S2AF THRU S2MF
Surface Mount General Purpose Silicon Rectifiers
Reverse Voltage -50 to 1000V
Forward Current -2A
PINNING
PIN
FEATURES
• For surface mounted applications
• Low profile package
• Glass Passivated Chip Juntion
• Easy to pick and place
• Lead free in comply with EU RoHS 2011/65/EU directives
DESCRIPTION
1
Cathode
2
Anode
1
2
Top View
MECHANICAL DATA
• Case: SMAF
• Terminals: Solderable per MIL-STD-750,
750, Method 2026
• Approx. Weight: 27mg 0.00086oz
Marking Code:S2A-S2M
Simplified outline SMAF L and symbol
Maximum Ratings and Electrical characteristics
aracteristics
Ratings at 25°C
C ambient temperature unless otherwise specified.Single phase half-wave
half wave 60 Hz, resistive or inductive load, for capacitive load
current derate by 20 %.
Symbols
S2AF
Maximum Repetitive Peak Reverse Voltage
V RRM
Maximum RMS voltage
S2BF
S2DF
S2GF
S2JF
S2KF
S2MF
Units
50
100
200
400
600
800
1000
V
V RMS
35
70
140
280
420
560
700
V
Maximum DC Blocking Voltage
V DC
50
100
200
400
600
800
1000
V
Maximum Average Forward Rectified Current
at Ta = 65 °C
I F(AV)
2
A
Peak Forward Surge Current 8.3 ms Single Half
Sine Wave Superimposed on Rated Load
(JEDEC Method)
I FSM
60
A
Maximum Instantaneous Forward Voltage at 2 A
VF
1.1
V
IR
5
50
μA
Cj
30
pF
RθJA
50
°C/W
T j , T stg
-55 ~ +150
°C
Parameter
Maximum DC Reverse Current
at Rated DC Blocking Voltage
Typical Junction Capacitance
Typical Thermal Resistance
Ta = 25 °C
Ta =125 °C
1)
2)
Operating and Storage Temperature Range
1) Measured at 1 MHz and applied reverse voltage of 4 V D.C
2)Thermal resistance from junction to ambient at 0.375" (9.5 mm) lead length, P.C.B. mounted
REV.08
1 of 3
S2AF THRU S2MF
Fig.2 Typical Instaneous Reverse
Characteristics
Instaneous Reverse Current ( μ A)
Average Forward Current (A)
Fig.1 Forward Current Derating Curve
2.5
100LFM
2.0
1.5
1.0
0.5
0.0
Single phase half-wave 60 Hz
resistive or inductive load
25
50
75
100
125
150
175
100
T J =150°C
T J =125°C
10
T J =100°C
1.0
T J =75°C
T J =50°C
0.1
T J =25°C
0.01
0
Junction Capacitance ( pF)
2 5°
C
=1
TJ
TJ =
00
50
°C
°C
1.5
=1
800
Fig.4 Typical Junction Capacitance
2.0
TJ
Instaneous Forward Current (A)
Fig.3 Typical Forward Characteristic
1.0
100
10
T J =25°C
1
0.7
0.8
0.9
1.0
1.1
0.1
1.0
10
Reverse Voltage (V)
Instaneous Forward Voltage (V)
REV.08
600
Instaneous Reverse Voltage (V)
Ambient Temperature (°C)
0.5
0.6
400
200
2 of 3
100
S2AF THRU S2MF
PACKAGE OUTLINE
Plastic surface mounted package; 2 leads
SMAF
∠ALL ROUND
C
A
∠ALL ROUND
HE
VM
g
Top View
mil
Bottom View
A
C
D
E
e
g
HE
max
1.1
0.20
3.7
2.7
1.6
1.2
4.9
min
0.9
0.12
3.3
2.4
1.3
0.8
4.4
max
43
7.9
146
106
63
47
193
min
35
4.7
130
94
51
31
173
UNIT
mm
g
pad
e
E
A
pad
D
E
A
7°
The recommended mounting pad size
2.2
(86 )
1.6
(63 )
1.8
(71 )
1.6
(63 )
Unit: mm
(mil)
REV.08
∠
3 of 3
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