STTH1R04QRL

STTH1R04 Datasheet 1 A - 400 V ultrafast recovery diode Features A K A A K K SMA SMB • • • • Applications • • A Negligible switching losses Low forward voltage drop High junction temperature ECOPACK compliant Switching diode Telecom power Description K The STTH1R04 series uses ST's new 400 V planar Pt doping technology. The STTH1R04 is specially suited for switching mode base drive and transistor circuits. Packaged in SMA, SMB and DO-15, the STTH1R04 is ideal for use low voltage, high frequency inverters, free wheeling and polarity protection DO-15 Product status STTH1R04 Product summary Symbol Value IF(AV) 1A VRRM 400 V T j(max.) 175 °C VF(typ.) 0.9 V trr(typ.) 14 ns DS5848 - Rev 4 - March 2019 For further information contact your local STMicroelectronics sales office. www.st.com STTH1R04 Characteristics 1 Characteristics Table 1. Absolute ratings (limiting values at 25 °C, unless otherwise specified) Symbol VRRM IF(AV) Parameter Unit 400 V 1 A 30 A -65 to +175 °C +175 °C Max. value Unit Repetitive peak reverse voltage Average forward current δ = 0.5, square wave IFSM Surge non repetitive forward current Tstg Storage temperature range Tj Value SMA TL = 125 °C SMB TL = 140 °C DO-15 TL = 105 °C tp = 10 ms sinusoidal Operating junction temperature Table 2. Thermal resistance parameter Symbol Rth(j-l) Parameter Junction to lead Junction to lead Lead length = 10 mm on infinite heatsink SMA 35 SMB 25 DO-15 50 °C/W For more information, please refer to the following application note : • AN5088 : Rectifiers thermal management, handling and mounting recommendations Table 3. Static electrical characteristics Symbol IR(1) Parameter Reverse leakage current Test conditions Tj = 25 °C Tj = 125 °C Min. VR = VRRM Tj = 25 °C (2) VF Forward voltage drop Tj = 100 °C Tj = 150 °C Typ. - 5 IF = 1 A Max. Unit 5 µA 50 µA 1.50 - 1.0 1.25 - 0.9 1.15 V 1. Pulse test: tp = 5 ms, δ < 2% 2. Pulse test: tp = 380 µs, δ < 2% To evaluate the conduction losses, use the following equation: P = 0.9 x IF(AV) + 0.250 x IF2(RMS) For more information, please refer to the following application notes related to the power losses : • AN604: Calculation of conduction losses in a power rectifier • AN4021: Calculation of reverse losses on a power diode DS5848 - Rev 4 page 2/14 STTH1R04 Characteristics Table 4. Dynamic characteristics (Tj = 25 °C unless otherwise stated) Symbol trr IRM tfr VFP DS5848 - Rev 4 Parameters Test conditions Min. Typ. Max. Unit IF = 1 A, dIF/dt = -50 A/μs, VR = 30 V - IF = 1 A, dIF/dt = -100 A/μs, VR = 30 V - 14 20 Reverse recovery current IF = 1 A, dIF/dt = -200 A/μs, VR = 320 V, Tj = 125 °C - 2.5 3.5 A Forward recovery time IF = 1 A, dIF/dt = 100 A/μs, VFR = 1.1 x VF(max.) - 50 ns Forward recovery voltage IF = 1 A, dIF/dt = 100 A/μs - Reverse recovery time 30 3.5 ns V page 3/14 STTH1R04 Characteristics (curves) 1.1 Characteristics (curves) Figure 1. Average forward power dissipation versus average forward current IFM(A) 50 P(W) 1.6 Figure 2. Forward voltage drop versus forward current δ=0.05 1.4 δ=0.1 45 δ=0.5 δ=0.2 δ=1 40 1.2 35 1.0 30 TJ=150°C (Maximum values) 25 0.8 TJ=150°C (Typical values) 20 0.6 15 0.4 T TJ=25°C =25°C (Maximum values) 10 5 0.2 I F(AV) (A) δ=tp/T tp 0.0 0.2 0.4 0.6 0.8 1.0 VFM(V) 0 0.0 1.2 0.0 0.4 0.8 1.2 1.6 2.0 2.4 2.8 3.2 3.6 4.0 Figure 3. Relative variation of thermal impedance junction Figure 4. Relative variation of thermal impedance junction to lead versus pulse duration (SMA) to lead versus pulse duration (SMB) 1.0 Zth(j-a)/Rth(j-a) 1.0 SMA Scu=1cm² 0.9 SMB Scu=1cm² 0.9 0.8 0.8 0.7 0.7 0.6 0.6 0.5 0.5 0.4 0.4 0.3 0.3 0.2 0.2 0.1 Zth(j-a)/Rth(j-a) Single pulse 0.1 t P(s) 0.0 1.E-02 DS5848 - Rev 4 1.E-01 1.E+00 Single pulse t P(s) 0.0 1.E+01 1.E+02 1.E+03 1.E-03 1.E-02 1.E-01 1.E+00 1.E+01 1.E+02 1.E+03 page 4/14 STTH1R04 Characteristics (curves) Figure 5. Relative variation of thermal impedance junction to lead versus pulse duration (DO-15) 1.0 Figure 6. Reverse recovery charges versus dIF/dt (typical values) Zth(j-a)/Rth(j-a) 40 DO-15 Lleads=10mm 0.9 QRR(nC) IF= 1 A VR=320 V 36 0.8 32 0.7 28 0.6 24 0.5 20 0.4 16 0.3 12 0.2 Tj=125 °C 8 Single pulse 0.1 0.0 Tj=25 °C 4 t P(s) dIF/dt(A/µs) 0 1.E-01 1.E+00 1.E+01 1.E+02 1.E+03 Figure 7. Junction capacitance versus reverse voltage applied (typical values) 100 C(pF) 10 10 t RR(ns) IF= 1 A VR=320 V Tj=125 °C 30 25 20 15 10 1 10 100 1000 Figure 9. Peak reverse recovery current versus dIF/dt (typical values) 5.0 IRM(A) dIF/dt(A/µs) 10 IF= 1 A VR=320 V 1.0 3.5 3.0 IRM 0.8 Tj=125 °C 2.5 1000 QRR [Tj ]j ]// Q QRR [Tj =125°C] Q RR;;IIRM RM [T RR;;IIRM RM [T j =125°C] 1.2 4.0 100 Figure 10. Relative variations of dynamic parameters versus junction temperature 1.4 IF= 1 A VR=320 V 4.5 Tj=25 °C 5 0 VR(V) 1 1000 Figure 8. Reverse recovery time versus dIF/dt (typical values) 70 65 60 55 50 45 40 35 F=1MHz VOSC=30mVRMS Tj=25°C 100 2.0 0.6 1.5 0.4 QRR 1.0 Tj=25 °C 0.5 0.2 dIF/dt(A/µs) T j (°C) 0.0 0.0 10 DS5848 - Rev 4 100 1000 25 50 75 100 125 150 page 5/14 STTH1R04 Characteristics (curves) Figure 11. Transient peak forward voltage versus dIF/dt (typical values) 30 Figure 12. Forward recovery time versus dIF/dt (typical values) VFp (V) t FR(ns) 55 IF=1 A Tj=125 °C IF=1 A Tj=125 °C 50 25 45 40 20 35 30 15 25 20 10 15 10 5 5 dIF/dt(A/µs) 0 50 100 150 200 250 300 350 400 450 0 500 Figure 13. Thermal resistance junction to ambient versus copper surface under each lead (typical values) 200 dIF/dt(A/µs) 0 0 50 100 150 200 250 300 350 400 500 Figure 14. Thermal resistance junction to ambient versus copper surface under each lead (typical values) Rth(j-a)(°C/W) 200 Rth(j-a)(°C/W) SMA SMB 150 150 100 100 Epoxy printed board FR4, eCu = 35 µm Epoxy printed board FR4, eCu = 35 µm 50 450 50 SCu (cm²) SCu (cm²) 0 0 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 Figure 15. Thermal resistance junction to ambient versus lead length, DO-15 Rth(j-a) (°C/W) 120 DO-15 100 80 60 40 20 L leads (mm) 0 0.0 DS5848 - Rev 4 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 page 6/14 STTH1R04 Package information 2 Package information In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK packages, depending on their level of environmental compliance. ECOPACK specifications, grade definitions and product status are available at: www.st.com. ECOPACK is an ST trademark. 2.1 SMB package information • • Epoxy meets UL94, V0 Lead-free package Figure 16. SMB package outline E1 D E A1 C A2 L DS5848 - Rev 4 b page 7/14 STTH1R04 SMB package information Table 5. SMB package mechanical data Dimensions Ref. Millimeters Inches (for reference only) Min. Max. Min. Max. A1 1.90 2.45 0.074 0.097 A2 0.05 0.20 0.001 0.008 b 1.95 2.20 0.076 0.087 c 0.15 0.40 0.005 0.016 D 3.30 3.95 0.129 0.156 E 5.10 5.60 0.200 0.221 E1 4.05 4.60 0.159 0.182 L 0.75 1.50 0.029 0.060 Figure 17. SMB recommended footprint 1.62 2.60 1.62 (0.064) (0.102) (0.064) 2.18 (0.086) 5.84 (0.230) DS5848 - Rev 4 page 8/14 STTH1R04 SMA package information 2.2 SMA package information • • Epoxy meets UL94, V0 Cooling method : by conduction (C) Figure 18. SMA package outline E1 D E A1 C A2 L b Table 6. SMA package mechanical data Dimensions Millimeters Ref. DS5848 - Rev 4 Inches (for reference only) Min. Max. Min. Max. A1 1.90 2.45 0.074 0.097 A2 0.05 0.20 0.001 0.008 b 1.25 1.65 0.049 0.065 c 0.15 0.40 0.005 0.016 D 2.25 2.90 0.088 0.115 E 4.80 5.35 0.188 0.211 E1 3.95 4.60 0.155 0.182 L 0.75 1.50 0.029 0.060 page 9/14 STTH1R04 SMA package information Figure 19. SMA recommended footprint in mm (inches) 1.4 2.63 1.4 (0.055) (0.104) (0.055) 1.64 (0.065) 5.43 (0.214) DS5848 - Rev 4 page 10/14 STTH1R04 DO-15 package information 2.3 DO-15 package information • Epoxy meets UL 94, V0 Figure 20. DO-15 package outline C C A ØD ØB Table 7. DO-15 package mechanical data Dimensions Ref. DS5848 - Rev 4 Millimeters Inches (for reference only) Min. Typ. Max. Min. Typ. Max. A 6.05 - 6.75 0.238 - 0.266 B 2.95 - 3.53 0.116 - 0.139 C 26.00 - 31.00 1.024 - 1.220 D 0.71 - 0.88 0.028 - 0.0035 page 11/14 STTH1R04 Ordering information 3 Ordering information Table 8. Ordering information DS5848 - Rev 4 Order code Marking Package Weight Base qty. Delivery mode STTH1R04A HR4 SMA 0.068 g 5000 Tape and reel STTH1R04U BR4 SMB 0.107 g 2500 Tape and reel STTH1R04QRL STTH1R04Q DO-15 0.400 g 6000 Tape and reel page 12/14 STTH1R04 Revision history Table 9. Document revision history DS5848 - Rev 4 Date Revision Changes 30-May-2008 1 First issue. 12-Nov-2015 2 Updated Figure 3, Figure 4, Figure 5 and Figure 6. Minor text changes. 13-Nov-2018 3 Removed DO-41 package information. 15-Mar-2019 4 Updated Table 3. Static electrical characteristics. page 13/14 STTH1R04 IMPORTANT NOTICE – PLEASE READ CAREFULLY STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, enhancements, modifications, and improvements to ST products and/or to this document at any time without notice. Purchasers should obtain the latest relevant information on ST products before placing orders. ST products are sold pursuant to ST’s terms and conditions of sale in place at the time of order acknowledgement. Purchasers are solely responsible for the choice, selection, and use of ST products and ST assumes no liability for application assistance or the design of Purchasers’ products. No license, express or implied, to any intellectual property right is granted by ST herein. Resale of ST products with provisions different from the information set forth herein shall void any warranty granted by ST for such product. ST and the ST logo are trademarks of ST. For additional information about ST trademarks, please refer to www.st.com/trademarks. All other product or service names are the property of their respective owners. Information in this document supersedes and replaces information previously supplied in any prior versions of this document. © 2019 STMicroelectronics – All rights reserved DS5848 - Rev 4 page 14/14