VLMO31J1L2-GS18

VLMO31.. Vishay Semiconductors Standard SMD LED PLCC2 FEATURES • Lead (Pb)-free product - RoHS compliant • SMD LED with exceptional brightness • Luminous intensity categorized e3 • Compatible with automatic placement equipment • EIA and ICE standard package • Compatible with IR reflow, vapor phase and wave solder processes according to CECC 00802 and J-STD-020C • Available in 8 mm tape • Low profile package • Non-diffused lens: excellent for coupling to light pipes and backlighting • Low power consumption • Luminous intensity ratio in one packaging unit IVmax/IVmin ≤ 1.6 • Lead (Pb)-free device • Preconditioning: acc. to JEDEC level 2a • ESD-withstand voltage up to 2 kV according to JESD22-A114-B APPLICATIONS • Automotive: backlighting in dashboards and switches • Telecommunication: indicator and backlighting in telephone and fax • Indicator and backlight for audio and video equipment • Indicator and backlight in office equipment • Flat backlight for LCDs, switches and symbols • General use 94 8553 DESCRIPTION This device has been designed for applications requiring narrow brightness and color selection. The package of this device is the PLCC-2. It consists of a lead frame which is embedded in a white thermoplast. The reflector inside this package is filled up with clear epoxy. PRODUCT GROUP AND PACKAGE DATA • Product group: LED • Package: SMD PLCC-2 • Product series: standard • Angle of half intensity: ± 60° PARTS TABLE PART VLMO31J1K2-GS08 VLMO31J1K2-GS18 VLMO31J1L2-GS08 VLMO31J1L2-GS18 VLMO31K1L2-GS08 VLMO31K1L2-GS18 COLOR, LUMINOUS INTENSITY Soft orange, IV = (4.5 to 11.2) mcd Soft orange, IV = (4.5 to 11.2) mcd Soft orange, IV = (4.5 to 18) mcd Soft orange, IV = (4.5 to 18) mcd Soft orange, IV = (7.1 to 18) mcd Soft orange, IV = (7.1 to 18) mcd TECHNOLOGY GaAsP on GaP GaAsP on GaP GaAsP on GaP GaAsP on GaP GaAsP on GaP GaAsP on GaP Document Number 81333 Rev. 1.2, 11-Sep-07 www.vishay.com 1 VLMO31.. Vishay Semiconductors ABSOLUTE MAXIMUM RATINGS1) VLMO31.. PARAMETER Reverse voltage2) DC Forward current Surge forward current Power dissipation Junction temperature Operating temperature range Storage temperature range Soldering temperature Thermal resistance junction/ambient t≤5s mounted on PC board (pad size > 16 mm2) Tamb ≤ 60 °C tp ≤ 10 µs TEST CONDITION SYMBOL VR IF IFSM PV Tj Tamb Tstg Tsd RthJA VALUE 6 30 0.5 100 100 - 40 to + 100 - 40 to + 100 260 400 UNIT V mA A mW °C °C °C °C K/W Note: 1) Tamb = 25 °C unless otherwise specified 2) Driving LED in reverse direction is suitable for short term application OPTICAL AND ELECTRICAL CHARACTERISTICS1) VLMO31.., SOFT ORANGE PARAMETER Luminous intensity2) TEST CONDITION IF = 10 mA IF = 10 mA IF = 10 mA IF = 10 mA IF = 20 mA IR = 10 μA VR = 0, f = 1 MHz PART VLMO31J1K2 VLMO31J1L2 VLMO31K1L2 Dominant wavelength Peak wavelength Angle of half intensity Forward voltage Reverse voltage Junction capacitance Note: 1) Tamb = 25 °C unless otherwise specified 2) in one Packing Unit I Vmax/IVmin ≤ 1.6 SYMBOL IV IV IV λd λp ϕ VF VR Cj 6 15 MIN 4.5 4.5 7.1 598 605 ± 60 2.0 2.8 TYP. MAX 11.2 18 18 611 UNIT mcd mcd mcd nm nm deg V V pF LUMINOUS INTENSITY CLASSIFICATION GROUP STANDARD J K L M Note: Luminous intensity is tested at a current pulse duration of 25 ms and an accuracy of ± 11 %. The above Type Numbers represent the order groups which include only a few brightness groups. Only one group will be shipped on each reel (there will be no mixing of two groups on each reel). In order to ensure availability, single brightness groups will not be orderable. In a similar manner for colors where wavelength groups are measured and binned, single wavelength groups will be shipped on any one reel. In order to ensure availability, single wavelength groups will not be orderable. www.vishay.com 2 1 2 1 2 1 2 1 2 LIGHT INTENSITY (MCD) OPTIONAL MIN 4.5 5.6 7.1 9.0 11.2 14.0 18.0 22.4 MAX 5.6 7.1 9.0 11.2 14.0 18.0 22.4 28.0 CROSSING TABLE VISHAY VLMO31J1K2 VLMO31J1L2 VLMO31K1L2 OSRAM LOT670-J1K2 LOT670-J1L2 LOT670-K1L2 COLOR CLASSIFICATION GROUP 1 2 3 4 5 6 SOFT ORANGE DOM. WAVELENGTH (NM) MIN. MAX. 598 601 600 603 602 605 604 607 606 609 608 611 Note: Wavelengths are tested at a current pulse duration of 25 ms and an accuracy of ± 1 nm. Document Number 81333 Rev. 1.2, 11-Sep-07 VLMO31.. Vishay Semiconductors TYPICAL CHARACTERISTICS Tamb = 25 °C, unless otherwise specified 60 1.2 IVrel - Relative Luminous Intensity soft orange 1.0 0.8 0.6 0.4 0.2 0 570 95 10324 IF - Forward Current (mA) 50 40 30 20 10 0 0 20 40 60 80 100 590 610 630 650 670 95 10905 Tamb - Ambient Temperature (°C) λ - Wavelength (nm) Figure 1. Forward Current vs. Ambient Temperature Figure 4. Relative Intensity vs. Wavelength 10000 0.01 0.02 0.05 100 I F - Forward Current (mA) t p /T = 0.005 Tamb < 60 °C soft orange I F - Forward Current (mA) 1000 10 100 0.2 0.5 DC 1 10 0.1 1 0.01 95 9985 0.1 0.1 1 10 100 95 9990 0 1 2 3 4 5 t p - Pulse Length (ms) V F - Forward Voltage (V) Figure 2. Forward Current vs. Pulse Length Figure 5. Forward Current vs. Forward Voltage 0° 10° 20° IV rel - Relative Luminous Intensity I v rel - Relative Luminous Intensity 30° 10 soft orange 40° 1.0 0.9 0.8 0.7 50° 60° 70° 80° 1 0.1 0.01 95 10319 0.6 0.4 0.2 0 0.2 0.4 0.6 95 9997 1 10 I F - Forward Current (mA) 100 Figure 3. Rel. Luminous Intensity vs. Angular Displacement Figure 6. Relative Luminous Intensity vs. Forward Current Document Number 81333 Rev. 1.2, 11-Sep-07 www.vishay.com 3 VLMO31.. Vishay Semiconductors 2.4 IV rel - Relative Luminous Intensity I V re l - Relative Luminous Intensity soft orange 2.0 1.6 1.2 0.8 0.4 0 10 95 10259 2.0 soft orange 1.6 1.2 0.8 0.4 0 20 0.5 50 0.2 100 0.1 200 0.05 500 I F (mA) 0.02 tp /T 95 9994 0 20 40 60 80 100 1 Tamb - Ambient Temperature (°C) Figure 7. Rel. Lumin. Intensity vs. Forw. Current/Duty Cycle Figure 8. Rel. Luminous Intensity vs. Ambient Temperature PACKAGE DIMENSIONS in millimeters 3.5 ± 0.2 1.75 ± 0.10 technical drawings according to DIN specifications 0.9 Mounting Pad Layout Pin identification 1.2 area covered with solder resist 2.6 (2.8) + 0.15 2.2 C A 2.8 4 1.6 (1.9) ? 2.4 3 + 0.15 Drawing-No.: 6.541-5025.01-4 Issue: 8; 22.11.05 95 11314-1 www.vishay.com 4 4 Document Number 81333 Rev. 1.2, 11-Sep-07 VLMO31.. Vishay Semiconductors METHOD OF TAPING/POLARITY AND TAPE AND REEL SMD LED (VLM.3 - SERIES) Vishay’s LEDs in SMD packages are available in an antistatic 8 mm blister tape (in accordance with DIN IEC 40 (CO) 564) for automatic component insertion. The blister tape is a plastic strip with impressed component cavities, covered by a top tape. Identification Label: Vishay Type Group Tape Code Production Code Quantity REEL PACKAGE DIMENSION IN MM FOR SMD LEDS, TAPE OPTION GS18 (= 8000 PCS.) PREFERRED 120° 10.4 8.4 4.5 3.5 2.5 1.5 13.00 12.75 62.5 60.0 Adhesive Tape 321 329 14.4 max. 18857 Blister Tape Figure 11. Reel Dimensions - GS18 SOLDERING PROFILE IR Reflow Soldering Profile for lead (Pb)-free soldering Component Cavity Preconditioning acc. to JEDEC Level 2a 94 8670 300 255 °C 255°C 240 °C 217 °C max. 260 °C 245 °C TAPING OF VLM.3... Temperature (°C) 3.5 3.1 2.2 2.0 250 200 max. 30 s 150 max. 120 sec max. 100 sec 5.75 5.25 3.6 3.4 1.85 1.65 4.0 3.6 8.3 7.7 100 max. Ramp Up 3 °C/sec max. Ramp Down 6 °C/sec 50 0 0 0.25 19470-2 50 100 150 Time (s) 200 250 300 1.6 1.4 4.1 3.9 2.05 1.95 4.1 3.9 max. 2 cycles allowed 94 8668 Figure 12. Vishay Leadfree Reflow Soldering Profile (acc. to J-STD-020C) Figure 9. Tape Dimensions in mm for PLCC-2 REEL PACKAGE DIMENSION IN MM FOR SMD LEDS, TAPE OPTION GS08 (= 1500 PCS.) Temperature (°C) 120° 10.0 9.0 TTW Soldering 300 250 200 150 100 50 235 °C...260 °C first wave ca. 200 K/s 100 °C...130 °C 5s (acc. to CECC00802) 948626-1 Lead Temperature second wave ca. 2 K/s full line: typical dotted line: process limits 4.5 3.5 2.5 1.5 13.00 12.75 63.5 60.5 2 K/s forced cooling ca. 5 K/s Identification Label: Vishay Type Group Tape Code Production Code Quantity 0 0 50 100 Time (s) 150 200 250 Figure 13. Double Wave Soldering of Opto Devices (all Packages) 180 178 14.4 max. 94 8665 Figure 10. Reel Dimensions - GS08 Document Number 81333 Rev. 1.2, 11-Sep-07 www.vishay.com 5 VLMO31.. Vishay Semiconductors BAR CODE PRODUCT LABEL 106 A H VISHAY 37 B C D E F G 20131 A) Type of component B) Manufacturing plant C) SEL - selection code (bin): e.g.: J1 = code for luminous intensity group 3 = code for color group D) Date code year/week E) Day code (e.g. 3: Wednesday) F) Batch no. G) Total quantity H) Company code DRY PACKING The reel is packed in an anti-humidity bag to protect the devices from absorbing moisture during transportation and storage. Aluminum bag RECOMMENDED METHOD OF STORAGE Dry box storage is recommended as soon as the aluminium bag has been opened to prevent moisture absorption. The following conditions should be observed, if dry boxes are not available: • Storage temperature 10 °C to 30 °C • Storage humidity ≤ 60 % RH max. After more than 672 h under these conditions moisture content will be too high for reflow soldering. In case of moisture absorption, the devices will recover to the former condition by drying under the following condition: 192 h at 40 °C + 5 °C/ - 0 °C and < 5 % RH (dry air/ nitrogen) or 96 h at 60 °C + 5 °C and < 5 % RH for all device containers or 24 h at 100 °C + 5 °C not suitable for reel or tubes. An EIA JEDEC standard JESD22-A112 level 2a label is included on all dry bags. LEVEL This bag contains MOISTURE –SENSITIVE DEVICES CAUTION 2a 1. Shelf life in sealed bag 12 months at