ADP194CB-EVALZ

Logic Controlled, High-Side Power Switch ADP194 FEATURES Low RDSON of 80 mΩ at 1.8 V Low input voltage range: 1.1 V to 3.6 V 500 mA continuous operating current Built-in level shift for control logic that can be operated by 1.2 V logic Low 2 μA (maximum) ground current Ultralow shutdown current VIH, ILOAD = 100 mA, TA = 25°C, unless otherwise noted. 0.12 4.0 3.5 3.0 0.10 0.08 ILOAD = 20mA ILOAD = 50mA ILOAD = 100mA ILOAD = 200mA ILOAD = 500mA VOLTAGE (V) RDSON (Ω) 2.5 2.0 1.5 1.0 VEN VIN = 1.5V VIN = 1.8V VIN = 2.5V VIN = 3.6V 0 20 40 TIME (µs) 60 80 100 08629-007 0.06 0.04 0.02 0.5 0 –40 –5 25 TEMPERATURE (°C) 65 85 Figure 4. RDSON vs. Temperature 0.30 08629-004 0 Figure 7. Start-Up and Turn-On Delay vs. Input Voltage 2.0 1.8 0.25 GROUND CURRENT (µA) ILOAD = 10mA ILOAD = 20mA ILOAD = 50mA ILOAD = 100mA ILOAD = 200mA ILOAD = 500mA 1.6 1.4 1.2 1.0 0.8 0.6 0.4 0.2 08629-005 0.20 RDS ON (Ω) 0.15 ILOAD = 20mA ILOAD = 50mA ILOAD = 100mA ILOAD = 200mA ILOAD = 500mA 0.10 0.05 1.4 1.8 2.2 VIN (V) 2.6 3.0 3.4 –40 –5 25 TEMPERATURE (°C) 65 85 Figure 5. RDSON vs. Input Voltage, VIN 140 120 7 6 Figure 8. Ground Current vs. Temperature GROUND CURRENT (µA) 100 DIFFERENCE (V) 80 60 40 20 0 VIN = 1.1V VIN = 1.3V VIN = 1.5V VIN = 1.8V VIN = 2.1V VIN = 2.4V VIN = 2.7V VIN = 3.0V VIN = 3.3V VIN = 3.6V 5 4 3 2 1 0 1.0 ILOAD = 10mA ILOAD = 20mA ILOAD = 50mA ILOAD = 100mA ILOAD = 200mA ILOAD = 500mA 08629-006 10 100 ILOAD (mA) 1000 1.4 1.8 2.2 VIN (V) 2.6 3.0 3.4 Figure 6. Voltage Drop vs. Load Current Figure 9. Ground Current vs. Input Voltage, VIN Rev. 0 | Page 6 of 12 08629-009 08629-008 0 1.0 0 ADP194 5.0 4.5 10 VIN = 3.6V VIN = 2.7V VIN = 3.3V VIN = 2.4V IGND SHUTDOWN CURRENT (µA) 4.0 3.5 3.0 2.5 2.0 1.5 1.0 0.5 08629-010 VIN = 1.1V VIN = 1.5V VIN = 1.8V VIN = 2.4V VIN = 2.7V VIN = 3.3V VIN = 3.6V IGND SHUTDOWN CURRENT (µA) 1 VIN = 1.8V VIN = 1.5V VIN = 1.1V –20 0 20 40 60 80 100 –20 0 20 40 60 80 100 TEMPERATURE (°C) TEMPERATURE (°C) Figure 10. Shutdown Current vs. Temperature, VOUT Open 10 Figure 13. Reverse Shutdown Current vs. Temperature, VOUT = 0 V 0.50 0.45 IOUT SHUTDOWN CURRENT (µA) IGND SHUTDOWN CURRENT (µA) 0.40 0.35 0.30 0.25 0.20 0.15 0.10 0.05 VIN = 1.1V VIN = 1.5V VIN = 1.8V VIN = 2.4V VIN = 2.7V VIN = 3.3V VIN = 3.6V 1 0.1 VIN = 1.1V VIN = 1.5V VIN = 1.8V VIN = 2.4V 0.01 –40 –20 0 VIN = 2.7V VIN = 3.3V VIN = 3.6V 20 40 60 80 100 08629-011 –20 0 TEMPERATURE (°C) 20 40 60 TEMPERATURE (°C) 80 100 Figure 11. Shutdown Current vs. Temperature, VOUT = 0 V 0.50 0.45 Figure 14. IOUT Reverse Current vs. Temperature, VOUT = 0 V IOUT SHUTDOWN CURRENT (µA) 0.40 0.35 0.30 0.25 0.20 0.15 0.10 0.05 –20 0 20 40 60 TEMPERATURE (°C) 80 100 08629-012 VIN = 1.1V VIN = 1.5V VIN = 1.8V VIN = 2.4V VIN = 2.7V VIN = 3.3V VIN = 3.6V 0 –40 Figure 12. IOUT Shutdown Current vs. Temperature, VOUT = 0 V Rev. 0 | Page 7 of 12 08629-114 0 –40 08629-013 0 –40 0.1 –40 ADP194 THEORY OF OPERATION The ADP194 is a high-side PMOS load switch. It is designed to operate from a supply range from 1.1 V to 3.6 V. The PMOS load switch is designed for low on resistance, 80 mΩ at VIN = 1.8 V, and supports 500 mA of continuous output current. The ADP194 is a low ground current device with a nominal 4 MΩ pull-down resistor on its enable pin. The reverse current protection circuitry prevents current flow backwards through the ADP194 when the output voltage is greater than the input voltage. A comparator senses the difference between the input and output voltages. When the difference between the input voltage and output voltage exceeds 50 mV, the body of the PFET is switched to VOUT and turned off or opened. In other words, the gate is connected to VOUT. The package is a space-saving 0.8 mm × 0.8 mm, 4-ball WLCSP. ADP194 VIN GND LEVEL SHIFT AND SLEW RATE CONTROL 08629-115 REVERSE POLARITY PROTECTION VOUT EN Figure 15. Functional Block Diagram Rev. 0 | Page 8 of 12 ADP194 APPLICATIONS INFORMATION GROUND CURRENT The major source for ground current in the ADP194 is the 4 MΩ pull-down resistor on the enable (EN) pin. Figure 16 shows typical ground current when VEN = VIN and VIN varies from 1.1 V to 3.6 V. 7 6 VIN = 3.6V VIN = 3.3V ENABLE FEATURE The ADP194 uses the EN pin to enable and disable the VOUT pin under normal operating conditions. As shown in Figure 18, when a rising voltage on EN crosses the active threshold, VOUT turns on. When a falling voltage on EN crosses the inactive threshold, VOUT turns off. 2.0 1.8 1.6 1.4 VOUT (V) VIN = 1.3V 100 ILOAD (mA) 1000 08629-116 GROUND CURRENT (µA) 5 VIN = 3.0V 4 3 2 1 0 10 VIN = 2.7V VIN = 2.4V VIN = 2.1V VIN = 1.8V VIN = 1.5V VIN = 1.1V 1.2 1.0 0.8 0.6 0.4 0.2 0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 VEN (V) 0.8 0.9 1.0 1.1 1.2 08629-015 08629-016 0 Figure 16. Ground Current vs. Load Current, Different Input Voltages Figure 18. Typical EN Operation, VIN = 1.8 V As shown in Figure 17, an increase in ground current can occur when VEN ≠ VIN. This is caused by the CMOS logic nature of the level shift circuitry as it translates an EN signal ≥ 1.1 V to a logic high. This increase is a function of the VIN − VEN delta. 14 12 GROUND CURRENT (µA) The EN input has built-in hysteresis, as shown in Figure 18. The hysteresis prevents on/off oscillations that can occur due to noise on the EN pin as VEN passes through the threshold points. The EN input active/inactive thresholds derive from the VIN voltage; therefore, these thresholds vary with changing input voltage. Figure 19 shows typical EN active/inactive thresholds when the input voltage varies from 1.1 V to 3.6 V. 10 VOUT = 3.6V 8 6 4 2 1.15 1.05 0.95 EN ACTIVE 0.85 0.75 0.65 0.55 0.45 0.35 VOUT = 1.8V 08629-014 0 0.1 0.3 0.5 0.7 0.9 1.1 1.3 1.5 1.7 1.9 2.1 2.3 2.5 2.7 2.9 3.1 3.3 3.5 VEN (V) TYPICAL EN THRESHOLDS (V) EN INACTIVE Figure 17. Typical Ground Current when VEN ≠ VIN 1.20 1.35 1.50 1.65 1.80 1.95 2.10 2.25 2.55 2.70 2.85 3.00 3.15 3.30 3.45 VIN (V) Figure 19. Typical EN Pin Thresholds vs. Input Voltage, VIN Rev. 0 | Page 9 of 12 2.40 3.60 ADP194 TIMING Turn-on delay is defined as the delta between the time that EN reaches >1.1 V until VOUT rises to ~10% of its final value. The ADP194 includes circuitry to set the typical 1.5 μs turn-on delay at 3.6 V VIN to limit the VIN inrush current. As shown in Figure 20, the turn-on delay is dependent on the input voltage. 4.0 3.5 3.0 VOLTAGE (V) VEN 3 VOUT LOAD CURRENT 1 2.5 2.0 1.5 1.0 0.5 0 VEN VIN = 1.5V VIN = 1.8V VIN = 2.5V VIN = 3.6V 0 20 40 TIME (µs) 60 80 100 08629-020 CH1 1.00V BW CH3 1.00V BW CH2 200mA Ω BW M4.00µs A CH3 T 10.00% 400mV Figure 22. Typical Rise Time and Inrush Current with VIN = 3.6 V, CLOAD = 1 μF The fall time or turn-off time of VOUT is defined as the time delta between the 90% and 10% points of VOUT as it transitions to its final value. The turn-off time is also dependent on the RC time constant. VEN 3 Figure 20. Typical Turn-On Delay Time with Varying Input Voltage VEN 3 CH1 500mV BW CH2 200mA Ω BW M2.00µs A CH3 T 10.00% CH3 1.00V BW 400mV Figure 23. Typical Turn-Off Time, VIN = 1.8 V, RLOAD = 3.6 Ω VOUT VEN 1 3 LOAD CURRENT 089629-021 VOUT 2 1 CH1 500mV BW CH2 200mA Ω BW M20.0µs A CH3 T 10.00% CH3 1.00V BW 400mV LOAD CURRENT 089629-024 Figure 21. Typical Rise Time and Inrush Current with VIN = 1.8 V, CLOAD = 1 μF 2 CH1 1.00V BW CH2 200mA Ω BW M2.00µs A CH3 T 10.00% CH3 1.00V BW 400mV Figure 24. Typical Turn-Off Time, VIN = 3.6 V, RLOAD = 7.5 Ω Rev. 0 | Page 10 of 12 089629-023 The rise time of VOUT is defined as the time delta between the 10% and 90% points of VOUT as it transitions to its final value. It is dependent on the RC time constant where C = load capacitance (CLOAD) and R = RDSON||RLOAD. Because RDSON is usually smaller than RLOAD, an adequate approximation for RC is RDSON × CLOAD. The ADP194 does not need any input or load capacitor, but capacitors can be used to suppress noise on the board. If significant load capacitance is connected, inrush current may be a concern. VOUT 1 LOAD CURRENT 2 089629-022 2 ADP194 THERMAL CONSIDERATIONS In most applications, the ADP194 does not dissipate much heat due to its low on-channel resistance. However, in applications with high ambient temperature and high load current, the heat dissipated in the package can cause the junction temperature of the die to exceed the maximum junction temperature of 125°C. The junction temperature of the die is the sum of the ambient temperature of the environment and the temperature rise of the package due to the power dissipation, as shown in Equation 1. To guarantee reliable operation, the junction temperature of the ADP194 must not exceed 125°C. To ensure that the junction temperature stays below this maximum value, the user must be aware of the parameters that contribute to junction temperature changes. These parameters include ambient temperature, power dissipation in the device, and thermal resistances between the junction and ambient air (θJA). The θJA value is dependent on the package assembly compounds that are used and the amount of copper used to solder the package GND pin to the PCB. Table 5 shows typical θJA values of the 4-ball WLCSP for various PCB copper sizes. Table 6 shows the typical ΨJB value of the 4-ball WLCSP. Table 5. Typical θJA Values for WLCSP Copper Size (mm2) 01 50 100 300 500 1 Power dissipation due to ground current is quite small and can be ignored. Therefore, the junction temperature equation simplifies to the following: TJ = TA + {[(VIN − VOUT) × ILOAD] × θJA} (3) In cases where the board temperature is known, use the thermal characterization parameter, ΨJB, to estimate the junction temperature rise. Maximum junction temperature (TJ) is calculated from the board temperature (TB) and power dissipation (PD) using the formula TJ = TB + (PD × ΨJB) (4) PCB LAYOUT CONSIDERATIONS The heat dissipation capability of the package can be improved by increasing the amount of copper attached to the pins of the ADP194. However, as listed in Table 5, a point of diminishing returns is eventually reached, beyond which an increase in the copper size does not yield significant heat dissipation benefits. It is critical to keep the input and output traces as wide and as short as possible to minimize the circuit board trace resistance. θJA (°C/W) 260 159 157 153 151 Device soldered to minimum size pin traces. Table 6. Typical ΨJB Values Package 4-Ball WLCSP ΨJB 58.4 Unit °C/W 08629-025 The junction temperature of the ADP194 is calculated from the following equation: TJ = TA + (PD × θJA) where: TA is the ambient temperature. PD is the power dissipation in the die, given by PD = [(VIN − VOUT) × ILOAD] + (VIN × IGND) where: ILOAD is the load current. IGND is the ground current. VIN and VOUT are the input and output voltages, respectively. (2) (1) Figure 25. ADP194 PCB Layout Rev. 0 | Page 11 of 12 ADP194 OUTLINE DIMENSIONS 0.800 0.740 SQ 0.720 2 1 A BALL A1 IDENTIFIER 0.40 REF TOP VIEW (BALL SIDE DOWN) B BOTTOM VIEW (BALL SIDE UP) 0.560 0.500 0.440 END VIEW 0.330 0.300 0.270 COPLANARITY 0.03 Figure 26. 4-Ball Wafer Level Chip Scale Package [WLCSP] (CB-4-5) Dimensions shown in millimeters ORDERING GUIDE Model 1 ADP194ACBZ-R7 ADP194CB-EVALZ 1 Temperature Range −40°C to +85°C Package Description 4-Ball Wafer Level Chip Scale Package [WLCSP] Evaluation Board Package Option CB-4-5 10-08-2010-A SEATING PLANE 0.300 0.260 0.220 0.230 0.200 0.170 Branding 76 Z = RoHS Compliant Part. ©2011 Analog Devices, Inc. All rights reserved. Trademarks and registered trademarks are the property of their respective owners. D08629-0-5/11(0) Rev. 0 | Page 12 of 12