VLMO31..
Vishay Semiconductors
Standard SMD LED PLCC2
FEATURES • Lead (Pb)-free product - RoHS compliant • SMD LED with exceptional brightness • Luminous intensity categorized e3 • Compatible with automatic placement equipment • EIA and ICE standard package • Compatible with IR reflow, vapor phase and wave solder processes according to CECC 00802 and J-STD-020C • Available in 8 mm tape • Low profile package • Non-diffused lens: excellent for coupling to light pipes and backlighting • Low power consumption • Luminous intensity ratio in one packaging unit IVmax/IVmin ≤ 1.6 • Lead (Pb)-free device • Preconditioning: acc. to JEDEC level 2a • ESD-withstand voltage up to 2 kV according to JESD22-A114-B APPLICATIONS • Automotive: backlighting in dashboards and switches • Telecommunication: indicator and backlighting in telephone and fax • Indicator and backlight for audio and video equipment • Indicator and backlight in office equipment • Flat backlight for LCDs, switches and symbols • General use
94 8553
DESCRIPTION This device has been designed for applications requiring narrow brightness and color selection. The package of this device is the PLCC-2. It consists of a lead frame which is embedded in a white thermoplast. The reflector inside this package is filled up with clear epoxy. PRODUCT GROUP AND PACKAGE DATA • Product group: LED • Package: SMD PLCC-2 • Product series: standard • Angle of half intensity: ± 60° PARTS TABLE
PART VLMO31J1K2-GS08 VLMO31J1K2-GS18 VLMO31J1L2-GS08 VLMO31J1L2-GS18 VLMO31K1L2-GS08 VLMO31K1L2-GS18
COLOR, LUMINOUS INTENSITY Soft orange, IV = (4.5 to 11.2) mcd Soft orange, IV = (4.5 to 11.2) mcd Soft orange, IV = (4.5 to 18) mcd Soft orange, IV = (4.5 to 18) mcd Soft orange, IV = (7.1 to 18) mcd Soft orange, IV = (7.1 to 18) mcd
TECHNOLOGY GaAsP on GaP GaAsP on GaP GaAsP on GaP GaAsP on GaP GaAsP on GaP GaAsP on GaP
Document Number 81333 Rev. 1.2, 11-Sep-07
www.vishay.com 1
VLMO31..
Vishay Semiconductors
ABSOLUTE MAXIMUM RATINGS1) VLMO31..
PARAMETER Reverse voltage2) DC Forward current Surge forward current Power dissipation Junction temperature Operating temperature range Storage temperature range Soldering temperature Thermal resistance junction/ambient t≤5s mounted on PC board (pad size > 16 mm2) Tamb ≤ 60 °C tp ≤ 10 µs TEST CONDITION SYMBOL VR IF IFSM PV Tj Tamb Tstg Tsd RthJA VALUE 6 30 0.5 100 100 - 40 to + 100 - 40 to + 100 260 400 UNIT V mA A mW °C °C °C °C K/W
Note: 1) Tamb = 25 °C unless otherwise specified 2) Driving LED in reverse direction is suitable for short term application
OPTICAL AND ELECTRICAL CHARACTERISTICS1) VLMO31.., SOFT ORANGE
PARAMETER Luminous intensity2) TEST CONDITION IF = 10 mA IF = 10 mA IF = 10 mA IF = 10 mA IF = 20 mA IR = 10 μA VR = 0, f = 1 MHz PART VLMO31J1K2 VLMO31J1L2 VLMO31K1L2 Dominant wavelength Peak wavelength Angle of half intensity Forward voltage Reverse voltage Junction capacitance Note: 1) Tamb = 25 °C unless otherwise specified 2) in one Packing Unit I Vmax/IVmin ≤ 1.6 SYMBOL IV IV IV λd λp ϕ VF VR Cj 6 15 MIN 4.5 4.5 7.1 598 605 ± 60 2.0 2.8 TYP. MAX 11.2 18 18 611 UNIT mcd mcd mcd nm nm deg V V pF
LUMINOUS INTENSITY CLASSIFICATION
GROUP STANDARD J K L M Note: Luminous intensity is tested at a current pulse duration of 25 ms and an accuracy of ± 11 %. The above Type Numbers represent the order groups which include only a few brightness groups. Only one group will be shipped on each reel (there will be no mixing of two groups on each reel). In order to ensure availability, single brightness groups will not be orderable. In a similar manner for colors where wavelength groups are measured and binned, single wavelength groups will be shipped on any one reel. In order to ensure availability, single wavelength groups will not be orderable. www.vishay.com 2 1 2 1 2 1 2 1 2 LIGHT INTENSITY (MCD) OPTIONAL MIN 4.5 5.6 7.1 9.0 11.2 14.0 18.0 22.4 MAX 5.6 7.1 9.0 11.2 14.0 18.0 22.4 28.0
CROSSING TABLE
VISHAY VLMO31J1K2 VLMO31J1L2 VLMO31K1L2 OSRAM LOT670-J1K2 LOT670-J1L2 LOT670-K1L2
COLOR CLASSIFICATION
GROUP 1 2 3 4 5 6 SOFT ORANGE DOM. WAVELENGTH (NM) MIN. MAX. 598 601 600 603 602 605 604 607 606 609 608 611
Note: Wavelengths are tested at a current pulse duration of 25 ms and an accuracy of ± 1 nm.
Document Number 81333 Rev. 1.2, 11-Sep-07
VLMO31..
Vishay Semiconductors
TYPICAL CHARACTERISTICS Tamb = 25 °C, unless otherwise specified
60
1.2 IVrel - Relative Luminous Intensity soft orange 1.0 0.8 0.6 0.4 0.2 0 570
95 10324
IF - Forward Current (mA)
50 40 30 20 10 0 0 20 40 60 80 100
590
610
630
650
670
95 10905
Tamb - Ambient Temperature (°C)
λ - Wavelength (nm)
Figure 1. Forward Current vs. Ambient Temperature
Figure 4. Relative Intensity vs. Wavelength
10000
0.01 0.02 0.05
100 I F - Forward Current (mA)
t p /T = 0.005 Tamb < 60 °C
soft orange
I F - Forward Current (mA)
1000
10
100
0.2 0.5 DC
1
10
0.1
1 0.01
95 9985
0.1 0.1 1 10 100
95 9990
0
1
2
3
4
5
t p - Pulse Length (ms)
V F - Forward Voltage (V)
Figure 2. Forward Current vs. Pulse Length
Figure 5. Forward Current vs. Forward Voltage
0°
10°
20°
IV rel - Relative Luminous Intensity
I v rel - Relative Luminous Intensity
30°
10 soft orange
40° 1.0 0.9 0.8 0.7 50° 60° 70° 80°
1
0.1
0.01
95 10319
0.6
0.4
0.2
0
0.2
0.4
0.6
95 9997
1
10 I F - Forward Current (mA)
100
Figure 3. Rel. Luminous Intensity vs. Angular Displacement
Figure 6. Relative Luminous Intensity vs. Forward Current
Document Number 81333 Rev. 1.2, 11-Sep-07
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VLMO31..
Vishay Semiconductors
2.4 IV rel - Relative Luminous Intensity I V re l - Relative Luminous Intensity soft orange 2.0 1.6 1.2 0.8 0.4 0 10
95 10259
2.0 soft orange 1.6
1.2
0.8 0.4 0
20 0.5
50 0.2
100 0.1
200 0.05
500 I F (mA) 0.02 tp /T
95 9994
0
20
40
60
80
100
1
Tamb - Ambient Temperature (°C)
Figure 7. Rel. Lumin. Intensity vs. Forw. Current/Duty Cycle
Figure 8. Rel. Luminous Intensity vs. Ambient Temperature
PACKAGE DIMENSIONS in millimeters
3.5 ± 0.2
1.75 ± 0.10
technical drawings according to DIN specifications
0.9
Mounting Pad Layout Pin identification 1.2 area covered with solder resist
2.6 (2.8)
+ 0.15
2.2
C
A
2.8
4 1.6 (1.9)
?
2.4
3
+ 0.15
Drawing-No.: 6.541-5025.01-4 Issue: 8; 22.11.05
95 11314-1
www.vishay.com 4
4
Document Number 81333 Rev. 1.2, 11-Sep-07
VLMO31..
Vishay Semiconductors
METHOD OF TAPING/POLARITY AND TAPE AND REEL SMD LED (VLM.3 - SERIES) Vishay’s LEDs in SMD packages are available in an antistatic 8 mm blister tape (in accordance with DIN IEC 40 (CO) 564) for automatic component insertion. The blister tape is a plastic strip with impressed component cavities, covered by a top tape.
Identification Label: Vishay Type Group Tape Code Production Code Quantity
REEL PACKAGE DIMENSION IN MM FOR SMD LEDS, TAPE OPTION GS18 (= 8000 PCS.) PREFERRED
120° 10.4 8.4
4.5 3.5 2.5 1.5
13.00 12.75 62.5 60.0
Adhesive Tape
321 329
14.4 max.
18857
Blister Tape
Figure 11. Reel Dimensions - GS18
SOLDERING PROFILE
IR Reflow Soldering Profile for lead (Pb)-free soldering
Component Cavity
Preconditioning acc. to JEDEC Level 2a
94 8670
300
255 °C 255°C 240 °C 217 °C max. 260 °C 245 °C
TAPING OF VLM.3...
Temperature (°C)
3.5 3.1 2.2 2.0
250
200
max. 30 s
150
max. 120 sec max. 100 sec
5.75 5.25 3.6 3.4
1.85 1.65
4.0 3.6 8.3 7.7
100
max. Ramp Up 3 °C/sec max. Ramp Down 6 °C/sec
50
0 0
0.25
19470-2
50
100
150 Time (s)
200
250
300
1.6 1.4
4.1 3.9
2.05 1.95
4.1 3.9
max. 2 cycles allowed
94 8668
Figure 12. Vishay Leadfree Reflow Soldering Profile (acc. to J-STD-020C)
Figure 9. Tape Dimensions in mm for PLCC-2
REEL PACKAGE DIMENSION IN MM FOR SMD LEDS, TAPE OPTION GS08 (= 1500 PCS.)
Temperature (°C)
120° 10.0 9.0
TTW Soldering 300 250 200 150 100 50 235 °C...260 °C first wave ca. 200 K/s 100 °C...130 °C 5s
(acc. to CECC00802)
948626-1
Lead Temperature second wave ca. 2 K/s full line: typical dotted line: process limits
4.5 3.5 2.5 1.5
13.00 12.75 63.5 60.5
2 K/s forced cooling
ca. 5 K/s
Identification Label: Vishay Type Group Tape Code Production Code Quantity
0 0 50 100 Time (s) 150 200 250
Figure 13. Double Wave Soldering of Opto Devices (all Packages)
180 178 14.4 max.
94 8665
Figure 10. Reel Dimensions - GS08
Document Number 81333 Rev. 1.2, 11-Sep-07
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VLMO31..
Vishay Semiconductors
BAR CODE PRODUCT LABEL
106 A H VISHAY 37
B
C
D
E
F
G
20131
A) Type of component B) Manufacturing plant C) SEL - selection code (bin): e.g.: J1 = code for luminous intensity group 3 = code for color group D) Date code year/week E) Day code (e.g. 3: Wednesday) F) Batch no. G) Total quantity H) Company code DRY PACKING The reel is packed in an anti-humidity bag to protect the devices from absorbing moisture during transportation and storage.
Aluminum bag
RECOMMENDED METHOD OF STORAGE Dry box storage is recommended as soon as the aluminium bag has been opened to prevent moisture absorption. The following conditions should be observed, if dry boxes are not available: • Storage temperature 10 °C to 30 °C • Storage humidity ≤ 60 % RH max. After more than 672 h under these conditions moisture content will be too high for reflow soldering. In case of moisture absorption, the devices will recover to the former condition by drying under the following condition: 192 h at 40 °C + 5 °C/ - 0 °C and < 5 % RH (dry air/ nitrogen) or 96 h at 60 °C + 5 °C and < 5 % RH for all device containers or 24 h at 100 °C + 5 °C not suitable for reel or tubes. An EIA JEDEC standard JESD22-A112 level 2a label is included on all dry bags.
LEVEL This bag contains MOISTURE –SENSITIVE DEVICES
CAUTION
2a
1. Shelf life in sealed bag 12 months at
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