ICS-40180

ICS-40180 RF-Hardened, Low-Noise Microphone with Bottom Port and Analog Output GENERAL DESCRIPTION * The ICS-40180 is an analog MEMS microphone with high SNR and enhanced RF immunity. The ICS-40180 includes a MEMS microphone element, an impedance converter, and an output amplifier. Other high-performance specification include a linear response up to 124 dB SPL, tight ±1 dB sensitivity tolerance, and enhanced immunity to both radiated and conducted RF interference. The ICS-40180 is available in a small, 3.5 mm × 2.65 mm × 0.98 mm, surface-mount package. *Protected by U.S. Patents 7,449,356; 7,825,484; 7,885,423; and 7,961,897. Other patents are pending. APPLICATIONS • • • • • • • FEATURES • • • • • • • • • • • • • FUNCTIONAL BLOCK DIAGRAM Smartphones Tablet Computers Wearable Devices Still and Video Cameras Bluetooth Headsets Notebook PCs Security and Surveillance High 65 dBA SNR −38 dBV Sensitivity ±1 dB Sensitivity Tolerance Non-Inverted Signal Output Extended Frequency Response from 60 Hz to 20 kHz Enhanced RF Immunity 124 dB SPL Acoustic Overload Point Low Current Consumption: 190 µA Single-Ended Analog Output High −78 dBV PSR 3.5 × 2.65 × 0.98 mm Surface-Mount Package Compatible with Sn/Pb and Pb-Free Solder Processes RoHS/WEEE Compliant ORDERING INFORMATION PART ICS-40180 EV_ICS-40180-FX OUTPUT AMPLIFIER ICS-40180 TEMP RANGE PACKAGING −40°C to +85°C — 13” Tape and Reel OUTPUT POWER VDD GND InvenSense reserves the right to change the detail specifications as may be required to permit improvements in the design of its products. InvenSense Inc. 1745 Technology Drive, San Jose, CA 94089 U.S.A +1(408) 988–7339 www.invensense.com Document Number: DS-000021 Revision: 1.2 Rev Date: 04/03/2015 ICS-40180 TABLE OF CONTENTS General Description ..................................................................................................................................................................... 1 Applications ................................................................................................................................................................................. 1 Features ....................................................................................................................................................................................... 1 Functional Block Diagram ............................................................................................................................................................ 1 Ordering Information ................................................................................................................................................................... 1 Table of Contents .................................................................................................................................................................................... 2 Specifications .......................................................................................................................................................................................... 3 Table 1. Electrical Characteristics ................................................................................................................................................ 3 Absolute Maximum Ratings .................................................................................................................................................................... 4 Table 2. Absolute Maximum Ratings ........................................................................................................................................... 4 ESD Caution ................................................................................................................................................................................. 4 Soldering Profile........................................................................................................................................................................... 5 Table 3. Recommended Soldering Profile*.................................................................................................................................. 5 Pin Configuration And Function Descriptions ......................................................................................................................................... 6 Table 4. Pin Function Descriptions............................................................................................................................................... 6 Typical Performance Characteristics....................................................................................................................................................... 7 Applications Information ........................................................................................................................................................................ 8 Codec Connection ........................................................................................................................................................................ 8 Supporting Documents ........................................................................................................................................................................... 9 Evaluation Board User Guide ....................................................................................................................................................... 9 Application Notes ........................................................................................................................................................................ 9 PCB Design And Land Pattern Layout ................................................................................................................................................... 10 PCB Material And Thickness ...................................................................................................................................................... 10 Handling Instructions ............................................................................................................................................................................ 11 Pick And Place Equipment ......................................................................................................................................................... 11 Reflow Solder ............................................................................................................................................................................. 11 Board Wash................................................................................................................................................................................ 11 Outline Dimensions ............................................................................................................................................................................... 12 Ordering Guide .......................................................................................................................................................................... 12 Revision History ......................................................................................................................................................................... 13 Compliance Declaration Disclaimer ...................................................................................................................................................... 14 Document Number: DS-000021 Revision: 1.2 Page 2 of 14 ICS-40180 SPECIFICATIONS TABLE 1. ELECTRICAL CHARACTERISTICS TA = 25°C, VDD = 1.5 to 3.63 V, unless otherwise noted. Typical specifications are not guaranteed. PARAMETER PERFORMANCE Directionality Output Polarity Sensitivity Signal-to-Noise Ratio (SNR) Equivalent Input Noise (EIN) Dynamic Range Frequency Response Total Harmonic Distortion (THD) Power-Supply Rejection (PSR) Power Supply Rejection Ratio (PSRR) Acoustic Overload Point POWER SUPPLY Supply Voltage (VDD) Supply Current (IS) OUTPUT CHARACTERISTICS Output Impedance CONDITIONS 1 kHz, 94 dB SPL 20 Hz to 20 kHz, A-weighted 20 Hz to 20 kHz, A-weighted Derived from EIN and maximum acoustic input Low frequency −3 dB point High frequency −3 dB point 105 dB SPL 217 Hz, 100 mVp-p square wave superimposed on VDD = 1.8 V 1 kHz, 100 mVp-p sine wave superimposed on VDD = 1.8 V 10% THD MIN TYP MAX UNITS −39 Omni Non-Inverted −38 65 29 −37 dBV dBA dBA SPL 95 dB 60 >20 0.3 Hz kHz % −78 dBV −46 dB 124 dB SPL 1.5 VDD = 1.8 V VDD = 3.3 V 190 210 Output DC Offset 1 3.63 240 260 V µA µA 350 Ω 0.7 V Maximum Output Voltage 124 dB SPL input 0.398 V rms Noise Floor 20 Hz to 20 kHz, A-weighted, rms −103 dBV Note 1: See Figure 3 and Figure 4. Document Number: DS-000021 Revision: 1.2 Page 3 of 14 NOTES 1 ICS-40180 ABSOLUTE MAXIMUM RATINGS Stress above those listed as Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only and functional operation of the device at these conditions is not implied. Exposure to the absolute maximum ratings conditions for extended periods may affect device reliability. TABLE 2. ABSOLUTE MAXIMUM RATINGS PARAMETER Supply Voltage (VDD) Sound Pressure Level Mechanical Shock Vibration Temperature Range Biased Storage RATING −0.3 V to +3.63 V 160 dB 10,000 g Per MIL-STD-883 Method 2007, Test Condition B −40°C to +85°C −55°C to +150°C ESD CAUTION ESD (electrostatic discharge) sensitive device. Charged devices and circuit boards can discharge without detection. Although this product features patented or proprietary protection circuitry, damage may occur on devices subjected to high energy ESD. Therefore proper ESD precautions should be taken to avoid performance degradation or loss of functionality. Document Number: DS-000021 Revision: 1.2 Page 4 of 14 ICS-40180 SOLDERING PROFILE CRITICAL ZONE TL TO TP tP TP TEMPERATURE RAMP-UP TL tL TSMAX TSMIN tS RAMP-DOWN PREHEAT t25°C TO PEAK TEMPERATURE TIME Figure 1. Recommended Soldering Profile Limits TABLE 3. RECOMMENDED SOLDERING PROFILE* PROFILE FEATURE Average Ramp Rate (TL to TP) Minimum Temperature (TSMIN) Minimum Temperature Preheat (TSMIN) Time (TSMIN to TSMAX), tS Ramp-Up Rate (TSMAX to TL) Time Maintained Above Liquidous (tL) Liquidous Temperature (TL) Peak Temperature (TP) Time Within +5°C of Actual Peak Temperature (tP) Ramp-Down Rate Time +25°C (t25°C) to Peak Temperature Sn63/Pb37 1.25°C/sec max Pb-Free 1.25°C/sec max 100°C 100°C 150°C 200°C 60 sec to 75 sec 1.25°C/sec 45 sec to 75 sec 60 sec to 75 sec 1.25°C/sec ~50 sec 183°C 217°C 215°C +3°C/−3°C 260°C +0°C/−5°C 20 sec to 30 sec 20 sec to 30 sec 3°C/sec max 3°C/sec max 5 min max 5 min max *The reflow profile in Table 3 is recommended for board manufacturing with InvenSense MEMS microphones. All microphones are also compatible with the J-STD-020 profile Document Number: DS-000021 Revision: 1.2 Page 5 of 14 ICS-40180 PIN CONFIGURATION AND FUNCTION DESCRIPTIONS 3 4 5 GND GND OUTPUT VDD GND 2 1 Figure 2. Pin Configuration Top View (Terminal Side Down) Not to Scale TABLE 4. PIN FUNCTION DESCRIPTIONS PIN NAME FUNCTION 1 OUTPUT Analog Output Signal 2 GND Ground 3 GND Ground 4 GND Ground 5 VDD Power Supply Document Number: DS-000021 Revision: 1.2 Page 6 of 14 ICS-40180 20 20 15 15 10 NORMALIZED AMPLITUDE (dB) NORMALIZED AMPLITUDE (dB) TYPICAL PERFORMANCE CHARACTERISTICS 10 5 0 –5 5 0 –5 –10 –10 –15 –15 10 1k 100 –20 10k 10 100 1k 10k FREQUENCY (Hz) FREQUENCY (Hz) Figure 4. Typical Frequency Response (Measured) Figure 3. Frequency Response Mask –40 –41 10 –42 THD + N (%) PSRR (dB) –43 –44 –45 –46 1 –47 –48 –49 –50 100 1k 0.1 90 10k 100 FREQUENCY (Hz) Figure 5. PSR vs. Frequency, 100 mV p-p Swept Sine Wave 120 130 Figure 6. Total Harmonic Distortion + Noise (THD+N) vs. Input SPL -5 1.4 -10 1.2 -15 1.0 -20 OUTPUT (V) OUTPUT AMPLITUDE (dBV) 110 INPUT (dB SPL) -25 -30 0.8 0.6 0.4 -35 -45 90 120dB SPL 124dB SPL 128dB SPL 132dB SPL 0.2 -40 0 100 110 120 INPUT AMPLITUDE (dB SPL) 0 130 1.0 TIME (ms) Figure 7. Linearity Document Number: DS-000021 Revision: 1.2 0.5 Figure 8. Clipping Characteristics Page 7 of 14 ICS-40180 APPLICATIONS INFORMATION CODEC CONNECTION The ICS-40180 output can be connected to a dedicated codec microphone input (see Figure 9) or to a high input impedance gain stage. A 0.1 µF ceramic capacitor placed close to the ICS-40180 supply pin is used for testing and is recommended to adequately decouple the microphone from noise on the power supply. A DC blocking capacitor is required at the output of the microphone. This capacitor creates a high-pass filter with a corner frequency at fC = 1/(2π × C × R) where R is the input impedance of the codec. A minimum value of 2.2 μF is recommended in Figure 9 because the input impedance of some codecs can be as low as 2 kΩ at their highest PGA gain setting, which results in a high-pass filter corner frequency at 37 Hz. Figure 10 shows the ICS-40180 connected to an op amp configured as a noninverting preamplifier. MICBIAS 0.1 µF VDD 2.2 µF MINIMUM ICS-40180 ADC OR CODEC INPUT OUTPUT GND Figure 9. ICS-40180 Connected to a Codec 1.8-3.3 V GAIN = (R1 + R2)/R1 R2 R1 VREF 0.1µF VDD ICS-40180 AMP 1µF MINIMUM OUTPUT GND 10kΩ VREF Figure 10. ICS-40180 Connected to an Op Amp Document Number: DS-000021 Revision: 1.2 Page 8 of 14 VOUT ICS-40180 SUPPORTING DOCUMENTS For additional information, see the following documents. EVALUATION BOARD USER GUIDE UG-325, Analog Output MEMS Microphone Flex Evaluation Board APPLICATION NOTES AN-100, MEMS Microphone Handling and Assembly Guide AN-1003, Recommendations for Mounting and Connecting the InvenSense Bottom-Ported MEMS Microphones AN-1112, Microphone Specifications Explained AN-1124, Recommendations for Sealing InvenSense Bottom-Port MEMS Microphones from Dust and Liquid Ingress AN-1140, Microphone Array Beamforming AN-1165, Op Amps for Microphone Preamp Circuits AN-1181, Using a MEMS Microphone in a 2-Wire Microphone Circuit Document Number: DS-000021 Revision: 1.2 Page 9 of 14 ICS-40180 PCB DESIGN AND LAND PATTERN LAYOUT Below is the lay out the PCB land pattern for the ICS-40180, at a 1:1 ratio to the solder pads on the microphone package, (see Figure 11.) Take care to avoid applying solder paste to the sound hole in the PCB. Figure 12 shows a suggested solder-paste stencil pattern layout. The response of the ICS-40180 is not affected by the PCB hole size, as long as the hole is not smaller than the sound port of the microphone (0.25 mm, or 0.01 inch, in diameter). A 0.5 mm to 1 mm (0.020 inch to 0.040 inch) diameter for the hole is recommended. Align the hole in the microphone package with the hole in the PCB. The exact degree of the alignment does not affect the performance of the microphone as long as the holes are not partially or completely blocked. 0.522x0.725(4X) Ø1.625 Ø1.025 1.675 0.838 0.822 1.252 Figure 11. Recommended PCB Land Pattern Layout 0.422x0.625(4X) Ø1.625 Ø1.125 1.675 0.1(4x) 0.822 1.252 Figure 12. Recommended Solder Paste Stencil Pattern Layout PCB MATERIAL AND THICKNESS The performance of the ICS-40180 is not affected by PCB thickness. The ICS-40180 can be mounted on either a rigid or flexible PCB. A flexible PCB with the microphone can be attached directly to the device housing with an adhesive layer. This mounting method offers a reliable seal around the sound port while providing the shortest acoustic path for good sound quality. Document Number: DS-000021 Revision: 1.2 Page 10 of 14 ICS-40180 HANDLING INSTRUCTIONS PICK AND PLACE EQUIPMENT The MEMS microphone can be handled using standard pick-and-place and chip shooting equipment. Take care to avoid damage to the MEMS microphone structure as follows: • Use a standard pickup tool to handle the microphone. Because the microphone hole is on the bottom of the package, the pickup tool can make contact with any part of the lid surface. • Do not pick up the microphone with a vacuum tool that makes contact with the bottom side of the microphone. Do not pull air out of or blow air into the microphone port. • Do not use excessive force to place the microphone on the PCB. REFLOW SOLDER For best results, the soldering profile must be in accordance with the recommendations of the manufacturer of the solder paste used to attach the MEMS microphone to the PCB. It is recommended that the solder reflow profile not exceed the limit conditions specified in Figure 1 and Table 3. BOARD WASH When washing the PCB, ensure that water does not make contact with the microphone port. Do not use blow-off procedures or ultrasonic cleaning. Document Number: DS-000021 Revision: 1.2 Page 11 of 14 ICS-40180 OUTLINE DIMENSIONS Figure 13. 5-Terminal Chip Array Small Outline No-Lead Cavity [LGA_CAV] 3.5 × 2.65 × 0.98 mm Body Dimensions shown in millimeters PART NUMBER PIN 1 INDIC ATION 180 YY XXX DATE CODE LOT TR ACEABILITY CODE Figure 14. Package Marking Specification (Top View) ORDERING GUIDE PART ICS-40180 TEMP RANGE −40°C to +85°C PACKAGE 5-Terminal LGA_CAV QUANTITY 10,000 EV_ICS-40180-FX — Flexible Evaluation Board — Document Number: DS-000021 Revision: 1.2 Page 12 of 14 PACKAGING 13” Tape and Reel ICS-40180 REVISION HISTORY REVISION DATE REVISION DESCRIPTION 10/7/2014 1.0 Initial Release 11/17/2014 1.1 Updated General Description information 04/03/2015 1.2 Corrected PSRR spec and replaced Figure 5 Document Number: DS-000021 Revision: 1.2 Page 13 of 14 ICS-40180 COMPLIANCE DECLARATION DISCLAIMER InvenSense believes the environmental and other compliance information given in this document to be correct but cannot guarantee accuracy or completeness. Conformity documents substantiating the specifications and component characteristics are on file. InvenSense subcontracts manufacturing, and the information contained herein is based on data received from vendors and suppliers, which has not been validated by InvenSense. This information furnished by InvenSense is believed to be accurate and reliable. However, no responsibility is assumed by InvenSense for its use, or for any infringements of patents or other rights of third parties that may result from its use. Specifications are subject to change without notice. InvenSense reserves the right to make changes to this product, including its circuits and software, in order to improve its design and/or performance, without prior notice. InvenSense makes no warranties, neither expressed nor implied, regarding the information and specifications contained in this document. InvenSense assumes no responsibility for any claims or damages arising from information contained in this document, or from the use of products and services detailed therein. This includes, but is not limited to, claims or damages based on the infringement of patents, copyrights, mask work and/or other intellectual property rights. Certain intellectual property owned by InvenSense and described in this document is patent protected. No license is granted by implication or otherwise under any patent or patent rights of InvenSense. This publication supersedes and replaces all information previously supplied. Trademarks that are registered trademarks are the property of their respective companies. InvenSense sensors should not be used or sold in the development, storage, production or utilization of any conventional or mass-destructive weapons or for any other weapons or life threatening applications, as well as in any other life critical applications such as medical equipment, transportation, aerospace and nuclear instruments, undersea equipment, power plant equipment, disaster prevention and crime prevention equipment. ©2015 InvenSense, Inc. All rights reserved. InvenSense, MotionTracking, MotionProcessing, MotionProcessor, MotionFusion, MotionApps, DMP, AAR and the InvenSense logo are trademarks of InvenSense, Inc. Other company and product names may be trademarks of the respective companies with which they are associated. ©2015 InvenSense, Inc. All rights reserved. Document Number: DS-000021 Revision: 1.2 Page 14 of 14