SS34A

SS32A THRU SS320A 3.0 A Surface Mount Schottky Barrier Rectifiers - 20V-200V Features Package outline The plastic package carries Underwriters Laboratory Flammability Classification 94V-0 For surface mounted applications Metal silicon junction,majority carrier conduction Low power loss,high efficiency Built-in strain relief,ideal for automated placement High forward surge current capability High temperature soldering guaranteed: 250 C/10 seconds at terminals Compliant to RoHS Directive 2011/65/EU SMA/DO-214AC 0.108(2.75) 0.096(2.45) 0.067 (1.70) 0.051 (1.30) 0.177(4.50) 0.157(3.99) 0.012(0.305) 0.006(0.152) Mechanical data 0.096(2.42) 0.078(1.98) Case: JEDEC DO-214AC molded plastic body Terminals: Solder plated, solderable per MIL-STD-750, Method 2026 Polarity: Color band denotes cathode end Mounting Position: Any 0.060(1.52) 0.030(0.76) 0.008(0.203)MAX. 0.208(5.28) 0.188(4.80) Dimensions in inches and (millimeters) Maximum ratings and Electrical Characteristics (AT T A=25 oC unless otherwise noted) SYMBOLS SS32A SS33A SS34A SS35A SS36A SS38A SS310A SS315A SS320A UNITS Maximum repetitive peak reverse voltage Maximum RMS voltage Maximum DC blocking voltage Maximum average forward rectified current at TL(see fig.1) Peak forward surge current 8.3ms single half sine-wave superimposed on rated load Maximum instantaneous forward voltage at 3.0A Maximum DC reverse current TA=25 C at rated DC blocking voltage TA=100 C Typical junction capacitance (NOTE 1) Typical thermal resistance (NOTE 2) Operating junction temperature range Storage temperature range VRRM VRMS VDC 20 14 20 30 21 30 40 28 40 50 35 50 60 42 60 80 56 80 100 70 100 150 200 105 150 140 200 V V V I(AV) 3.0 A IFSM 80.0 A VF 0.85 0.95 0.1 0.5 10.0 IR CJ RθJA TJ, TSTG 0.70 0.55 5.0 450 70 -55 to +125 -55 to +150 -55 to +150 2.0 V mA pF C/W C C Note:1.Measured at 1MHz and applied reverse voltage of 4.0V D.C. 2.P.C.B. mounted with 2.0x2.0”(5.0x5.0cm) copper pad areas www.fuxinsemi.com Page 1 Ver2.1 SS32A THRU SS320A 3.0 A Surface Mount Schottky Barrier Rectifiers - 20V-200V FIG. 1- FORWARD CURRENT DERATING CURVE 3.0 2.4 Single Phase Half Wave 60Hz Resistive or inductive Load 1.8 P.C.B mounted on 0.2*0.2"(5.0*5.0mm) copper pad areas 1.2 SS32A-SS345A SS35A-SS320A 0.6 0 0 25 50 75 100 125 150 FIG. 2-MAXIMUM NON-REPETITIVE PEAK FORWARD SURGE CURRENT PEAK FORWARD SURGE CURRENT, AMPERES AVERAGE FORWARD RECTIFIED CURRENT, AMPERES Rating and characteristic curves 100 80 60 40 20 175 0 8.3ms SINGLE HALF SINE-WAVE (JEDEC Method) 1 10 LEAD TEMPERATURE, C NUMBER OF CYCLES AT 60 Hz 50 INSTANTANEOUS FORWARD CURRENT,AMPERES TJ=25 C 10.0 1 SS32A-SS345A SS35A-SS36A SS38A-SS310A SS315A-SS320A FIG. 4-TYPICAL REVERSE CHARACTERISTICS INSTANTANEOUS REVERSE CURRENT, MILLIAMPERES FIG. 3-TYPICAL INSTANTANEOUS FORWARD CHARACTERISTICS 0.1 100 10 TJ=100 C 1 TJ=75 C 0.1 0.01 TJ=25 C 0.001 0.2 0.4 0.6 0.8 1.0 1.2 1.4 20 40 60 80 100 1.6 INSTANTANEOUS FORWARD VOLEAGE, VOLTS FIG. 5-TYPICAL JUNCTION CAPACITANCE JUNCTION CAPACITANCE, pF 0 PERCENT OF PEAK REVERSE VOLTAGE,% 0 2000 1000 TJ=25 C 100 SS32A-SS345A SS35A-SS320A TRANSIENT THERMAL IMPEDANCE, C/W 0.01 100 FIG. 6-TYPICAL TRANSIENT THERMAL IMPEDANCE 100 10 1 0.1 0.01 0.1 1 10 100 10 0.1 1.0 10 100 REVERSE VOLTAGE,VOLTS www.fuxinsemi.com t,PULSE DURATION,sec. Page 2 Ver2.1 SS32A THRU SS320A 3.0 A Surface Mount Schottky Barrier Rectifiers - 20V-200V Pinning information Pin Pin1 Pin2 Simplified outline cathode anode 1 Symbol 2 1 2 Marking Type number Marking code Example SS32 SS34 SS345 SS35 SS36 SS38 SS310 SS315 SS320 SS34 SS32A SS34A SS345A SS35A SS36A SS38A SS310A SS315A SS320A Marking code Suggested solder pad layout C A B Dimensions in inches and (millimeters) www.fuxinsemi.com PACKAGE A B C SMA 0.110 (2.80) 0.063 (1.60) 0.087 (2.20) Page 3 Ver2.1 SS32A THRU SS320A 3.0 A Surface Mount Schottky Barrier Rectifiers - 20V-200V Suggested thermal profiles for soldering processes 1.Storage environment: Temperature=5 oC ~40 oC Humidity=55%±25% 2.Reflow soldering of surface-mount devices Critical Zone TL to TP Tp TP Ramp-up TL TL Tsmax Temperature Tsmin tS Preheat Ramp-down 25 o t25 C to Peak Time 3.Reflow soldering Profile Feature Soldering Condition Average ramp-up rate(T L to T P ) o