TC62D748AFG

TC62D748AFG/AFNAG/BFNAG TOSHIBA CDMOS Integrated Circuit Silicon Monolithic TC62D748AFG,TC62D748AFNAG, TC62D748BFNAG 16-Output Constant Current LED Driver (Output switching standard-speed version) TC62D748 series are an LED driver with a sink type constant current output. It is the best for lighting the LED module and the LED display. This IC consists of a constant current output circuit of 16 outputs, a shift register of 16 bits, a latch of 16 bits, and 16 AND gates. The output current of 16 outputs can be set by one external resistance. Moreover, high-speed data transfer is possible by adoption of a CMOS process. This IC can operate with the power supply voltage of a 3.3 V system and a 5 V system. The TC62D748 series are RoHS compatible. TC62D748AFG SSOP24-P-300-1.00B TC62D748AFNAG/BFNAG SSOP24-P-150-0.64 Weight SSOP24-P-300-1.00B : 0.29 g (typ.) SSOP24-P-150-0.64: 0.14 g (typ.) Features • • • • Power supply voltages 16-output built-in Output current setting range : IOUT = 1.5 to 90 mA : Between outputs ± 1.5 % (max) : Between devices: ± 1.5 % (max) • • • • • • • • Output voltage High-speed output switching Control data format Input signal voltage level Serial data transfer rate Operation temperature range Power-on-reset function built-in Package : VOUT = 17 V (max) : twOE(L) = 25 ns (min), tor = 30ns (typ.), tof = 10ns (typ.) There is TC62D749 as an output switching high-speed version of this product. : VDD = 3.3 V to 5.0 V Current accuracy (@ REXT = 1.2 kΩ, VOUT = 1.0 V, VDD = 3.3 V, 5.0 V) : serial-in, parallel-out : 3.3 V and 5.0 V CMOS interfaces (Schmitt trigger input) : 25 MHz (max) @cascade connection : Topr = −40 to 85 °C : When the power supply is turned on, internal data is reset. : AFG type : AFNAG type : BFNAG type SSOP24-P-300-1.00B SSOP24-P-150-0.64 SSOP24-P-150-0.64 Marktech Optoelectronics For part availability and ordering information please call Toll Free: 800.984.5337 Website: www.marktechopto.com | Email: info@marktechopto.com 1 2010-03-05 TC62D748AFG/AFNAG/BFNAG Block Diagram OUT0 OUT1 OUT15 VDD OUT0 OUT1 Constant current outputs OUT15 B.G POR GND REXT OE SLAT G Q15 Q0 Q1 16-bit D-latch D0 D1 D15 Q15 Q0 Q1 16-bit shift register R SIN SCK D0 D15 R SOUT 2 2010-03-05 TC62D748AFG/AFNAG/BFNAG Pin Assignment (top view) TC62D748AFG/AFNAG GND SIN SCK SLAT OUT0 VDD REXT SOUT OE OUT15 OUT14 OUT15 OE SOUT REXT VDD GND SIN SCK SLAT OUT0 TC62D748BFNAG OUT13 OUT12 OUT11 OUT10 OUT9 OUT8 OUT1 OUT2 OUT3 OUT14 OUT13 OUT12 OUT7 OUT6 OUT5 OUT4 OUT5 OUT6 OUT11 OUT10 OUT9 OUT4 OUT3 OUT2 OUT7 OUT8 OUT1 Note1: Short circuiting an output pin to a power supply pin (Power-supply voltage VDD and LED anode power supply), or short-circuiting the REXT pin to the GND pin will likely exceed the rating, which in turn may result in smoldering and/or permanent damage. Please keep this in mind when determining the wiring layout for the power supply and GND pins. Pin Functions Pin No AFG, AFNAG 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 BFNAG 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 1 2 3 4 5 6 GND SIN SCK SLAT OUT0 OUT1 ⎯ Pin Name I/O The ground pin. The serial data input pin. Function I I I O O O O O O O O O O O O O O O O I O ⎯ ⎯ The serial data transfer clock input pin. The latch signal input pin. Data is saved at L level. A sink type constant current output pin. A sink type constant current output pin. A sink type constant current output pin. A sink type constant current output pin. A sink type constant current output pin. A sink type constant current output pin. A sink type constant current output pin. A sink type constant current output pin. A sink type constant current output pin. A sink type constant current output pin. A sink type constant current output pin. A sink type constant current output pin. A sink type constant current output pin. A sink type constant current output pin. A sink type constant current output pin. A sink type constant current output pin. The constant current output enable signal input pin. During the “H” level, the output will be forced off. The serial data output pin. The constant current value setting resistor connection pin. The power supply input pin. OUT2 OUT3 OUT4 OUT5 OUT6 OUT7 OUT8 OUT9 OUT10 OUT11 OUT12 OUT13 OUT14 OUT15 OE SOUT REXT VDD 3 2010-03-05 TC62D748AFG/AFNAG/BFNAG I/O Equivalent Circuits 1. SCK, SIN VDD (SCK) (SIN) GND 2. OE VDD OE GND 3. SLAT VDD SLAT 4. SOUT VDD SOUT GND GND 4 2010-03-05 TC62D748AFG/AFNAG/BFNAG Truth Table SCK SLAT H L H −*2 −*2 OE L L L L H SIN Dn Dn + 1 Dn + 2 Dn + 3 Dn + 3 OUT0 … OUT7 … OUT15 *1 Dn … Dn − 7 … Dn − 15 No Change Dn + 2 … Dn − 5 … Dn − 13 Dn + 2 … Dn − 5 … Dn − 13 OFF SOUT Dn − 15 Dn − 14 Dn − 13 Dn − 13 Dn − 13 Note1: When OUT0 to OUT15 output pins are set to "H" the respective output will be ON and when set to "L" the respective output will be OFF. Note2: “-“ is irrelevant to the truth table. Timing Diagram n=0 SCK L H SIN L H SLAT 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 H L OE H L ON OUT0 OFF ON OUT1 OFF ON OUT2 OFF OUT15 ON OFF H SOUT L Note 1: Note 2: The latch circuit is a leveled-latch circuit. Please exercise precaution as it is not triggered-latch circuit. Keep the SLAT pin is set to “L” to enable the latch circuit to hold data. In addition, when the SLAT pin is set to “H” the latch circuit does not hold data. The data will instead pass onto output. When the OE pin is set to “L” the OUT0 to OUT15 output pins will go ON and OFF in response to the data. In addition, when the OE pin is set to “H” all the output pins will be forced OFF regardless of the data. 5 2010-03-05 TC62D748AFG/AFNAG/BFNAG Absolute Maximum Ratings (Ta = 25°C) Characteristics Power supply voltage Symbol VDD IOUT VIN VOUT Topr Tstg Rth(j-a) Rating *1 −0.3 to 6.0 Unit V mA V V °C °C °C/W Output Logic current voltage 95 −0.3 to VDD + 0.3 *2 −0.3 to 17 −40 to 85 −55 to 150 input Output Operating Storage Thermal Power voltage temperature temperature resistance 94 (AFG) *3, 80.07(AFNAG/BFNAG) When mounted PCB 1.32 (AFG) *3, 1.56(AFNAG/BFNAG) When mounted PCB dissipation PD*4 W Note1: Voltage is ground referenced. Note2: Do not exceed 6.0V. Note3: PCB condition 76.2 x 114.3 x 1.6 mm, Cu 30% (SEMI conforming) Note4: The power dissipation decreases the reciprocal of the saturated thermal resistance (1/ Rth(j-a)) for each degree (1°C) that the ambient temperature is exceeded (Ta = 25°C). Operating Conditions DC Items (Unless otherwise specified, VDD = 3.0 to 5.5 V, Ta = −40°C to 85°C) Characteristics Power supply voltage Symbol VDD VIH VIL IOH IOL IOUT Test Conditions ⎯ Min 3.0 0.7 × VDD GND ⎯ ⎯ Typ. ⎯ ⎯ ⎯ ⎯ ⎯ ⎯ Max 5.5 VDD 0.3 × VDD −1 Unit V V V mA mA mA H i g h l e v e l l o g i c i n p u t v o l ta g e Low level logic input voltage H igh level SOUT output current Low level SOUT output current Constant current output SIN,SCK, SLAT , OE SIN,SCK, SLAT , OE ⎯ ⎯ 1 90 OUTn 1.5 AC Items (Unless otherwise specified, VDD = 3.0 to 5.5 V, Ta = −40°C to 85°C) Characteristics S e r i a l d a ta t r a n s f e r f r e q u e n c y H o l d t i m e Symbol fSCK tHOLD1 tHOLD2 tSETUP1 tSETUP2 tr tf Test Circuits 6 6 6 6 6 6 6 *1 *1 Test Conditions ⎯ ⎯ ⎯ ⎯ ⎯ Min ⎯ Typ. ⎯ ⎯ ⎯ ⎯ ⎯ ⎯ ⎯ Max 25 ⎯ ⎯ ⎯ ⎯ Unit MHz ns ns ns ns ns ns 5 5 5 5 ⎯ ⎯ S e t u p t i m e Maximum clock rise time Maximum clock fall time 500 500 Note1: If the device is connected in a cascade and the tr/tf of the clock waveform increases due to deceleration of the clock waveform,it may not be possible to achieve the timing required for data transfer. Please keep these timing conditions in mind when designing your application. 6 2010-03-05 TC62D748AFG/AFNAG/BFNAG Electrical Characteristics (Unless otherwise specified, VDD = 3.3V, Ta = 25°C) Characteristics High level logic output voltage L o w l e v e l l o g i c o u t p u t v o l ta g e High level logic input current Low level logic input current Power supply current Symbol VOH VOL IIH IIL IDD IOUT ΔIOUT(Ch) ΔIOUT(IC) Test Circuits 1 1 2 3 4 5 5 5 5 5 5 3 2 Test Conditions IOH = −1 mA IOL = +1 mA VIN = VDD, OE , SIN, SCK VIN = GND, SLAT , SIN, SCK REXT = 1.2 kΩ, All output on VDD = 3.3 V, VOUT = 1.0 V, REXT = 1.2 kΩ, 1 output on VDD = 3.3 V, VOUT = 1.0 V, REXT = 1.2 kΩ, 1 output on VDD = 3.3 V, VOUT = 1.0 V, REXT = 1.2 kΩ, 1 output on VDD = 3.3 V, VOUT= 17 V, REXT = 1.2 kΩ VDD = 3.0 to 3.6 V, VOUT = 1.0 V, REXT = 1.2 kΩ, 1 output on VDD = 3.3 V, VOUT = 1.0 to 3.0 V, REXT = 1.2 kΩ, 1 output on OE SLAT Min VDD − 0.4 ⎯ ⎯ ⎯ ⎯ ⎯ ⎯ ⎯ ⎯ ⎯ ⎯ Typ. ⎯ ⎯ ⎯ ⎯ ⎯ Max ⎯ Unit V V μA μA 0.4 1 −1 8.0 ⎯ ±1.5 ±1.5 mA mA % % μA Output current 14.4 ±1 ±1 ⎯ ±1 ±0.1 Constant current error(Ch to Ch) C onstant current error(IC to IC) Output OFF leak current IOK %VDD %VOUT RUP RDOWN 0.5 ±5 ±0.5 Constant current power supply voltage regulation Constant current output voltage regulation Pull-up Pull-down resistor resistor %/V %/V kΩ kΩ 400 400 500 500 600 600 Electrical Characteristics (Unless otherwise specified, VDD = 5.0V, Ta = 25°C) Characteristics High level logic output voltage L o w l e v e l l o g i c o u t p u t v o l ta g e High level logic input current Low level logic input current Power supply current Symbol VOH VOL IIH IIL IDD IOUT ΔIOUT(Ch) ΔIOUT(IC) Test Circuits 1 1 2 3 4 5 5 5 5 5 5 3 2 Test Conditions IOH = −1 mA IOL = +1 mA VIN = VDD, OE , SIN, SCK VIN = GND, SLAT , SIN, SCK REXT = 1.2 kΩ, All output on VDD = 5.0 V, VOUT = 1.0 V, REXT = 1.2 kΩ, 1 output on VDD = 5.0 V, VOUT = 1.0 V, REXT = 1.2 kΩ, 1 output on VDD = 5.0 V, VOUT = 1.0 V, REXT = 1.2 kΩ, 1 output on VDD = 5.0 V, VOUT = 17 V, REXT = 1.2 kΩ VDD = 4.5 to 5.5 V, VOUT = 1.0 V, REXT = 1.2 kΩ, 1 output on VDD = 5.0 V, VOUT = 1.0 to 3.0 V, REXT = 1.2 kΩ, 1 output on Min VDD − 0.4 ⎯ ⎯ ⎯ ⎯ ⎯ ⎯ ⎯ ⎯ ⎯ ⎯ Typ. ⎯ ⎯ ⎯ ⎯ ⎯ Max ⎯ Unit V V μA μA 0.4 1 −1 8.0 ⎯ ±1.5 ±1.5 mA mA % % μA Output current 14.4 ±1 ±1 ⎯ ±1 ±0.1 Constant current error(Ch to Ch) C onstant current error(IC to IC) Output OFF leak current IOK %VDD %VOUT RUP RDOWN 0.5 ±5 ±0.5 Constant current power supply voltage regulation Constant current output voltage regulation Pull-up Pull-down resistor resistor %/V %/V kΩ kΩ OE SLAT 400 400 500 500 600 600 7 2010-03-05 TC62D748AFG/AFNAG/BFNAG Switching Characteristics (Unless otherwise specified, VDD = 3.3V, Ta = 25°C) Characteristics SCK- OUT0 SLAT - OUT0 OE - OUT0 P ropagation delay t i m e SCK-SOUT SCK- OUT0 SLAT - OUT0 OE - OUT0 SCK-SOUT Output Output Enable Clock Latch rise fall pulse pulse pulse time time width width width Symbol tpLH1 tpLH2 tpLH3 tpLH tpHL1 tpHL2 tpHL3 tpHL tor tof twOE(L) twOE(H) twSCK twSLAT Test Circuits 6 6 6 6 6 6 6 6 6 6 6 6 6 6 Test Conditions Min ⎯ ⎯ ⎯ Typ. 50 50 50 20 30 30 30 20 30 10 ⎯ ⎯ ⎯ ⎯ Max 65 65 65 35 40 40 40 35 45 20 ⎯ Unit ns ns ns ns ns ns ns ns ns ns ns SLAT = “H”, OE = “L” OE = “L” SLAT = “H” CL=10.5 pF SLAT = “H”, OE = “L” OE = “L” SLAT = “H” CL=10.5 pF 10 to 90% of voltage waveform 90 to 10% of voltage waveform OE = “L” OE = “H” SCK = “H” or “L” SLAT = “H” 10 ⎯ ⎯ ⎯ 10 ⎯ ⎯ 25 50 20 20 ⎯ ⎯ ⎯ ns ns Switching Characteristics (Unless otherwise specified, VDD = 5.0V, Ta = 25°C) Characteristics SCK- OUT0 Symbol tpLH1 tpLH2 tpLH3 tpLH tpHL1 tpHL2 tpHL3 tpHL tor tof twOE(L) twOE(H) Clock Latch pulse pulse width width twSCK twSLAT Test Circuits 6 6 6 6 6 6 6 6 6 6 6 6 6 6 Test Conditions SLAT = “H”, OE = “L” Min ⎯ ⎯ ⎯ Typ. 50 50 50 20 30 30 30 20 30 10 ⎯ ⎯ ⎯ ⎯ Max 65 65 65 35 40 40 40 35 45 20 ⎯ Unit ns ns ns ns ns ns ns ns ns ns ns SLAT - OUT0 OE - OUT0 P ropagation delay t i m e SCK-SOUT SCK- OUT0 OE = “L” SLAT = “H” CL=10.5 pF SLAT = “H”, OE = “L” 10 ⎯ ⎯ ⎯ SLAT - OUT0 OE - OUT0 SCK-SOUT Output Output Enable rise fall pulse time time width OE = “L” SLAT = “H” CL=10.5 pF 10 to 90% of voltage waveform 90 to 10% of voltage waveform OE = “L” OE = “H” SCK = “H” or “L” SLAT = “H” 10 ⎯ ⎯ 25 50 20 20 ⎯ ⎯ ⎯ ns ns 8 2010-03-05 TC62D748AFG/AFNAG/BFNAG Test Circuits Test Circuit1: High level logic input voltage / Low level logic input voltage SCK SIN SLAT VDD OUT0 F.G OE OUT7 OUT15 VIH = VDD VIL = 0 V tr = tf = 10 ns (10 to 90%) REXT GND SOUT VDD = 3.3 V, 5.0 V VDD = 3.3 V, 5.0 V VDD = 3.3 V, 5.0 V REXT IO = -1mA to 1mA CL = 10.5 pF V Test Circuit2: High level logic input current / Pull-down resistor VIN = VDD A A A SCK SIN SLAT VDD OUT0 A OE OUT7 OUT15 REXT GND SOUT CL = 10.5 pF Test Circuit3: Low level logic input current / Pull-up resistor A A A A SCK SIN SLAT REXT VDD OUT0 OE OUT7 OUT15 REXT GND SOUT CL = 10.5 pF REXT 9 2010-03-05 TC62D748AFG/AFNAG/BFNAG Test Circuit4: Power supply current SCK SIN SLAT VDD OUT0 F.G OE OUT7 OUT15 VIH = VDD VIL = 0 V tr = tf = 10 ns (10 to 90%) A REXT GND SOUT VDD = 3.3 V, 5.0 V VDD = 3.0~3.6 V, 4.5~5.5 V CL = 10.5 pF VOUT = 1.0 V Test Circuit5: Constant current output / Output OFF leak current / Constant current error Test Circuit5: Constant current power supply voltage regulation / Constant current output voltage regulation SCK SIN SLAT REXT = 1.2kΩ VDD OUT0 A F.G OE OUT7 A OUT15 VIH = VDD VIL = 0 V tr = tf = 10 ns (10 to 90%) REXT GND SOUT CL = 10.5 pF A VOUT = 1.0~3.0 V, 17 V Test Circuit6: Switching Characteristics SCK SIN SLAT REXT = 1.2kΩ VDD OUT0 RL = 300 Ω CL RL CL RL F.G OE OUT7 OUT15 VIH = VDD VIL = 0 V tr = tf = 10 ns (10 to 90%) REXT REXT = 1.2kΩ GND SOUT CL = 10.5 pF CL = 10.5 pF VDD = 3.3 V, 5.0 V VLED = 5.32 V 10 2010-03-05 TC62D748AFG/AFNAG/BFNAG Timing Waveforms 1. SCK, SIN, SOUT twSCK SCK 50% tSETUP1 SIN 50% tHOLD1 SOUT 50% tpLH/tpHL 50% 50% twSCK 50% 90% 10% tr tf 90% 10% 2. SCK, SIN, SLAT , OE , OUT0 SCK 50% 50% SIN tHOLD2 SLAT 50% twSLAT OE tSETUP2 50% twOE 50% 50% OUT0 tpHL1/tpLH1 tpHL2/tpLH2 50% 3. OE , OUT0 ~ OUT15 twOE 50% OE 50% tpHL3 tpLH3 90% OUT0 ~ OUT15 50% 10% tof 50% 10% tor 90% OFF ON 11 2010-03-05 TC62D748AFG/AFNAG/BFNAG Reference data *This data is provided for reference only. Thorough evaluation and testing should be implemented when designing your application's mass production design. Output Current (IOUT) – Output current setting resistance (REXT) IOUT - REXT 90 80 70 60 I OUT (mA) 50 40 30 20 10 0 0 VOUT=1.0V Ta=25°C Theoretical formula IOUT (A) = (1.04(V) ÷ REXT (Ω)) × 16.6 1000 2000 3000 4000 5000 REXT (Ω) 12 2010-03-05 TC62D748AFG/AFNAG/BFNAG Reference data *This data is provided for reference only. Thorough evaluation and testing should be implemented when designing your application's mass production design. Output current (IOUT) – Output voltage (VOUT) IOUT - VOUT 100 90 80 70 IOUT (mA) 60 50 40 30 20 10 0 0 0.5 1 1.5 VOUT (V) 2 2.5 3 VDD =3.3V,Ta=25℃,1chON IOUT - VOUT 100 90 80 70 IOUT (mA) 60 50 40 30 20 10 0 0 0.5 1 1.5 VOUT (V) 2 2.5 3 VDD=5.0V,Ta=25℃,1chON 13 2010-03-05 TC62D748AFG/AFNAG/BFNAG Package Dimensions Weight: 0.29 g (typ.) 14 2010-03-05 TC62D748AFG/AFNAG/BFNAG Package Dimensions SSOP24-P-150-0.64 0.337 to 0.344 Unit : Inch 0.0325(REF) 0.150 to 0.157 0.025 0.054 to 0.068 0.008 to 0.012 0.010(TYP) 0.016 to 0.034 Weight: 0.14 g (typ.) 0.004 to 0.098 15 2010-03-05 0.229 to 0.244 TC62D748AFG/AFNAG/BFNAG Notes on Contents 1. Block Diagrams Some of the functional blocks, circuits, or constants in the block diagram may be omitted or simplified for explanatory purposes. 2. Equivalent Circuits The equivalent circuit diagrams may be simplified or some parts of them may be omitted for explanatory purposes. 3. Timing Charts Timing charts may be simplified for explanatory purposes. 4. Application Circuits The application circuits shown in this document are provided for reference purposes only. Thorough evaluation is required, especially at the mass production design stage. Toshiba does not grant any license to any industrial property rights by providing these examples of application circuits. 5. Test Circuits Components in the test circuits are used only to obtain and confirm the device characteristics. These components and circuits are not guaranteed to prevent malfunction or failure from occurring in the application equipment. 16 2010-03-05 TC62D748AFG/AFNAG/BFNAG IC Usage Considerations Notes on handling of ICs [1] The absolute maximum ratings of a semiconductor device are a set of ratings that must not be exceeded, even for a moment. Do not exceed any of these ratings. Exceeding the rating(s) may cause the device breakdown, damage or deterioration, and may result injury by explosion or combustion. [2] Use an appropriate power supply fuse to ensure that a large current does not continuously flow in case of over current and/or IC failure. The IC will fully break down when used under conditions that exceed its absolute maximum ratings, when the wiring is routed improperly or when an abnormal pulse noise occurs from the wiring or load, causing a large current to continuously flow and the breakdown can lead smoke or ignition. To minimize the effects of the flow of a large current in case of breakdown, appropriate settings, such as fuse capacity, fusing time and insertion circuit location, are required. [3] If your design includes an inductive load such as a motor coil, incorporate a protection circuit into the design to prevent device malfunction or breakdown caused by the current resulting from the inrush current at power ON or the negative current resulting from the back electromotive force at power OFF. IC breakdown may cause injury, smoke or ignition. Use a stable power supply with ICs with built-in protection functions. If the power supply is unstable, the protection function may not operate, causing IC breakdown. IC breakdown may cause injury, smoke or ignition. [4] Do not insert devices in the wrong orientation or incorrectly. Make sure that the positive and negative terminals of power supplies are connected properly. Otherwise, the current or power consumption may exceed the absolute maximum rating, and exceeding the rating(s) may cause the device breakdown, damage or deterioration, and may result injury by explosion or combustion. In addition, do not use any device that is applied the current with inserting in the wrong orientation or incorrectly even just one time. [5] Carefully select external components (such as inputs and negative feedback capacitors) and load components (such as speakers), for example, power amp and regulator. If there is a large amount of leakage current such as input or negative feedback condenser, the IC output DC voltage will increase. If this output voltage is connected to a speaker with low input withstand voltage, overcurrent or IC failure can cause smoke or ignition. (The over current can cause smoke or ignition from the IC itself.) In particular, please pay attention when using a Bridge Tied Load (BTL) connection type IC that inputs output DC voltage to a speaker directly. Points to remember on handling of ICs (1) Heat Radiation Design In using an IC with large current flow such as power amp, regulator or driver, please design the device so that heat is appropriately radiated, not to exceed the specified junction temperature (TJ) at any time and condition. These ICs generate heat even during normal use. An inadequate IC heat radiation design can lead to decrease in IC life, deterioration of IC characteristics or IC breakdown. In addition, please design the device taking into considerate the effect of IC heat radiation with peripheral components. (2) Back-EMF When a motor rotates in the reverse direction, stops or slows down abruptly, a current flow back to the motor’s power supply due to the effect of back-EMF. If the current sink capability of the power supply is small, the device’s motor power supply and output pins might be exposed to conditions beyond maximum ratings. To avoid this problem, take the effect of back-EMF into consideration in system design. 17 2010-03-05 TC62D748AFG/AFNAG/BFNAG About solderability, following conditions were confirmed Solderability (1) · · · · (2) · · · · Use of Sn-37Pb solder Bath solder bath temperature: 230°C dipping time: 5 seconds the number of times: once use of R-type flux Use of Sn-3.0Ag-0.5Cu solder Bath solder bath temperature: 245°C dipping time: 5 seconds the number of times: once use of R-type flux 18 2010-03-05 TC62D748AFG/AFNAG/BFNAG RESTRICTIONS ON PRODUCT USE • Toshiba Corporation, and its subsidiaries and affiliates (collectively “TOSHIBA”), reserve the right to make changes to the information in this document, and related hardware, software and systems (collectively “Product”) without notice. • This document and any information herein may not be reproduced without prior written permission from TOSHIBA. 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Product and related software and technology may be controlled under the Japanese Foreign Exchange and Foreign Trade Law and the U.S. Export Administration Regulations. Export and re-export of Product or related software or technology are strictly prohibited except in compliance with all applicable export laws and regulations. • Please contact your TOSHIBA sales representative for details as to environmental matters such as the RoHS compatibility of Product. Please use Product in compliance with all applicable laws and regulations that regulate the inclusion or use of controlled substances, including without limitation, the EU RoHS Directive. TOSHIBA assumes no liability for damages or losses occurring as a result of noncompliance with applicable laws and regulations. 19 2010-03-05