WSD6036DN
N-Ch MOSFET
General Description
Product Summery
The WSD6036DN is the highest performance
trench N-Ch MOSFET with extreme high cell
density,which provide excellent RDSON and gate
charge for most of the synchronous buck
converter applications .
BVDSS
RDSON
60V
12mΩ
ID
50A
Applications
Secondary Side Synchronous Rectification
The WSD6040DN56 meet the RoHS and Green
Product requirement 100% EAS guaranteed with full
function reliability approved.
DC-DC Converter
Motor Control
Load Switching
Features
Lead Fre e an d Green Devices Available
DFN3x3-8_EP1 Pin Configuration
(RoH SCom plia nt)
100% UIS + Rg Tested
Reliable and Rugged
Moistu re Sensitivity Level MSL1
(per JED EC J-STD-020D)
Absolute Maximum Ratings @TA=25℃ unless otherwise noted
Parameter
Symbol
Rating
Units
VDS
Drain-Source Voltage
60
V
VGS
Gate-Source Voltage
±20
V
Continuous Drain Current
ID
IDM a
PD
Pulsed Drain Current
Maximum Power Dissipation
TC=25°C
50
TC=100°C
30
TC=25°C
90
TC=25°C
45
TC=100°C
18
A
A
W
Single Pulse Avalanche Energy
L=0.1mH
39.2
mJ
IS
Diode Continuous Forward Current
TC=25°C
50
A
TJ
Maximum Junction Temperature
150
℃
-55 to 150
℃
EAS c
TSTG
b
Storage Temperature Range
RθJA
Thermal Resistance Junction to ambient
Steady State
62
℃/W
RθJC
Thermal Resistance-Junction to Case
Steady State
3.3
℃/W
Note a:Pulse width limited by max. junction temperature.
Note b:Surface Mounted on 1in2 pad area.
Note c:UIS tested and pulse width limited by maximum junction temperature 150℃(initial temperature Tj=25℃).
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Page 1
Rev1.1 Mar.2022
WSD6036DN
N-Ch MOSFET
Electrical Characteristics @TA=25℃ unless otherwise noted
Symbol
Conditions
Parameter
Min. Typ. Max.
Unit
Static
V(BR)DSS
IDSS
IGSS
Drain-Source Breakdown Voltage
Zero Gate Voltage Drain Current
Gate Leakage Current
VGS = 0V, ID = 250μA
60
V
VDS = 48 V, VGS = 0V
1
TJ=85°C
30
VGS = ±20V, VDS = 0V
µA
±100
nA
1.6
2.5
V
VGS = 10V, ID = 25A
14
17.5
mΩ
VGS = 4.5V, ID = 20A
19
22
mΩ
On Characteristics
VGS(TH)
RDS(on)d
Gate Threshold Voltage
Drain-Source On-state Resistance
VGS = VDS, IDS = 250µA
1
Switching
Qg
Total Gate Charge
Qgs
Gate-Sour
Qgd
Gate-Drain Charge
td (on)
tr
td(off)
VDS=30V
VGS=10V
ID=25A
Charge
Turn-on Delay Time
VGEN=10V
VDD=30V
ID=1A
RG=6Ω
RL=30Ω
Turn-on Rise Time
Turn-off Delay Time
tf
Turn-off Fall Time
Rg
Gat resistance
VGS=0V, VDS=0V, f=1MHz
42
nC
6.4
nC
9.6
nC
17
ns
9
ns
58
ns
14
ns
1.5
Ω
2100
pF
140
pF
100
pF
Dynamic
Ciss
In
Capacitance
Coss
Out
Crss
Reverse Transfer Capacitance
VGS=0V
VDS=30V
f=1MHz
Capacitance
Drain-Source Diode Characteristics and Maximum Ratings
IS
Continuous Source Current
ISM
Pulsed Source Current3
VSD d
Diode Forward Voltage
trr
Reverse Recovery Time
Qrr
Reverse Recovery Charge
VG=VD=0V , Force Current
ISD = 20A , VGS=0V
ISD=25A, dlSD/dt=100A/µs
0.8
18
A
35
A
1.3
V
27
ns
33
nC
Note d:Pulse test ; pulse width≤300µs, duty cycle≤2%.
Note e:Guaranteed by design, not subject to production testing.
www.winsok.tw
Page 2
Rev1.1 Mar.2022
WSD6036DN
N-Ch MOSFET
Typical Operating Characteristics
Figure1: Output Characteristics
Figure 2: Typical Transfer Characteristics
Figure 3:On-resistance vs. Drain Current
Figure 4: Body Diode Characteristics
Figure 5: Gate Charge Characteristics
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Figure 6: Capacitance Characteristics
Page 3
Rev1.1 Mar.2022
WSD6036DN
N-Ch MOSFET
Typical Operating Characteristics
Figure 7: Normalized Breakdown Voltage vs
Junction Temperature
Figure 8: Normalized on Resistance vs.
Junction Temperature
Figure 9: Maximum Safe Operating Area
Figure 10: Maximum Continuous Drain Current
vs. Ambient Temperature
Figure.11: Maximum Effective Transient Thermal
Impedance, Junction-to-Ambien
www.winsok.tw
Page 4
Rev1.1 Mar.2022
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