U6803B-FP

U6803B Triple-Driver with Thermal Monitoring Description The triple-driver IC includes three non inverted and current limited output stages with an open collector. Common thermal shutdown protects outputs against critical junction temperature. Each output can sink 20 mA, parallel output operation is possible. The digital inputs have Schmitt-trigger function with pull-up current sources to 5 V. Features D Three input comparators with Schmitt-trigger characteristic D ESD protection to human body model: D Output stages: D Input clamping current capability to 10 mA D Integrated protection cells (EMC, ESD, RF) dedicated to all input stages " "2000 V (C = 100 pF, R = 1.5 kW) – Short circuit protected with diode – Load-dump protected @ 1 kW – Clamping current @ –2 mA – Jump start possible D Common shutdown by junction temperature monitor D Low voltage reset with hysteresis – No crosstalk on adjacent channels Ordering Information Extended Type Number U6803B–FP Package SO8 Remarks Block Diagram / Applications VO1 1 VO2 3 VO3 4 VS 7 Thermal shutdown 2 GND Under voltage detection VS=5 V 8 VI1 6 VI2 Figure 1. 5 VI3 13332 VS TELEFUNKEN Semiconductors Rev. A4, 28-Apr-97 1 (6) U6803B Pin Configuration VO1 GND VO2 VO3 1 8 VI1 VS VI2 VI3 2 7 3 6 4 13330 5 Pin 1 2 3 4 5 6 7 8 Symbol VO1 GND VO2 VO3 VI3 VI2 VS VI1 Function Output 1 Ground Output 2 Output 3 Input 3 Input 2 Supply voltage 5 V Input 1 Figure 2. Pinning Basic Circuitry Integrated circuit, U6803B, requires a stabilized supply voltage (VS = 5 V 5%) to comply with its electrical characteristics. An external buffer capacitor of C = 100 nF value is recommended. An integrated 14-V Zener-diode between VS and ground protects the supply pin. " Current Limitation of the Output Stages and Overtemperature Shut-down A temperature dependent current limitation between 25 and 100 mA protects the stages during a short. Additionally the chip temperature is monitored. For Tchip > 148_C all outputs are disabled and automatically enabled with a hysteresis of TChip > 5_C. All input stages are provided with an integrated 250 kW pull-up resistor and can be directly connected to a microcontroller. All output stages are open collectors each capable of sinking 20 mA. Recommended external components: Pull-up resistor, R = 1 kW Capacitor to GND, C = 470 pF, see figure 2 Transients and Load-Dump An integrated 28-V Zener-diode protects each output stage against transients and load-dump (Schaffner pulses). With the help of external 1 kW resistor , the output transistor is capable of the corresponding current which flows during each of these conditions. Apart from that, outputs are short circuit and overload protected. Functional Description General ON state: Low level at the input stage activates the corresponding output stage. OFF state: The internal pull-up resistor gives high level to the input comparator and deactivates the output stage 7-V Zener-diodes between each input pin and GND are capable of 10 mA clamping currents without crosstalk on adjacent input stages. Low Voltage Detection When supply voltage is switched on, a power-on reset pulse is generated internally, which disables all output stages until a defined supply voltage level is reached. The low voltage detection is provided with a hysteresis of Vhyst = 0.5 V typically. " A total clamping current of 30 mA should be observed with respect to the power dissipation. " 2 (6) TELEFUNKEN Semiconductors Rev. A4, 28-Apr-97 U6803B VS=5 V 100 nF VI1 Micro controller VI2 VI3 VO1 VBatt Load R R R 3x 1kΩ U6803B Tripledrive IC VO2 VO3 C C C 3x 470 pF 13333 Figure 3. Application schematic Absolute Maximum Ratings Parameters Supply voltage Ambient temperature range Storage temperature range Maximum junction temperature Symbol VS Tamb Tstg Tj Value 7.0 –40 to +125 –50 to +150 +150 Unit V _C _C _C Thermal Resistance Parameters Junction ambient Symbol RthJA Value 120 Unit K/W TELEFUNKEN Semiconductors Rev. A4, 28-Apr-97 3 (6) U6803B Electrical Characteristics VS = 5 V 5%, Tamb = 27_C, reference point pin 2 (GND), unless otherwise specified, see figures 1 and 3. Parameters Supply Supply voltage Supply current Low voltage detection threshold: Low voltage hysteresis Temperature shut down Temperature shut down hysteresis Input Pins 5, 6, 8 VI II RI VI VI Vhyst VO 170 250 3.3 1.8 1.5 6.7 8.5 V mA kW V V V V 5 (I = 20 mA) (470 pF, 1 kW, 20 V) ILeak VSat Ilimit td 2.5 0.7 25 5 pF mA V mA ms Zener-diode protection voltage Zener-diode clamping current Pull-up resistor Switching threshold Hysteresis Output Pins 1, 3, 4 26.5 Zener-diode protection voltage Integrated capacitor Leakage current Saturation voltage Current limitation Propagation delay Pin 7 Inputs open Inputs closed to GND ON OFF VS IS IS VTH(ON) VTH(OFF) Vhyst TChip Thyst 4.75 0.8 7 3.7 3.0 0.55 140 5 5.25 3.2 13 4.6 3.8 1.05 149 V mA mA V V V _C _C Test Conditions / Pins Symbol Min. Typ. Max. Unit " "10 305 OFF ON 4 (6) TELEFUNKEN Semiconductors Rev. A4, 28-Apr-97 U6803B Package Information Package SO8 Dimensions in mm 5.00 4.85 1.4 0.4 1.27 3.81 8 5 0.25 0.10 0.2 3.8 6.15 5.85 5.2 4.8 3.7 technical drawings according to DIN specifications 13034 8 5 TELEFUNKEN Semiconductors Rev. A4, 28-Apr-97 5 (6) U6803B Ozone Depleting Substances Policy Statement It is the policy of TEMIC TELEFUNKEN microelectronic GmbH to 1. Meet all present and future national and international statutory requirements. 2. Regularly and continuously improve the performance of our products, processes, distribution and operating systems with respect to their impact on the health and safety of our employees and the public, as well as their impact on the environment. It is particular concern to control or eliminate releases of those substances into the atmosphere which are known as ozone depleting substances ( ODSs). The Montreal Protocol ( 1987) and its London Amendments ( 1990) intend to severely restrict the use of ODSs and forbid their use within the next ten years. Various national and international initiatives are pressing for an earlier ban on these substances. TEMIC TELEFUNKEN microelectronic GmbH semiconductor division has been able to use its policy of continuous improvements to eliminate the use of ODSs listed in the following documents. 1. Annex A, B and list of transitional substances of the Montreal Protocol and the London Amendments respectively 2 . Class I and II ozone depleting substances in the Clean Air Act Amendments of 1990 by the Environmental Protection Agency ( EPA) in the USA 3. Council Decision 88/540/EEC and 91/690/EEC Annex A, B and C ( transitional substances ) respectively. TEMIC can certify that our semiconductors are not manufactured with ozone depleting substances and do not contain such substances. We reserve the right to make changes to improve technical design and may do so without further notice. Parameters can vary in different applications. All operating parameters must be validated for each customer application by the customer. Should the buyer use TEMIC products for any unintended or unauthorized application, the buyer shall indemnify TEMIC against all claims, costs, damages, and expenses, arising out of, directly or indirectly, any claim of personal damage, injury or death associated with such unintended or unauthorized use. TEMIC TELEFUNKEN microelectronic GmbH, P.O.B. 3535, D-74025 Heilbronn, Germany Telephone: 49 ( 0 ) 7131 67 2831, Fax number: 49 ( 0 ) 7131 67 2423 6 (6) TELEFUNKEN Semiconductors Rev. A4, 28-Apr-97