TC62D748AFG/AFNAG/BFNAG
TOSHIBA CDMOS Integrated Circuit Silicon Monolithic
TC62D748AFG,TC62D748AFNAG, TC62D748BFNAG
16-Output Constant Current LED Driver (Output switching standard-speed version)
TC62D748 series are an LED driver with a sink type constant current output. It is the best for lighting the LED module and the LED display. This IC consists of a constant current output circuit of 16 outputs, a shift register of 16 bits, a latch of 16 bits, and 16 AND gates. The output current of 16 outputs can be set by one external resistance. Moreover, high-speed data transfer is possible by adoption of a CMOS process. This IC can operate with the power supply voltage of a 3.3 V system and a 5 V system. The TC62D748 series are RoHS compatible.
TC62D748AFG
SSOP24-P-300-1.00B TC62D748AFNAG/BFNAG
SSOP24-P-150-0.64
Weight SSOP24-P-300-1.00B : 0.29 g (typ.) SSOP24-P-150-0.64: 0.14 g (typ.)
Features
• • • • Power supply voltages 16-output built-in Output current setting range : IOUT = 1.5 to 90 mA : Between outputs ± 1.5 % (max) : Between devices: ± 1.5 % (max) • • • • • • • • Output voltage High-speed output switching Control data format Input signal voltage level Serial data transfer rate Operation temperature range Power-on-reset function built-in Package : VOUT = 17 V (max) : twOE(L) = 25 ns (min), tor = 30ns (typ.), tof = 10ns (typ.)
There is TC62D749 as an output switching high-speed version of this product.
: VDD = 3.3 V to 5.0 V
Current accuracy (@ REXT = 1.2 kΩ, VOUT = 1.0 V, VDD = 3.3 V, 5.0 V)
: serial-in, parallel-out : 3.3 V and 5.0 V CMOS interfaces (Schmitt trigger input) : 25 MHz (max) @cascade connection : Topr = −40 to 85 °C : When the power supply is turned on, internal data is reset. : AFG type : AFNAG type : BFNAG type SSOP24-P-300-1.00B SSOP24-P-150-0.64 SSOP24-P-150-0.64
Marktech Optoelectronics
For part availability and ordering information please call Toll Free: 800.984.5337 Website: www.marktechopto.com | Email: info@marktechopto.com
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Block Diagram
OUT0 OUT1 OUT15
VDD
OUT0 OUT1 Constant current outputs OUT15
B.G
POR
GND REXT
OE
SLAT
G
Q15 Q0 Q1 16-bit D-latch D0 D1 D15 Q15 Q0 Q1 16-bit shift register
R
SIN SCK
D0
D15 R
SOUT
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Pin Assignment (top view)
TC62D748AFG/AFNAG
GND SIN SCK SLAT OUT0 VDD REXT SOUT OE OUT15 OUT14 OUT15 OE SOUT REXT VDD GND SIN SCK SLAT OUT0
TC62D748BFNAG
OUT13
OUT12
OUT11 OUT10
OUT9
OUT8
OUT1
OUT2 OUT3
OUT14
OUT13 OUT12
OUT7
OUT6 OUT5
OUT4
OUT5 OUT6
OUT11
OUT10 OUT9
OUT4 OUT3 OUT2
OUT7
OUT8
OUT1
Note1: Short circuiting an output pin to a power supply pin (Power-supply voltage VDD and LED anode power supply), or short-circuiting the REXT pin to the GND pin will likely exceed the rating, which in turn may result in smoldering and/or permanent damage. Please keep this in mind when determining the wiring layout for the power supply and GND pins.
Pin Functions
Pin No AFG, AFNAG 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 BFNAG 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 1 2 3 4 5 6 GND SIN SCK SLAT OUT0 OUT1
⎯
Pin Name
I/O The ground pin. The serial data input pin.
Function
I I I O O O O O O O O O O O O O O O O I O
⎯ ⎯
The serial data transfer clock input pin. The latch signal input pin. Data is saved at L level. A sink type constant current output pin. A sink type constant current output pin. A sink type constant current output pin. A sink type constant current output pin. A sink type constant current output pin. A sink type constant current output pin. A sink type constant current output pin. A sink type constant current output pin. A sink type constant current output pin. A sink type constant current output pin. A sink type constant current output pin. A sink type constant current output pin. A sink type constant current output pin. A sink type constant current output pin. A sink type constant current output pin. A sink type constant current output pin. The constant current output enable signal input pin. During the “H” level, the output will be forced off. The serial data output pin. The constant current value setting resistor connection pin. The power supply input pin.
OUT2 OUT3 OUT4
OUT5 OUT6 OUT7
OUT8 OUT9 OUT10
OUT11 OUT12 OUT13
OUT14 OUT15 OE
SOUT REXT VDD
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I/O Equivalent Circuits
1. SCK, SIN
VDD (SCK) (SIN) GND
2. OE
VDD
OE
GND
3. SLAT
VDD
SLAT
4. SOUT
VDD SOUT GND
GND
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Truth Table
SCK
SLAT
H L H
−*2 −*2
OE
L L L L H
SIN Dn Dn + 1 Dn + 2 Dn + 3 Dn + 3
OUT0 … OUT7 … OUT15 *1
Dn … Dn − 7 … Dn − 15 No Change Dn + 2 … Dn − 5 … Dn − 13 Dn + 2 … Dn − 5 … Dn − 13 OFF
SOUT Dn − 15 Dn − 14 Dn − 13 Dn − 13 Dn − 13
Note1: When OUT0 to OUT15 output pins are set to "H" the respective output will be ON and when set to "L" the respective output will be OFF. Note2: “-“ is irrelevant to the truth table.
Timing Diagram
n=0 SCK L H SIN L H
SLAT
1
2
3
4
5
6
7
8
9
10 11 12 13 14 15
H
L
OE
H L ON
OUT0
OFF ON
OUT1 OFF ON OUT2 OFF
OUT15
ON OFF H
SOUT L
Note 1: Note 2:
The latch circuit is a leveled-latch circuit. Please exercise precaution as it is not triggered-latch circuit. Keep the SLAT pin is set to “L” to enable the latch circuit to hold data. In addition, when the SLAT pin is set to “H” the latch circuit does not hold data. The data will instead pass onto output. When the OE pin is set to “L” the OUT0 to OUT15 output pins will go ON and OFF in response to the data. In addition, when the OE pin is set to “H” all the output pins will be forced OFF regardless of the data.
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Absolute Maximum Ratings (Ta = 25°C)
Characteristics Power supply voltage Symbol VDD IOUT VIN VOUT Topr Tstg Rth(j-a) Rating *1
−0.3 to 6.0
Unit V mA V V °C °C °C/W
Output Logic
current voltage
95
−0.3 to VDD + 0.3 *2 −0.3 to 17 −40 to 85 −55 to 150
input
Output Operating Storage Thermal Power
voltage temperature temperature resistance
94 (AFG) *3, 80.07(AFNAG/BFNAG) When mounted PCB 1.32 (AFG) *3, 1.56(AFNAG/BFNAG) When mounted PCB
dissipation
PD*4
W
Note1: Voltage is ground referenced. Note2: Do not exceed 6.0V. Note3: PCB condition 76.2 x 114.3 x 1.6 mm, Cu 30% (SEMI conforming) Note4: The power dissipation decreases the reciprocal of the saturated thermal resistance (1/ Rth(j-a)) for each degree (1°C) that the ambient temperature is exceeded (Ta = 25°C).
Operating Conditions
DC Items (Unless otherwise specified, VDD = 3.0 to 5.5 V, Ta = −40°C to 85°C)
Characteristics Power supply voltage Symbol VDD VIH VIL IOH IOL IOUT Test Conditions
⎯
Min 3.0 0.7 × VDD GND
⎯ ⎯
Typ.
⎯ ⎯ ⎯ ⎯ ⎯ ⎯
Max 5.5 VDD 0.3 × VDD
−1
Unit V V V mA mA mA
H i g h l e v e l l o g i c i n p u t v o l ta g e Low level logic input voltage H igh level SOUT output current Low level SOUT output current Constant current output
SIN,SCK, SLAT , OE SIN,SCK, SLAT , OE
⎯ ⎯
1 90
OUTn
1.5
AC Items (Unless otherwise specified, VDD = 3.0 to 5.5 V, Ta = −40°C to 85°C)
Characteristics S e r i a l d a ta t r a n s f e r f r e q u e n c y H o l d t i m e Symbol fSCK tHOLD1 tHOLD2 tSETUP1 tSETUP2 tr tf Test Circuits 6 6 6 6 6 6 6 *1 *1 Test Conditions
⎯ ⎯ ⎯ ⎯ ⎯
Min
⎯
Typ.
⎯ ⎯ ⎯ ⎯ ⎯ ⎯ ⎯
Max 25
⎯ ⎯ ⎯ ⎯
Unit MHz ns ns ns ns ns ns
5 5 5 5
⎯ ⎯
S
e
t
u
p
t
i
m
e
Maximum clock rise time Maximum clock fall time
500 500
Note1: If the device is connected in a cascade and the tr/tf of the clock waveform increases due to deceleration of the clock waveform,it may not be possible to achieve the timing required for data transfer. Please keep these timing conditions in mind when designing your application.
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Electrical Characteristics (Unless otherwise specified, VDD = 3.3V, Ta = 25°C)
Characteristics High level logic output voltage L o w l e v e l l o g i c o u t p u t v o l ta g e High level logic input current Low level logic input current Power supply current Symbol VOH VOL IIH IIL IDD IOUT
ΔIOUT(Ch) ΔIOUT(IC)
Test Circuits 1 1 2 3 4 5 5 5 5 5 5 3 2
Test Conditions IOH = −1 mA IOL = +1 mA VIN = VDD, OE , SIN, SCK VIN = GND, SLAT , SIN, SCK REXT = 1.2 kΩ, All output on VDD = 3.3 V, VOUT = 1.0 V, REXT = 1.2 kΩ, 1 output on VDD = 3.3 V, VOUT = 1.0 V, REXT = 1.2 kΩ, 1 output on VDD = 3.3 V, VOUT = 1.0 V, REXT = 1.2 kΩ, 1 output on VDD = 3.3 V, VOUT= 17 V, REXT = 1.2 kΩ VDD = 3.0 to 3.6 V, VOUT = 1.0 V, REXT = 1.2 kΩ, 1 output on VDD = 3.3 V, VOUT = 1.0 to 3.0 V, REXT = 1.2 kΩ, 1 output on OE
SLAT
Min VDD − 0.4
⎯ ⎯ ⎯ ⎯ ⎯ ⎯ ⎯ ⎯ ⎯ ⎯
Typ.
⎯ ⎯ ⎯ ⎯ ⎯
Max
⎯
Unit V V
μA μA
0.4 1
−1
8.0
⎯ ±1.5 ±1.5
mA mA % %
μA
Output
current
14.4
±1 ±1 ⎯ ±1 ±0.1
Constant current error(Ch to Ch) C onstant current error(IC to IC) Output OFF leak current
IOK %VDD %VOUT RUP RDOWN
0.5
±5 ±0.5
Constant current power supply voltage regulation Constant current output voltage regulation Pull-up Pull-down resistor resistor
%/V %/V kΩ kΩ
400 400
500 500
600 600
Electrical Characteristics (Unless otherwise specified, VDD = 5.0V, Ta = 25°C)
Characteristics High level logic output voltage L o w l e v e l l o g i c o u t p u t v o l ta g e High level logic input current Low level logic input current Power supply current Symbol VOH VOL IIH IIL IDD IOUT
ΔIOUT(Ch) ΔIOUT(IC)
Test Circuits 1 1 2 3 4 5 5 5 5 5 5 3 2
Test Conditions IOH = −1 mA IOL = +1 mA VIN = VDD, OE , SIN, SCK VIN = GND, SLAT , SIN, SCK REXT = 1.2 kΩ, All output on VDD = 5.0 V, VOUT = 1.0 V, REXT = 1.2 kΩ, 1 output on VDD = 5.0 V, VOUT = 1.0 V, REXT = 1.2 kΩ, 1 output on VDD = 5.0 V, VOUT = 1.0 V, REXT = 1.2 kΩ, 1 output on VDD = 5.0 V, VOUT = 17 V, REXT = 1.2 kΩ VDD = 4.5 to 5.5 V, VOUT = 1.0 V, REXT = 1.2 kΩ, 1 output on VDD = 5.0 V, VOUT = 1.0 to 3.0 V, REXT = 1.2 kΩ, 1 output on
Min VDD − 0.4
⎯ ⎯ ⎯ ⎯ ⎯ ⎯ ⎯ ⎯ ⎯ ⎯
Typ.
⎯ ⎯ ⎯ ⎯ ⎯
Max
⎯
Unit V V
μA μA
0.4 1
−1
8.0
⎯ ±1.5 ±1.5
mA mA % %
μA
Output
current
14.4
±1 ±1 ⎯ ±1 ±0.1
Constant current error(Ch to Ch) C onstant current error(IC to IC) Output OFF leak current
IOK %VDD %VOUT RUP RDOWN
0.5
±5 ±0.5
Constant current power supply voltage regulation Constant current output voltage regulation Pull-up Pull-down resistor resistor
%/V %/V kΩ kΩ
OE
SLAT
400 400
500 500
600 600
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Switching Characteristics (Unless otherwise specified, VDD = 3.3V, Ta = 25°C)
Characteristics SCK- OUT0 SLAT - OUT0 OE - OUT0 P ropagation delay t i m e SCK-SOUT SCK- OUT0 SLAT - OUT0 OE - OUT0 SCK-SOUT Output Output Enable Clock Latch rise fall pulse pulse pulse time time width width width Symbol tpLH1 tpLH2 tpLH3 tpLH tpHL1 tpHL2 tpHL3 tpHL tor tof twOE(L) twOE(H) twSCK twSLAT Test Circuits 6 6 6 6 6 6 6 6 6 6 6 6 6 6 Test Conditions Min
⎯ ⎯ ⎯
Typ. 50 50 50 20 30 30 30 20 30 10
⎯ ⎯ ⎯ ⎯
Max 65 65 65 35 40 40 40 35 45 20
⎯
Unit ns ns ns ns ns ns ns ns ns ns ns
SLAT = “H”, OE = “L”
OE = “L” SLAT = “H” CL=10.5 pF SLAT = “H”, OE = “L” OE = “L” SLAT = “H” CL=10.5 pF 10 to 90% of voltage waveform 90 to 10% of voltage waveform OE = “L” OE = “H” SCK = “H” or “L” SLAT = “H”
10
⎯ ⎯ ⎯
10
⎯ ⎯
25 50 20 20
⎯ ⎯ ⎯
ns ns
Switching Characteristics (Unless otherwise specified, VDD = 5.0V, Ta = 25°C)
Characteristics SCK- OUT0 Symbol tpLH1 tpLH2 tpLH3 tpLH tpHL1 tpHL2 tpHL3 tpHL tor tof twOE(L) twOE(H) Clock Latch pulse pulse width width twSCK twSLAT Test Circuits 6 6 6 6 6 6 6 6 6 6 6 6 6 6 Test Conditions SLAT = “H”, OE = “L” Min
⎯ ⎯ ⎯
Typ. 50 50 50 20 30 30 30 20 30 10
⎯ ⎯ ⎯ ⎯
Max 65 65 65 35 40 40 40 35 45 20
⎯
Unit ns ns ns ns ns ns ns ns ns ns ns
SLAT - OUT0
OE - OUT0 P ropagation delay t i m e SCK-SOUT SCK- OUT0
OE = “L”
SLAT = “H” CL=10.5 pF SLAT = “H”, OE = “L”
10
⎯ ⎯ ⎯
SLAT - OUT0
OE - OUT0 SCK-SOUT Output Output Enable rise fall pulse time time width
OE = “L”
SLAT = “H” CL=10.5 pF 10 to 90% of voltage waveform 90 to 10% of voltage waveform OE = “L” OE = “H” SCK = “H” or “L” SLAT = “H”
10
⎯ ⎯
25 50 20 20
⎯ ⎯ ⎯
ns ns
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Test Circuits
Test Circuit1: High level logic input voltage / Low level logic input voltage
SCK SIN
SLAT
VDD
OUT0
F.G
OE
OUT7
OUT15 VIH = VDD VIL = 0 V tr = tf = 10 ns (10 to 90%) REXT GND SOUT
VDD = 3.3 V, 5.0 V VDD = 3.3 V, 5.0 V VDD = 3.3 V, 5.0 V
REXT
IO = -1mA to 1mA
CL = 10.5 pF
V
Test Circuit2: High level logic input current / Pull-down resistor
VIN = VDD
A A A
SCK SIN
SLAT
VDD
OUT0
A
OE
OUT7
OUT15
REXT GND SOUT
CL = 10.5 pF
Test Circuit3: Low level logic input current / Pull-up resistor A A A A
SCK SIN
SLAT
REXT
VDD
OUT0
OE
OUT7
OUT15
REXT GND SOUT
CL = 10.5 pF
REXT
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Test Circuit4: Power supply current
SCK SIN
SLAT
VDD
OUT0
F.G
OE
OUT7
OUT15
VIH = VDD VIL = 0 V tr = tf = 10 ns (10 to 90%)
A
REXT GND SOUT
VDD = 3.3 V, 5.0 V VDD = 3.0~3.6 V, 4.5~5.5 V CL = 10.5 pF VOUT = 1.0 V
Test Circuit5: Constant current output / Output OFF leak current / Constant current error Test Circuit5: Constant current power supply voltage regulation / Constant current output voltage regulation
SCK SIN
SLAT
REXT = 1.2kΩ
VDD
OUT0
A
F.G
OE
OUT7
A
OUT15 VIH = VDD VIL = 0 V tr = tf = 10 ns (10 to 90%) REXT GND SOUT
CL = 10.5 pF
A
VOUT = 1.0~3.0 V, 17 V
Test Circuit6: Switching Characteristics
SCK SIN
SLAT
REXT = 1.2kΩ
VDD
OUT0
RL = 300 Ω CL RL CL RL
F.G
OE
OUT7
OUT15 VIH = VDD VIL = 0 V tr = tf = 10 ns (10 to 90%) REXT
REXT = 1.2kΩ
GND
SOUT
CL = 10.5 pF
CL = 10.5 pF
VDD = 3.3 V, 5.0 V VLED = 5.32 V
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Timing Waveforms
1. SCK, SIN, SOUT
twSCK SCK 50% tSETUP1 SIN 50% tHOLD1 SOUT 50% tpLH/tpHL 50% 50% twSCK 50% 90% 10% tr tf 90% 10%
2. SCK, SIN, SLAT , OE , OUT0
SCK
50%
50%
SIN tHOLD2 SLAT 50% twSLAT
OE
tSETUP2 50% twOE 50% 50%
OUT0 tpHL1/tpLH1 tpHL2/tpLH2
50%
3. OE , OUT0 ~ OUT15
twOE 50% OE
50%
tpHL3
tpLH3
90% OUT0 ~ OUT15
50% 10% tof
50% 10% tor
90%
OFF
ON
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Reference data
*This data is provided for reference only. Thorough evaluation and testing should be implemented when designing your application's mass production design.
Output Current (IOUT) – Output current setting resistance (REXT)
IOUT - REXT
90 80 70 60 I OUT (mA) 50 40 30 20 10 0 0
VOUT=1.0V Ta=25°C Theoretical formula
IOUT (A) = (1.04(V) ÷ REXT (Ω)) × 16.6
1000
2000
3000
4000
5000
REXT (Ω)
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Reference data
*This data is provided for reference only. Thorough evaluation and testing should be implemented when designing your application's mass production design.
Output current (IOUT) – Output voltage (VOUT)
IOUT - VOUT 100 90 80 70 IOUT (mA) 60 50 40 30 20 10 0 0 0.5 1 1.5 VOUT (V) 2 2.5 3 VDD =3.3V,Ta=25℃,1chON
IOUT - VOUT 100 90 80 70 IOUT (mA) 60 50 40 30 20 10 0 0 0.5 1 1.5 VOUT (V) 2 2.5 3 VDD=5.0V,Ta=25℃,1chON
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Package Dimensions
Weight: 0.29 g (typ.)
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Package Dimensions
SSOP24-P-150-0.64
0.337 to 0.344
Unit : Inch
0.0325(REF)
0.150 to 0.157 0.025 0.054 to 0.068 0.008 to 0.012 0.010(TYP) 0.016 to 0.034
Weight: 0.14 g (typ.)
0.004 to 0.098
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0.229 to 0.244
TC62D748AFG/AFNAG/BFNAG
Notes on Contents
1. Block Diagrams
Some of the functional blocks, circuits, or constants in the block diagram may be omitted or simplified for explanatory purposes.
2. Equivalent Circuits
The equivalent circuit diagrams may be simplified or some parts of them may be omitted for explanatory purposes.
3. Timing Charts
Timing charts may be simplified for explanatory purposes.
4. Application Circuits
The application circuits shown in this document are provided for reference purposes only. Thorough evaluation is required, especially at the mass production design stage. Toshiba does not grant any license to any industrial property rights by providing these examples of application circuits.
5. Test Circuits
Components in the test circuits are used only to obtain and confirm the device characteristics. These components and circuits are not guaranteed to prevent malfunction or failure from occurring in the application equipment.
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IC Usage Considerations
Notes on handling of ICs
[1] The absolute maximum ratings of a semiconductor device are a set of ratings that must not be exceeded, even for a moment. Do not exceed any of these ratings. Exceeding the rating(s) may cause the device breakdown, damage or deterioration, and may result injury by explosion or combustion. [2] Use an appropriate power supply fuse to ensure that a large current does not continuously flow in case of over current and/or IC failure. The IC will fully break down when used under conditions that exceed its absolute maximum ratings, when the wiring is routed improperly or when an abnormal pulse noise occurs from the wiring or load, causing a large current to continuously flow and the breakdown can lead smoke or ignition. To minimize the effects of the flow of a large current in case of breakdown, appropriate settings, such as fuse capacity, fusing time and insertion circuit location, are required. [3] If your design includes an inductive load such as a motor coil, incorporate a protection circuit into the design to prevent device malfunction or breakdown caused by the current resulting from the inrush current at power ON or the negative current resulting from the back electromotive force at power OFF. IC breakdown may cause injury, smoke or ignition. Use a stable power supply with ICs with built-in protection functions. If the power supply is unstable, the protection function may not operate, causing IC breakdown. IC breakdown may cause injury, smoke or ignition. [4] Do not insert devices in the wrong orientation or incorrectly. Make sure that the positive and negative terminals of power supplies are connected properly. Otherwise, the current or power consumption may exceed the absolute maximum rating, and exceeding the rating(s) may cause the device breakdown, damage or deterioration, and may result injury by explosion or combustion. In addition, do not use any device that is applied the current with inserting in the wrong orientation or incorrectly even just one time. [5] Carefully select external components (such as inputs and negative feedback capacitors) and load components (such as speakers), for example, power amp and regulator. If there is a large amount of leakage current such as input or negative feedback condenser, the IC output DC voltage will increase. If this output voltage is connected to a speaker with low input withstand voltage, overcurrent or IC failure can cause smoke or ignition. (The over current can cause smoke or ignition from the IC itself.) In particular, please pay attention when using a Bridge Tied Load (BTL) connection type IC that inputs output DC voltage to a speaker directly.
Points to remember on handling of ICs
(1) Heat Radiation Design In using an IC with large current flow such as power amp, regulator or driver, please design the device so that heat is appropriately radiated, not to exceed the specified junction temperature (TJ) at any time and condition. These ICs generate heat even during normal use. An inadequate IC heat radiation design can lead to decrease in IC life, deterioration of IC characteristics or IC breakdown. In addition, please design the device taking into considerate the effect of IC heat radiation with peripheral components. (2) Back-EMF When a motor rotates in the reverse direction, stops or slows down abruptly, a current flow back to the motor’s power supply due to the effect of back-EMF. If the current sink capability of the power supply is small, the device’s motor power supply and output pins might be exposed to conditions beyond maximum ratings. To avoid this problem, take the effect of back-EMF into consideration in system design.
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About solderability, following conditions were confirmed
Solderability (1) · · · · (2) · · · · Use of Sn-37Pb solder Bath solder bath temperature: 230°C dipping time: 5 seconds the number of times: once use of R-type flux Use of Sn-3.0Ag-0.5Cu solder Bath solder bath temperature: 245°C dipping time: 5 seconds the number of times: once use of R-type flux
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RESTRICTIONS ON PRODUCT USE
• Toshiba Corporation, and its subsidiaries and affiliates (collectively “TOSHIBA”), reserve the right to make changes to the information in this document, and related hardware, software and systems (collectively “Product”) without notice. • This document and any information herein may not be reproduced without prior written permission from TOSHIBA. Even with TOSHIBA’s written permission, reproduction is permissible only if reproduction is without alteration/omission. • Though TOSHIBA works continually to improve Product’s quality and reliability, Product can malfunction or fail. Customers are responsible for complying with safety standards and for providing adequate designs and safeguards for their hardware, software and systems which minimize risk and avoid situations in which a malfunction or failure of Product could cause loss of human life, bodily injury or damage to property, including data loss or corruption. Before customers use the Product, create designs including the Product, or incorporate the Product into their own applications, customers must also refer to and comply with (a) the latest versions of all relevant TOSHIBA information, including without limitation, this document, the specifications, the data sheets and application notes for Product and the precautions and conditions set forth in the “TOSHIBA Semiconductor Reliability Handbook” and (b) the instructions for the application with which the Product will be used with or for. Customers are solely responsible for all aspects of their own product design or applications, including but not limited to (a) determining the appropriateness of the use of this Product in such design or applications; (b) evaluating and determining the applicability of any information contained in this document, or in charts, diagrams, programs, algorithms, sample application circuits, or any other referenced documents; and (c) validating all operating parameters for such designs and applications. TOSHIBA ASSUMES NO LIABILITY FOR CUSTOMERS’ PRODUCT DESIGN OR APPLICATIONS. • Product is intended for use in general electronics applications (e.g., computers, personal equipment, office equipment, measuring equipment, industrial robots and home electronics appliances) or for specific applications as expressly stated in this document. Product is neither intended nor warranted for use in equipment or systems that require extraordinarily high levels of quality and/or reliability and/or a malfunction or failure of which may cause loss of human life, bodily injury, serious property damage or serious public impact (“Unintended Use”). Unintended Use includes, without limitation, equipment used in nuclear facilities, equipment used in the aerospace industry, medical equipment, equipment used for automobiles, trains, ships and other transportation, traffic signaling equipment, equipment used to control combustions or explosions, safety devices, elevators and escalators, devices related to electric power, and equipment used in finance-related fields. Do not use Product for Unintended Use unless specifically permitted in this document. • Do not disassemble, analyze, reverse-engineer, alter, modify, translate or copy Product, whether in whole or in part. • Product shall not be used for or incorporated into any products or systems whose manufacture, use, or sale is prohibited under any applicable laws or regulations. • The information contained herein is presented only as guidance for Product use. No responsibility is assumed by TOSHIBA for any infringement of patents or any other intellectual property rights of third parties that may result from the use of Product. No license to any intellectual property right is granted by this document, whether express or implied, by estoppel or otherwise. • ABSENT A WRITTEN SIGNED AGREEMENT, EXCEPT AS PROVIDED IN THE RELEVANT TERMS AND CONDITIONS OF SALE FOR PRODUCT, AND TO THE MAXIMUM EXTENT ALLOWABLE BY LAW, TOSHIBA (1) ASSUMES NO LIABILITY WHATSOEVER, INCLUDING WITHOUT LIMITATION, INDIRECT, CONSEQUENTIAL, SPECIAL, OR INCIDENTAL DAMAGES OR LOSS, INCLUDING WITHOUT LIMITATION, LOSS OF PROFITS, LOSS OF OPPORTUNITIES, BUSINESS INTERRUPTION AND LOSS OF DATA, AND (2) DISCLAIMS ANY AND ALL EXPRESS OR IMPLIED WARRANTIES AND CONDITIONS RELATED TO SALE, USE OF PRODUCT, OR INFORMATION, INCLUDING WARRANTIES OR CONDITIONS OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE, ACCURACY OF INFORMATION, OR NONINFRINGEMENT. • Do not use or otherwise make available Product or related software or technology for any military purposes, including without limitation, for the design, development, use, stockpiling or manufacturing of nuclear, chemical, or biological weapons or missile technology products (mass destruction weapons). Product and related software and technology may be controlled under the Japanese Foreign Exchange and Foreign Trade Law and the U.S. Export Administration Regulations. Export and re-export of Product or related software or technology are strictly prohibited except in compliance with all applicable export laws and regulations. • Please contact your TOSHIBA sales representative for details as to environmental matters such as the RoHS compatibility of Product. Please use Product in compliance with all applicable laws and regulations that regulate the inclusion or use of controlled substances, including without limitation, the EU RoHS Directive. TOSHIBA assumes no liability for damages or losses occurring as a result of noncompliance with applicable laws and regulations.
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