APT50GN120B2(G)
1200V
TYPICAL PERFORMANCE CURVES
APT50GN120B2
APT50GN120B2G*
®
*G Denotes RoHS Compliant, Pb Free Terminal Finish.
Utilizing the latest Non-Punch Through (NPT) Field Stop technology, these IGBT’s
have a very short, low amplitude tail current and low Eoff. The Trench Gate design
results in superior VCE(on) performance. Easy paralleling results from very tight
parameter distribution and slightly positive VCE(on) temperature coefficient. Built-in
gate resistance ensures ultra-reliable operation. Low gate charge simplifies gate drive
design and minimizes losses.
T-MaxTM
G
C
E
• 1200V NPT Field Stop
•
•
•
•
Trench Gate: Low VCE(on)
Easy Paralleling
10µs Short Circuit Capability
Intergrated Gate Resistor: Low EMI, High Reliability
C
G
E
Applications: Welding, Inductive Heating, Solar Inverters, SMPS, Motor drives, UPS
MAXIMUM RATINGS
Symbol
All Ratings: TC = 25°C unless otherwise specified.
Parameter
APT50GN120B2(G)
VCES
Collector-Emitter Voltage
1200
VGE
Gate-Emitter Voltage
±30
I C1
Continuous Collector Current
I C2
Continuous Collector Current @ TC = 110°C
I CM
Pulsed Collector Current
SSOA
PD
TJ,TSTG
TL
1
8
@ TC = 25°C
UNIT
Volts
134
66
Amps
150
@ TC = 150°C
150A @ 1200V
Switching Safe Operating Area @ TJ = 150°C
543
Total Power Dissipation
Operating and Storage Junction Temperature Range
Watts
-55 to 150
Max. Lead Temp. for Soldering: 0.063" from Case for 10 Sec.
°C
300
STATIC ELECTRICAL CHARACTERISTICS
Collector-Emitter Breakdown Voltage (VGE = 0V, I C = 400µA)
VGE(TH)
Gate Threshold Voltage
VCE(ON)
I CES
Collector-Emitter On Voltage (VGE = 15V, I C = 50A, Tj = 25°C)
RGINT
Intergrated Gate Resistor
5.8
6.5
1.4
1.7
2.1
2
Collector Cut-off Current (VCE = 1200V, VGE = 0V, Tj = 125°C)
Gate-Emitter Leakage Current (VGE = ±20V)
5
Units
Volts
1.9
Collector-Emitter On Voltage (VGE = 15V, I C = 50A, Tj = 125°C)
I GES
MAX
1200
(VCE = VGE, I C = 2mA, Tj = 25°C)
Collector Cut-off Current (VCE = 1200V, VGE = 0V, Tj = 25°C)
TYP
100
2
600
4
CAUTION: These Devices are Sensitive to Electrostatic Discharge. Proper Handling Procedures Should Be Followed.
APT Website - http://www.advancedpower.com
µA
TBD
nA
Ω
10-2005
V(BR)CES
MIN
Rev C
Characteristic / Test Conditions
050-7602
Symbol
APT50GN120B2(G)
DYNAMIC CHARACTERISTICS
Symbol
Test Conditions
Characteristic
Cies
Input Capacitance
Coes
Output Capacitance
Cres
Reverse Transfer Capacitance
VGEP
Gate-to-Emitter Plateau Voltage
3
3600
VGE = 0V, VCE = 25V
210
f = 1 MHz
170
Gate Charge
9.5
VGE = 15V
315
Total Gate Charge
Qge
Gate-Emitter Charge
Qgc
Gate-Collector ("Miller ") Charge
I C = 50A
SSOA
Switching Safe Operating Area
TJ = 150°C, R G = 2.2Ω 7, VGE =
VCE = 600V
15V, L = 100µH,VCE = 1200V
Short Circuit Safe Operating Area
VCC = 960V, VGE = 15V,
TJ = 125°C, R G = 2.2Ω 7
td(on)
tr
td(off)
tf
Eon1
Eon2
Turn-on Delay Time
Turn-off Switching Energy
td(on)
Turn-on Delay Time
tr
td(off)
tf
TBD
TJ = +25°C
Inductive Switching (125°C)
28
VCC = 800V
27
VGE = 15V
395
RG = 2.2Ω 7
205
TBD
I C = 50A
Current Fall Time
44
Turn-on Switching Energy
Turn-on Switching Energy (Diode)
µJ
3900
4495
Turn-off Delay Time
Turn-off Switching Energy
115
RG = 2.2Ω 7
Current Rise Time
Eon2
ns
320
6
Eon1
Eoff
µs
I C = 50A
Turn-on Switching Energy (Diode)
Eoff
nC
10
27
5
V
A
VGE = 15V
4
pF
150
VCC = 800V
Current Fall Time
UNIT
190
28
Turn-off Delay Time
MAX
20
Inductive Switching (25°C)
Current Rise Time
Turn-on Switching Energy
TYP
Capacitance
Qg
SCSOA
MIN
55
TJ = +125°C
ns
5660
66
µJ
6795
THERMAL AND MECHANICAL CHARACTERISTICS
Symbol
Characteristic
MIN
TYP
MAX
RθJC
Junction to Case (IGBT)
.23
RθJC
Junction to Case (DIODE)
N/A
WT
Package Weight
5.9
UNIT
°C/W
gm
1 Repetitive Rating: Pulse width limited by maximum junction temperature.
2 For Combi devices, Ices includes both IGBT and FRED leakages
3 See MIL-STD-750 Method 3471.
4 Eon1 is the clam ped inductive turn-on-energy of the IGBT only, without the effect of a commutating diode reverse recovery current
adding to the IGBT turn-on loss. (See Figure 24.)
10-2005
8 Continuous current limited by package lead temperature.
050-7602
6 Eoff is the clamped inductive turn-off energy measured in accordance with JEDEC standard JESD24-1. (See Figures 21, 23.)
7 RG is external gate resistance, not including RGint nor gate driver impedance.
Rev C
5 Eon2 is the clamped inductive turn-on energy that includes a commutating diode reverse recovery current in the IGBT turn-on switching
loss. (See Figures 21, 22.)
APT Reserves the right to change, without notice, the specifications and information contained herein.
TYPICAL PERFORMANCE CURVES
15V
15V
140
80
10V
60
9V
40
8V
20
7V
0
2
4
6
8
10
12
VCE, COLLECTER-TO-EMITTER VOLTAGE (V)
0
IC, COLLECTOR CURRENT (A)
120
TJ = 125°C
100
TJ = 25°C
80
TJ = -55°C
60
40
20
0
0
10V
60
9V
40
8V
20
7V
0
2
4
6
8
10
12
14
VCE, COLLECTER-TO-EMITTER VOLTAGE (V)
FIGURE 2, Output Characteristics (TJ = 125°C)
16
VGE, GATE-TO-EMITTER VOLTAGE (V)
250µs PULSE
TEST
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