EV_ICS-40180-FX

UG-325 Analog Output MEMS Microphone Flex Evaluation Board User Guide GENERAL DESCRIPTION This user guide applies to the following MEMS microphone evaluation boards:        Table 1 describes the functions of the three connection wires. Table 2 describes the functional differences between the different microphones that are used with this flex circuit. EVAL-INMP404Z-FLEX EVAL-INMP405Z-FLEX EVAL-INMP504Z-FLEX EVAL-INMP510Z-FLEX EVAL-INMP801Z-FLEX EV_ICS-40180-FX EV_ICS-40310-FX InvenSense reserves the right to change the detail specifications as may be required to permit improvements in the design of its products. InvenSense Inc. 1745 Technology Drive, San Jose, CA 95110 U.S.A +1(408) 988–7339 www.invensense.com Document Number: AN-000013 Revision: 1.3 Rev Date: 09/23/2014 UG-325 Analog Output MEMS Microphone Flex Evaluation Board User Guide TABLE 1. PIN FUNCTION DESCRIPTIONS EVALUATION BOARD CIRCUIT Wire Color Microphone Pin Red VDD Power Supply. 1.5 V DC to 3.6 V DC; (0.9 V DC to 1.3 V DC for ICS-40310 and INMP801) White OUTPUT Analog Output Signal Figure 1 shows the schematic of the evaluation board, and Figure 2 shows the flex board layout. See the respective microphone data sheets for complete descriptions and specifications of the microphones. Note that the layout for the EV_ICS-40180-FX differs slightly from what is shown in Figure 2 because of this part’s different package footprint, but the routing of the three signals is consistent. Black GND Ground Description VDD TABLE 2. MICROPHONE FUNCTIONAL DIFFERENCES 0.1µF OUTPUT Microphone Maximum Supply Current Maximum Output Voltage Output Impedance DC Offset INMP404 250 µA 0.18 V rms 200 Ω 0.8 V INMP405 250 µA 0.18 V rms 200 Ω 0.8 V INMP504 225 µA 0.18 V rms 200 Ω 0.8 V INMP510 250 µA 0.40 V rms 350 Ω 0.7 V INMP801 23 µA 0.13 V rms 4.5 kΩ 0.57 V ICS-40180 260 µA 0.40 V rms 350 Ω 0.7 V ICS-40310 25 µA 0.12 V rms 4.5 kΩ 0.57 V MICROPHONE GND Figure 1. Evaluation Board Schematic Figure 2. Evaluation Board Layout (Top View) 15mm 3.14mm Figure 3. Evaluation Board Dimensions in Millimeters (Wires Not Included) InvenSense reserves the right to change the detail specifications as may be required to permit improvements in the design of its products. InvenSense Inc. 1745 Technology Drive, San Jose, CA 95110 U.S.A +1(408) 988–7339 www.invensense.com Document Number: AN-000013 Revision: 1.3 Rev Date: 09/23/2014 UG-325 Analog Output MEMS Microphone Flex Evaluation Board User Guide EVALUATION BOARD PHOTOGRAPH Figure 4. Top and Bottom View InvenSense reserves the right to change the detail specifications as may be required to permit improvements in the design of its products. InvenSense Inc. 1745 Technology Drive, San Jose, CA 95110 U.S.A +1(408) 988–7339 www.invensense.com Document Number: AN-000013 Revision: 1.3 Rev Date: 09/23/2014 UG-325 COMPLIANCE DECLARATION DISCLAIMER InvenSense believes the environmental and other compliance information given in this document to be correct but cannot guarantee accuracy or completeness. Conformity documents substantiating the specifications and component characteristics are on file. InvenSense subcontracts manufacturing and the information contained herein is based on data received from vendors and suppliers, which has not been validated by InvenSense. This information furnished by InvenSense is believed to be accurate and reliable. However, no responsibility is assumed by InvenSense for its use, or for any infringements of patents or other rights of third parties that may result from its use. Specifications are subject to change without notice. InvenSense reserves the right to make changes to this product, including its circuits and software, in order to improve its design and/or performance, without prior notice. InvenSense makes no warranties, neither expressed nor implied, regarding the information and specifications contained in this document. InvenSense assumes no responsibility for any claims or damages arising from information contained in this document, or from the use of products and services detailed therein. This includes, but is not limited to, claims or damages based on the infringement of patents, copyrights, mask work and/or other intellectual property rights. Certain intellectual property owned by InvenSense and described in this document is patent protected. No license is granted by implication or otherwise under any patent or patent rights of InvenSense. This publication supersedes and replaces all information previously supplied. Trademarks that are registered trademarks are the property of their respective companies. InvenSense sensors should not be used or sold in the development, storage, production or utilization of any conventional or mass-destructive weapons or for any other weapons or life threatening applications, as well as in any other life critical applications such as medical equipment, transportation, aerospace and nuclear instruments, undersea equipment, power plant equipment, disaster prevention and crime prevention equipment. ©2014 InvenSense, Inc. All rights reserved. InvenSense, MotionTracking, MotionProcessing, MotionProcessor, MotionFusion, MotionApps, DMP, AAR, and the InvenSense logo are trademarks of InvenSense, Inc. Other company and product names may be trademarks of the respective companies with which they are associated. ©2014 InvenSense, Inc. All rights reserved. Document Number: AN-000013 Revision: 1.3 Rev Date: 09/23/2014 Page 4 of 4