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LAN8841/Q2A

LAN8841/Q2A

  • 厂商:

    ACTEL(微芯科技)

  • 封装:

    VQFN64_8X8MM

  • 描述:

    以太网芯片 支持GMII/MII/RGMII和IEEE 1588v2的千兆以太网收发器 VQFN64_8X8MM

  • 数据手册
  • 价格&库存
LAN8841/Q2A 数据手册
LAN8841 Gigabit Ethernet Transceiver with GMII/MII/ RGMII and IEEE 1588v2 Support Features • Single-Chip 10/100/1000 Mbps Ethernet Transceiver Suitable for IEEE 802.3 Applications • GMII/MII Standard Interface with 3.3V/2.5V/1.8V Tolerant I/Os • RGMII with 3.3V/2.5V/1.8V Tolerant I/Os - RGMII Timing Supports On-Chip Delay According to RGMII Version 2.0, with Programming Options for External Delay and Making Adjustments and Corrections to TX and RX Timing Paths • Auto-Negotiation to Automatically Select the Highest Link-Up Speed (10/100/1000 Mbps) and Duplex (Half/Full) • On-Chip Termination Resistors for the Differential Pairs • On-Chip LDO Controller to Support Single 3.3V Supply Operation • Jumbo Frame Support Up to 16 KB • 125 MHz Reference Clock Output • Energy-Detect Power-Down Mode for Reduced Power Consumption When Cable is Not Attached • EtherSynch® IEEE 1588v2/PTP - Layer 2, UDP/IPv4 and UDP/IPv6 formats - Tagged and non-tagged frame formats - One-step and two-step modes of operation • Energy Efficient Ethernet (EEE) Support with Low-Power Idle (LPI) Mode and Clock Stoppage for 100BASE-TX/1000BASE-T and Transmit Amplitude Reduction with 10BASE-Te Option • Wake-On-LAN (WOL) Support with Robust Custom-Packet Detection • Programmable LED Outputs for Link, Activity, and Speed • Baseline Wander Correction • LinkMD® TDR-based Cable Diagnostic to Identify Faulty Copper Cabling • Signal Quality Indication • Parametric NAND Tree Support to Detect Faults Between Chip I/Os and Board • Loopback Modes for Diagnostics • Automatic MDI/MDI-X Crossover to Detect and Correct Pair Swap at All Speeds of Operation • Automatic Detection and Correction of Pair Swaps, Pair Skew, and Pair Polarity • MDC/MDIO Management Interface for PHY Register Configuration  2022 Microchip Technology Inc. and its subsidiaries • Interrupt Pin Option • Power-Down and Power-Saving Modes • Operating Voltages - Core (VDD, VDDAL, VDDAL_PLL) - VDD I/O (VDDIO): 3.3V, 2.5V, or 1.8V - Transceiver (VDDAH): 3.3V or 2.5V • Available in commercial (0°C to +70°C) and extended industrial (-40°C to +105°C) temperature ranges • 64-pin VQFN (8 mm × 8 mm) Package Target Applications • • • • • • • • • • • • Industrial Control Laser/Network Printer Network Attached Storage (NAS) Network Server Broadband Gateway Gigabit SOHO/SMB Router IPTV IP Set-Top Box Game Console IP Camera Triple-Play (Data, Voice, Video) Media Center Media Converter DS00004726A-page 1 LAN8841 TO OUR VALUED CUSTOMERS It is our intention to provide our valued customers with the best documentation possible to ensure successful use of your Microchip products. To this end, we will continue to improve our publications to better suit your needs. Our publications will be refined and enhanced as new volumes and updates are introduced. If you have any questions or comments regarding this publication, please contact the Marketing Communications Department via E-mail at docerrors@microchip.com. We welcome your feedback. Most Current Data Sheet To obtain the most up-to-date version of this data sheet, please register at our Worldwide Web site at: http://www.microchip.com You can determine the version of a data sheet by examining its literature number found on the bottom outside corner of any page. The last character of the literature number is the version number, (e.g., DS30000000A is version A of document DS30000000). Errata An errata sheet, describing minor operational differences from the data sheet and recommended workarounds, may exist for current devices. As device/documentation issues become known to us, we will publish an errata sheet. The errata will specify the revision of silicon and revision of document to which it applies. To determine if an errata sheet exists for a particular device, please check with one of the following: • Microchip’s Worldwide Web site; http://www.microchip.com • Your local Microchip sales office (see last page) When contacting a sales office, please specify which device, revision of silicon and data sheet (include -literature number) you are using. Customer Notification System Register on our web site at www.microchip.com to receive the most current information on all of our products. DS00004726A-page 2  2022 Microchip Technology Inc. and its subsidiaries LAN8841 Table of Contents 1.0 Preface ............................................................................................................................................................................................ 4 2.0 Introduction ..................................................................................................................................................................................... 7 3.0 Pin Descriptions and Configuration ................................................................................................................................................. 8 4.0 Device Connections ...................................................................................................................................................................... 23 5.0 Functional Description .................................................................................................................................................................. 26 6.0 Operational Characteristics ........................................................................................................................................................... 75 7.0 Package Outline .......................................................................................................................................................................... 109 Appendix A: Document Revision History .......................................................................................................................................... 113 The Microchip Web Site .................................................................................................................................................................... 114 Customer Change Notification Service ............................................................................................................................................. 114 Customer Support ............................................................................................................................................................................. 114 Product Identification System ........................................................................................................................................................... 115  2022 Microchip Technology Inc. and its subsidiaries DS00004726A-page 3 LAN8841 1.0 PREFACE 1.1 General Terms TABLE 1-1: GENERAL TERMS Term Description 1000BASE-T 1 Gbps Ethernet over twisted pair, IEEE 802.3 compliant 100BASE-TX 100 Mbps Ethernet over twisted pair, IEEE 802.3 compliant 10BASE-T 10 Mbps Ethernet over twisted pair, IEEE 802.3 compliant ADC Analog-to-Digital Converter AFE Analog Front End AN, ANEG Auto-Negotiation BYTE 8-bits DA Destination Address DCQ Dynamic Channel Quality EEE Energy Efficient Ethernet FCS Frame Check Sequence FSM Finite State Machine GMII Gigabit Media Independent Interface GPIO General Purpose I/O HOST External system (Includes processor, application software, etc.) LDO Linear Drop-Out Regulator LFSR Linear Feedback Shift Register MAC Media Access Controller MAGJACK Configuration strap for power modes. MDI Medium Dependent Interface MDIX Media Independent Interface with Crossover MII Media Independent Interface MLT-3 Multi-Level Transmission Encoding (3-Levels). A tri-level encoding method where a change in the logic level represents a code bit “1” and the logic output remaining at the same level represents a code bit “0”. N/A Not Applicable OTP One Time Programmable PCS Physical Coding Sublayer PLL Phase Locked Loop POR Power on Reset. PTP Precision Time Protocol DS00004726A-page 4  2022 Microchip Technology Inc. and its subsidiaries LAN8841 TABLE 1-1: GENERAL TERMS (CONTINUED) Term Description RESERVED Refers to a reserved bit field or address. Unless otherwise noted, reserved bits must always be zero for write operations. Unless otherwise noted, values are not guaranteed when reading reserved bits. Unless otherwise noted, do not read or write to reserved addresses. RGMII Reduced Gigabit Media Independent Interface SA Source Address SFD Start of Frame Delimiter - The 8-bit value indicating the end of the preamble of an Ethernet frame SQI Signal Quality Indicator UDP User Datagram Protocol - A connectionless protocol run on top of IP networks  2022 Microchip Technology Inc. and its subsidiaries DS00004726A-page 5 LAN8841 1.2 Buffer Types TABLE 1-2: BUFFER TYPE DESCRIPTIONS BUFFER DESCRIPTION AI Analog input AO Analog output AIO Analog bidirectional ICLK Crystal oscillator input pin OCLK Crystal oscillator output pin RGMII_O RGMII compliant output VIS Variable voltage Schmitt-triggered input VO5 Variable voltage output with 5 mA sink and 5 mA source VO8 Variable voltage output with 8 mA sink and 8 mA source VOD8 Variable voltage open-drain output with 8 mA sink VOS8 Variable voltage open-source output with 8 mA source VO24 Variable voltage output with 24 mA sink and 24 mA source PU 70 KΩ (typical) internal pull-up. Unless otherwise noted in the pin description, internal pull-ups are always enabled. Note: PD 70 KΩ (typical) internal pull-down. Unless otherwise noted in the pin description, internal pulldowns are always enabled. Note: P Note: 1.3 1. 2. 3. 4. Internal pull-up resistors prevent unconnected inputs from floating. Do not rely on internal resistors to drive signals external to the device. When connected to a load that must be pulled high, an external resistor must be added. Internal pull-down resistors prevent unconnected inputs from floating. Do not rely on internal resistors to drive signals external to the device. When connected to a load that must be pulled low, an external resistor must be added. Power pin Digital signals are not 5V tolerant unless specified. Reference Documents IEEE 802.3TM-2015 IEEE Standard for Ethernet, http://standards.ieee.org/about/get/802/802.3.html IEEE 802.3bwTM-2015 IEEE Standard for Ethernet Amendment 1, https://standards.ieee.org/findstds/standard/802.3bw-2015.html Reduced Gigabit Media Independent Interface (RGMII) Specification Version 2.0, https://web.archive.org/web/20160303171328/http://www.hp.com/rnd/pdfs/RGMIIv2_0_final_hp.pdf OPEN Alliance TC1 - Advanced diagnostics features for 100BASE-T1 automotive Ethernet PHYs Version 1.0 http://www.opensig.org/download/document/218/Advanced_PHY_features_for_automotive_Ethernet_V1.0.pdf DS00004726A-page 6  2022 Microchip Technology Inc. and its subsidiaries LAN8841 2.0 INTRODUCTION 2.1 General Description The LAN8841 is a completely integrated triple-speed (10BASE-T/100BASE-TX/1000BASE-T) Ethernet physical-layer transceiver for transmission and reception of data on standard CAT-5 as well as CAT-5e and CAT-6 unshielded twisted pair (UTP) cables. The LAN8841 offers the industry-standard GMII/MII (Gigabit Media Independent Interface/Media Independent Interface) for connection to GMII/MII MACs in Gigabit Ethernet processors and switches for data transfer at 1000 Mbps or 10/100 Mbps. An optional RGMII (Reduced Gigabit Media Independent Interface) mode is also provided, allowing the device to provide additional GPIOs. The IEEE1588-2008 PTP functions provide hardware support for the IEEE Std 1588-2008 (v2) Precision Time Protocol (PTP), allowing clock synchronization with remote Ethernet devices, packet time stamping, and time driven event generation. The device supports master or slave modes for ordinary and boundary clock operations and a transparent clock per the IEEE Std 1588-2008 specification. End-to-end and peer-to-peer link delay mechanisms are supported as are one-step and two-step operations. The LAN8841 reduces board cost and simplifies board layout by using on-chip termination resistors for the four differential pairs and by integrating an LDO controller to drive a low-cost MOSFET to supply the core voltage. The LAN8841 offers diagnostic features to facilitate system bring-up and debugging in production testing and in product deployment. Parametric NAND tree support enables fault detection between LAN8841 I/Os and the board. The LinkMD® TDR-based cable diagnostic identifies faulty copper cabling. Remote, external, and local loopback functions verify analog and digital data paths. The LAN8841 is available in a 64-pin, RoHS Compliant VQFN package. FIGURE 2-1: SYSTEM BLOCK DIAGRAM 10/100/1000Mbps GMII/MII/RGMII Ethernet MAC LAN8841 MDC/MDIO MANAGEMENT INT_N / PME_N / LEDs / GPIOs SYSTEM POWER CIRCUIT / INTERUPT CONTROLLER / LEDs / GPIOs MAGNETICS GMII/MII/RGMII ON-CHIP TERMINATION RESISTORS CRYSTAL RJ-45 CONNECTOR MEDIA TYPES 10BASE-T 100BASE-TX 1000BASE-T LDO CONTROLLER VIN 3.3V, 2.5V  2022 Microchip Technology Inc. and its subsidiaries VOUT DS00004726A-page 7 LAN8841 3.0 PIN DESCRIPTIONS AND CONFIGURATION 3.1 Pin Assignments XO LDO_O TX_CLK RESET_N CLK125_NDO/GPIO6/LED_MODE VDDIO VDD INT_N/GPIO5 COL/GPIO9 MDIO MDC CRS/GPIO8 RX_CLK/RXC/MODE4 61 60 59 58 57 56 55 54 53 52 51 50 49 62 63 ISET VDDAL_P LL XI PIN ASSIGNMENTS (TOP VIEW) 64 FIGURE 3-1: VDDAH 1 48 RX_ER VDDAH 2 47 VDDIO TXRXP_A 3 46 RX_DV/RX_CTL/CLK125_EN TXRXM_A 4 45 RXD0/MODE0 VDDAL 5 44 RXD1/MODE1 VDDAL 6 43 VDD TXRXP_B 7 42 RXD2/MODE2 TXRXM_B 8 TXRXP_C 9 TXRXM_C LAN8841 41 RXD3/MODE3 40 VDDIO 10 39 RXD4/RGMII_EN VDDAL 11 38 RXD5/PHYAD4 VDDAL 12 37 RXD6/PHYAD3 TXRXP_D 13 36 RXD7 TXRXM_D 14 35 VDD VDDAH 15 34 TX_EN/TX_CTL LED5/GPIO4/ALLPHYAD/LEDPOL5 16 33 GTX_CLK/TXC 64 -VQFN ( To p Vi ew ) P_VSS 27 TXD5 32 26 TXD4 TX_ER/GPIO7 25 TXD3 31 24 TXD2 VDDIO 23 TXD1 30 22 TXD0 TXD7 21 LED1/GPIO0/PHYAD0/LEDPOL1 29 20 VDDIO TXD6 19 LED2/GPIO1/PHYAD1/LEDPOL2 28 18 LED3/GPIO2/PHYAD2/LEDPOL3 VDD 17 LED4/GPIO3/MAGJACK/LEDPOL4 Connect exposed pad to ground with a via field Note: Exposed pad (P_VSS) on bottom of package must be connected to ground with a via field Note: Configuration strap inputs are indicated with an underline Note: This pinout is preliminary and not intended for schematic use Note: PME_N, SOF_RX, SOF_TX, and 1588 event outputs are not shown since they can map to various GPIO pins DS00004726A-page 8  2022 Microchip Technology Inc. and its subsidiaries LAN8841 TABLE 3-1: LAN8841 PIN ASSIGNMENTS Pin Num Pin Name Pin Num 1 VDDAH 33 GTX_CLK/TXC 2 VDDAH 34 TX_EN/TX_CTL 3 TXRXP_A 35 VDD 4 TXRXM_A 36 RXD7 5 VDDAL 37 RXD6/PHYAD3 6 VDDAL 38 RXD5/PHYAD4 Pin Name 7 TXRXP_B 39 RXD4/RGMII_EN 8 TXRXM_B 40 VDDIO 9 TXRXP_C 41 RXD3/MODE3 10 TXRXM_C 42 RXD2/MODE2 11 VDDAL 43 VDD 12 VDDAL 44 RXD1/MODE1 13 TXRXP_D 45 RXD0/MODE0 14 TXRXM_D 46 RX_DV/RX_CTL/CLK125_EN 15 VDDAH 47 VDDIO 16 LED5/GPIO4/ALLPHYAD/LEDPOL5 48 RX_ER 17 LED4/GPIO3/MAGJACK/LEDPOL4 49 RX_CLK/RXC/MODE4 18 LED3/GPIO2/PHYAD2/LEDPOL3 50 CRS/GPIO8 MDC 19 LED2/GPIO1/PHYAD1/LEDPOL2 51 20 VDDIO 52 MDIO 21 LED1/GPIO0/PHYAD0/LEDPOL1 53 COL/GPIO9 22 TXD0 54 INT_N/GPIO5 23 TXD1 55 VDD 24 TXD2 56 VDDIO 25 TXD3 57 CLK125_NDO/GPIO6/LED_MODE 26 TXD4 58 RESET_N 27 TXD5 59 TX_CLK 28 VDD 60 LDO_O 29 TXD6 61 XO 30 TXD7 62 XI 31 VDDIO 63 VDDAL_PLL 32 TX_ER/GPIO7 64 ISET Exposed Pad (P_VSS) must be connected to ground.  2022 Microchip Technology Inc. and its subsidiaries DS00004726A-page 9 LAN8841 3.2 Pin Descriptions This section contains descriptions of the various LAN8841 pins. The “_N” symbol in the signal name indicates that the active, or asserted, state occurs when the signal is at a low voltage level. For example, RESET_N indicates that the reset signal is active low. When “_N” is not present after the signal name, the signal is asserted when at the high voltage level. The pin function descriptions have been broken into functional groups as follows: • • • • • • • • Analog Front End GMII Interface RGMII Interface Crystal Miscellaneous Alternate Functions Strap Inputs I/O Power, Core Power and Ground TABLE 3-2: ANALOG FRONT END Name Symbol Buffer Type Ethernet TX/RX Positive Channel A TXRXP_A AIO Description Media Dependent Interface[0], positive signal of differential pair 1000BT mode: TXRXP_A corresponds to BI_DA+. Ethernet TX/RX Negative Channel A TXRXM_A AIO 10BT/100BTX mode: TXRXP_A is the positive transmit signal (TX+) for MDI configuration and the positive receive signal (RX+) for MDI-X configuration, respectively. Media Dependent Interface[0], negative signal of differential pair 1000BT mode: TXRXM_A corresponds to BI_DA-. Ethernet TX/RX Positive Channel B TXRXP_B AIO 10BT/100BTX mode: TXRXM_A is the negative transmit signal (TX-) for MDI configuration and the negative receive signal (RX-) for MDI-X configuration, respectively. Media Dependent Interface[1], positive signal of differential pair 1000BT mode: TXRXP_B corresponds to BI_DB+. Ethernet TX/RX Negative Channel B TXRXM_B AIO 10BT/100BTX mode: TXRXP_B is the positive receive signal (RX+) for MDI configuration and the positive transmit signal (TX+) for MDI-X configuration, respectively. Media Dependent Interface[1], negative signal of differential pair 1000BT mode: TXRXM_B corresponds to BI_DB-. 10BT/100BTX mode: TXRXP_B is the negative receive signal (RX-) for MDI configuration and the negative transmit signal (TX-) for MDI-X configuration, respectively. DS00004726A-page 10  2022 Microchip Technology Inc. and its subsidiaries LAN8841 TABLE 3-2: ANALOG FRONT END (CONTINUED) Name Symbol Buffer Type Ethernet TX/RX Positive Channel C TXRXP_C AIO Description Media Dependent Interface[2], positive signal of differential pair 1000BT mode: TXRXP_C corresponds to BI_DC+. Ethernet TX/RX Negative Channel C TXRXM_C AIO 10BT/100BTX mode: TXRXP_C is not used. Media Dependent Interface[2], negative signal of differential pair 1000BT mode: TXRXM_C corresponds to BI_DC- Ethernet TX/RX Positive Channel D TXRXP_D AIO 10BT/100BTX mode: TXRXM_C is not used. Media Dependent Interface[3], positive signal of differential pair 1000BT mode: TXRXP_D corresponds to BI_DD+. Ethernet TX/RX Negative Channel D TXRXM_D AIO 10BT/100BTX mode: TXRXP_D is not used. Media Dependent Interface[3], negative signal of differential pair 1000BT mode: TXRXM_D corresponds to BI_DD-. 10BT/100BTX mode: TXRXM_D is not used. TABLE 3-3: GMII INTERFACE Name Symbol Transmit Data TXD7 TXD6 TXD5 TXD4 TXD3 TXD2 TXD1 TXD0 TX_EN TX_ER Transmit Enable Transmit Error Buffer Type Description VIS The MAC transmits data to the PHY using these signals. (PD) Note: Bits 7-4 are not used in MII mode (10 and 100 (see notes) Mbps). Internal pull-down resistors are enabled. Note: Bits 7-4 are not used in RGMII mode. Internal pulldown resistors are enabled. VIS Indicates the presence of valid data on TXD[7:0]. VIS Indicates a transmit error condition during frame transmission. (PD) (see notes) Also used to request Low Power Idle for Energy Efficient Ethernet operation. Note: If the GMII/MII MAC does not provide the TX_ER output signal, this pin should have an external pulldown resistor or otherwise be tied low. Note: GMII Transmit Clock GTX_CLK This pin is not used in RGMII mode. An internal pulldown resistor is enabled. GMII transmit reference clock. VIS (PD) Note: (see notes)  2022 Microchip Technology Inc. and its subsidiaries This signal is not used in MII mode (10 and 100 Mbps). An internal pull-down resistor is enabled. DS00004726A-page 11 LAN8841 TABLE 3-3: GMII INTERFACE (CONTINUED) Name Symbol MII Transmit Clock TX_CLK Collision Detect Carrier Sense Receive Data COL CRS Receive Data Valid RXD7 RXD6 RXD5 RXD4 RXD3 RXD2 RXD1 RXD0 RX_DV Receive Error RX_ER Receive Clock DS00004726A-page 12 RX_CLK Buffer Type VO5 (PD) (see notes) VO10 (PD) (see notes) VO10 (PD) (see notes) VO5 (PD) (see notes) VO5 VO5 (PD) (see notes) VO5 Description MII transmit reference clock. Note: This signal is not used in GMII mode. Asserted to indicate detection of a collision condition. Note: Used in half-duplex mode only. Indicates detection of carrier. Note: Used in half-duplex mode only. The PHY transfers data to the MAC using these signals. Note: Bits 7-4 are not used in MII mode and are driven low. Indicates that recovered and decoded data is being presented on the receive data pins. Asserted to indicate an error has been detected in the frame presently being transferred from the PHY. Also used to indicate Low Power Idle for Energy Efficient Ethernet operation. Receive reference clock.  2022 Microchip Technology Inc. and its subsidiaries LAN8841 TABLE 3-4: RGMII INTERFACE Buffer Type Name Symbol Transmit Data TXD3 TXD2 TXD1 TXD0 TX_CTL VIS The MAC transmits data to the PHY using these signals. VIS TXC VIS Indicates both the transmit data enable (TXEN) and transmit error (TXER) functions per the RGMII specification. Used to latch data from the MAC into the PHY in RGMII mode. Transmit Control RGMII Transmit Clock Receive Data RXD3 RXD2 RXD1 RXD0 Receive Control RX_CTL RGMII Receive Clock RXC Description 1000BASE-T: 125MHz 100BASE-TX: 25MHz 10BASE-T: 2.5MHz RGMII_O The PHY transfers data to the MAC using these signals. The PHY’s link status (speed, duplex and link) are indicated on these signals whenever Normal Data, Data Error, Carrier Extend, Carrier Sense, False Carrier or Lower Power Idle are not present. RGMII_O Indicates both the receive data valid (RXDV) and receive error (RXER) functions per the RGMII specification. RGMII_O Used to transfer data from the PHY to the MAC in RGMII mode. 1000BASE-T: 125MHz 100BASE-TX: 25MHz 10BASE-T: 2.5MHz TABLE 3-5: CRYSTAL Name Symbol BUFFER TYPE Crystal Input XI ICLK DESCRIPTION When using a 25MHz crystal, this input is connected to one lead of the crystal. When using an clock source, this is the input from the oscillator. Note: Crystal Output XO OCLK The crystal or oscillator should have a tolerance of ±50ppm. When using a 25MHz crystal, this output is connected to one lead of the crystal. When using an external oscillator, this pin is not connected.  2022 Microchip Technology Inc. and its subsidiaries DS00004726A-page 13 LAN8841 TABLE 3-6: MISCELLANEOUS Name Symbol Indicator LEDs LED5 LED4 LED3 LED2 LED1 General Purpose I/O Management Interface Data Management Interface Clock PHY Interrupt GPIO9 GPIO8 GPIO7 GPIO6 GPIO5 GPIO4 GPIO3 GPIO2 GPIO1 GPIO0 MDIO MDC INT_N Buffer Type VO10/ VOD10/ VOS10 VIS/ VO10/ VOD10 (PU) Description Programmable LED outputs. The polarity of the pin depends upon the corresponding LED Polarity bit in the Output Control Register. The buffer type (push-pull or open-drain/open-source) depends on the setting of the corresponding LED Buffer Type bit in the Output Control Register. This polarity then determines open-drain (active low) and open-source (active high). General purpose I/O The buffer type (push-pull or open-drain/open-source), direction, and pull-up depend on the settings in the GPIO registers. The GPIOs may be used to capture the 1588 timestamp and to clear the 1588 clock event interrupts. GPIOs are shared with various pins. VIS/ VO10 VOD10 (PU) VIS (PU) VO10/ VOD10 This is the management data from/to the MAC. Note: An external pull-up resistor to VDDIO in the range of 1.0 kΩ to 4.7 kΩ is required. (1.0 kΩ for high-speed MDIO operation). The buffer type (push-pull or open-drain/open-source) depends on the setting of the MDIO Buffer Type bit in the Output Control Register. This is the management clock input from the MAC. Programmable interrupt output. The buffer type (push-pull or open-drain) depends on the setting of the INT Buffer Type bit in the Output Control Register and defaults to open-drain. The polarity depends on the setting of the Intr Polarity Invert bit in the Control Register and defaults to active low. Note: CLK125 MHz CLK125_NDO If the buffer type is set to open-drain, the polarity is forced to be active low. VIS/VO10 125 MHz clock output. This pin provides a 125 MHz reference clock output option for use by the MAC. This pin may also provide a 125 MHz clock output synchronous to the receive data for use in Synchronous Ethernet (SyncE) applications. System Reset RESET_N VIS (PU) This pin may also be used as the 1588 reference clock input. Chip reset (active low). Hardware pin configurations are strapped-in at the de-assertion (rising edge) of RESET_N. DS00004726A-page 14  2022 Microchip Technology Inc. and its subsidiaries LAN8841 TABLE 3-6: MISCELLANEOUS (CONTINUED) Name Symbol Buffer Type LDO Controller Output LDO_O AO Description On-chip core voltage LDO controller output. This pin drives the input gate of a P-channel MOSFET to generate the chip’s core voltages. Note: PHY Bias Resistor TABLE 3-7: ISET AI If the system provides the core voltage, this pin is not used and can be left unconnected. This pin should be connected to ground through a 6.04KΩ 1% resistor. ALTERNATE FUNCTIONS Name Symbol Power Management Event PME_N Buffer Type VO10/ VOD10/ Description Programmable PME_N output. When asserted, this pin signals that a WOL event has occurred. PME_N can be mapped to various GPIO pins. The buffer type (push-pull or open-drain) depends on the setting of the corresponding GPIO Buffer Type (GPIO_BUF) bit in the General Purpose IO Buffer Type Register (GPIO_BUF). Start of Frame SOF_RX SOF_TX VO10/ VOD10/ The polarity is set by the PME Polarity bit in the Output Control Register. RX and TX Start of Frame indications. When pulsed, these pins signal the start of frame. SOF_RX and SOF_TX can be mapped to various GPIO pins. The buffer type (push-pull or open-drain) depends on the setting of the corresponding GPIO Buffer Type (GPIO_BUF) bit in the General Purpose IO Buffer Type Register (GPIO_BUF). The polarity is always active high.  2022 Microchip Technology Inc. and its subsidiaries DS00004726A-page 15 LAN8841 TABLE 3-7: ALTERNATE FUNCTIONS (CONTINUED) Name Symbol Buffer Type 1588 LTC Events 1588_EVENT_A 1588_EVENT_B VO10/ VOD10/ Description 1588 Local Time Counter Event output. When asserted, these pins signal that a 1588 Local Time Counter event has occurred. 1588_EVENT_A and 1588_EVENT_B can be mapped to various GPIO pins. The buffer type (push-pull or open-drain) depends on the setting of the corresponding GPIO Buffer Type (GPIO_BUF) bit in the General Purpose IO Buffer Type Register (GPIO_BUF). The polarity is set by the Clock Event Polarity Channel A (CLOCK_EVENT_POL_A) and Clock Event Polarity Channel B (CLOCK_EVENT_POL_B) bits of the PTP General Configuration Register (PTP_GENERAL_CONFIG). TABLE 3-8: STRAP INPUTS Name Symbol Buffer Type MagJack MAGJACK VIS PHY Address PHYAD4 PHYAD3 PHYAD2 PHYAD1 PHYAD0 VIS LED Polarity LEDPOL5 LEDPOL4 LEDPOL3 LEDPOL2 LEDPOL1 VIS DS00004726A-page 16 Description The MAGJACK strap-in pin is sampled and latched at powerup/reset and is used to set various registers for MagJack operation as follows: 0 = normal register settings 1 = MagJack register settings See Section 3.3, "Configuration Straps" for more information. The PHY address, PHYAD[4:0], is sampled and latched at power-up/reset and is configurable to any value from 0 to 1Fh. Each PHY address bit is configured as follows: Pulled-up = 1 Pulled-down = 0 See Section 3.3, "Configuration Straps" for more information. Since the LED pins are shared with configuration straps, the default polarity of the LED pins is determined during strap loading. If the strap value on a pin is a 0, the LED is set as active high (LEDPOL=1), since it is assumed that a LED to ground is used as the pull-down. If the strap value on a pin is 1, the LED is set as active low (LEDPOL=0), since it is assumed that a LED to VDDIO is used as the pullup. See Section 3.3, "Configuration Straps" for more information.  2022 Microchip Technology Inc. and its subsidiaries LAN8841 TABLE 3-8: STRAP INPUTS (CONTINUED) Name Symbol Buffer Type All PHY Address Enable ALLPHYAD VIS Description The ALLPHYAD strap-in pin is sampled and latched at powerup/reset and are defined as follows: 0 = PHY will respond to PHY address 0 as well as it’s assigned PHY address 1 = PHY will respond to only it’s assigned PHY address Note: Device Mode MODE4 MODE3 MODE2 MODE1 MODE0 RGMII_EN VIS 125MHz Output Clock Enable CLK125_EN VIS LED Mode LED_MODE VIS RGMII Enable VIS  2022 Microchip Technology Inc. and its subsidiaries This strap input is inverted compared to the All PHYAD Enable register bit. See Section 3.3, "Configuration Straps" for more information. The MODE[4:0] strap-in pins are sampled and latched at power-up/reset and are defined in Section 3.3.1, "Device Mode Select (MODE[4:0])". See Section 3.3, "Configuration Straps" for more information. RGMII_EN is sampled and latched at power-up/reset and is defined as follows: 0 = MII/GMII Mode 1 = RGMII Mode See Section 3.3, "Configuration Straps" for more information. CLK125_EN is sampled and latched at power-up/reset and is defined as follows: 0 = Disable 125 MHz clock output 1 = Enable 125 MHz clock output CLK125_NDO provides the 125 MHz reference clock output option for use by the MAC. See Section 3.3, "Configuration Straps" for more information. LED_MODE is sampled and latched at power-up/reset and is defined as follows: 0 = Tri-color-LED mode 1 = Individual-LED mode See Section 3.3, "Configuration Straps" for more information. DS00004726A-page 17 LAN8841 TABLE 3-9: I/O POWER, CORE POWER AND GROUND Name Symbol Buffer Type +2.5/3.3V Analog Power Supply VDDAH P +2.5/3.3V analog power supply VDD +1.1V Analog Power Supply VDDAL P +1.1V analog power supply VDD +1.1V Analog PLL Power Supply VDDAL_PLL P +1.1V analog PLL power supply VDD +3.3/2.5/1.8V Variable I/O Power Supply Input VDDIO P +3.3/2.5/1.8V variable I/O digital power supply VDD_IO +1.1V Digital Core Power Supply Input VDD P +1.1V digital core power supply input Paddle Ground P_VSS GND DS00004726A-page 18 Description Common ground. This exposed paddle must be connected to the ground plane with a via array.  2022 Microchip Technology Inc. and its subsidiaries LAN8841 3.3 Configuration Straps Configuration straps allow various features of the device to be automatically configured to user defined values. Configuration straps are latched upon the release of pin reset (RESET_N). Configuration straps do not include internal resistors and require the use of external resistors. Note: The system designer must ensure that configuration strap pins meet timing requirements. The system designer must guarantee that configuration strap pins meet the timing requirements specified in Section 6.6.3, "Reset Pin Configuration Strap Timing". If configuration strap pins are not at the correct voltage level prior to being latched, the device may capture incorrect strap values. Note: When externally pulling configuration straps high, the strap should be tied to VDDIO. APPLICATION NOTE: All straps should be pulled-up or pulled-down externally on the PCB to enable the desired operational state. 3.3.1 DEVICE MODE SELECT (MODE[4:0]) The MODE[4:0] configuration straps select the device mode as follows: Note: MODE[4:0] definitions are preliminary and subject to change. Note: 1000BT Half Duplex is not advertised in any of the below device modes. TABLE 3-10: DEVICE MODE SELECTIONS Test Modes MODE Mode [4:0] 00010 00011 00100 00101 00110 00111 RESERVED RESERVED NAND tree mode RESERVED RESERVED Device power down mode Functional Modes Power Down 01000 Software Power Down PLL Enabled 01001 Software Power Down PLL Disabled Auto-Negotiation Disabled, Auto MDIX Disabled, EEE Disabled 01010 01011 01100 01101 1000FD Host 100FD 100HD 1000FD Client *Legend: 1000FD = 1000BASE-T Full Duplex 100FD = 100BASE-TX Full Duplex 100HD = 100BASE-TX Half Duplex 10FD = 10BASE-T Full Duplex 10HD = 10BASE-T Half Duplex  2022 Microchip Technology Inc. and its subsidiaries DS00004726A-page 19 LAN8841 TABLE 3-10: DEVICE MODE SELECTIONS (CONTINUED) Auto-Negotiation Enabled, Auto MDIX Enabled, EEE Disabled, Asym & Sym Pause Advertised Auto-Negotiation Advertisement 1000BT FD 10000 1000FD Single Port 100FD/HD 10FD/HD 10001 1000FD Multi Port 100FD/HD 10FD/HD 10010 1000FD Single Port 10011 1000FD Multi Port 10100 100FD/HD 10101 100FD 10110 100HD 10111 100FD/HD 10FD/HD 100BTX Single EEE / Multi FD HD 10BT EEE FD HD Asym 10BT AMDIX / Sym cat3/5 Pause X S X X X X X cat3 X X M X X X X X cat3 X X X S M X X X X X X X na na na na na cat3 X X X X X X X X X X X X X Auto-Negotiation Enabled, Auto MDIX Enabled, EEE Enabled, Asym & Sym Pause Advertised Auto-Negotiation Advertisement 1000BT FD 11000 1000FD Single Port 100FD/HD 10FD/HD 11001 1000FD Multi Port 100FD/HD 10FD/HD 11010 1000FD Single Port 11011 1000FD Multi Port 11100 100FD/HD 11101 100FD 11111 100FD/HD 10FD/HD 100BTX Single EEE / Multi 10BT FD HD EEE FD HD Asym 10BT AMDIX / Sym cat3/5 Pause X S X X X X X X X cat5 X X M X X X X X X X cat5 X X X S M X X X X X X X X na na na na cat5 X X X X X X X X X X X X X X RESERVED 00000 00001 01101 01110 01111 11110 RESERVED RESERVED RESERVED RESERVED RESERVED RESERVED *Legend: 1000FD = 1000BASE-T Full Duplex 100FD = 100BASE-TX Full Duplex 100HD = 100BASE-TX Half Duplex 10FD = 10BASE-T Full Duplex 10HD = 10BASE-T Half Duplex DS00004726A-page 20  2022 Microchip Technology Inc. and its subsidiaries LAN8841 3.3.2 MAGJACK (MAGJACK) The MAGJACK configuration straps sets the value of MMD28 registers 13h through 1Eh for compatibility with MagJack RJ-45s with common center-taps. 3.3.3 RGMII MODE SELECT (RGMII_EN) The RGMII_EN configuration strap selects between the GMII/MII (pulled-down) and RGMII (pulled-up) modes of operation. 3.3.4 PHY ADDRESS (PHYAD[4:0]) The PHYAD[4:0] configuration straps set the value of the PHY’s management address. 3.3.5 ALL PHYs ADDRESS (ALLPHYAD) The ALLPHYAD configuration strap sets the default of the All-PHYAD Enable bit in the Common Control Register which enables (pulled-down) or disables (pulled-up) the PHY’s ability to respond to PHY address 0 as well as its assigned PHY address. Note: 3.3.6 This strap input is inverted compared to the register bit. 125MHZ OUTPUT CLOCK ENABLE (CLK125_EN) The CLK125_EN configuration strap enables the 125 MHz clock output onto the CLK125_NDO pin (pulled-up). The output clock defaults to a locally generated 125MHz clock. The recovered 125MHz RX clock can be selected for use in Synchronous Ethernet (SyncE) applications. 3.3.7 LED MODE SELECT (LED_MODE) The LED_MODE configuration strap selects between Individual-LED (pulled-up) or Tri-color-LED (pulled-down) modes. 3.3.8 LED POLARITY (LEDPOL[5:1]) The LEDPOL[5:1] configuration straps set the default polarity of the LED pins. When a LED pin is used as a function mode strap (for example a PHY address bit), it is difficult to strap in a low value when a (active low) LED is connected via a resistor to VDDIO. A secondary pull-down resistor is needed to provide a low level during strap load time. When the LED is lit (pin driven low), the pull-down resistor is inconsequential. However, when the LED is not lit (pin driven high), the device drives wasted current, on the order of 3ma, through this resistor. This is especially important during power saving modes with multiple LEDs. This situation is shown in Figure 3-2. FIGURE 3-2: LOW STRAP ON LED PIN LED output On Functional Strap = 0 LED Output Active Low VDDIO VDDIO 220 strap resistor sized to 1K ensure a low level during strap load LED output Off 220 LED / strap pin (driving 0)  2022 Microchip Technology Inc. and its subsidiaries strap resistor sized to 1K ensure a low level during strap load LED / strap pin (driving 1) DS00004726A-page 21 LAN8841 To avoid this, the default LED pin polarity, shown in the Strap Status Register, is automatically selected based on the inverse of the strap value. A LED, via a resistor, is then used as a pull-up, or as a pull-down.This is shown in Figure 3-3. FIGURE 3-3: STRAP ON LED WITH POLARITY Functional Strap = 1 LED output = Active Low (LEDPOL strap = 1) Functional Strap = 0 LED output = Active High (LEDPOL strap = 1) VDDIO LED / strap pin supplemental resistor to ensure a valid low level during strap load 220 220 LED / strap pin 3.4 Pin Alternate Functions Various pins may be configured to carry alternate functions if the primary function is not required by the application: • LEDs 1-5 may be individually configured as GPIO0-4 by setting the corresponding GPIO Enable (GPIO_EN) bits in the General Purpose IO Enable Register (GPIO_EN). • During MII/GMII half-duplex operation, COL and CRS are not required and may be configured as GPIO9-8 by setting the corresponding GPIO Enable (GPIO_EN) bits in the General Purpose IO Enable Register (GPIO_EN). • During RGMII operation, COL and CRS are not used and may be configured as GPIO9-8 by setting the corresponding GPIO Enable (GPIO_EN) bits in the General Purpose IO Enable Register (GPIO_EN). • During MII/GMII operation if the host MAC does not generate transmit errors, TX_ER may be configured as GPIO7 by setting the corresponding GPIO Enable (GPIO_EN) bit in the General Purpose IO Enable Register (GPIO_EN). The internal transmit error signal is forced inactive. • During RGMII operation, TX_ER is not used and may be configured as GPIO7 by setting the corresponding GPIO Enable (GPIO_EN) bit in the General Purpose IO Enable Register (GPIO_EN). • INT_N may be configured as GPIO5 by setting the corresponding GPIO Enable (GPIO_EN) bit in the General Purpose IO Enable Register (GPIO_EN). • CLK125_NDO may be configured as GPIO6 by setting the corresponding GPIO Enable (GPIO_EN) bit in the General Purpose IO Enable Register (GPIO_EN). • CLK125_NDO may be used as the 1588 reference clock input. CLK125_NDO does not have to be set as GPIO6 for this function. 3.4.1 GPIO PIN ALTERNATE FUNCTIONS After a pin has been enabled as a GPIO, alternate output functions can be mapped onto the GPIO: • 1588 inputs and output events may be mapped to any enabled GPIOs. • RX_SOF and TX_SOF may be mapped to any enabled GPIO by setting the corresponding bits in the General Purpose IO Data Select 1 Register (GPIO_DATA_SEL1) or the General Purpose IO Data Select 2 Register (GPIO_DATA_SEL2). • PME_N may be mapped to any enabled GPIO by setting the corresponding bits in the General Purpose IO Data Select 1 Register (GPIO_DATA_SEL1) or the General Purpose IO Data Select 2 Register (GPIO_DATA_SEL2). DS00004726A-page 22  2022 Microchip Technology Inc. and its subsidiaries LAN8841 4.0 DEVICE CONNECTIONS 4.1 Voltage Regulator In order to facilitate ease of integration, this device includes an LDO controller for use with an external MOSFET to generate the core voltage supply. 4.1.1 MOSFET SELECTION The selected MOSFET should exceed the following minimum requirements: • • • • • P-channel 500 mA (continuous current) 3.3V or 2.5V (source – input voltage) 1.1V (drain – output voltage) VGS in the range of: - (–1.2V to –1.5V) @ 500 mA or 3.3V source voltage - (–1.0V to –1.1V) @ 500 mA for 2.5V source voltage The VGS for the MOSFET needs to be operating in the constant current saturated region, and not towards the VGS(th), the threshold voltage for the cut-off region of the MOSFET. Refer to Table 6-15 for the LDO controller output driving range to the gate input of the MOSFET. A 47µF electrolytic capacitor between 3.3V/2.5V source and ground is required. A 47µF electrolytic capacitor between core voltage and ground is required for proper LDO operation. 4.1.2 LDO DISABLE The LDO controller can be disabled by setting the LDO Enable bit in Analog Control Register 11. An external source of 1.1V is necessary for operation in this case. 4.2 Power Connectivity This section details the power connectivity of the device in the following modes of operation: • Power Connectivity with Internal LDO Controller • Power Connectivity with External 1.1V Power Supply  2022 Microchip Technology Inc. and its subsidiaries DS00004726A-page 23 LAN8841 4.2.1 POWER CONNECTIVITY WITH INTERNAL LDO CONTROLLER FIGURE 4-1: POWER CONNECTIVITY WITH INTERNAL LDO CONTROLLER +2.5V, +3.3V + + 100K LDO_O LDO +1.8V, +2.5V, +3.3V VDDIO (5 pins) IO Pads VDD (3 pins) Digital PLL Analog VDDAL_PLL (1 pin) VDDAL (4 pins) +3.3V, +2.5V Bandgap and Osc P_VSS (exposed paddle) VDDAH (3 pins) Notes: Bypass and bulk caps as needed for PCB. Electrolytic capacitor required on MOSFET output. Ferrites on VDDAL and VDDAL_PLL may be combined. DS00004726A-page 24  2022 Microchip Technology Inc. and its subsidiaries LAN8841 4.2.2 POWER CONNECTIVITY WITH EXTERNAL 1.1V POWER SUPPLY FIGURE 4-2: POWER CONNECTIVITY WITH EXTERNAL 1.1V POWER SUPPLY +1.1V NC LDO_O LDO +1.8V, +2.5V, +3.3V VDDIO (5 pins) IO Pads VDD (3 pins) Digital PLL Analog VDDAL_PLL (1 pin) VDDAL (4 pins) +3.3V, +2.5V Bandgap and Osc P_VSS (exposed paddle) VDDAH (3 pins) Notes: Bypass and bulk caps as needed for PCB. Ferrites on VDDAL and VDDAL_PLL may be combined.  2022 Microchip Technology Inc. and its subsidiaries DS00004726A-page 25 LAN8841 5.0 FUNCTIONAL DESCRIPTION The LAN8841 is a completely integrated triple-speed (10BASE-T/100BASE-TX/1000BASE-T) Ethernet physical layer transceiver solution for transmission and reception of data over a standard CAT-5, as well as CAT-5e and CAT-6, unshielded twisted pair (UTP) cables. The device reduces board cost and simplifies board layout by using on-chip termination resistors for the four differential pairs and by integrating an LDO controller to drive a low-cost MOSFET to supply the core voltage. On the copper media interface, the device can automatically detect and correct for differential pair misplacements and polarity reversals, and correct propagation delays and re-sync timing between the four differential pairs, as specified in the IEEE 802.3 standard for 1000BASE-T operation. The LAN8841 provides the RGMII/GMII/MII interface for connection to GMACs in Gigabit Ethernet processors and switches for data transfer at 10/100/1000Mbps.Figure 5-1 shows a high-level block diagram of the LAN8841. FIGURE 5-1: LAN8841 BLOCK DIAGRAM PMA TX10/100/1000 CLOCK RESET CONFIGURATIONS PMA RX1000 PCS 1000 MEDIA INTERFACE PMA RX100 1588 PCS 100 PMA RX10 PCS 10 AUTONEGOTIATION 5.1 5.1.1 RGMII/GMII/MII INTERFACE LED DRIVERS 10BASE-T/100BASE-TX Transceiver 100BASE-TX TRANSMIT The 100BASE-TX transmit function performs parallel-to-serial conversion, 4B/5B coding, scrambling, NRZ-to-NRZI conversion, and MLT-3 encoding and transmission. The circuitry starts with a parallel-to-serial conversion, which converts the MII data from the MAC into a 125 MHz serial bit stream. The data and control stream is then converted into 4B/5B coding, followed by a scrambler. The serialized data is further converted from NRZ-to-NRZI format, and then transmitted in MLT-3 current output. The output current is set by an external 6.04 kΩ 1% resistor for the 1:1 transformer ratio. The output signal has a typical rise/fall time of 4 ns and complies with the ANSI TP-PMD standard regarding amplitude balance, and overshoot. The wave-shaped 10BASE-T output is also incorporated into the 100BASE-TX transmitter. 5.1.2 100BASE-TX RECEIVE The 100BASE-TX receiver function performs adaptive equalization, DC restoration, MLT-3-to-NRZI conversion, data and clock recovery, NRZI-to-NRZ conversion, de-scrambling, 4B/5B decoding, and serial-to-parallel conversion. The receiving side starts with the equalization filter to compensate for inter-symbol interference (ISI) over the twisted pair cable. Because the amplitude loss and phase distortion are a function of the cable length, the equalizer must adjust its characteristics to optimize performance. In this design, the variable equalizer makes an initial estimation based on comparisons of incoming signal strength against some known cable characteristics, then tunes itself for optimization. This is an ongoing process and self-adjusts against environmental changes such as temperature variations. DS00004726A-page 26  2022 Microchip Technology Inc. and its subsidiaries LAN8841 Next, the equalized signal goes through a DC-restoration and data-conversion block. The DC-restoration circuit compensates for the effect of baseline wander and improves the dynamic range. The differential data conversion circuit converts the MLT-3 format back to NRZI. The slicing threshold is also adaptive. The clock-recovery circuit extracts the 125 MHz clock from the edges of the NRZI signal. This recovered clock is then used to convert the NRZI signal into the NRZ format. This signal is sent through the de-scrambler followed by the 4B/ 5B decoder. Finally, the NRZ serial data is converted to the MII/GMII or RGMII format and provided as the input data to the MAC. 5.1.3 SCRAMBLER/DE-SCRAMBLER (100BASE-TX ONLY) The purpose of the scrambler is to spread the power spectrum of the signal to reduce electromagnetic interference (EMI) and baseline wander. Transmitted data is scrambled using an 11-bit wide linear feedback shift register (LFSR). The scrambler generates a 2047-bit non-repetitive sequence, then the receiver de-scrambles the incoming data stream using the same sequence as at the transmitter. 5.1.4 10BASE-T TRANSMIT The 10BASE-T output drivers are incorporated into the 100BASE-TX drivers to allow for transmission with the same magnetic. The drivers perform internal wave-shaping and pre-emphasis, and output signals with typical amplitude of 2.5V peak for standard 10BASE-T mode and 1.75V peak for energy-efficient 10BASE-Te mode. The 10BASE-T/ 10BASE-Te signals have harmonic contents that are at least 31 dB below the fundamental frequency when driven by an all-ones Manchester-encoded signal. 5.1.5 10BASE-T RECEIVE On the receive side, input buffer and level-detecting squelch circuits are used. A differential input receiver circuit and a phase-locked loop (PLL) perform the decoding function. The Manchester-encoded data stream is separated into clock signal and NRZ data. A squelch circuit rejects signals with levels less than 300 mV or with short pulse widths to prevent noises at the receive inputs from falsely triggering the decoder. When the input exceeds the squelch limit, the PLL locks onto the incoming signal and the device decodes a data frame. The receiver clock is maintained active during idle periods between receiving data frames. The device removes all 7 bytes of the preamble and presents the received frame starting with the SFD (start of frame delimiter) to the MAC. Auto-polarity correction is provided for the receiving differential pair to automatically swap and fix the incorrect +/– polarity wiring in the cabling.  2022 Microchip Technology Inc. and its subsidiaries DS00004726A-page 27 LAN8841 5.2 1000BASE-T Transceiver The 1000BASE-T transceiver is based-on a mixed-signal/digital-signal processing (DSP) architecture, which includes the analog front-end, digital channel equalizers, trellis encoders/decoders, echo cancelers, cross-talk cancelers, precision clock recovery scheme, and power-efficient line drivers. Figure 5-2 shows a high-level block diagram of a single channel of the 1000BASE-T transceiver for one of the four differential pairs. FIGURE 5-2: 1000BASE-T BLOCK DIAGRAM - SINGLE CHANNEL XTAL OTHER CHANNELS CLOCK GENERATION TX SIGNAL SIDE -STREAM SCRAMBLER & SYMBOL ENCODER TRANSMIT BLOCK PCS STATE MACHINES LED DRIVER NEXT CANCELLER NEXT Canceller NEXT Canceller ECHO CANCELLER ANALOG HYBRID PAIR SWAP & ALIGN UNIT BASELINE WANDER COMPENSATION AGC RXADC FFE + DESCRAMBLER + DECODER SLICER RX SIGNAL CLOCK & PHASE RECOVERY AUTO NEGOTIATION DFE MII REGISTERS MII MANAGEMENT CONTROL PMA STATE MACHINES 5.2.1 ANALOG ECHO-CANCELLATION CIRCUIT In 1000BASE-T mode, the analog echo-cancellation circuit helps to reduce the near-end echo. This analog hybrid circuit relieves the burden of the ADC and the adaptive equalizer. This circuit is disabled in 10BASE-T/100BASE-TX mode. 5.2.2 AUTOMATIC GAIN CONTROL (AGC) In 1000BASE-T mode, the automatic gain control (AGC) circuit provides initial gain adjustment to boost up the signal level. This pre-conditioning circuit is used to improve the signal-to-noise ratio of the receive signal. 5.2.3 ANALOG-TO-DIGITAL CONVERTER (ADC) In 1000BASE-T mode, the analog-to-digital converter (ADC) digitizes the incoming signal. ADC performance is essential to the overall performance of the transceiver. This circuit is disabled in 10BASE-T/100BASE-TX mode. DS00004726A-page 28  2022 Microchip Technology Inc. and its subsidiaries LAN8841 5.2.4 TIMING RECOVERY CIRCUIT In 1000BASE-T mode, the mixed-signal clock recovery circuit together with the digital phase-locked loop is used to recover and track the incoming timing information from the received data. The digital phase-locked loop has very low long-term jitter to maximize the signal-to-noise ratio of the receive signal. The 1000BASE-T slave PHY must transmit the exact receive clock frequency recovered from the received data back to the 1000BASE-T master PHY. Otherwise, the master and slave will not be synchronized after long transmission. This also helps to facilitate echo cancellation and NEXT removal. 5.2.5 ADAPTIVE EQUALIZER In 1000BASE-T mode, the adaptive equalizer provides the following functions: • Detection for partial response signaling • Removal of NEXT and ECHO noise • Channel equalization Signal quality is degraded by residual echo that is not removed by the analog hybrid because of impedance mismatch. The device uses a digital echo canceler to further reduce echo components on the receive signal. In 1000BASE-T mode, data transmission and reception occurs simultaneously on all four pairs of wires (four channels). This results in high-frequency cross-talk coming from adjacent wires. The device uses three NEXT cancelers on each receive channel to minimize the cross-talk induced by the other three channels. In 10BASE-T/100BASE-TX mode, the adaptive equalizer needs only to remove the inter-symbol interference and recover the channel loss from the incoming data. 5.2.6 TRELLIS ENCODER AND DECODER In 1000BASE-T mode, the transmitted 8-bit data is scrambled into 9-bit symbols and further encoded into 4D-PAM5 symbols. The initial scrambler seed is determined by the specific PHY address to reduce EMI when more than one device is used on the same board. On the receiving side, the idle stream is examined first. The scrambler seed, pair skew, pair order, and polarity must be resolved through the logic. The incoming 4D-PAM5 data is then converted into 9bit symbols and de-scrambled into 8-bit data. 5.3 Auto MDI/MDI-X The Automatic MDI/MDI-X feature eliminates the need to determine whether to use a straight cable or a crossover cable between the device and its link partner. This auto-sense function detects the MDI/MDI-X pair mapping from the link partner, and assigns the MDI/MDI-X pair mapping of the device accordingly. Table 5-1 shows the device’s 10/100/1000 pin configuration assignments for MDI/MDI-X pin mapping. TABLE 5-1: Pin (RJ-45 Pair) MDI/MDI-X PIN MAPPING MDI MDI-X 1000BASE-T 100BASE-T 10BASE-T 1000BASE-T 100BASE-T 10BASE-T TXRXP/M_A (1, 2) A+/– TX+/– TX+/– B+/– RX+/– RX+/– TXRXP/M_B (3, 6) B+/– RX+/– RX+/– A+/– TX+/– TX+/– TXRXP/M_C (4, 5) C+/– Not Used Not Used D+/– Not Used Not Used TXRXP/M_D (7, 8) D+/– Not Used Not Used C+/– Not Used Not Used Auto-MDIX detection is enabled in the device by default. Auto-MDIX can be disable by setting the swapoff bit in the Digital Debug Control 1 Register. The MDI / MDI-X mode may then be manually selected by the mdi_set bit in the Digital Debug Control 1 Register. The Auto-MDIX status bits are located in the Digital AX/AN Status Register. An isolation transformer with symmetrical transmit and receive data paths is recommended to support Auto MDI/MDI-X.  2022 Microchip Technology Inc. and its subsidiaries DS00004726A-page 29 LAN8841 5.4 Alignment and Polarity Detection/Correction In 1000BASE-T mode, the device supports 50 ns ±10 ns difference in propagation delay between pairs of channels in accordance with the IEEE 802.3 standard, and automatically corrects the data skew so the corrected four pairs of data symbols are synchronized. Additionally, the device detects and corrects polarity errors on all MDI pairs, a useful capability that exceeds the requirements of the standard. Polarity detection and correction applies to 10BASE-T and 1000BASE-T and is not required for 100BASE-TX. 5.5 Wave Shaping, Slew-Rate Control, and Partial Response In communication systems, signal transmission encoding methods are used to provide the noise-shaping feature and to minimize distortion and error in the transmission channel. • For 1000BASE-T, a special partial-response signaling method is used to provide the band-limiting feature for the transmission path. • For 100BASE-TX, a simple slew-rate control method is used to minimize EMI. • For 10BASE-T, pre-emphasis is used to extend the signal quality through the cable. 5.6 MagJack RJ-45 with Common Center-taps Operation Normally the center-taps of the device side of the magnetics need to be capacitively coupled to signal ground. To operate with MagJack RJ-45s with common center-taps, the MAGJACK strap may be used. This strap sets the default of the MagJack_mode bit in the Operation Mode Strap Override Low Register, which in turn sets the values of the Power Management Mode Registers. 5.7 PLL Clock Synthesizer The device generates 125 MHz, 25 MHz, and 10 MHz clocks for system timing. Internal clocks are generated from the external 25 MHz crystal or reference clock. 5.8 Auto-Negotiation The device conforms to the auto-negotiation protocol, defined in Clause 28 of the IEEE 802.3 Specification. Auto-negotiation allows UTP (unshielded twisted pair) link partners to select the highest common mode of operation. During auto-negotiation, link partners advertise capabilities across the UTP link to each other, and then compare their own capabilities with those they received from their link partners. The highest speed and duplex setting that is common to the two link partners is selected as the operating mode. The following list shows the speed and duplex operation mode from highest-to-lowest: • Priority 1: 1000BASE-T, full-duplex • Priority 2: 1000BASE-T, half-duplex Note: • • • • The device does not support 1000BASE-T, half-duplex and should not be enabled to advertise such. Priority 3: 100BASE-TX, full-duplex Priority 4: 100BASE-TX, half-duplex Priority 5: 10BASE-T, full-duplex Priority 6: 10BASE-T, half-duplex If auto-negotiation is not supported or the device’s link partner is forced to bypass auto-negotiation for 10BASE-T and 100BASE-TX modes, the device sets its operating mode by observing the input signal at its receiver. This is known as parallel detection, and allows the device to establish a link by listening for a fixed signal protocol in the absence of the auto-negotiation advertisement protocol. DS00004726A-page 30  2022 Microchip Technology Inc. and its subsidiaries LAN8841 The auto-negotiation link-up process is shown in Figure 5-3. FIGURE 5-3: AUTO-NEGOTIATION FLOW CHART START AUTO-NEGOTIATION START AUTO-NEGOTIATION FORCE LINK SETTING NO PARALLEL OPERATION YES BYPASS AUTO-NEGOTIATION AND SET LINK MODE ATTEMPT AUTONEGOTIATION LISTEN FOR 100BASE-TX IDLES LISTEN FOR 10BASE-T LINK PULSES JOIN FLOW LINK MODE SET? YES LINK MODE SET For 1000BASE-T mode, auto-negotiation is required and always used to establish a link. During 1000BASE-T autonegotiation, the master and slave configuration is first resolved between link partners. Then the link is established with the highest common capabilities between link partners. Auto-negotiation is enabled by default after power-up or hardware reset. After that, auto-negotiation can be enabled or disabled through the Basic Control Register, Bit [12]. If auto-negotiation is disabled, the speed is set by the Basic Control Register, Bits [6, 13] and the duplex is set by the Basic Control Register, Bit [8]. If the speed is changed on the fly, the link goes down and either auto-negotiation and parallel detection initiate until a common speed between the device and its link partner is re-established for a link. If the link is already established and there is no change of speed on the fly, the changes (for example, duplex and pause capabilities) will not take effect unless either auto-negotiation is restarted through the Basic Control Register, Bit [9], or a link-down to link-up transition occurs (that is, disconnecting and reconnecting the cable). After auto-negotiation is completed, the link status is updated in the Basic Status Register, Bit [2], and the link partner capabilities are updated in Registers 5h, 6h, 8h, and Ah. The auto-negotiation finite state machines use interval timers to manage the auto-negotiation process. The duration of these timers under normal operating conditions is summarized in Table 5-2.  2022 Microchip Technology Inc. and its subsidiaries DS00004726A-page 31 LAN8841 TABLE 5-2: AUTO-NEGOTIATION TIMERS Auto-Negotiation Interval Timers Transmit Burst Interval Transmit Pulse Interval Time Duration 16 ms 68 µs FLP Detect Minimum Time 17.2 µs FLP Detect Maximum Time 185 µs Receive Minimum Burst Interval 6.8 ms Receive Maximum Burst Interval 112 ms Data Detect Minimum Interval 35.4 µs Data Detect Maximum Interval 95 µs NLP Test Minimum Interval 4.5 ms NLP Test Maximum Interval 30 ms Link Loss Time 52 ms Break Link Time 1480 ms Parallel Detection Wait Time 830 ms Link Enable Wait Time 1000 ms 5.8.1 AUTO-NEGOTIATION NEXT PAGE USAGE The device supports “Next Page” capability which is used to negotiate Gigabit Ethernet and Energy Efficient Ethernet functionality as well as to support software controlled pages. As described in IEEE 802.3 Annex 40C “Add-on interface for additional Next Pages”, the device will autonomously send and receive the Gigabit Ethernet and Energy Efficient Ethernet next pages and then optionally send and receive software controlled next pages. Gigabit Ethernet next pages consist of one message and two unformatted pages. The message page contains an 8 as the message code. The first unformatted page contains the information from the Auto-Negotiation Master Slave Control Register. The second unformatted page contains the Master-Slave Seed value used to resolve the Master-Slave selection. The result of the Gigabit Ethernet next pages exchange is stored in Auto-Negotiation Master Slave Status Register. Gigabit Ethernet next pages are always transmitted, regardless of the advertised settings in the Auto-Negotiation Master Slave Control Register. Energy Efficient Ethernet (EEE) next pages consist of one message and one unformatted page. The message page contains a 10 as the message code (this value can be overridden in the EEE Message Code Register). The unformatted page contains the information from the EEE Advertisement Register. The result of the Gigabit Ethernet next pages exchange is stored in EEE Link Partner Ability Register. EEE next pages are transmitted only if the advertised setting in the EEE Advertisement Register is not zero. APPLICATION NOTE: The Gigabit Ethernet and EEE next pages may be viewed in Auto-Negotiation Next Page RX Register as they are exchanged. Following the EEE next page exchange, software controlled next pages are exchanged when the Next Page bit in the Auto-Negotiation Advertisement Register is set. Software controlled next page status is monitored via the Auto-Negotiation Expansion Register and Auto-Negotiation Next Page RX Register. 5.8.2 PARALLEL DETECT DUPLEX Normally, and according to IEEE 802.3, when parallel detection is used to establish the link, the resulting operation is set to half duplex. An option exists to force this result to full duplex. This is enabled by setting the LP Force 100 FD Override and/or LP Force 10 FD Override bits in the Parallel Detect Full Duplex Override Register. 5.9 Fast Link Failure To aid Synchronous Ethernet and network fail-over applications, unstable link operation leading to link failure can be detected in ~1 ms. By comparison, standard 1000BASE-T link failure detection requires a minimum of 750 ms, which may be unacceptable for Synchronous Ethernet and other applications. DS00004726A-page 32  2022 Microchip Technology Inc. and its subsidiaries LAN8841 Enabled by setting the Fast Link Fail Enable bit in the Driving Strength, Fast Link Down, S2P RX PCS Select Setting Register, the PHY detects Fast Link Failure (FLF) at 100 and 1000 Mbps and indicates the result via in the link status bit in the RGMII in-band status. FLF is supported at 100 and 1000 Mbps speeds as follows: • At 1000 Mbps, FLF is asserted when remote receiver status goes low (part of the scrambled idles) or when the local descrambler loses lock. At 100 Mbps, FLF is asserted when the local descrambler loses lock. 5.10 10/100 Mbps Speeds Only Some applications require link-up to be limited to 10/100 Mbps speeds only. After power-up/reset, the device can be restricted to auto-negotiate and link-up to 10/100 Mbps speeds only by programming the following register settings: 1. 2. 3. Configure the Speed Select[1] bit in the Basic Control Register to ‘0’ to disable the 1000 Mbps speed. Configure the 1000BASE-T Full Duplex and 1000BASE-T Half Duplex bits in the Auto-Negotiation Master Slave Control Register to ‘00’ to remove Auto-Negotiation advertisements for 1000 Mbps full/half duplex. Write a ‘1’ to the Restart Auto-Negotiation (PHY_RST_AN) bit in the Basic Control Register, a self-clearing bit, to force a restart of Auto-Negotiation. Auto-Negotiation and 10BASE-T/100BASE-TX speeds use only differential pairs A and B. Differential pairs C and D can be left as no connects. 5.11 Energy Efficient Ethernet The device implements Energy Efficient Ethernet (EEE) as described in IEEE Standard 802.3az. The specification is defined around an EEE-compliant MAC on the host side and an EEE-compliant link partner on the line side that support the special signaling associated with EEE. EEE saves power by keeping the AC signal on the copper Ethernet cable at approximately 0V peak-to-peak as often as possible during periods of no traffic activity, while maintaining the link-up status. This is referred to as low-power idle (LPI) mode or state. As set by the MODE[4:0] configuration straps, the device has the EEE function enabled or disabled as the power-up default setting. The EEE function can be enabled or disabled by setting or clearing the following EEE advertisement bits in the EEE Advertisement Register (MMD Address 7h, Register 3Ch), followed by restarting auto-negotiation (writing a ‘1’ to the Basic Control Register, Bit [9]): • 1000BASE-T EEE (Bit [2]) = 0/1 • 100BASE-TX EEE (Bit [1]) = 0/1 // Disable/Enable 1000 Mbps EEE mode // Disable/Enable 100 Mbps EEE mode During LPI mode, the copper link responds automatically when it receives traffic and resumes normal PHY operation immediately, without blockage of traffic or loss of packet. This involves exiting LPI mode and returning to normal 100/ 1000 Mbps operating mode. Wake-up times are 10^-10 3 4 5 6 BER
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