EMIF02-USB01F2

EMIF02-USB01F2 2-line IPAD™, EMI filter including ESD protection Features ■ 2-line low-pass filter + ESD protection ■ High efficiency in EMI filtering ■ Lead-free package ■ Very low PCB space occupation: < 2.5 mm2 ■ Very thin package: 0.65 mm ■ High efficiency in ESD suppression (IEC 61000-4-2 level 4) ■ High reliability offered by monolithic integration ■ High reduction of parasitic elements through integration and wafer level packaging Flip Chip (8 bumps) Figure 1. Pin configuration (bump side view) 3 2 Pup 1 Vbus Complies with the following standards B DZ ■ IEC 61000-4-2 level 4 – ±15 kV (air discharge) – ±8 kV (contact discharge) D+ out D+ in C D GND Din A Dout E Application ■ ESD protection and EMI filtering for USB port Figure 2. Schematic Pup Description Vbus 1.3K R3 33 The EMIF02-USB01F2 is a highly integrated array designed to suppress EMI / RFI noise for USB port filtering. The EMIF02-USB01F2 Flip-Chip packaging means the package size is equal to the die size. DZ D+ out D+ in R1 GND 33 D- out D- in R2 Additionally, this filter includes ESD protection circuitry which prevents damage to the protected device when subjected to ESD surges up to 15 kV. TM: IPAD is a trademark of STMicroelectronics. September 2009 Doc ID 10950 Rev 4 1/8 www.st.com 8 Characteristics 1 EMIF02-USB01F2 Characteristics Table 1. Absolute ratings (Tamb = 25 °C) Symbol Parameter Junction temperature Tj Value Unit 125 °C Top Operating temperature range -40 to +85 °C Tstg Storage temperature range -55 to 150 °C Figure 3. Electrical characteristics - definitions I IPP Symbol VRM VBR IRM IPP C line Parameter Stand-off voltage Breakdown voltage Leakage current @ VRM Peak pulse current Input capacitance per line VBR VRM IR IRM V IRM IR VRM VBR IPP Table 2. Electrical characteristics - values (Tamb = 25 °C) Symbol 2/8 Test conditions Min. Typ. Max. Unit VBR IR = 1 mA 6 - - V IRM VRM = 3 V - - 0.5 µA Cline @0V - 40 45 pF R1, R2 Tolerance ± 5 % - 33 - Ω R3 Tolerance ± 5 % - 1.30 - kΩ Doc ID 10950 Rev 4 EMIF02-USB01F2 Figure 4. Characteristics S21 (dB) attenuation measurement Figure 5. Analog crosstalk measurements 0.00 dB -10.00 EMIF02-USB01: filtering response of lines C1/C3 and E1/E3 0.00 dB -5.00 -20.00 -10.00 -30.00 -15.00 -40.00 -20.00 -50.00 -25.00 -60.00 -30.00 -70.00 -35.00 -40.00 -80.00 -45.00 -90.00 -100.0 -50.00 1.0M E1_E3 Figure 6. 3.0M 10.0M 30.0M 100.0M 300.0M 1.0G 3.0G 1.0M 3.0M 10.0M C1_C3 Frequency/Hz 30.0M 100.0M 300.0M 1.0G 3.0G f/Hz ESD response to IEC 61000-4-2 (+15 kV air discharge) on one input (Vin) and one output (Vout) Figure 7. ESD response to IEC 61000-4-2 (-15 kV air discharge) on one input (Vin) and on one output (Vout) Vin: 10 V/d Vin: 10 V/d Vin: 5 V/d Vin: 5 V/d 100 ns/d 50 ns/d Figure 8. Capacitance versus reverse applied voltage (typical) C(pF) 40 35 30 25 20 15 VR(V) 10 0 0.5 1 1.5 2 2.5 3 3.5 Doc ID 10950 Rev 4 4 4.5 5 3/8 Application information 2 EMIF02-USB01F2 Application information Figure 9. Aplac model (resistors, diodes and bumps and ground connections) R_1k3 3.8nH A1, A3, B2, C1, C3, E1, E3 A3 C1 Csub Csub rsub_1k3 D2 Cbump Rsubump I/O bulk 0.15nH rsub_1k3 Lbump D02_usb 100m D2 bulk Rbump bulk 0.15nH cap_33R R_33R 0.23nH C3 Csub rsub_33R Csub rsub_33R D02_Nw D02_usb Rhole Lgnd_D Rsub_D D2 bulk bulk 0.3nH R_33R 0.7nH E1 E3 cap_33R Csub rsub_33R Csub rsub_33R cap_33R bulk Figure 10. Aplac model parameters R_33R 33.9 cap_33R 1.2pF R_1k3 1.3k Cz29pF Rsub_D 100 Model D02_Nw BV=100 IBV=1m CJO=6.8p M=0.3333 RS=2 VJ=0.6 TT=100n Csub0.3pF Rsub_33R 15 Rsub_1k3 50 lhole10pH Rhole400m Caphole0.4pF Lgnd_D 150pH Lbump50pH Rbump50m Cbump1.5pF Rsubump150 4/8 Lhole caphole cap_33R Doc ID 10950 Rev 4 Model D02_usb BV=16 IBV=1m CJO=Cz M=0.3333 RS=2 VJ=0.6 TT=100n EMIF02-USB01F2 3 Ordering information scheme Ordering information scheme Figure 11. Ordering information scheme EMIF yy - xxx zz Fx EMI filter Number of lines Information x = resistance value (Ohms) z = capacitance value / 10(pF) or 3 letters = application 2 digits = version Package F = Flip Chip X = 2: lead-free, pitch = 500 µm, bump = 315 µm Package information In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK® packages, depending on their level of environmental compliance. ECOPACK® specifications, grade definitions and product status are available at: www.st.com. ECOPACK® is an ST trademark. Figure 12. Package dimensions 700 ± 50 315 ± 50 650µm ± 65 m 5µ 49 ± m ± 50 1.97mm ± 50µm 50 1.27mm ± 50µm 285 µm 285µm 49 5µ 4 Doc ID 10950 Rev 4 5/8 Ordering information EMIF02-USB01F2 Figure 13. Footprint Figure 14. Marking Dot, ST logo xx = marking z = manufacturing location yww = datecode (y = year ww = week) Copper pad Diameter: 250 µm recommended, 300 µm max E Solder stencil opening: 330 µm x x z y ww Solder mask opening recommendation: 340 µm min for 315 µm copper pad diameter Figure 15. Flip Chip tape and reel specification Dot identifying Pin A1 location 3.5 ± 0.1 xxz yww 6/8 ST E User direction of unreeling Ordering information Table 3. Note: 1.37 xxz yww 4 ± 0.1 All dimensions in mm 5 ST E xxz yww ST E 8 ± 0.3 2.07 0.73 ± 0.05 1.75 ± 0.1 Ø 1.5 ± 0.1 4 ± 0.1 Ordering information Order code Marking Package Weight Base qty Delivery mode EMIF02-USB01F2 FF Flip Chip 3.35 mg 5000 Tape and reel 7” More information is available in the application notes: AN1235:"Flip Chip: Package description and recommendations for use" AN1751: “EMI filters: Recommendations and measurements” Doc ID 10950 Rev 4 EMIF02-USB01F2 6 Revision history Revision history Table 4. Document revision history Date Revision Changes 26-Oct-2004 1 Initial release. 16-Apr-2007 2 Updated ECOPACK statement. Updated Figure 11, Figure 12 and Figure 15. Reformatted to current standards. 29-Apr-2008 3 Typographical errors corrected. 18-Sep-2009 4 Updated ESD graphic in Figure 6 and Figure 7. Doc ID 10950 Rev 4 7/8 EMIF02-USB01F2 Please Read Carefully: Information in this document is provided solely in connection with ST products. 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