STD7N60DM2
N-channel 600 V, 0.78 Ω typ., 6 A MDmesh™ DM2
Power MOSFET in a DPAK package
Datasheet - production data
Features
Order code
VDS
RDS(on) max.
ID
PTOT
STD7N60DM2
600 V
0.90 Ω
6A
60 W
Figure 1: Internal schematic diagram
Fast-recovery body diode
Extremely low gate charge and input
capacitance
Low on-resistance
100% avalanche tested
Extremely high dv/dt ruggedness
Zener-protected
Applications
Switching applications
Description
This high voltage N-channel Power MOSFET is
part of the MDmesh™ DM2 fast recovery diode
series. It offers very low recovery charge (Qrr)
and time (trr) combined with low RDS(on), rendering
it suitable for the most demanding high efficiency
converters and ideal for bridge topologies and
ZVS phase-shift converters.
Table 1: Device summary
Order code
Marking
Package
Packing
STD7N60DM2
7N60DM2
DPAK
Tape and reel
June 2017
DocID030755 Rev 1
This is information on a product in full production.
1/15
www.st.com
Contents
STD7N60DM2
Contents
1
Electrical ratings ............................................................................. 3
2
Electrical characteristics ................................................................ 4
2.1
Electrical characteristics (curves) ...................................................... 6
3
Test circuits ..................................................................................... 8
4
Package information ....................................................................... 9
5
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4.1
DPAK (TO-252) type A package information..................................... 9
4.2
DPAK (TO-252) packing information ............................................... 12
Revision history ............................................................................ 14
DocID030755 Rev 1
STD7N60DM2
1
Electrical ratings
Electrical ratings
Table 2: Absolute maximum ratings
Symbol
VGS
Parameter
Gate-source voltage
Value
Unit
±25
V
Drain current (continuous) at Tcase = 25 °C
6
Drain current (continuous) at Tcase = 100 °C
3.8
IDM(1)
Drain current (pulsed)
24
A
PTOT
W
ID
Total dissipation at Tcase = 25 °C
60
dv/dt(2)
Peak diode recovery voltage slope
50
dv/dt(3)
MOSFET dv/dt ruggedness
50
Tstg
Storage temperature range
Tj
Operating junction temperature range
A
V/ns
-55 to 150
°C
Value
Unit
Notes:
(1)
Pulse width is limited by safe operating area.
(2)
ISD ≤ 6 A, di/dt=900 A/μs; VDS peak < V(BR)DSS, VDD = 480 V.
(3)
VDS ≤ 480 V.
Table 3: Thermal data
Symbol
Rthj-case
Rthj-pcb
(1)
Parameter
Thermal resistance junction-case
2.08
Thermal resistance junction-pcb
50
°C/W
Notes:
(1)
When mounted on a 1-inch² FR-4, 2 Oz copper board.
Table 4: Avalanche characteristics
Symbol
Parameter
Value
Unit
IAR(1)
Avalanche current, repetitive or not repetitive
1.5
A
EAS(2)
Single pulse avalanche energy
160
mJ
Notes:
(1)
Pulse width limited by Tjmax.
(2)
Starting Tj = 25 °C, ID = IAR, VDD = 50 V.
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Electrical characteristics
2
STD7N60DM2
Electrical characteristics
(Tcase = 25 °C unless otherwise specified)
Table 5: Static
Symbol
V(BR)DSS
Parameter
Test conditions
Drain-source breakdown
voltage
VGS = 0 V, ID = 1 mA
Min.
Typ.
Max.
600
Unit
V
VGS = 0 V, VDS = 600 V
1
VGS = 0 V, VDS = 600 V,
Tcase = 125 °C (1)
100
Gate-body leakage
current
VDS = 0 V, VGS = ±25 V
±5
µA
VGS(th)
Gate threshold voltage
VDS = VGS, ID = 250 µA
4
4.75
V
RDS(on)
Static drain-source onresistance
VGS = 10 V, ID = 3 A
0.78
0.90
Ω
Min.
Typ.
Max.
Unit
-
324
-
-
18
-
-
2
-
IDSS
Zero gate voltage drain
current
IGSS
3.25
µA
Notes:
(1)Defined
by design, not subject to production test.
Table 6: Dynamic
Symbol
Parameter
Ciss
Input capacitance
Coss
Output capacitance
Crss
Reverse transfer
capacitance
Coss
Test conditions
VDS = 100 V, f = 1 MHz,
VGS = 0 V
pF
Equivalent output
capacitance
VDS = 0 to 480 V, VGS = 0 V
-
25
-
pF
RG
Intrinsic gate resistance
f = 1 MHz, ID = 0 A
-
6
-
Ω
Qg
Total gate charge
-
7.5
-
Qgs
Gate-source charge
-
2.2
-
Qgd
Gate-drain charge
VDD = 480 V, ID = 6 A,
VGS = 0 to 10 V
(see Figure 15: "Test circuit for
gate charge behavior")
-
3.2
-
eq.
(1)
nC
Notes:
(1)
Coss eq. is defined as a constant equivalent capacitance giving the same charging time as Coss when VDS
increases from 0 to 80% VDSS.
Table 7: Switching times
Symbol
td(on)
tr
td(off)
tf
4/15
Parameter
Turn-on delay time
Rise time
Turn-off delay time
Fall time
Test conditions
Min.
Typ.
Max.
VDD = 300 V, ID = 3 A
RG = 4.7 Ω, VGS = 10 V
(see Figure 14: "Test circuit for
resistive load switching times"
and Figure 19: "Switching time
waveform")
-
10
-
-
6
-
-
12.6
-
-
22.6
-
DocID030755 Rev 1
Unit
ns
STD7N60DM2
Electrical characteristics
Table 8: Source-drain diode
Symbol
Parameter
Test conditions
Min.
Typ.
Max.
Unit
ISD
Source-drain current
-
6
A
ISDM(1)
Source-drain current
(pulsed)
-
24
A
VSD(2)
Forward on voltage
VGS = 0 V, ISD = 6 A
-
1.6
V
trr
Reverse recovery time
-
69
ns
Qrr
Reverse recovery charge
-
164
nC
IRRM
Reverse recovery current
ISD = 6 A, di/dt = 100 A/µs,
VDD = 60 V
(see Figure 16: "Test circuit
for inductive load switching
and diode recovery times")
-
4.8
A
ISD = 6 A, di/dt = 100 A/µs,
VDD = 60 V, Tj = 150 °C
(see Figure 16: "Test circuit
for inductive load switching
and diode recovery times")
-
144
ns
-
492
nC
-
6.8
A
trr
Reverse recovery time
Qrr
Reverse recovery charge
IRRM
Reverse recovery current
Notes:
(1)
Pulse width is limited by safe operating area.
(2)
Pulse test: pulse duration = 300 µs, duty cycle 1.5%.
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Electrical characteristics
2.1
STD7N60DM2
Electrical characteristics (curves)
Figure 2: Safe operating area
Figure 3: Thermal impedance
Figure 4: Output characteristics
Figure 5: Transfer characteristics
Figure 6: Gate charge vs gate-source voltage
Figure 7: Static drain-source on-resistance
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DocID030755 Rev 1
STD7N60DM2
Electrical characteristics
Figure 8: Capacitance variations
Figure 9: Output capacitance stored energy
Figure 10: Normalized gate threshold voltage vs
temperature
Figure 11: Normalized on-resistance vs
temperature
Figure 12: Source-drain diode forward
characteristics
Figure 13: Normalized V(BR)DSS vs temperature
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7/15
Test circuits
3
8/15
STD7N60DM2
Test circuits
Figure 14: Test circuit for resistive load
switching times
Figure 15: Test circuit for gate charge
behavior
Figure 16: Test circuit for inductive load
switching and diode recovery times
Figure 17: Unclamped inductive load test
circuit
Figure 18: Unclamped inductive waveform
Figure 19: Switching time waveform
DocID030755 Rev 1
STD7N60DM2
4
Package information
Package information
In order to meet environmental requirements, ST offers these devices in different grades of
ECOPACK® packages, depending on their level of environmental compliance. ECOPACK ®
specifications, grade definitions and product status are available at: www.st.com.
ECOPACK® is an ST trademark.
4.1
DPAK (TO-252) type A package information
Figure 20: DPAK (TO-252) type A package outline
DocID030755 Rev 1
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Package information
STD7N60DM2
Table 9: DPAK (TO-252) type A mechanical data
mm
Dim.
Min.
Max.
A
2.20
2.40
A1
0.90
1.10
A2
0.03
0.23
b
0.64
0.90
b4
5.20
5.40
c
0.45
0.60
c2
0.48
0.60
D
6.00
6.20
D1
4.95
E
6.40
E1
4.60
4.70
4.80
e
2.16
2.28
2.40
e1
4.40
4.60
H
9.35
10.10
L
1.00
1.50
(L1)
2.60
2.80
3.00
L2
0.65
0.80
0.95
L4
0.60
R
V2
10/15
Typ.
5.10
5.25
6.60
1.00
0.20
0°
DocID030755 Rev 1
8°
STD7N60DM2
Package information
Figure 21: DPAK (TO-252) type A recommended footprint (dimensions are in mm)
DocID030755 Rev 1
11/15
Package information
4.2
STD7N60DM2
DPAK (TO-252) packing information
Figure 22: DPAK (TO-252) tape outline
12/15
DocID030755 Rev 1
STD7N60DM2
Package information
Figure 23: DPAK (TO-252) reel outline
Table 10: DPAK (TO-252) tape and reel mechanical data
Tape
Reel
mm
mm
Dim.
Dim.
Min.
Max.
A0
6.8
7
A
B0
10.4
10.6
B
1.5
12.1
C
12.8
B1
D
1.5
D1
1.5
E
1.65
F
1.6
Min.
Max.
330
13.2
D
20.2
G
16.4
1.85
N
50
7.4
7.6
T
K0
2.55
2.75
P0
3.9
4.1
Base qty.
2500
P1
7.9
8.1
Bulk qty.
2500
P2
1.9
2.1
R
40
T
0.25
0.35
W
15.7
16.3
DocID030755 Rev 1
18.4
22.4
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Revision history
5
STD7N60DM2
Revision history
Table 11: Document revision history
14/15
Date
Revision
20-Jun-2017
1
DocID030755 Rev 1
Changes
First release.
STD7N60DM2
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