with provisions different from the statements and/or technical features set forth in this document shall immediately void any warranty granted by ST for the ST product or service described herein and shall not create or extend in any manner whatsoever, any liability of ST. ST and the ST logo are trademarks or registered trademarks of ST in various countries. Information in this document supersedes and replaces all information previously supplied. The ST logo is a registered trademark of STMicroelectronics. All other names are the property of their respective owners. © 2011 STMicroelectronics - All rights reserved STMicroelectronics group of companies Australia - Belgium - Brazil - Canada - China - Czech Republic - Finland - France - Germany - Hong Kong - India - Israel - Italy - Japan Malaysia - Malta - Morocco - Philippines - Singapore - Spain - Sweden - Switzerland - United Kingdom - United States of America www.st.com 8/8 Doc ID 17052 Rev 3