EMIF04-VID01F2

EMIF04-VID01F2 ® IPAD™ 4 LINES LOW CAPACITANCE EMI FILTER AND ESD PROTECTION MAIN APPLICATION Where EMI filtering in ESD sensitive equipment is required: ■ ■ ■ ■ LCD and camera for mobile phones Computers and printers Communication systems MCU board DESCRIPTION The EMIF04-VID01F2 is a 4 lines highly integrated array designed to suppress EMI / RFI noise in all systems subjected to electromagnetic interferences. The EMIF04-VID01F2 Flip-Chip packaging means the package size is equal to the die size. Additionally, this filter includes an ESD protection circuitry which prevents the protected device from destruction when subjected to ESD surges up to 15 kV. BENEFITS ■ High efficiency EMI filtering (-40db @ 900MHz) ■ Low line capacitance suitable for high speed data bus ■ Low serial resistance for camera impedance adaptation ■ Lead free package ■ Optimized PCB space consuming: 1.92mm x 1.29mm ■ Very thin package: 0.65 mm ■ High efficiency in ESD suppression on inputs pins (IEC61000-4-2 level 4) ■ High reliability offered by monolithic integration ■ High reducing of parasitic elements through integration & wafer level packaging ■ Reduce compnents counts and BOM ® Flip-Chip (10 Bumps) Table 1: Order Code Part Number EMIF04-VID01F2 Marking GU Figure 1: Pin Configuration (ball side) 6 5 I4 4 3 I3 I2 Gnd O4 2 1 I1 Gnd O3 O2 A B O1 C Figure 2: Configuration R Input COMPLIES WITH THE FOLLOWING STANDARDS: IEC61000-4-2 Level 4 on input pins 15kV (air discharge) 8kV (contact discharge) Output R = 100Ω CLINE = 16pF typ. @ 3V MIL STD 883E - Method 3015-6 Class 3 TM: IPAD is a trademark of STMicroelectronics. February 2005 REV. 1 1/6 EMIF04-VID01F2 Table 2: Absolute Ratings (limiting values) Symbol Tj Parameter and test conditions Value Unit 125 °C Maximum junction temperature Top Operating temperature range - 40 to + 85 °C Tstg Storage temperature range - 55 to + 150 °C Table 3: Electrical Characteristics (Tamb = 25°C) Symbol Parameter VBR Breakdown voltage IRM Leakage current @ VRM I VBR VRM R Cline IR IRM IRM IR Stand-off voltage VRM VBR V Series resistance between Input & Output Input capacitance per line Symbol Test conditions VBR IR = 1mA IRM VRM = 3V per line R Cline 2/6 VRM I = 10mA VR = 3V DC 1MHz VOSC = 30mV Min. Typ. Max. Unit 6 8 10 V 500 nA 100 120 Ω 16 19 pF 80 EMIF04-VID01F2 Figure 3: S21 (dB) attenuation measurement Figure 4: Analog crosstalk measurement 0 0 dB -10 dB -10 -20 -30 -20 -40 -50 -30 -60 -40 -70 -80 -50 -90 -100 -60 100k 1M 10M 100M 100k 1G 1M 10M 100M 1G f/Hz f/Hz Figure 5: ESD response to IEC61000-4-2 (+15kV air discharge) on one input V(in) and on one output (Vout) Figure 6: ESD response to IEC61000-4-2 (-15kV air discharge) on one input V(in) and on one output (Vout) Input 10V/d Input 10V/d Output 10V/d Output 10V/d 200ns/d 200ns/d Figure 7: Junction capacitance versus reverse voltage applied (typical values) CLINE(pF) 28 26 24 22 20 18 16 14 12 10 0.0 0.5 1.0 1.5 2.0 2.5 3.0 VLINE(V) 3/6 EMIF04-VID01F2 Figure 8: Ordering Information Scheme EMIF yy - xxx zz Fx EMI Filter Number of lines Information x = resistance value (Ohms) z = capacitance value / 10(pF) or 3 letters = application 2 digits = version Package F2 = Leadfree Flip-Chip x = 1: 500µm, Bump = 315µm = 2: Leadfree Pitch = 500µm, Bump = 315µm Figure 9: FLIP-CHIP Package Mechanical Data 435µm ± 50 315µm ± 50 500µm ± 50 650µm ± 65 50 1µ m ±5 0 1.29mm ± 50µm 250µm ± 50 1.92mm ± 50µm Figure 10: Foot Print Recommendations Dot, ST logo xx = marking z = packaging location yww = date code (y = year ww = week) 365 240 365 Copper pad Diameter : 250µm recommended , 300µm max Figure 11: Marking E Solder stencil opening : 330µm All dimensions in µm 4/6 x x z y w w 40 220 Solder mask opening recommendation : 340µm min for 300µm copper pad diameter EMIF04-VID01F2 Figure 12: FLIP-CHIP Tape and Reel Specification Dot identifying Pin A1 location Ø 1.5 +/- 0.1 1.75 +/- 0.1 4 +/- 0.1 3.5 +/- 0.1 ST E xxx yww ST E xxx yww ST E xxx yww 8 +/- 0.3 0.73 +/- 0.05 4 +/- 0.1 User direction of unreeling All dimensions in mm Table 4: Ordering Information Ordering code Marking Package Weight Base qty Delivery mode EMIF04-VID01F2 GU Flip-Chip 3.6 mg 5000 Tape & reel 7” Note: More packing informations are available in the application note AN1235: “Flip-Chip: Package description and recommendations for use” AN1751: “EMI Filters: Recommendations and measurements” Table 5: Revision History Date Revision 15-Feb-2005 1 Description of Changes First issue. 5/6 EMIF04-VID01F2 Information furnished is believed to be accurate and reliable. However, STMicroelectronics assumes no responsibility for the consequences of use of such information nor for any infringement of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of STMicroelectronics. Specifications mentioned in this publication are subject to change without notice. This publication supersedes and replaces all information previously supplied. STMicroelectronics products are not authorized for use as critical components in life support devices or systems without express written approval of STMicroelectronics. The ST logo is a registered trademark of STMicroelectronics. All other names are the property of their respective owners © 2005 STMicroelectronics - All rights reserved STMicroelectronics group of companies Australia - Belgium - Brazil - Canada - China - Czech Republic - Finland - France - Germany - Hong Kong - India - Israel - Italy - Japan Malaysia - Malta - Morocco - Singapore - Spain - Sweden - Switzerland - United Kingdom - United States of America www.st.com 6/6