STH290N4F6-2AG

UM1575 User manual Spice model tutorial for Power MOSFETs Introduction This document describes ST’s Spice model versions available for Power MOSFETs. This is a guide designed to support user choosing the best model for his goals. In fact, it explains the features of different model versions both in terms of static and dynamic characteristics and simulation performance, in order to find the right compromise between the computation time and accuracy. For example, the self-heating model (V3 version), which accurately reproduces the thermal response of all electrical parameters, requires a considerable simulation effort. Finally, an example shows how the self-heating model works. Spice models describe the characteristics of typical devices and don't guarantee the absolute representation of product specifications and operating characteristics; the datasheet is the only document providing product specifications. Although simulation is a very important tool to evaluate the device’s performance, the exact device’s behavior in all situations is not predictable, therefore the final laboratory test is necessary. November 2013 Doc ID 023670 Rev 1 1/24 www.st.com Spice model versions 1 UM1575 Spice model versions ST provides 6 model versions on each part number: • partnumber_V1C • partnumber_V1T • partnumber_V2 • partnumber_V3 • partnumber_V4 • partnumber_TN V1C version It is the basic model (LEVEL =3) enclosing Coss and Crss modeling through capacitance profile tables. It is an empirical model, and it assumes a 27 °C constant temperature. V1T version It comes directly from V1C version and it also includes the package thermal modeling through a thermal equivalent network and presents two additional external thermal nodes Tj and Tcase. This version hasn't the dynamic link between Power MOSFET temperature and internal parameters. V2 version It is more advanced than V1C, in fact it takes into account the temperature dependence and capacitance profiles too. It allows the static and dynamic behavior to be reproduced by user at fixed temperatures. By using this version, the simulation of self-heating effects isn't possible. V3 version It comes directly from V2 version and includes the package thermal model through a thermal equivalent network and presents two additional external thermal nodes: Tj and Tcase. In this version, during each transient, the current power dissipation is calculated and a current proportional to this power is fed into the thermal network. In this way, the voltage at Tj node contains all the information about the junction temperature, which changes internal device’s parameters. Since it is a monitoring node, usually Tj pin is not connected (however, to avoid warning messages on this node, the user has to add a floating wire - see Figure 1). On contrary, Tcase node has to be connected, either to a constant voltage source Vdc representing the ambient temperature or to a heat sink modeled by its own thermal network (Figure 1). V4 version It comes directly from V3 version considering the device sited in free air. It includes the package thermal modeling through a thermal equivalent network and presents three additional external thermal nodes: Tj, Tcase and Tamb. The voltage at Tj node and Tcase node contains all the information about the junction temperature and case temperature which change internal device’s parameters. Since they are monitoring nodes, usually Tj and Tcase pins are not connected (however, to avoid warning messages on this node, the user has to add a floating wire - see Figure 1). Conversely, Tamb node has to be connected: to a constant voltage source Vdc, representing the ambient temperature. 2/24 Doc ID 023670 Rev 1 UM1575 Spice model versions TN version It includes the RC thermal network only, which represents the thermal model of the package. Its symbol has two pins: Tj and Tcase. Figure 1. Self-heating model (V3 version) D D R1 TJ Zth G Tcase S R2 TJ Zth G Tamb 25 Tcase S 0 C1 C2 Tamb 25 0 GIPD081020130954FSR Note: Tj is a monitoring node and it is not connected; Tcase is connected either by using a Vdc, representing the ambient temperature (on the left-side), or by heat-sink thermal network (on the right-side). Doc ID 023670 Rev 1 3/24 24 Spice model symbol 2 UM1575 Spice model symbol For each model version, ST provides the appropriate symbol as shown below: Figure 2. Model symbols V1C version V2 version V4 version D TJ Zth G Tcase Tamb S V1T version V3 version D TJ TJ Tcase TN version Zth G 1 TJ TCASE 2 Tcase S GIPD081020131007FSR 4/24 Doc ID 023670 Rev 1 UM1575 3 Spice models - instructions to simulate Spice models - instructions to simulate In Spice simulator, user has to upload the device symbol (.OLB file) and the Spice model (.LIB file) to simulate transistors in the schematic. 3.1 Installation In the package model, there are the following files: • name.lib text file representing the model library written as a Spice code; • name.olb symbol file to use the model into Orcad capture user interface. In Capture open the menu dialog window "Pspice" "Edit Simulation Profile". Go to "Configuration Files" tab and "Library" category. Select the library (*.lib) path by "Browse…" button and click to "Add to Design" (see Figure 3) Figure 3. Capture dialog window to select the library (*.lib) GIPD081020131721FSR To include the symbol *.olb in the schematic view, open the menu dialog window "Place" "Part" (or simply pressing "P" key in keyboard) and click the "Add Library…" button (or pressing Alt+"A") to select the file (see figure below). Doc ID 023670 Rev 1 5/24 24 Spice models - instructions to simulate UM1575 Figure 4. Capture dialog window to include the symbol (*.olb) GIPD081020131724FSR Finally, you can simulate your circuit choosing the simulation type and parameters. 3.2 Typical simulation parameters / options As our models contain many non-linear elements, the standard simulation parameters are often not suitable. The following values can facilitate convergence (set them in dialog window "Pspice" "Edit Simulation Profile" "Options" tab): Note: ABSTOL= 1nA (best accuracy of currents) CHGTOL= 1 pC..10 pC (best accuracy of charges) ITL1= 150 (DC and bias 'blind' iteration limit) ITL2= 20...150 (DC and bias 'best guess' iteration limit) ITL4= 20...150 (transient time point iteration limit) RELTOL= 0.001...0.01 (relative accuracy of voltages and currents) If the following error message appears during the simulation of one of device models: ==> INTERNAL ERROR -- Overflow in device.....