VS-E5TX3006THN3
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Vishay Semiconductors
Hyperfast Rectifier, 30 A FRED Pt® G5
FEATURES
Base cathode
2
• Best in class forward voltage drop and
switching losses trade off
2
• Optimized for high speed operation
• 175 °C maximum operating junction temperature
1
• Polyimide passivation
3
TO-220AC 2L
1
Cathode
3
Anode
• AEC-Q101 qualified, meets JESD 201 class 2 whisker test
• Material categorization: for definitions of compliance
please see www.vishay.com/doc?99912
LINKS TO ADDITIONAL RESOURCES
DESCRIPTION / APPLICATIONS
3D 3D
3D Models
Featuring a unique combination of low conduction and
switching losses, this rectifier is the right choice for soft
switched and resonant converters, as well as medium
frequency hard switching converters. This device is
specifically designed to improve efficiency of high speed
LLC output rectification stages of EV / HEV on-board battery
chargers
Application
Notes
PRIMARY CHARACTERISTICS
IF(AV)
30 A
VR
600 V
VF at IF at 125 °C
1.3 V
TJ max.
175 °C
trr (typ.)
22 ns
Package
TO-220AC 2L
Circuit configuration
Single
MECHANICAL DATA
Case: TO-220AC 2L
Molding compound meets UL 94 V-0 flammability rating
Terminals:
J-STD-002
matte
tin
plated
leads,
solderable
per
ABSOLUTE MAXIMUM RATINGS
PARAMETER
SYMBOL
TEST CONDITIONS
VALUES
UNITS
600
V
Repetitive peak reverse voltage
VRRM
Average rectified forward current
IF(AV)
TC = 106 °C, D = 0.50
30
Non-repetitive peak surge current
IFSM
TC = 25 °C, tp = 10 ms, sine wave
310
IFRM
TC = 106 °C, D = 0.50, f = 20 kHz
Repetitive peak forward current
Operating junction and storage temperature
TJ, TStg
A
60
-55 to +175
°C
ELECTRICAL SPECIFICATIONS (TJ = 25 °C unless otherwise specified)
PARAMETER
Breakdown voltage, blocking voltage
SYMBOL
VBR,
VR
Forward voltage
VF
Reverse leakage current
IR
Junction capacitance
CT
Series inductance
LS
TEST CONDITIONS
MIN.
TYP.
MAX.
600
-
-
IF = 30 A
-
1.6
2.1
IF = 30 A, TJ = 125 °C
-
1.3
-
IR = 100 μA
UNITS
V
VR = VR rated
-
-
20
TJ = 125 °C, VR = VR rated
-
-
500
VR = 200 V
-
36
-
pF
Measured to lead 5 mm from package body
-
8
-
nH
μA
Revision: 18-May-2022
Document Number: 96827
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VS-E5TX3006THN3
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Vishay Semiconductors
DYNAMIC RECOVERY CHARACTERISTICS (TJ = 25 °C unless otherwise specified)
PARAMETER
Reverse recovery time
Peak recovery current
SYMBOL
trr
IRRM
Reverse recovery charge
Qrr
Reverse recovery time
trr
Peak recovery current
IRRM
Reverse recovery charge
Qrr
TEST CONDITIONS
MIN.
TYP.
MAX.
IF = 1.0 A,dIF/dt = 100 A/μs, VR = 30 V
-
22
-
TJ = 25 °C
-
39
-
TJ = 125 °C
-
50
-
-
14
-
-
24
-
TJ = 25 °C
-
253
-
TJ = 125 °C
-
785
-
TJ = 25 °C
TJ = 125 °C
IF = 20 A
dIF/dt = 1000 A/μs
VR = 400 V
UNITS
ns
A
nC
TJ = 25 °C
-
41
-
TJ = 125 °C
-
56
-
-
16
-
-
27
-
TJ = 25 °C
-
306
-
TJ = 125 °C
-
952
-
MIN.
TYP.
MAX.
UNITS
-
-
1.3
°C/W
-
2.0
-
g
-
12
(10)
kgf · cm
(lbf · in)
-
175
°C
TJ = 25 °C
TJ = 125 °C
IF = 30 A
dIF/dt = 1000 A/μs
VR = 400 V
ns
A
nC
THERMAL - MECHANICAL SPECIFICATIONS
PARAMETER
Thermal resistance, junction-to-case
SYMBOL
TEST CONDITIONS
RthJC
Weight
6
(5)
Mounting torque
Maximum junction and storage temperature range
Marking device
TJ, TStg
-55
Case style: TO-220AC 2L
E5TX3006TH
Revision: 18-May-2022
Document Number: 96827
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VS-E5TX3006THN3
Vishay Semiconductors
1000
CT - Junction Capacitance (pF)
100
100
TJ = 175°C
10
TJ = 125 °C
TJ = 25 °C
TJ = -40 °C
1
10
0
0.5
1.0
1.5
2.0
2.5
0
200
300
400
500
600
VR - Reverse Voltage (V)
Fig. 1 - Typical Forward Voltage Drop Characteristics
Fig. 3 - Typical Junction Capacitance vs. Reverse Voltage
1000
TJ = 175 °C
IR - Reverse Current (µA)
100
VF - Forward Voltage Drop (V)
Allowable Solder Pad Temperature (°C)
IF - Instantaneous Forward Current (A)
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100
TJ = 125 °C
10
1
TJ = 25 °C
0.1
0.01
0.001
0
100
200
300
400
500
600
180
170
160
150
140
DC
130
120
110
Square wave (D = 0.50)
rated VR applied
100
90
80
0
5
VR - Reverse Voltage (V)
10
15
20
25
30
35
IF(AV) - Average Forward Current (A)
Fig. 2 - Typical Values of Reverse Current vs. Reverse Voltage
Fig. 4 - Maximum Allowable Case Temperature vs.
Average Forward Current
Average Power Loss (W)
70
RMS limit
60
50
40
D = 0.01
D = 0.05
D = 0.10
D = 0.20
D = 0.50
DC
30
20
10
0
0
5
10
15
20
25
30
35
40
45
50
IF(AV) - Average Forward Current (A)
Fig. 5 - Average Power Loss vs. Average Forward Current
Revision: 18-May-2022
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ZthJC - Thermal Impedance
Junction to Case (°C/W)
10
1
0.50
0.20
0.10
0.05
0.02
0.01
0.1
DC
0.01
0.00001
0.0001
0.001
0.01
0.1
1
t1 - Rectangular Pulse Duration (s)
Fig. 6 - Thermal Impedance ZthJC - Characteristics
35
160
TJ = 125 °C
TJ = 125 °C, VR = 400 V
150
140
130
110
IF = 30 A
100
IF = 30 A
25
IF = 60 A
Irr (A)
trr (ns)
120
IF = 60 A
VR = 400 V
30
20
90
15
80
IF = 15 A
70
60
10
IF = 15 A
50
5
40
100
100
1000
dIF/dt (A/µs)
dIF/dt (A/µs)
Fig. 7 - Typical Reverse Recovery Time vs. dIF/dt
Fig. 9 - Typical Reverse Recovery Current vs. dIF/dt
1500
300
1400
TJ = 125 °C
1300
VR = 400 V
IF = 60 A
In this dI/dt range curves are not dependent
from applied IF switching current, from 0.5 to
2 times IF(AV) rating
250
1200
1100
200
1000
IF = 30 A
900
trr (ns)
Qrr (nC)
1000
800
700
125 °C
150
25 °C
100
600
IF = 15 A
500
50
400
IF = 30 A, VR = 400 V, low dI/dt
300
0
100
1000
0
20
40
60
80
100
dIF/dt (A/µs)
dIF/dt (A/µs)
Fig. 8 - Typical Reverse Recovery Charge vs. dIF/dt
Fig. 10 - Typical Reverse Recovery Time vs. dIF/dt
Revision: 18-May-2022
Document Number: 96827
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VS-E5TX3006THN3
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Vishay Semiconductors
600
10
In this dI/dt range curves are not dependent
from applied IF switching current, from 0.5 to
2 times IF(AV) rating
500
8
In this dI/dt range curves are not dependent
from applied IF switching current, from 0.5 to
2 times IF(AV) rating
6
IF = 30 A, VR = 400 V, low dI/dt
125 °C
Irr (A)
Qrr (nC)
400
300
200
4
125 °C
IF = 30 A, VR = 400 V, low dI/dt
25 °C
2
100
25 °C
0
0
0
20
40
60
80
100
0
20
40
60
80
100
dIF/dt (A/µs)
dIF/dt (A/µs)
Fig. 11 - Typical Reverse Recovery Charge vs. dIF/dt
Fig. 12 - Typical Reverse Recovery Current vs. dIF/dt
(3)
trr
ta
IF
tb
t0
t10 %
0
0.1 IRRM
(2)
IRRM
Qrr (4)
di(rec)M/dt (5)
(1) diF/dt
Fig. 13 - Reverse Recovery Waveform and Definitions
Notes
(1) di /dt - rate of change of current through zero crossing
F
(2) I
RRM - peak reverse recovery current
(3) t - reverse recovery time measured from t , crossing point of negative going I , to point t
rr
0
F
10%, 0.1 IRRM
(4) Q - area under curve defined by t and t
rr
0
10 %
t 10 %
Q rr =
I ( t ) dt
t0
(5)
di(rec)M/dt - peak rate of change of current during tb portion of trr
Revision: 18-May-2022
Document Number: 96827
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THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
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VS-E5TX3006THN3
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Vishay Semiconductors
ORDERING INFORMATION TABLE
Device code
VS-
E
5
T
X
30
06
T
H
N3
1
2
3
4
5
6
7
8
9
10
1
-
Vishay Semiconductors product
2
-
E = single diode
3
-
5 = FRED generation 5
4
-
Package: T = TO-220AC 2L
5
-
X = hyperfast recovery
6
-
Current rating (30 = 30 A)
7
-
Voltage rating (06 = 600 V)
8
-
T = true pin TO-220
9
-
H = AEC-Q101 qualified
10
-
Environmental digit:
N3 = halogen-free, RoHS-compliant, and totally lead (Pb)-free
ORDERING INFORMATION (Example)
PREFERRED P/N
VS-E5TX3006THN3
QUANTITY PER TUBE
MINIMUM ORDER QUANTITY
PACKAGING DESCRIPTION
50
1000
Antistatic plastic tube
LINKS TO RELATED DOCUMENTS
Dimensions
www.vishay.com/doc?96069
Part marking information
www.vishay.com/doc?95391
SPICE model
www.vishay.com/doc?96918
Revision: 18-May-2022
Document Number: 96827
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Outline Dimensions
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Vishay Semiconductors
TO-220AC 2L
DIMENSIONS in millimeters and inches
(6)
B
Seating
plane
A
E
A
ØP
0.014 M B A M
E2 (7)
A
Thermal pad
E
A1
Q
(6)
H1
(7)
(6) D
H1
D2 (6)
Detail B
D1
1
2
(2) L1
C
E1 (6)
1
2
L
D
C
Base metal
D
C
L1 (2)
A
b1, b3
(4)
Section C - C and D - D
View A - A
A2
Plating
c1 (4)
c
c
2 x b 2 x b2
Detail B
e1
(b, b2)
0.015 M B A M
SYMBOL
MILLIMETERS
INCHES
NOTES
SYMBOL
MILLIMETERS
MIN.
MAX.
MIN.
MAX.
A
4.25
4.65
0.167
0.183
E1
A1
1.14
1.40
0.045
0.055
E2
-
0.76
A2
2.56
2.92
0.101
0.115
e1
4.88
5.28
b
0.69
1.01
0.027
0.040
b1
0.38
0.97
0.015
0.038
b2
1.20
1.73
0.047
0.068
b3
1.14
1.73
0.045
0.068
INCHES
MAX.
MIN.
MAX.
6.86
8.89
0.270
0.350
6
-
0.030
7
0.192
0.208
H1
5.84
6.86
0.230
0.270
4
L
13.52
14.02
0.532
0.552
L1
3.32
3.82
0.131
0.150
4
ØP
3.54
3.73
0.139
0.147
Q
2.60
3.00
0.102
0.118
c
0.36
0.61
0.014
0.024
c1
0.36
0.56
0.014
0.022
4
3
D
14.85
15.25
0.585
0.600
D1
8.38
9.02
0.330
0.355
D2
11.68
12.88
0.460
0.507
6
E
10.11
10.51
0.398
0.414
3, 6
NOTES
MIN.
6, 7
2
Notes
(1) Dimensioning and tolerancing as per ASME Y14.5M-1994
(2) Lead dimension and finish uncontrolled in L1
(3) Dimension D, D1 and E do not include mold flash. Mold flash shall not exceed 0.127 mm (0.005") per side. These dimensions are measured
at the outermost extremes of the plastic body
(4) Dimension b1, b3 and c1 apply to base metal only
(5) Controlling dimension: inches
(6) Thermal pad contour optional within dimensions E, H1, D2 and E1
(7) Dimension E2 x H1 define a zone where stamping and singulation irregularities are allowed
(8) Outline conforms to JEDEC® TO-220, except D2, where JEDEC® minimum is 0.480"
Revision: 14-Mar-2022
Document Number: 96069
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