LTC6412
800MHz, 31dB Range
Analog-Controlled VGA
FEATURES
DESCRIPTION
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The LTC®6412 is a fully differential variable gain amplifier
with linear-in-dB analog gain control. It is designed for
AC-coupled operation in IF receiver chains from 1MHz
to 500MHz. The part has a constant OIP3 across a wide
output amplitude range and across the 31dB gain control
range. The output noise (NF + Gain) is also flat versus gain
to provide a uniform spurious-free dynamic range (SFDR)
>120dB over the full gain control range at 240MHz.
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800MHz –3dB Small-Signal Bandwidth
Continuously-Adjustable Gain Control
–14dB to +17dB Linear-in-dB Gain Range
35dBm OIP3 at 240MHz Across All Gain Settings
10dB Noise Figure at Maximum Gain
(IIP3 – NF) = +8dBm at 240MHz Across All Gains
2.7nV/√Hz Input Referred Noise
Differential Inputs and Outputs
50Ω Input Impedance Across all Gains
Single Supply Operation from 3V to 3.6V
110mA Supply Current
4mm × 4mm × 0.75mm 24-Pin QFN Package
The LTC6412 is ideal for interfacing with the LT®5527 and
LT5557 downconverting mixers, LTC6410-6 IF amplifier
and the LTC6400/LTC6401/LTC6416 ADC drivers for use
in 12-, 14-, and 16-bit ADC applications.
APPLICATIONS
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The LTC6412 recovers quickly from an overdrive condition,
and the EN pin allows for a fast output signal disable to
protect sensitive downstream components. Asserting the
SHDN pin reduces the current consumption below 1mA
for power-down or sleep modes.
IF Signal Chain Automatic Gain Control (AGC)
2.5G and 3G Cellular Basestation Transceivers
WiMAX, WiBro, WLAN Receivers
Satellite and GPS Receiver IF
L, LT, LTC, LTM, Linear Technology and the Linear logo are registered trademarks of Linear
Technology Corporation. All other trademarks are the property of their respective owners.
TYPICAL APPLICATION
3.3V Fully Differential 240MHz IF Receiver Chain with 31dB Gain Control
VGA Gain vs Frequency
Over Gain Control Range
3.3V
20
3.3V
10nF
10nF
BPF
–OUT
0.1μF
0.1μF
GAIN CONTROL
(+ SLOPE MODE)
0.1μF
0.1μF
10
3.3V
3.3V
+OUT
LTC6400-8
VCM
–IN V– –OUT
VDD
GAIN (dB)
+IN V+
0.1μF
LTC6412
–IN
180nH
+OUT
GND
VCM
DECL1
DECL2
–VG
VREF
+VG
IF INPUT
180nH
EN
+IN
SHDN
VCC
10nF
GMAX
0.1μF
1nF
AIN+
LTC2208
AIN–
VCM
0
–10
GND
6412 TA01
GMIN
–20
2.2μF
–30
1
10
100
1000
FREQUENCY (MHz)
10000
6412 G01
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LTC6412
ABSOLUTE MAXIMUM RATINGS
PIN CONFIGURATION
(Note 1)
Total Supply Voltage (VCC to GND)...........................3.8V
Amplifier Input Current (+IN, –IN)........................±20mA
Amplifier Output Current (+OUT, –OUT) ...............±70mA
Input Current (+VG, –VG, VREF, EN, SHDN ) .........±10mA
Input Current (VCM, DECL1, DECL2) ....................±10mA
RF Input Power, Continuous, 50Ω......................+15dBm
RF Input Power, 100μs pulse, 50Ω ....................+20dBm
Operating Temperature Range (Note 2).... –40°C to 85°C
Specified Temperature Range (Note 3) .... –40°C to 85°C
Storage Temperature Range................... –65°C to 150°C
Junction Temperature ........................................... 150°C
VCC
GND
EN
SHDN
GND
VCC
TOP VIEW
24 23 22 21 20 19
GND 1
18 GND
+IN 2
17 +OUT
–IN 3
16 –OUT
25
VCM 4
15 GND
GND
9 10 11 12
–VG
8
VREF
7
+VG
13 VCC
GND
14 DECL2
VCC 6
DECL1
VCM 5
UF PACKAGE
24-LEAD (4mm s 4mm) PLASTIC QFN
TJMAX = 150°C, θJA = 37°C/W
EXPOSED PAD (PIN 25) IS GND, MUST BE SOLDERED TO PCB
ORDER INFORMATION
LEAD FREE FINISH
TAPE AND REEL
PART MARKING*
PACKAGE DESCRIPTION
SPECIFIED TEMPERATURE RANGE
LTC6412CUF#PBF
LTC6412CUF#TRPBF
6412
24-Lead (4mm × 4mm) Plastic QFN
0°C to 70°C
LTC6412IUF#PBF
LTC6412IUF#TRPBF
6412
24-Lead (4mm × 4mm) Plastic QFN
–40°C to 85°C
Consult LTC Marketing for parts specified with wider operating temperature ranges. *The temperature grade is identified by a label on the shipping container.
Consult LTC Marketing for information on non-standard lead based finish parts.
For more information on lead free part marking, go to: http://www.linear.com/leadfree/
For more information on tape and reel specifications, go to: http://www.linear.com/tapeandreel/
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2
LTC6412
DC ELECTRICAL CHARACTERISTICS The l denotes specifications that apply over the full operating
temperature range, otherwise specifications are at TA = 25°C. DC electrical performance measured using DC test circuit schematic.
VIN(DIFF) is defined as (+IN) – (–IN). VOUT(DIFF) is defined as (+OUT) – (–OUT). VIN(CM) is defined as [(+IN) + (–IN)]/2. VOUT(CM) is
defined as [(+OUT) + (–OUT)]/2. Unless noted otherwise, default operating conditions are VCC = 3.3V, EN = 0.8V, SHDN = 2.2V, +VG tied
to VREF (negative gain slope mode), VOUT(CM) = 3.3V. Differential power gain defined at ZSOURCE = 50Ω differential and ZLOAD = 200Ω
differential.
SYMBOL
PARAMETER
CONDITIONS
MIN
TYP
MAX
UNITS
l
16.1
15.5
17.1
18.1
18.7
dB
dB
l
–16.2
–16.8
–14.9
–13.6
–13.0
dB
dB
l
30.7
30.1
31.9
33.1
33.7
dB
dB
Gain Characteristics
GMAX
Maximum Differential Power Gain (Note 4)
–VG = 0V, VIN(DIFF) = 100mV
GMIN
Minimum Differential Power Gain (Note 4)
–VG = 1.2V, VIN(DIFF) = 200mV
GRANGE
Differential Power Gain Range
GMAX-GMIN
TCGAIN
Temperature Coefficient of Gain at Fixed VG
–VG = 0V to 1.2V
GSLOPE
Gain Control Slope
–VG = 0.2V to 1.0V, 85 Points, Slope of the
Least-Square Fit Line
GCONF(AVE)
Average Conformance Error to Gain Slope Line
GCONF(MAX)
Maximum Conformance Error to Gain Slope
Line
–0.007
–32.9
–31.7
–31.1
dB/V
dB/V
–VG = 0.2V to 1.0V, 85 Points, Standard
Error to the Least-Square Fit Line
0.12
0.20
dB
–VG = 0.2V to 1.0V, 85 points, Maximum
Error to the Least-Square Fit Line
0.20
0.45
dB
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–34.1
–34.7
dB/°C
+IN and –IN Pins
RIN(GMAX)
Differential Input Resistance at Maximum Gain
–VG = 0V, VIN(DIFF) = 100mV
RIN(GMIN)
Differential Input Resistance at Minimum Gain
–VG = 1.2V, VIN(DIFF) = 200mV
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49
47
57
65
67
Ω
Ω
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49
47
57
65
67
Ω
Ω
VINCM(GMAX)
Input Common Mode Voltage at Maximum Gain –VG = 0V, DC Blocking Capacitor to Input
640
mV
VINCM(GMIN)
Input Common Mode Voltage at Minimum Gain –VG = 1.2V, DC Blocking Capacitor to Input
640
mV
+VG, –VG, and VREF Pins
RIH(+VG)
+VG Input High Resistance
+VG = 1.0V, –VG Tied to VREF ,
RIN(+VG) = 1V/Δ IIL(+VG)
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7.8
7.2
9.2
10.6
11.6
kΩ
kΩ
RIH(–VG)
–VG Input High Resistance
–VG = 1.0V, +VG Tied to VREF ,
RIN(–VG) = 1V/Δ IIL(–VG)
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7.8
7.2
9.2
10.6
11.6
kΩ
kΩ
IIL(+VG)
+VG Input Low Current
+VG = 0V, –VG Tied to VREF
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–9
–10
–5
–1
–1
μA
μA
IIL(–VG)
–VG Input Low Current
–VG = 0V, +VG Tied to VREF
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–9
–10
–5
–1
–1
μA
μA
VREF
Internal Bias Voltage
–VG = 0V, +VG Tied to VREF
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590
580
615
640
650
mV
mV
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LTC6412
DC ELECTRICAL CHARACTERISTICS The l denotes specifications that apply over the full operating
temperature range, otherwise specifications are at TA = 25°C. DC electrical performance measured using DC test circuit schematic.
VIN(DIFF) is defined as (+IN) – (–IN). VOUT(DIFF) is defined as (+OUT) – (–OUT). VIN(CM) is defined as [(+IN) + (–IN)]/2. VOUT(CM) is
defined as [(+OUT) + (–OUT)]/2. Unless noted otherwise, default operating conditions are VCC = 3.3V, EN = 0.8V, SHDN = 2.2V, +VG tied
to VREF (negative gain slope mode), VOUT(CM) = 3.3V. Differential power gain defined at ZSOURCE = 50Ω differential and ZLOAD = 200Ω
differential.
SYMBOL
PARAMETER
CONDITIONS
MIN
TYP
MAX
UNITS
SHDN Pin
VIL(SHDN)
SHDN Input Low Voltage
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VIH(SHDN)
SHDN Input High Voltage
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2.2
IIL(SHDN)
SHDN Input Low Current
SHDN = 0.8V
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–60
–30
–1
μA
IIH(SHDN)
SHDN Input High Current
SHDN = 2.2V
l
–30
–15
–1
μA
0.8
V
0.8
V
V
EN Pin
VIL(EN)
EN Input Low Voltage
l
VIH(EN)
EN Input High Voltage
l
2.2
IIL(EN)
EN Input Low Current
EN = 0.8V
l
–60
–30
–1
μA
IIH(EN)
EN Input High Current
EN = 2.2V
l
–30
–15
–1
μA
l
3.0
V
Power Supply
VS
Operating Supply Range
IS(TOT)
Total Supply Current
All VCC Pins Plus +OUT and –OUT Pins
IS(OUT)
Sum of Supply Current to OUT Pins
IS(OUT) = I+OUT + I–OUT
IΔ(OUT)
Delta of Supply Current to OUT Pins
Current Imbalance to +OUT and –OUT
IS(SHDN)
Supply Current in Shutdown
IS(OUT) at SHDN = 0.8V
PSRRMAX
Power Supply Rejection Ratio at Max Gain
–VG = 0V, Output Referred
40
53
dB
PSRRMIN
Power Supply Rejection Ratio at Min Gain
–VG = 1.2V, Output Referred
40
53
dB
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l
l
l
3.3
3.6
V
110
135
140
mA
mA
44
55
60
mA
mA
0.5
1.5
2.0
mA
mA
0.5
1.3
2.0
mA
mA
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LTC6412
AC ELECTRICAL CHARACTERISTICS
The l denotes specifications that apply over the full operating
temperature range, otherwise specifications are at TA = 25°C. Typical AC electrical performance measured in demo board DC1464A
(Figure 3, Test Circuit A) unless otherwise noted. Default operating conditions are VCC = 3.3V, EN = 0.8V, SHDN = 2.2V, +VG tied to VREF
(negative gain slope mode), and ZSOURCE = ZLOAD = 50Ω unless otherwise noted.
SYMBOL
PARAMETER
CONDITIONS
MIN
TYP
MAX
UNITS
Small Signal
BWGMAX
–3dB Bandwidth for Sdd21 at Maximum Gain –VG = 0V, Test Circuit B
800
MHz
BWGMIN
–3dB Bandwidth for Sdd21 at Minimum Gain
Sdd11
Input Match at ZSOURCE = 50Ω Differential
–VG = 1.2V, Test Circuit B
800
MHz
–VG = 0V to 1.2V, 10MHz-500MHz,
Test Circuit B
–20
dB
Sdd22
Output Match at ZLOAD = 200Ω Differential
–VG = 0V to 1.2V, 10MHz-250MHz,
Test Circuit B
–10
dB
Sdd12
Reverse Isolation
–VG = 0V to 1.2V, 10MHz-500MHz,
Test Circuit B
-80
dB
Transient Response
tSTEP(6dB)
6dB Gain Step Response Time
Peak POUT = +4dBm, –VG = 0.2V to 0.4V,
Time to Settle Within 1dB of Final POUT
0.4
μs
tSTEP(12dB)
12dB Gain Step Response Time
Peak POUT = +4dBm, –VG = 0.2V to 0.6V,
Time to Settle Within 1dB of Final POUT
0.4
μs
tSTEP(20dB)
20dB Gain Step Response Time
Peak POUT = +4dBm, –VG = 0.2V to 0.8V,
Time to Settle Within 1dB of Final POUT
0.4
μs
tOVDR
Overdrive Recovery Time at 70MHz
–VG = 0V, PIN = +3dBm to –17dBm, Time to
Settle Within 1dB of Final POUT
25
ns
tOFF
Output Amplifier Disable Time
POUT = 0dBm at EN = 0V, –VG = 0V,
EN = 0V to 3V, Time for POUT ≤ –20dBm
25
ns
tON
Output Amplifier Enable Time
POUT = 0dBm at EN = 0V, –VG = 0V, EN = 3V to
0V, Time for POUT ≥ –1dBm
20
ns
70MHz Signal
GMAX
Maximum Gain
–VG = 0V, Test Circuit B
17
dB
GMIN
Minimum Gain
–VG = 1.2V, Test Circuit B
–15
dB
GRANGE
Gain Range
GMAX-GMIN
32
dB
HD2
Second Harmonic Distortion
POUT = 0dBm, –VG = 0V to 1.0V
–80
dBc
HD3
Third Harmonic Distortion
POUT = 0dBm, –VG = 0V to 1.0V
–80
dBc
IM3
Third-Order Intermodulation
f1 = 69.5MHz, f2 = 70.5MHz,
POUT = –6dBm/Tone, –VG = 0V to 1.0V
–90
dBc
OIP3
Output Third-Order Intercept
f1 = 69.5MHz, f2 = 70.5MHz,
POUT = –6dBm/Tone, –VG = 0V to 1.0V
39
dBm
P1dBGMAX
Output 1dB Compression Point at Max Gain
–VG = 0V (Note 6)
13
dBm
NFGMAX
Noise Figure at Maximum Gain
–VG = 0V (Note 5)
10
dB
NFGMIN
Noise Figure at Minimum Gain
–VG = 1.2V (Note 5)
42
dB
140MHz Signal
GMAX
Maximum Gain
–VG = 0V, Test Circuit B
17
dB
GMIN
Minimum Gain
–VG = 1.2V, Test Circuit B
–15
dB
GRANGE
Gain Range
GMAX-GMIN
32
dB
HD2
Second Harmonic Distortion
POUT = 0dBm, –VG = 0V to 1.0V
–80
dBc
HD3
Third Harmonic Distortion
POUT = 0dBm, –VG = 0V to 1.0V
–75
dBc
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LTC6412
AC ELECTRICAL CHARACTERISTICS
The l denotes specifications that apply over the full operating
temperature range, otherwise specifications are at TA = 25°C. Typical AC electrical performance measured in demo board DC1464A
(Figure 3, Test Circuit A) unless otherwise noted. Default operating conditions are VCC = 3.3V, EN = 0.8V, SHDN = 2.2V, +VG tied to VREF
(negative gain slope mode), and ZSOURCE = ZLOAD = 50Ω unless otherwise noted.
SYMBOL
PARAMETER
CONDITIONS
IM3
Third-Order Intermodulation
f1 = 139.5MHz, f2 = 140.5MHz,
POUT = –6dBm/Tone, –VG = 0V to 1.0V
MIN
TYP
–88
MAX
UNITS
dBc
OIP3
Output Third-Order Intercept
f1 = 139.5MHz, f2 = 140.5MHz,
POUT = –6dBm/Tone, –VG = 0V to 1.0V
38
dBm
P1dBGMAX
Output 1dB Compression Point at Max Gain
–VG = 0V (Note 6)
13
dBm
NFGMAX
Noise Figure at Maximum Gain
–VG = 0V (Note 5)
10
dB
NFGMIN
Noise Figure at Minimum Gain
–VG = 1.2V (Note 5)
42
dB
–VG = 0V, Test Circuit B
17
dB
240MHz Signal
GMAX
Maximum Gain
GMIN
Minimum Gain
–VG = 1.2V, Test Circuit B
–14
dB
GRANGE
Gain Range
GMAX-GMIN
31
dB
HD2
Second Harmonic Distortion
POUT = 0dBm, –VG = 0V to 1.0V
–70
dBc
HD3
Third Harmonic Distortion
POUT = 0dBm, –VG = 0V to 1.0V
–70
dBc
IM3
Third-Order Intermodulation
f1 = 239.5MHz, f2 = 240.5MHz,
POUT = –6dBm/Tone, –VG = 0V to 1.0V
–82
dBc
OIP3
Output Third-Order Intercept
f1 = 239.5MHz, f2 = 240.5MHz,
POUT = –6dBm/Tone, –VG = 0V to 1.0V
35
dBm
P1dBGMAX
Output 1dB Compression Point at Max Gain
–VG = 0V (Note 6)
12
dBm
NFGMAX
Noise Figure at Maximum Gain
–VG = 0V (Note 5)
10
dB
NFGMIN
Noise Figure at Minimum Gain
–VG = 1.2V (Note 5)
42
dB
280MHz/320MHz Signal
GMAX
Maximum Gain
f = 320MHz, POUT = –3dBm, –VG = 0V
16.9
dB
GMID
Medium Gain
f = 320MHz, POUT = –5dBm, –VG = 0.6V
1.5
dB
GMIN
Minimum Gain
f = 320MHz, POUT = –5dBm, –VG = 1.2V
–14.2
dB
GRANGE
Gain Range
320MHz, GMAX-GMIN
IM3GMAX
Third-Order Intermodulation at Max Gain
f1 = 280MHz, f2 = 320MHz,
POUT = –3dBm/Tone, –VG = 0V
29.7
–72
IM3GMID
Third-Order Intermodulation at Mid Gain
f1 = 280MHz, f2 = 320MHz,
POUT = –5dBm/Tone, –VG = 0.6V
–71
IM3GMIN
Third-Order Intermodulation at Min Gain
f1 = 280MHz, f2 = 320MHz,
POUT = –5dBm/Tone, –VG = 1.2V
–56
dBc
OIP3GMAX
Output Third-Order Intercept at Max Gain
f1 = 280MHz, f2 = 320MHz,
POUT = –3dBm/Tone, –VG = 0V
31.0
dBm
OIP3GMID
Output Third-Order Intercept at Mid Gain
f1 = 280MHz, f2 = 320MHz,
POUT = –5dBm/Tone, –VG = 0.6V
30.5
dBm
OIP3GMIN
Output Third-Order Intercept at Min Gain
f1 = 280MHz, f2 = 320MHz,
POUT = –5dBm/Tone, –VG = 1.2V
23.0
dBm
26.0
31.1
32.5
dB
dBc
–65
dBc
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LTC6412
AC ELECTRICAL CHARACTERISTICS
The l denotes specifications that apply over the full operating
temperature range, otherwise specifications are at TA = 25°C. Typical AC electrical performance measured in demo board DC1464A
(Figure 3, Test Circuit A) unless otherwise noted. Default operating conditions are VCC = 3.3V, EN = 0.8V, SHDN = 2.2V, +VG tied to VREF
(negative gain slope mode), and ZSOURCE = ZLOAD = 50Ω unless otherwise noted.
SYMBOL
PARAMETER
CONDITIONS
MIN
TYP
MAX
UNITS
380MHz Signal
GMAX
Maximum Gain
–VG = 0V, Test Circuit B
17
GMIN
GRANGE
Minimum Gain
–VG = 1.2V, Test Circuit B
–14
dB
Gain Range
GMAX-GMIN
31
dB
IM3
Third-Order Intermodulation
f1 = 379.5MHz, f2 = 380.5MHz,
POUT = –6dBm/Tone, –VG = 0V to 1.0V
–72
dBc
OIP3
Output Third-Order Intercept
f1 = 379.5MHz, f2 = 380.5MHz,
POUT = –6dBm/Tone, –VG = 0V to 1.0V
30
dBm
P1dBGMAX
Output 1dB Compression Point at Max Gain
–VG = 0V (Note 6)
11
dBm
NFGMAX
Noise Figure at Maximum Gain
–VG = 0V (Note 5)
10.5
dB
NFGMIN
Noise Figure at Minimum Gain
–VG = 1.2V (Note 5)
42
dB
Note 1: Stresses beyond those listed under Absolute Maximum Ratings
may cause permanent damage to the device. Exposure to any Absolute
Maximum Rating condition for extended periods may affect device
reliability and lifetime. RF input power rating is guaranteed by design and
engineering characterization, but not production tested. The absolute
maximum continuous RF input power shall not exceed +15dBm
Note 2: The LTC6412C/LTC6412I are guaranteed functional over the
operating temperature range of –40°C to 85°C.
Note 3: The LTC6412C is guaranteed to meet specified performance from
0°C to 70°C. It is designed, characterized and expected to meet specified
performance from –40°C and 85°C but is not tested or QA sampled
at these temperatures. The LT6412I is guaranteed to meet specified
performance from –40°C to 85°C.
Note 4: Power gain is defined at ZSOURCE = 50Ω and ZLOAD = 200Ω.
Voltage gain for this test condition is 6dB higher than the stated power
gain.
dB
Note 5: en can be calculated from 50Ω NF with the formula:
en = √{4kT(50)(10NF/10 – 1)}
where
en = Input referred voltage noise in V/√Hz
NF = 50Ω noise figure in dB
k = Boltzmann’s constant = 1.38 • 10–23J/°K
T = Absolute temperature in °K = °C + 273
Note 6: P1dB compression of the output amplifier cannot be achieved
in the minimum gain state while complying with the absolute maximum
rating for input RF power.
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LTC6412
TYPICAL PERFORMANCE CHARACTERISTICS
Electrical Performance in Test Circuits A and B at TA = 25°C and VCC = 3.3V unless otherwise noted.
Differential Gain (Sdd21) vs
Frequency Over 11 Gain Settings
Common Mode Gain (Scc21) vs
Frequency Over 11 Gain Settings
20
CM-to-DM Gain (Sdc21) vs
Frequency Over 11 Gain Settings
0
20
GMAX
10
GMAX
0
–20
–10
–20
GMIN
–40
–40
GMIN
GMIN
–20
–60
–60
–30
–80
–80
1
10
100
1000
FREQUENCY (MHz)
10000
1
10
100
1000
FREQUENCY (MHz)
10
1
10000
100
1000
FREQUENCY (MHz)
10000
6412 G01
6412 G02
6412 G03
Differential Input Match (Sdd11)
vs Frequency Over 11 Gain Settings
Differential Output Match (Sdd22)
vs Frequency Over 11 Gain Settings
Differential Reverse Isolation
(Sdd12) vs Frequency Over 6 Gain
Settings
0
0
–10
–10
–40
RETURN LOSS (dB)
GMAX
–20
GMIN
GMAX
GMIN
–60
ISOLATION (dB)
GMAX
RETURN LOSS (dB)
GAIN (dB)
0
GAIN (dB)
GAIN (dB)
GMAX
–20
–30
–30
1
10
100
1000
FREQUENCY (MHz)
10000
–120
1
10
100
1000
FREQUENCY (MHz)
10000
1
10
100
1000
FREQUENCY (MHz)
10000
6412 G05
6412 G04
Differential Input Smith Chart
(Sdd11) 10MHz to 500MHz Over 6
Gain Settings
GMIN
–100
–40
–40
–80
6412 G06
Differential Output Smith Chart
(Sdd22) 10MHz to 500MHz Over 6
Gain Settings
Supply Current vs Supply Voltage
Over Temperature
ZO = 50Ω
ZO = 200Ω
GMIN
10MHz
GMAX
GMAX 120MHz
GMIN 240MHz
380MHz
500MHz
6412 G07
TOTAL SUPPLY CURRENT (mA)
120
115
85°C
110
30°C
105
–40°C
0°C
100
95
6412 G08
90
3.0
3.1
3.2
3.3
3.4
SUPPLY VOLTAGE (V)
3.5
3.6
6412 G09
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LTC6412
TYPICAL PERFORMANCE CHARACTERISTICS
Electrical Performance in Test Circuits A and B at TA = 25°C and VCC = 3.3V unless otherwise noted.
Gain (Sdd21) Conformance Error
vs Control Voltage Over
Temperature
20
5
15
GAIN (dB)
10
5 –V : NEGATIVE
G
SLOPE MODE
0
+VG: POSITIVE
SLOPE MODE
–5
–10
–40°C
25°C
85°C
–15
–20
0
0.2
GAIN CONFORMANCE ERROR (dB)
FREQ = 140MHz
20
FREQ = 140MHz
4
3
2
–40°C
1
25°C
0
–1
85°C
–2
–3
–4
GMAX
–5
0.4
0.8
1.0
0.6
+VG OR –VG VOLTAGE (V)
1.2
0
0.2
GMIN
0.6
0.8
0.4
–VG VOLTAGE (V)
1.0
6412 G10
45
45
40
40
20
15
0
0.2
–5
PHASE
DELAY
–10
–15
GMAX
0
0.2
GMIN
0.4
0.8
0.6
–VG VOLTAGE (V)
1.0
40
35
OIP3 (dBm)
30
380MHz
25
POUT = –6dBm/TONE
ΔFREQ = 1MHz
3.6V
3.3V
3V
30
25
20
10
0
0.2
POUT = –6dBm/TONE
ΔFREQ = 1MHz
0.8
0.6
0.4
–VG VOLTAGE (V)
15
GMAX
GMIN
10
1.2
1.0
6412 G13
0
0.2
GMIN
0.8
0.6
0.4
–VG VOLTAGE (V)
1.0
6412 G14
Output IP3 vs Control Voltage
Over Tone Spacing
45
40
40
35
35
1.2
6412 G15
Output IP3 vs Control Voltage
Over Output Power per Tone
45
1.2
Output IP3 at 140MHz
vs Control Voltage Over VCC
240MHz
GMAX
1.2
1.0
100MHz
6412 G12
140MHz
GMIN
0.8
0.6
0.4
–VG VOLTAGE (V)
0
1.2
70MHz
15
10
PHASE
ADV.
5
–20
20
GMAX
10
45
35
OIP3 (dBm)
OIP3 (dBm)
35
25
200MHz
Output IP3 vs Control Voltage
Over Frequency
POUT = –6dBm/TONE
ΔFREQ = 1MHz
–40°C
25°C
85°C
400MHz
15
6412 G11
Output IP3 at 140MHz vs Control
Voltage Over Temperature
30
Relative Phase (Sdd21)
vs Control Voltage Over Frequency
sdd21 PHASE RELATIVE TO GMAX (DEG)
Differential Gain (Sdd21) vs
Control Voltage Over Temperature
3rd Harmonic Distortion
vs Control Voltage Over VCC
–20
FREQ = 140MHz
POUT = 0dBm
25
20
TEST EQUIPMENT LIMITED
30
FREQ = 140MHz
ΔFREQ = 1MHz
POUT =
–6dBm/TONE
–3dBm/TONE
–9dBm/TONE
25
20
15
15
GMAX
10
0
0.2
GMIN
0.8
0.6
0.4
–VG VOLTAGE (V)
1.0
1.2
6412 G16
HD3 (dBc)
POUT = –6dBm/TONE
FREQ = 140MHz
SPACING =
0.5MHz
1MHz
2MHz
5MHz
30
OIP3 (dBm)
OIP3 (dBm)
–40
INPUT
ATTENUATOR
LIMITED
0
0.2
0.8
0.6
0.4
–VG VOLTAGE (V)
VCC = 3V
–80
VCC = 3.3V
VCC = 3.6V
–100
GMIN
GMAX
10
–60
1.0
1.2
6412 G17
–120
GMIN
GMAX
0
0.2
0.4
0.6
0.8
–VG VOLTAGE (V)
1.0
1.2
6412 G18
6412fa
9
LTC6412
TYPICAL PERFORMANCE CHARACTERISTICS
Electrical Performance in Test Circuits A and B at TA = 25°C and VCC = 3.3V unless otherwise noted.
2nd Harmonic vs Distortion vs
Control Voltage Over Frequency
–20
3rd Harmonic Distortion vs
Control Voltage Over Frequency
–20
POUT = 0dBm
Noise Figure at GMAX vs
Frequency Over Temperature
14
POUT = 0dBm
85°C
12
–40
–60
–80
0
0.2
FREQ = 280MHz
FREQ = 140MHz
FREQ = 70MHz
0.4
0.6
0.8
–VG VOLTAGE (V)
FREQ = 280MHz
–80
FREQ = 70MHz
FREQ = 140MHz
GMIN
1.0
1.2
–120
2
0
0.2
0.4
0.6
0.8
–VG VOLTAGE (V)
1.0
INPUT
ATTENUATOR
LIMITED
–60
–80
–100
0
0.2
0.4
0.6
0.8
–VG VOLTAGE (V)
1.0
1.2
100 150 200 250 300 350 400
FREQUENCY (MHz)
6412 G21
140MHz Noise Figure vs Gain
Setting Over Temperature
45
40
INPUT
ATTENUATOR
LIMITED
–60
35
POUT = 3dBm
–80
POUT = 0dBm
–120
30
85°C
25
25°C
–40°C
20
15
10
–100
GMIN
50
0
FREQ = 140MHz
–40
HD3 (dBc)
HD2 (dBc)
–20
POUT = –3dBm
0
0.2
5
GMIN
GMAX
0.4
0.6
0.8
–VG VOLTAGE (V)
1.0
6412 G22
0
–20 –15 –10
1.2
0
5
–5
10
GAIN SETTING (dB)
15
6412 G23
Output P1dB at GMAX vs Frequency
Over Supply Voltage
20
20
6412 G24
Input and Output P1dB vs Gain
Setting at 140MHz
140MHz Sideband Noise Near
GMAX at POUT = +8dBm
20
0
GAIN = GMAX – 2dB
18
INPUT P1dB
16
15
3.6V
14
3.3V
3V
12
P1dB (dBm)
OUTPUT P1dB (dBm)
0
1.2
3rd Harmonic Distortion vs
Control Voltage Over POUT
–20
GMAX
4
6412 G20
2nd Harmonic Distortion vs
Control Voltage Over POUT
–120
6
GMIN
GMAX
6412 G19
FREQ = 140MHz
POUT = 3dBm
POUT = 0dBm
–40
POUT = –3dBm
–40°C
8
–100
10
8
–20
POWER DENSITY (dBc/Hz)
–120
GMAX
–60
NOISE FIGURE (dB)
–100
25°C
10
NOISE FIGURE (dB)
HD3 (dBc)
HD2 (dBc)
–40
OUTPUT P1dB
10
5
6
4
0
2
0
0
50
100 150 200 250 300 350 400
FREQUENCY (MHz)
6412 G25
INPUT
ATTENUATOR
LIMITED
–5
–20 –15 –10
OUTPUT
AMPLIFIER
LIMITED
0
–5
5
10
GAIN SETTING (dB)
–40
–60
–80
–100
–120
15
20
–140
–20000
–10000
0
10000
20000
OFFSET FROM 140MHz (Hz)
6412 G26
6412 G27
6412fa
10
LTC6412
TYPICAL PERFORMANCE CHARACTERISTICS
Electrical Performance in Test Circuits A and B at TA = 25°C and VCC = 3.3V unless otherwise noted.
10dB Gain Control Step
70MHz Time Domain Response
–VG (0.5V/DIV)
VOLTAGE (V)
RFOUT
50Ω
RFOUT
50Ω
1
2
3
TIME (μs)
4
5
0
SHDN Step at GMAX with EN = 0V
70MHz Time Domain Response
2
3
TIME (μs)
VOLTAGE (V)
200
300
TIME (μs)
400
2
3
TIME (μs)
4
0
100
6412 G31
PEAK GAIN RF
OUT 50Ω
COMPRESSION
20dB
200
300
TIME (μs)
400
10dB
PEAK RFOUT = 14dBm
0
500
6412 G32
Output EN Step at GMAX
140MHz Time Domain Response
20
40
60
TIME (μs)
80
100
6412 G33
SHDN Supply Current
Time Domain Response
3.0
2.5
2.0
EN
EXTERNAL
RF SWITCH PULSE
0.8
VOLTAGE (V)
0.6
0.4
RFOUT INTO 50Ω,
10dB ATTENUATED
0.2
0
SMALL SIGNAL
–0.2
–0.4
15dB COMPRESSED
0
50
2.0
1.5
1.0
120
0.5
RFOUT
50Ω
0
–0.5
PEAK
RFOUT = 14dBm
100 150 200 250 300 350 400
TIME (ns)
6412 G34
–1.0
PEAK RFOUT = 10dBm
–1.5
0
20 40 60 80 100 120 140 160 180 200
TIME (ns)
6412 G35
1.0
100
SHDN PIN VOLTAGE (V)
1.0
5
6412 G30
Overdrive Compression at GMAX
70MHz Time Domain Response
PEAK RFOUT = 4dBm
500
1.2
VOLTAGE (V)
1
0dB
Overdrive Recovery at GMAX
70MHz Time Domain Response
–0.6
PEAK
RFOUT = 4dBm
0
5
RFOUT
50Ω
PEAK RFOUT = 4dBm
100
RFOUT
50Ω
6412 G29
SHDN (1V/DIV)
RFOUT
50Ω
0
4
SHDN Step at G = 3dB with EN = 0V
70MHz Time Domain Response
SHDN (1V/DIV)
VOLTAGE (V)
1
6412 G28
VOLTAGE (V)
0
–VG (0.5V/DIV)
PEAK
RFOUT = 4dBm
PEAK
RFOUT = 4dBm
SUPPLY CURRENT (mA)
VOLTAGE (V)
–VG (0.25V/DIV)
20dB Gain Control Step
70MHz Time Domain Response
VOLTAGE (V)
6dB Gain Control Step
70MHz Time Domain Response
0
80
60
40
20
0
0
0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0
TIME (ms)
6412 G36
6412fa
11
LTC6412
PIN FUNCTIONS
GND (Pins 1, 8, 12, 15, 18, 20, 23): Ground. Pins are
connected to each other internally. For best RF performance,
all ground pins should be connected to the printed circuit
board ground plane.
+IN (Pin 2): Positive Signal Input Pin. Has an internally generated DC Bias. A 10nF DC blocking capacitor is
recommended.
–IN (Pin 3): Negative Signal Input Pin. Has an internally generated DC Bias. A 10nF DC blocking capacitor is
recommended.
VCM (Pins 4, 5): Input Common Mode Voltage Pins. Two
pins are tied together internally and serve as a virtual
ground for the differential inputs, +IN and –IN. Capacitive decoupling to ground with 10nF close to the pins is
recommended to help terminate any residual common
mode input signal.
VCC (Pins 6, 13, 19, 24): Positive Power Supply. All
four pins must be tied to the same voltage, usually 3.3V.
Bypass each pin with 1000pF and 0.1μF capacitors close
to the pins.
DECL1 (Pin 7): Decoupling Pin. Serves to reduce internal
noise. Bypass to ground with a 0.1μF capacitor close to
the pin.
+VG (Pin 9): Positive Gain Control Pin. Input signal pin used
for positive mode gain control. Otherwise, pin is typically
connected to VREF for negative mode gain control. Pin is
internally pulled to ground with a 10k resistor. In positive
gain slope mode, the gain control slope is approximately
+32dB/V at 140MHz with a gain control range of 0.1V to
1.1V.
VREF (Pin 10): Internal Bias Voltage Pin. Typically tied to
–VG pin for positive gain control or tied to +VG for negative gain control. Determines the midpoint voltage of the
gain-vs-VG characteristic. Bypass to ground with 0.1μF
capacitor close to the pin. Not intended for use as an
external reference voltage.
–VG (Pin 11): Negative Gain Control Pin. Input signal pin
used for negative mode gain control. Otherwise, pin is
typically connected to VREF for positive mode gain control. Pin is internally pulled to ground with a 10k resistor.
In negative gain slope mode, the gain control slope is
approximately –32dB/V at 140MHz with a gain control
range of 0.1V to 1.1V.
DECL2 (Pin 14): Decoupling Pin. Serves to reduce internal
noise. Bypass to ground with a 1000pF capacitor close
to the pin.
–OUT (Pin 16): Negative Amplifier Output Pin. A transformer with a center tap tied to VCC or a choke inductor
is recommended to conduct DC quiescent current to the
open-collector output device. For best performance, DC
bias voltage to –OUT must be within 100mV of VCC.
+OUT (Pin 17): Positive Amplifier Output Pin. A transformer with a center tap tied to VCC or a choke inductor
is recommended to conduct DC quiescent current to the
open-collector output device. For best performance, DC
bias voltage to +OUT must be within 100mV of VCC.
EN (Pin 21): Output Signal Enable Pin. Pin is internally
pulled high with 100kΩ to VCC. Assert pin to a low voltage to enable the output amplifier signal. Output amplifier
impedance and DC current are not affected by the EN state.
Connect pin to ground if enable function is not used.
SHDN (Pin 22): Shutdown Pin. Pin is internally pulled high
with 100kΩ to VCC. Assert pin to a low voltage to shut
down the circuit and greatly reduce the supply current.
Proper sequencing of the EN and SHDN pins is required
to avoid non-monotonic output signal behavior. See
Applications Information section for details. Connect pin
to VCC if shutdown function is not used.
Exposed Pad (Pin 25): Ground. The Exposed Pad should
have multiple via holes to an underlying ground plane for
low inductance and good thermal dissipation.
6412fa
12
LTC6412
BLOCK DIAGRAM
6
13
VCC
19
VCC
24
VCC
22
21
SHDN
VCC
EN
15
23
GND
GND
REFERENCE AND BIAS CONTROL
2
+IN
+OUT
•••
BUFFER/
OUTPUT
AMPLIFIER
•••
3
4
5
–IN
–OUT
•••
VCM
DECL1
ATTENUATOR
CONTROL
VCM
+VG
9
REFERENCE AND
BIAS CONTROL
–VG GND
VREF
10
11
1
17
DECL2
GND
GND
GND
GND
EXPOSED
PAD
8
12
15
18
25
16
7
14
6412 BD
DC TEST CIRCUIT
VCC
2.2V 0.8V
0.1μF
SHDN
VCM
VCC
0.1μF
EN
VSUPPLY ≈ VCC + 2.3V
100Ω
+IN
+OUT
+OUT
LTC6412
–IN
0.1μF
–OUT
–VG
+VG
VREF
DECL2
–OUT
DECL1
GND
+IN
VIN(DIFF) = (+IN) – (–IN)
VIN(CM) = [(+IN) + (–IN)]/2
–IN
VOUT(DIFF) = (+OUT) – (–OUT)
VOUT(CM) = [(+OUT) + (–OUT)]/2
6412 TC
100Ω
VSUPPLY ≈ VCC + 2.3V
0.1μF
0.1μF
GAIN CONTROL
(NEGATIVE SLOPE)
6412fa
13
LTC6412
OPERATION
The LTC6412 employs an interpolated, tapped attenuator
circuit architecture to generate the variable-gain characteristic of the amplifier. The tapped attenuator is fed to a
buffer and output amplifier to complete the differential
signal path shown in the Block Diagram. This circuit
architecture provides good RF input power handling capability along with a constant output noise and output IP3
characteristic that are desirable for most IF signal chain
applications. The internal control circuitry takes the gain
control signal from the ±VG terminals and converts this
to an appropriate set of control signals to the attenuator
ladder. The attenuator control circuit ensures that the
linear-in-dB gain response is continuous and monotonic
over the gain range for both slow and fast moving input
control signals while exhibiting very little input impedance
variation over gain. These design considerations result
in a gain-vs-VG characteristic with a ±0.1dB ripple and
a 0.5μs gain response time that is slower than a similar
digital step attenuator design.
An often overlooked characteristic of an analog-controlled
VGA is upconverted amplitude modulation (AM) noise
from the gain control terminals. The VGA behaves as a
2-quadrant multiplier, so some minimal care is required
to avoid excessive AM sideband noise generation. The
following table demonstrates the effect of the baseline
20nV/√Hz equivalent input control noise from the LTC6412
circuit along with the effect of a higher combined input
noise due to a noisy external control circuit.
CONTROL INPUT TOTAL NOISE
VOLTAGE (nV/√Hz)
PEAK AM NOISE AT 10kHz OFFSET
NEAR MAXIMUM GAIN (dBc/Hz)
20
–142
40
–136
70
–131
100
–128
200
–122
The baseline equivalent 20nV/√Hz input noise is seen to
produce worst-case AM sidebands of –142dBc/Hz which is
near the –147dBm/Hz output noise floor at maximum gain
for a nominal 0dBm output signal. An input control noise
voltage less than 80nV/√Hz is generally recommended to
avoid measurable AM sideband noise. While op amp control
circuit output noise voltage is usually below 80nV/√Hz,
some low power DAC outputs exceed 150nV/√Hz. DACs
with output noise in the range of 100nV/√Hz to 150nV/√Hz
can usually be accommodated with a suitable 2:1 or 3:1
resistor divider network on the DAC output to suppress the
noise amplitude by the same ratio. Noisy DACs in excess
of 150nV/√Hz should be avoided if minimal AM noise is
important in the application.
6412fa
14
LTC6412
APPLICATIONS INFORMATION
Introduction
Port Characteristics
The LTC6412 is a high linearity, fully-differential analogcontrolled variable-gain amplifier (VGA) optimized for
application frequencies in the range of 1MHz to 500MHz.
The VGA architecture provides a constant OIP3 and constant
output noise level (NF + Gain) over the 31dB gain-control
range and thus exhibits a uniform spurious-free dynamic
range (SFDR) over gain. This constant SFDR characteristic
is ideal for use in receiver IF chains that are upstream from
a signal sink such as a demodulator or ADC.
The LTC6412 provides a nominal 50Ω differential input
impedance and 200Ω differential output impedance over
the operating frequency range.
The low supply voltage requirements and fully differential
design are compatible with many other LTC mixer, amplifier
and ADC products for use in compact, low voltage, fully
differential receiver chains. For non-differential systems,
the 50Ω input impedance and 200Ω output impedance
are easily converted to single-ended 50Ω ports with
inexpensive 1:1 and 4:1 baluns.
Gain Characteristics
The LTC6412 provides a continuously adjustable gain range
of –14dB to 17dB that is linear-in-dB with respect to the
control voltages applied to +VG and –VG. These control
pins can be operated with a differential signal, but it is more
common to operate one of the VG pins with a single-ended
control signal while connecting the other VG pin to the
provided VREF pin. In this way, either a positive gain-control
slope or negative gain-control slope is easily achieved:
Negative Gain-Control Slope. Tie +VG to VREF and apply
gain control voltage to the –VG pin. Gain decreases with
increasing –VG voltage.
Positive Gain-Control Slope. Tie –VG to VREF and apply
gain control voltage to the +VG pin. Gain increases with
increasing +VG voltage.
When connected in this typical single-ended configuration,
the active control input range extends from 0.1V to 1.1V.
This control input range can be extended using a resistor
divider with a suitably low output resistance. For example,
two series resistors of 1k each would extend the control
input range from 0.2V to 2.2V while providing an effective
500Ω Thevinin equivalent source resistance, a relatively
small loading effect compared to the 10k input resistance
of the +VG/–VG terminals.
The input impedance characteristic derives from the
differential attenuator ladder shown in the Block Diagram.
The internal circuit controls the RF connections to this
attenuator ladder and generates the appropriate common
mode DC voltage to this port. The differential attenuator
ladder creates a virtual ground node that needs a capacitor
bypass to ground at the VCM pin to effectively attenuate
any common mode signal presented to the input port.
The +VIN and –VIN pins are connected to the input signal
through DC blocking capacitors as shown in Test Circuit A
and Test Circuit B, Figures 1-4.
The output impedance characteristic derives from the opencollector equivalent circuit shown in Figure 7. The action of
the differential shunt, lowpass filter, and internal feedback
presents an effective differential output impedance of
200Ω to 300Ω between the +OUT and –OUT pins over the
operating band. The +VOUT and –VOUT pins are connected
to the output port using shunt inductors or a transformer
to provide a DC path to the supply voltage. The DC block
to the circuit output is usually accomplished using series
capacitors. These blocking capacitors can be avoided if a
flux transformer is used at the output. Figure 9 illustrates
a few common inductor and balun transformer methods
for coupling the AC signal and DC supply to the output
pins. This is discussed further in the Typical Application
Circuits section.
Power Supplies
Inductance to the supply path can degrade the performance
of the LTC6412. It is recommended that low inductance
bypass capacitors are installed very close to each of
the VCC pins. 1000pF and 0.1μF parallel capacitors are
recommended with the smaller capacitor placed closer to
the VCC pin. Do not leave any supply pins disconnected. For
best performance, DC bias voltage to the +OUT and –OUT
pins must be within 100mV of VCC. The Exposed Pad on
the underside of the package must be connected to ground
with low inductance and low thermal resistance. Refer to
details of DC1464A (Test Circuit A) for an example of proper
6412fa
15
LTC6412
APPLICATIONS INFORMATION
grounding and supply decoupling. Failure to provide low
impedance supply and ground at high frequencies can
cause oscillations and increased distortion.
Enable/Shutdown
Both the EN pin and SHDN pin are self-biased to VCC through
their respective 100k pull-up resistors, so the default
open-pin state is powered on with the output amplifier
signal path disabled. Pulling the EN pin low completes
the signal path from the attenuator ladder through the
output amplifier. The EN pin essentially provides a fast
muting function while the SHDN pin provides slower
power on/off function.
For applications requiring the SHDN function, it is
recommended that the output amplifier signal path be
disabled with a high EN voltage before transitioning the
SHDN signal. When enabling the amplifier, allow at least
5ms dwell time between the rising SHDN transition and the
falling EN transition to avoid non-monotonic output signal
behavior though the VGA. The opposite delay sequence
is recommended for the falling SHDN transition, but this
is less critical as the output signal amplitude will drop
abruptly regardless of the EN pin.
SHDN
tDWELL
tDWELL
6412 AI01
EN
The topside metal and silkscreen drawings for Test Circuit A
illustrate the recommended decoupling capacitor placement, signal routing and grounding. Ground vias directly
beneath the Exposed Pad are critical; use as many as possible.
Ground vias to the other ground pins are less critical.
ESD
The LTC6412 is protected with reverse-biased ESD diodes
on all I/O pins. If any I/O pin is forced one diode drop above
the positive supply or one diode drop below the negative
supply, then large currents may flow through the diodes.
No damage to the devices will occur if the current is kept
below 10 mA. The +OUT/–OUT pins have additional series
diodes to the positive supply and can sustain approximately
2V overshoot above the positive supply before conducting
appreciable currents.
Signal Compression Characteristics
The graph entitled, Input and Output P1dB, illustrates
an important characteristic of the LTC6412 VGA. At gain
settings above –5dB, the output amplifier limits the linear
power handling capability, but at gain settings below
–5dB, the input attenuator ladder limits the linear power
handling capability. The linear input power limitations at
minimum gain do not affect the overall performance of
a signal chain if the preceding mixer or amplifier stage
exhibits an OP1dB < 19dBm and an OIP3 < 50dBm.
Test Circuits
Layout/Grounding
The high frequency performance of the LTC6412 requires
special attention to proper RF grounding, bias decoupling
and termination. The recommended PCB stack-up for a
4-layer board is shown below for 1oz copper clad FR-4
laminate with a relative dielectric constant, εr = 4.2-4.5
at 1GHz.
METAL 1
RF SIGNAL
FR4 12-18 MILS
METAL 2
GROUND PLANE
FR4 20-30 MILS
METAL 3
POWER PLANE
FR4 NOT CRITICAL
METAL 4
6412 AI02
GND AND LF SIGNAL
The fully-differential nature of the LTC6412 design requires
two test circuits to generate the performance information
presented in this data sheet.
Test Circuit A is DC1464A, a 2-port demonstration circuit
with input/output balun transformers to allow for direct
connection to a 2-port network analyzer or other singleended 50Ω test system. The balun transformers limit the
high and low frequency performance of the LTC6412 but
allow for simple and reasonably accurate measurements
from 70MHz to 380MHz. The gain control signal is supplied
to either of the VG turrets for DC control measurements
or through the VGAIN SMA connector for transient control
signal measurements. Clip leads to the gain control turrets
are susceptible to noise pickup and should be lowpass
6412fa
16
LTC6412
APPLICATIONS INFORMATION
filtered to avoid AM upconversion artifacts. While using
the ±VG turrets, a 4.7μF capacitor from the VGAIN SMA
input to ground provides an effective lowpass filter.
electrical characteristics such as low loss, broad band
response and good phase matching.
Typical data curves quoted for Test Circuit A are measured
at the plane of the SMA connectors and are NOT corrected
for any losses introduced by the input and output baluns,
estimated at approximately 0.5dB and 1.2dB, respectively.
All typical AC data reported in this data sheet correspond
to Test Circuit A, except for mixed-mode S-parameters of
the form Sdd21, Scc21, etc.
Test Circuit B uses a 4-port network analyzer to measure
differential mode and common mode S-parameters
beyond the frequency limitations imposed by the balun
transformers and associated circuitry. A matching
calibration set establishes the measurement reference
planes shown in Test Circuit B. The output plane is defined
at the edge of the package while the input plane is defined
at the edge of the input pair of 0402 capacitors. The IC
land and ground via pattern are identical to that shown
for Test Circuit A. The ground via pattern directly beneath
the package is critical to provide the proper RF ground to
produce the RF characteristics quoted in this data sheet.
All mixed-mode S-parameter typical data curves of the
form SxyAB correspond to Test Circuit B following the
definitions described in Figures 5 and 6.
Typical Application Circuits
Grounding and supply decoupling should closely follow the
suggested layout shown for Test Circuit A, but the input
and output networks can be customized to suit various
application requirements.
On the input side, the differential port impedance is
very close to 50Ω over all gain settings and application
frequencies. In a differential signal chain, the differential
input signal is easily supplied from a preceding differential
output stage with a suitable DC blocking capacitor of
approximately 10nF. If the system employs a single-ended
input signal to the VGA, then a suitable balun is required
to convert to a differential input signal. The passive
conversion from 50Ω single-ended to 50Ω differential is
most effectively accomplished with a 1:1 transmission-line
balun such as the ETC1-1-13 or MABA-007159. These 1:1
balun devices are relatively inexpensive and offer excellent
6412 F01
Figure 1. Top Silkscreen for DC1464A. Test Circuit A
On the output side, the differential port admittance is very
close to 300Ω||1.5pF across all gain settings and application
frequencies. This output port circuit must provide a path for
DC output supply current as well as any balun, matching,
or filtering functions required by the application. Thus, the
design options for the output circuitry are more varied. A
brief list of the more common output circuits is shown in
Figure 9 along with a few design guidelines to estimate
component values. Final design simulations should use the
small-signal equivalent circuit model in Figure 8 to properly
account for loading effects of the output terminals.
Figure 9a shows the simplest differential output
configuration employing two suitable inductors, L1 = L2,
to pass the DC supply current without loading the output
nodes at the application frequency. The PCB trace widths
6412fa
17
LTC6412
APPLICATIONS INFORMATION
Figure 9b shows a further variation of the tuned differential
output where the DC blocking capacitors are brought inside
the tank resonator to participate in the bandpass filter and
transform the VGA output impedance to a lower value.
Here too, the CO capacitor can be split into two separate
shunt capacitors to ground, so any common mode noise
is filtered as well.
Figure 9c shows a flux transformer used to achieve a
50Ω single-ended output. The flux transformer does
not provide the large bandwidth typical of the output
transmission-line transformer shown in Figure 3, but it
usually performs well over smaller bandwidths, especially
when tuned with shunt capacitors (not shown). The flux
transformer design eliminates DC blocking capacitors and
is attractive in rugged applications where the amplifier
output is subjected to ESD events and other forms of
transient electrical overstress that do not pass through a
typical RF flux transformer such as the MABAES0061.
6412 F02
Figure 2. Top Metal for DC1464A. Test Circuit A
from the output pins should be narrow in keeping with
the high impedance of these terminals; 8 to 10mil trace
width on 1oz copper is a good choice. The 0.1μF capacitors
serve to DC block and decouple as needed. These capacitor
values are adequate down to a few MHz and can be scaled
down for higher application frequencies.
If bandpass filtering is needed at the VGA output of
Figure 9a, then L1 and L2 can be designed to resonate
with a shunt capacitor, CO, at the frequency of interest,
ω =1/√CO(L1 + L2). Alternately, L1 = L2 can be designed
to resonate with two separate capacitors, C1 = C2, so any
common mode noise is filtered as well.
Figure 9d shows a discrete LC balun suitable for bandwidths
of approximately 15% to 30%. Larger bandwidths are
difficult to achieve with the number of components shown,
and smaller bandwidths are often limited by component
tolerance effects. Despite these limitations, the discrete
LC balun can be a cost effective output circuit solution.
At resonance, the tuned circuit produces an impedance
transformation along with the differential-to-single-ended
conversion.
DC-Coupled Operation
The LTC6412 is intended for AC-coupled operation. The
translation between the fixed input DC common mode
voltage and higher open-collector output DC bias point
makes it impractical to use in DC-coupled applications.
6412fa
18
LTC6412
APPLICATIONS INFORMATION
SHDN EN
VCC
VCC
R1
1k
R2
[1]
R3
[1]
R4
1k
VCC
VCC
C3 0.1μF
R5
1k
C2 1000pF
R7
[1]
5
+IN
0dB
4
1
C8
10nF
2
2
3
3
R9
0Ω
4
5
C11
10nF
6
VCC
C14
0.1μF
22
21
CB1
4.7μF
19
T2
4:1
C13
1000pF
–IN
16
–OUT
LTC6412
VCM
GND
VCM
DECL2
VCC
VCC
8
9
10
R15 0Ω
11
4
1
C6
0.1μF
C20
[1]
C9
[1]
2
5
•
+OUT
–OUT
C21
0.1μF
15
14
13
C12
1000pF
VCC
C16
1000pF
DECL1 GND +VG VREF –VG GND
7
VCC
C7 0.1μF
17
+OUT
+IN
3
18
GND
VCC
12
C15
0.1μF
BALUN
PART NUMBER
T1, T3, T4
TYCO MABA-007159
T2
MINI-CIRCUITS TCM4-19+
R14 [1]
C22
0.1μF
R17
100Ω
CA1
1μF
+VG
R20
100Ω
R18 [1]
–VG
R19 0Ω
VGAIN
NOTE:
[1] DO NOT PLACE
5
TEST IN
•
T3
1:1
C18 0.1μF
1
•
3
2
2
C19 0.1μF
T4
1:1
1
3
4
•
4
•
TEST OUT
5
R21
0Ω
R22
0Ω
6412 F03
Figure 3. Demo Board DC1464A Circuit Schematic. Test Circuit A
INPUT REF
PLANE
3.3V
OUTPUT REF
PLANE
0.1μF
1nF
+IN
10nF
PORT 2
50Ω
EN
10nF
PORT 1
50Ω
SHDN
1/2 AGILENT
E5071C
VCC
3.00V TO 3.60V
GND
20
GND
C17
0.1μF
VCC
C2 1000pF
VCC GND SHDN EN GND VCC
1
•
23
R6
1k
+OUT
LTC6412
GND
VCM
DECL1
DECL2
+VG
VREF
–VG
–IN
•
T1
1:1
24
C5
10nF
C4 0.1μF
–IN
10nF
IDC
PORT 3
50Ω
IDC
–OUT
0.1μF
0.1μF
1/2 AGILENT
E5071C
GAIN CONTROL
(– SLOPE MODE)
PORT 4
50Ω
6412 F04
0.1μF
Figure 4. 4-Port Analysis Schematic. Test Circuit B
6412fa
19
LTC6412
APPLICATIONS INFORMATION
DIFFERENTIAL
MODE
PORT 1
50Ω
COMMON
MODE
PORT 1
+IN
12.5Ω
–IN
1:1
IDEAL
TRANSFORMER WITH CENTER TAP
+OUT
DIFFERENTIAL
MODE
PORT 2
COMMON
MODE
PORT 2
200Ω
50Ω
DUT
–OUT
6412 F05
1:1
IDEAL
TRANSFORMER WITH CENTER TAP
Figure 5. Schematic of Mixed-Mode S-Parameters Reported for Test Circuit B
S xyAB
STIMULUS PORT NUMBER
RESPONSE PORT NUMBER
STIMULUS PORT MODE
RESPONSE PORT MODE
MODE
S xyAB
=
d: DIFFERENTIAL MODE (BALANCED)
c: COMMON MODE (BALANCED)
x MODE SIGNAL OUTPUT ON PORT A
y MODE SIGNAL INPUT ON PORT B
6412 F06
Figure 6. Definition of Mixed-Mode S-Parameters Reported for Test Circuit B
5Ω
IDEAL 1:1
TRANSFORMER
WITH
CENTER TAP 1nH
5Ω
+OUT
0.3pF
8pF
+OUT
gm
150Ω
300Ω
1.5pF
ZOUT
1nH
–OUT
TO BUFFER
AMP
DIFFERENTIAL
MODE ADMITTANCE
0.3pF
5Ω
150Ω
COMMON MODE
ADMITTANCE
5Ω
6412 F06
–OUT
LOWPASS FILTER
Figure 7. Large-Signal Output Equivalent Circuit Schematic
190Ω
175Ω
5pF
4pF
6412 F08
Figure 8. Small-Signal Output Equivalent Circuit Model
6412fa
20
LTC6412
APPLICATIONS INFORMATION
10mil
LINE WIDTH
+OUT
(a)
C1 0.1μF
L1 = L2
C1 = C2
L1
VCC
LTC6412
CO
ZOUT = 200Ω
DIFFERENTIAL
0.1μF
NOTE: DASHED LINE COMPONENTS
ARE FOR BANDPASS FILTERING
(SEE TEXT)
0.1μF
–OUT
L2
C2
C1
L1 = L2
C1 = C2
+OUT
(b)
L1
VCC
AT RESONANCE,
CO
LTC6412
0.1μF
–OUT
L2
C2
2
1
CO
200Ω
ZOUT =
1 + 1 + 1
C1 C2 CO
DIFFERENTIAL
T2
4:1
+OUT
(c)
VCC
T2 = MABAES0061
ZOUT = 50Ω
SINGLE ENDED
LTC6412
–OUT
0.1μF
VCC
0.1μF
L1
LCHOKE
+OUT
(d)
C1
0.1μF
LTC6412
–OUT
L1 = L2 = L
C1 = C2 = C
fO =
1
2π√LC
1
2πfOC
AT RESONANCE,
XC =
XC2
200Ω
SINGLE ENDED
L2
ZOUT =
C2 LC
BALUN
6412 F09
Figure 9. Output AC/DC Coupling, Filter and Balun Circuit Design Options
6412fa
21
LTC6412
PACKAGE DESCRIPTION
UF Package
24-Lead Plastic QFN (4mm × 4mm)
(Reference LTC DWG # 05-08-1697)
0.70 p0.05
4.50 p 0.05
2.45 p 0.05
3.10 p 0.05 (4 SIDES)
PACKAGE OUTLINE
0.25 p0.05
0.50 BSC
RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS
4.00 p 0.10
(4 SIDES)
BOTTOM VIEW—EXPOSED PAD
R = 0.115
TYP
0.75 p 0.05
PIN 1 NOTCH
R = 0.20 TYP OR
0.35 s 45o CHAMFER
23 24
PIN 1
TOP MARK
(NOTE 6)
0.40 p 0.10
1
2
2.45 p 0.10
(4-SIDES)
(UF24) QFN 0105
0.200 REF
0.00 – 0.05
0.25 p 0.05
0.50 BSC
NOTE:
1. DRAWING PROPOSED TO BE MADE A JEDEC PACKAGE OUTLINE MO-220 VARIATION (WGGD-X)—TO BE APPROVED
2. DRAWING NOT TO SCALE
3. ALL DIMENSIONS ARE IN MILLIMETERS
4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE
MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.15mm ON ANY SIDE, IF PRESENT
5. EXPOSED PAD SHALL BE SOLDER PLATED
6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION
ON THE TOP AND BOTTOM OF PACKAGE
6412fa
22
LTC6412
REVISION HISTORY
REV
DATE
DESCRIPTION
A
4/10
Change TCGAIN Typical to –0.007dB/°C in DC Electrical Characteristics
PAGE NUMBER
3
6412fa
Information furnished by Linear Technology Corporation is believed to be accurate and reliable.
However, no responsibility is assumed for its use. Linear Technology Corporation makes no representation that the interconnection of its circuits as described herein will not infringe on existing patent rights.
23
LTC6412
RELATED PARTS
PART NUMBER
DESCRIPTION
COMMENTS
Fixed Gain IF Amplifiers/ADC Drivers
LT1993-2, LT1993-4,
LT1993-10
800MHz Differential Amplifier/ADC Drivers
–72dBc IM3 at 70MHz 2VP-P Composite, AV = 2V/V, 4V/V, 10V/V
LTC6400-8, LTC6400-14, 1.8GHz Low Noise, Low Distortion Differential
LTC6400-20, LTC6400-26 ADC Drivers
–71dBc IM3 at 240MHz 2VP-P Composite, IS = 90mA, AV = 8dB, 14dB,
20dB, 26dB
LTC6401-8, LTC6401-14, 1.3GHz Low Noise, Low Distortion Differential
LTC6401-20, LTC6401-26 ADC Drivers
–74dBc IM3 at 140MHz 2VP-P Composite, IS = 50mA, AV = 8dB, 14dB,
20dB, 26dB
LT6402-6, LT6402-12,
LT6402-20
300MHz Differential Amplifier/ADC Drivers
–71dBc IM3 at 20MHz 2VP-P Composite, AV = 6dB, 12dB, 20dB
LTC6410-6
1.4GHz Differential IF Amplifier with Configurable
Input Impedance
OIP3 = 36dBm at 70MHz, Flexible Interface to Mixer IF Port
LTC6416
2GHz, 16-Bit Differential ADC Buffer
–72dBc IM2 at 300MHz 2VP-P Composite, IS = 42mA, eN = 2.8nV/√Hz,
AV = 0dB, 300MHz ±0.1dB Bandwidth
LTC6420-20
Dual 1.8GHz Low Noise, Low Distortion
Differential ADC Drivers
Dual Version of the LTC6400-20, AV = 20dB
LTC6421-20
Dual 1.3GHz Low Noise, Low Distortion
Differential ADC Drivers
Dual Version of the LTC6401-20, AV = 20dB
IF Amplifiers/ADC Drivers with Digitally Controlled Gain
LT5514
Ultralow Distortion IF Amplifier/ADC Driver with
Digitally Controlled Gain
OIP3 = 47dBm at 100MHz, Gain Range 10.5dB to 33dB by 1.5dB
LT5524
Low Distortion IF Amplifier/ADC Driver with
Digitally Controlled Gain
OIP3 = 40dBm at 100MHz, Gain Range 4.5dB to 37dB by 1.5dB
LT5554
High Dynamic Range 7-Bit Digitally Controlled IF
VGA/ADC Driver
OIP3 = 46dBm at 200MHz, Gain Range 1.725 to 17.6dB by 0.125dB
Baseband Differential Amplifiers
LT1994
Low Noise, Low Distortion Differential
Amplifier/ADC Driver
16-Bit SNR, SFDR at 1MHz, Rail-to-Rail Outputs
LTC6403-1
Low Noise Rail-to-Rail Output Differential
Amplifier/ADC Driver
16-Bit SNR, SFDR at 3MHz, Rail-to-Rail Outputs, eN = 2.8nV/√Hz
LTC6404-1, LTC6404-2
Low Noise Rail-to-Rail Output Differential
Amplifier/ADC Driver
16-Bit SNR, SFDR at 10MHz, Rail-to-Rail Outputs, eN = 1.5nV/√Hz,
LTC6404-1 is Unity-Gain Stable, LTC6404-2 is Gain-of-2 Stable
LTC6406
3GHz Rail-to-Rail Input Differential Amplifier/ADC –65dBc IM3 at 50MHz 2VP-P Composite, Rail-to-Rail Inputs,
Driver
eN = 1.6nV/√Hz, 18mA
LT6411
Low Power Differential ADC Driver/Dual
Selectable Gain Amplifier
–83dBc IM3 at 70MHz 2VP-P Composite, AV = 1, –1 or 2, 16mA, Excellent
for Single-Ended to Differential Conversion
Low Noise DAC for Gain Control
LTC2630-10
Low Power, Internal Reference, Single Supply
10-Bit DAC
SPI Input, 2.5V Output Range, Resistor Divide Output by ~2:1
LTC2640-10
Low Power, Internal Reference, Single Supply
10-Bit DAC
SPI Input, 2.5V Output Range, Resistor Divide Output by ~2:1
LTC2641-12
Low Noise, Low Power, Single Supply 12-Bit DAC SPI Input, Low Glitch Impulse, Power-On to Zero-Scale
LTC2642-12
Low Noise, Low Power, Single Supply 12-Bit DAC SPI Input, Low Glitch Impulse, Power-On to Mid-Scale
6412fa
24 Linear Technology Corporation
LT 0410 REV A • PRINTED IN USA
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