ATSAMR21G18-MR210UAT

802.15.4 ATSAMR21G18-MR210UA DATASHEET PRELIMINARY Description The ATSAMR21G18-MR210UA is a 20mm x 19mm wireless module with a solder mount footprint. It integrates an ATSAMR21G18 IC together with a serial flash and a crypto authentication device. Features • • • • • • • • • • ATSAMR21G18 system in package ® ® – Single-chip ARM Cortex -M0+ based 32-bit Microcontroller – Low power 2.4GHz transceiver for IEEE 802.15.4 and ZigBee applications – 256KB Flash – Maximum Operating Frequency: 48 MHz – 128-bit AES crypto engine – 32-bit MAC symbol counter – Temperature sensor – Automatic transmission modes AT45DB041E 4-Mbit DataFlash ATECC508A CryptoAuthentication Device – Secure Hardware-based Key Storage – Performs High-Speed Public Key Algorithms – NIST Standard P256 Elliptic Curve Support – SHA-256 Hash Algorithm with HMAC Option – Guaranteed Unique 72-bit Serial Number – High-quality FIPS Random Number Generator (RNG) – Intrusion Latch for External Tamper Switch Single 1.8V - 3.6V supply Radio module with a link budget of 103dBm FCC / ETSI compliant RF front end with harmonic filter Three SERCOM units left for external applications 32.768kHz crystal oscillator High precision 16MHz crystal oscillator 12-bit, 350ksps Analog-to-Digital Converter (ADC) Atmel-42475B-ATSAMR21G18-MR210UA_Datasheet_Preliminary-09/2015 • • • • I2C up to 3.4MHz Full-speed (12Mbps) Universal Serial Bus (USB) 2.0 interface 17 external GPIO lines One GPIO for ATECC508A intrusion latch Atmel ATSAMR21G18-MR210UA [DATASHEET] Atmel-42475B-ATSAMR21G18-MR210UA_Datasheet_Preliminary-09/2015 2 Table of Contents Description.......................................................................................................................1 Features.......................................................................................................................... 1 1. Integrated Devices and Block Diagram..................................................................... 4 1.1. 1.2. Module Block Diagram................................................................................................................. 4 Integrated Peripherals.................................................................................................................. 4 1.3. RF Front End Control................................................................................................................... 5 2. Mechanical Description..............................................................................................7 2.1. 2.2. Mechanical Dimensions................................................................................................................7 Footprint and Layout Recommendation....................................................................................... 7 3. I/O Pin Assignment.................................................................................................... 9 4. Electrical Characteristics..........................................................................................11 4.1. 4.2. 4.3. Absolute Maximum Ratings........................................................................................................ 11 Recommended Operating Ratings............................................................................................. 11 Module Performance Data..........................................................................................................11 5. Non-Volatile Memory Information............................................................................ 13 6. Radio Certification................................................................................................... 14 6.1. 6.2. 6.3. 6.4. United States (FCC)................................................................................................................... 14 Europe (ETSI).............................................................................................................................14 Industry Canada (IC) Compliance Statements...........................................................................15 Approved Antennas....................................................................................................................16 7. Boot Loader............................................................................................................. 17 8. Ordering Information................................................................................................18 9. References.............................................................................................................. 19 10. Revision History.......................................................................................................20 1. Integrated Devices and Block Diagram 1.1. Module Block Diagram Figure 1-1 Module Block Diagram ATSAMR21G18-MR210UA AT45DB041E U.Fl 50Ohm SPI 4-Mbit DataFlash ATSAMR21G18 ARM® Cortex®-M0+ Balun & Harmonic Filter Antenna Diversity Switch ATECC508 CryptoAuthentication Device U.Fl 50Ohm SWI 17 GPIO 1 GPIO 1.2. Integrated Peripherals 1.2.1. Serial Flash Interconnection Table 1-1 Serial Flash Interconnection DataFlash Signal MCU Function MCU Pin Port and SERCOM Configuration SO MISO 37 PA22 SERCOM5 PAD[2] DIPO=0x2 SI MOSI 38 PA23 SERCOM5 PAD[3] DOPO=0x2 SCK SCK 48 PB03 SERCOM5 PAD[1] DOPO=0x2 #CS GPIO 47 PB02 to be set low in software before SPI access The signals in this table are not available as module I/O. More information about the FLASH IC can be found in its related datasheet [ADESTO]. 1.2.2. UART with Hardware Flow Control (RTS/CTS) For an Application where the ADC is not in use, SERCOM0 can be multiplexed as shown in the table below. Table 1-2 UART with Hardware Flow Control (RTS/CTS) Module Pin MCU Function MCU Pin Port and SERCOM Configuration 14 UART TX 15 SERCOM0; MUX=C; PAD[0] TXPO=0x2 25 UART RX 10 SERCOM0; MUX=D; PAD[1] RXPO=0x1 Atmel ATSAMR21G18-MR210UA [DATASHEET] Atmel-42475B-ATSAMR21G18-MR210UA_Datasheet_Preliminary-09/2015 4 Module Pin MCU Function MCU Pin Port and SERCOM Configuration 26 UART RTS 11 SERCOM0; MUX=D; PAD[2] TXPO=0x2 13 UART CTS 12 SERCOM0; MUX=D; PAD[3] TXPO=0x2 The signals in this table are not available as module IO. More information about the FLASH IC can be found in its related datasheet. (ADESTO) 1.2.3. 32kHz Crystal PA00 and PA01 are used for the 32kHz crystal. This pins are not available as module IO. 1.2.4. SAM R21 USB Availability The USB pins are made available as differential pair routed GPIO’s. A base board with the required connection hardware can support an USB interface. Table 1-3 SAM R21 USB Availability Module Pin Function MCU Pin Port Configuration or Xplain Function 19 GPIO or USB_D+ 33 PA24: For USB MUX=G 20 SPIO or USB_D- 34 PA25: For USB MUX=G The module power supply can’t be operated directly from a 5V USB source. The module base board has to implement the required voltage regulator. 1.3. RF Front End Control The antenna diversity signals ANT_DIV_P/N are used to control the diversity switch U4. The signal ANT_DIV_P is available at the IO ring pin 18 to indicate the antenna currently in use. In addition at pin 17, the RX_TX indicator signal is available to indicate if the module is currently in transmit mode. Atmel ATSAMR21G18-MR210UA [DATASHEET] Atmel-42475B-ATSAMR21G18-MR210UA_Datasheet_Preliminary-09/2015 5 Table 1-4 RF Front End Control RF Front End Signal MCU Function MCU Pin ANT_DIV_P FECTRL2 21 Port and SERCOM Configuration PA12; MUX=F; F3CFG=DIG1 Available at module pin 18 ANT_DIV_N FECTRL1 16 PA09; MUX=F; F1CFG=DIG2 FEM_RX_TX FECTRL3 22 PA13; MUX=F; F0CFG=DIG3 for High active TX indication F0CFG=DIG4 for Low active TX indication Available at module pin 17 Atmel ATSAMR21G18-MR210UA [DATASHEET] Atmel-42475B-ATSAMR21G18-MR210UA_Datasheet_Preliminary-09/2015 6 2. Mechanical Description 2.1. Mechanical Dimensions Dimensions are in mm. The module pins are arranged with a 1mm pitch distance. The module is designed in a symmetric way. Figure 2-1 Module Bottom Dimensions ( Seen from a CAD top perspective ) The module can be mounted to a base board with a soldered RF connection. For this case one or both U.Fl connectors are left unconnected and the RF pads on the bottom side are used to feed an antenna located on the base board. 2.2. Footprint and Layout Recommendation Since the module does not contain an antenna, the module does not set any limits for the base board material selection or the board stack-up construction. The module does also not require a certain positioning on the board in relation to the board edge. The module must be placed away from interference sources on the base board like clock oscillators or step converters. The area underneath the module must be filled with a grounded copper plane. The RF-Pad area needs special attention. The following sections provide more information on that. A typical design is supposed to connect the I/O ring to the base board while the antenna feeds are using the U.Fl connectors. Using the antennas in Approved Antennas on page 16, the modular approval for the final product can be used without re-certification. 2.2.1. Design without RF-Pads For a design without U.Fl connected antennas, the base board design has to have no copper fill within the RF-Pad area (*!). All layers with less than 0.5mm distance from top shall not be filled with copper underneath the RF-Pad area. Atmel ATSAMR21G18-MR210UA [DATASHEET] Atmel-42475B-ATSAMR21G18-MR210UA_Datasheet_Preliminary-09/2015 7 For all other I/O pads the geometry in below figure should be used. Figure 2-2 Recommended Base Board Layout 2.2.2. Design without RF-Pads For applications where the antenna is implemented on the base PCB, the RF-Pads can be used to connect the RF signals. The pad layout is available in Figure 2-2 Recommended Base Board Layout on page 8. The base board traces shall be designed with a line impedance of 50Ohm. Depending on the base board stack construction a microstrip or a grounded coplanar design can be implemented. The best choice will be the line type with the best match in between line width and the 0.8mm pad width. For all other IO pads the geometry in Figure 2-2 Recommended Base Board Layout on page 8 should be used. Atmel ATSAMR21G18-MR210UA [DATASHEET] Atmel-42475B-ATSAMR21G18-MR210UA_Datasheet_Preliminary-09/2015 8 3. I/O Pin Assignment The module pin assignment is shown in below table. The Column "MCU pin" is referring to the ATSAMR21G18 datasheet [SAMR21]. The column “Port Configuration” is intended to help determine the required SAMR21 port configuration.. Table 3-1 RF Front End Control Module Pin Function MCU Pin Port Configuration 1 GND 2 GND 3 VCC 4 VCC 5 RSTN 40 6 SPI_CS 26 SERCOM1; MUX=C; DOPO=0x1; Master PAD1 7 SPI_MOSI 27 SERCOM1; MUX=C; DOPO=0x1 Master PAD2 For slave operation this pin is MISO 8 SPI_MISO 25 SERCOM1; MUX=C; DIPO=0x0 Master PAD0 For slave operation this pin is MOSI 9 SPI_SCLK 28 SERCOM1; MUX=C; DOPO=0x1 Master PAD3 10 GPIO 41 PA28 (Yellow LED; low active) 11 - 12 GND 13 RXD1 Not connected 12 SERCOM0; MUX=D; PAD[3] RXPO=0x3 Can be used for UART with RTS/CTS 14 TXD1 15 SERCOM0; MUX=C; PAD[0] TXPO=0x0 Can be used for UART with RTS/CTS 15 - Not connected 16 - Not connected 17 FEM_RX_TX 22 PA13; MUX=F; FECTRL3 (LED red) 18 ANT_DIV_P 21 PA12; MUX=F; FECTRL2 (LED green) 19 GPIO/USB_DM 33 PA24 for USB MUX=G 20 GPIO/USB_DP 34 PA25 for USB MUX=G 21 - 22 RXD0 24 SERCOM2; MUX=C; PAD[3]; RXPO=0x3 23 TXD0 23 SERCOM2; MUX=C; PAD[2]; TXPO=0x1 Not connected Atmel ATSAMR21G18-MR210UA [DATASHEET] Atmel-42475B-ATSAMR21G18-MR210UA_Datasheet_Preliminary-09/2015 9 Module Pin Function MCU Pin Port Configuration 24 AREF 9 MUX=B; disable digital 25 ADC0 10 MUX=B; AIN[1]; disable digital Can be used for UART with RTS/CTS 26 ADC1 11 MUX=B; AIN[2]¸ disable digital Can be used for UART with RTS/CTS 27 - Not connected 28 - Not connected 29 GND 30 SWCLK 45 Programming interface 31 SWDIO 46 Programming interface 32 - 33 ATECC508 GPIO 34 - Not connected 35 - Not connected 36 I2C SCL 32 SERCOM3 PAD1 MUX=C 37 I2C SDA 31 SERCOM3 PAD0 MUX=C 38 - Not connected 39 - Not connected 40 - Not connected 41 GND 42 GND Not connected Crypto IC GPIO with intrusion detection feature Atmel ATSAMR21G18-MR210UA [DATASHEET] Atmel-42475B-ATSAMR21G18-MR210UA_Datasheet_Preliminary-09/2015 10 4. Electrical Characteristics This section will outline the main parameters required to build applications. The module characteristics are determined by the implemented parts. See References on page 19 for required datasheet references. 4.1. Absolute Maximum Ratings Table 4-1 Absolute Maximum Ratings Symbol Parameter Min. Typ. Max. Unit TSTOR Storage temperature -40 +125 VPIN Pin voltage with respect to GND and VDD GND-0.3V VDD+0.3V V VESD ESD robustness PRF 4.2. Condition Modules I/O's routed to SAM R21 Human Body Model °C 4 kV Charged 550 Device Model V Input RF level +10 dBm Recommended Operating Ratings Table 4-2 Recommended Operating Ratings 4.3. Symbol Parameter Condition TOP Operating temperature range VDD Supply voltage Min. Typ. Max. Unit -40 85 °C 1.8 3.6 V Module Performance Data If not otherwise stated the measurements are done with VDD=3.3V at 25°C. Table 4-3 Module Performance Data Symbol Parameter Condition Min. Typ. Max. Unit IDD Supply current MCU at TBD MHz(1) 4 With transceiver in RX_ON state 10 With transceiver in TX state 10 PRF RF transmit power U.Fl interface Pemit Radiated transmit power Using antenna ANT-24G-S21-P5FL(2) Using antenna 2 M07-FL(3) mA 3.5 3.5 dBm 8 8 Atmel ATSAMR21G18-MR210UA [DATASHEET] Atmel-42475B-ATSAMR21G18-MR210UA_Datasheet_Preliminary-09/2015 dBm EIRP 11 Symbol Parameter Condition Min. Typ. Max. Unit PSPUR_TX Transmitter spurious emissions U.Fl connector, conducted, >2.5GHz PSENS Receiver sensitivity U.Fl interface -98 dBm dod Outdoor range Using antenna ANT-24G-S21-P5FL TBD m ANT-24G-S21-P5FL in Ch26(2) TBD Using antenna M07-FL TBD M07-FL in Ch26(3) TBD fRef_0 -50 Reference crystal deviation T = 25°C default XTAL_TRIM setting T = 25°C NV memory XTAL_TRIM setting -5 +5 fRef_T Reference crystal drift over temperature -40°C