H48-2K
Thermal Conductive Pad
Version 3.030220
Thermal Conductive Pad
H48-2K is an ultra thin, silicon based gap filler which is designed for applications
which require a high dielectric breakdown voltage combined with ultra low silicone
outgassing. H48-2K is available in various formats such as standard sheets or custom
die cuts to support both prototyping and high volume manufacturing.
Features
Good thermal conductivity
Ultra-soft and high compressibility
Natural tack
Easy to assemble
Good insulator
Shock and vibration absorber
Applications
Electronic components: IC, CPU, MOS
LED, M/B, P/S, Heat Sink
LCD, TV, Notebook PC, PC Telecom Device, Wireless Hub, etc.
DDR II Module, DVD Applications, Hand-set applications, etc.
Properties
REACH Compliant
ROHS Compliant
Property
H48-2K
Unit
Tolerance
Test Method
Colour
Dark Red
-
-
Visual
0.1/0.2/0.3
mm
-
-
0.004/0.008/0.01
inch
-
-
Optimal Temperature Range
-45 to 200
°C
-
-
Density
2.4
g/cm³
±0.2
ASTM D792
Thermal Conductivity
2.2
W/mK
±0.2
ASTM D5470
Flammability Rating
V-0
-
-
UL 94
Dielectric Breakdown Voltage
1.2/2.5/3.5
kV
±0.1/±0.2/±0.3
ASTM D149
Hardness
85
Shore A
±5
ASTM D2240
Volume Resistance
>1011
Ohm-m
-
ASTM D257
Elongation
50
%
-
ASTM D412
Shelf Life
36
months
-
-
Shelf Life with adhesive
(can be requalified for a
further 12)
12
months
-
-
Thickness
Thermal Impedance vs Pressure vs Deflection
T-Global Technology Limited
1 & 2 Cosford Business Park, Central Park,
Lutterworth, Leicestershire LE17 4QU U.K.
Tel: +44 (0)1455 553 510
Email: sales@tglobaltechnology.com
Web: www.tglobaltechnology.com
VAT #: GB 116 662 714
H48-2K
Thermal Conductive Pad
Standard Weights & Dimensional Tolerance
Weights (g)
Size
Thickness (mm)
0.10
0.20
0.30
100x100
2.10
4.20
6.30
150x150
4.73
9.45
14.18
300x300
18.90
37.80
56.70
320x320
21.50
43.01
64.51
Data
Die-Cut
Thickness
Tolerances
Thickness (mm)
Tolerance (mm)
0.3
±0.03
0.5
±0.05
0.8
±0.08
1.0
±0.1
1.2
±0.12
1.5
±0.15
2.0
±0.2
2.5 - 3.5
±0.25
4.0 - 4.5
±0.3
5.0
±0.35
6.0 - 8.0
±0.4
9.0
±0.45
10.0
±0.5
>10.0
±0.5
* Data for design engineer guidance only. Observed performance varies in application. Engineers are reminded to test the material in application.
NOTICE: The information contained herein is to the best of our knowledge true and accurate. However, since the varied conditions of potential use are beyond our
control, all recommendations or suggestions are presented without guarantee or responsibility on our part and users should make their own test to determine the
suitability of our products in any specific situation. This product is sold without warranty either expressed or implied, of fitness for a particular purpose or otherwise,
except that this product shall be of standard quality, and except to the extent otherwise stated in T-Global Technology Europe and North America’s invoice, quotation,
or order acknowledgment. We disclaim any and all liabilities incurred in connection with the use of information contained herein, or otherwise. All risks of such are
assumed by the user. Furthermore, nothing contained herein shall be construed as a recommendation to use any process or to manufacture or to use any product in
conflict with existing or future patents covering any product or material or its use.
Tel: +44 (0)1455 553 510 Email: sales@tglobaltechnology.com Web: www.tglobaltechnology.com
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