BLM8AD22S-60ABG
LDMOS 2-stage integrated Doherty MMIC
Rev. 2 — 11 April 2019
Product data sheet
1. Product profile
1.1 General description
The BLM8AD22S-60ABG is a dual section solution using Ampleon’s state of the art GEN8
LDMOS technology. It includes a 45 W 2-stage fully integrated Doherty MMIC in
section A, and a 15 W, 2-stage MMIC in section B, allowing a 3-way 1:2:1 Doherty when
both sections are externally combined. The carrier and peaking devices, input splitter and
output combiner, of the 2-stage fully integrated Doherty MMIC of section A are integrated
in package. This device is perfectly suited as final stage in massive MIMO or small cell
applications in the frequency range from 2100 MHz to 2200 MHz. Available in gull wing.
Table 1.
Performance
Typical RF performance at Tcase = 25 C; IDq = 105 mA (driver and final stages);
VGS(peak)(A) = VGS(carrier)(A) 0.65 V; VGS(peak)(B) = VGS(carrier)(A) 1.25 V. Single carrier LTE; carrier
spacing = 20 MHz; PAR = 7.6 dB at 0.01 % probability on CCDF.
Test signal
f
VDS
PL(AV)
(MHz)
(V)
(W)
single carrier LTE 20 MHz
2140
28
10
D
ACPR5M
(dB)
(%)
(dBc)
28.2
46.7
34.7
Gp
1.2 Features and benefits
Integrated input splitter in section A
Integrated output combiner in section A
Very high efficiency thanks to 3-way Doherty architecture
Designed for broadband operation (frequency 2100 MHz to 2200 MHz)
Integrated temperature compensated bias
Independent control of carrier and peaking bias
Integrated ESD protection
Excellent thermal stability
Source impedance 50 ; high power gain
For RoHS compliance see the product details on the Ampleon website
1.3 Applications
RF power MMIC for multi-carrier and multi-standard GSM, W-CDMA and LTE base
stations in the 2100 MHz to 2200 MHz frequency range
BLM8AD22S-60ABG
LDMOS 2-stage integrated Doherty MMIC
2. Pinning information
2.1 Pinning
pin 1 index
VDS(A1)
VGS(A_P)
VGS(A_C)
RF_IN_A
n.c.
n.c.
n.c.
n.c.
n.c.
n.c.
RF_IN_B
n.c.
VGS(B_P)
VDS(B1)
1
2
3
4
5
6
7
16
RF_OUT_
VDS(A2)
8
9
10
11
12
13
14
15
RF_OUT_
VDS(B2)
amp00859
Transparent top view
The exposed backside of the package is the ground terminal of the device.
Fig 1.
Pin configuration
2.2 Pin description
Table 2.
BLM8AD22S-60ABG
Product data sheet
Pin description
Symbol
Pin
Description
VDS(A1)
1
drain-source voltage of driver stages of section A
VGS(A_P)
2
gate-source voltage of peaking A_P
VGS(A_C)
3
gate-source voltage of carrier A_C
RF_IN_A
4
RF input section A
n.c.
5
not connected
n.c.
6
not connected
n.c.
7
not connected
n.c.
8
not connected
n.c.
9
not connected
n.c.
10
not connected
RF_IN_B
11
RF input section B
n.c.
12
not connected
VGS(B_P)
13
gate-source voltage of peaking B_P
VDS(B1)
14
drain-source voltage of driver stages of section B
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Rev. 2 — 11 April 2019
© Ampleon Netherlands B.V. 2019. All rights reserved.
2 of 19
BLM8AD22S-60ABG
LDMOS 2-stage integrated Doherty MMIC
Table 2.
Pin description …continued
Symbol
Pin
Description
RF_OUT_B/VDS(B2)
15
RF output section B / drain-source voltage of final stages of
section B
RF_OUT_A/VDS(A2)
16
RF output section A / drain-source voltage of final stages of
section A
GND
flange
RF ground
3. Ordering information
Table 3.
Ordering information
Type number
Package
Name Description
BLM8AD22S-60ABG
-
Version
plastic, heatsink small outline package; 16 leads OMP-780-16G-1
4. Limiting values
Table 4.
Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol
Parameter
Conditions
Min
Max
Unit
VDS
drain-source voltage
-
65
V
VGS
gate-source voltage
0.5
+13
V
Tstg
storage temperature
65
+150
C
-
225
C
-
150
C
Tj
junction temperature
Tcase
case temperature
[1]
[1]
Continuous use at maximum temperature will affect the reliability. For details refer to the online MTF
calculator.
5. Thermal characteristics
Table 5.
Thermal characteristics
Measured for total device.
Symbol Parameter
Rth(j-c)
[1]
BLM8AD22S-60ABG
Product data sheet
Conditions
Value Unit
thermal resistance from junction to case Tcase = 90 C
[1]
section A: PL = 7.08 W
1.86
K/W
section B: PL = 2.51 W
3.48
K/W
When operated with a 1-carrier W-CDMA with PAR = 9.9 dB.
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Rev. 2 — 11 April 2019
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3 of 19
BLM8AD22S-60ABG
LDMOS 2-stage integrated Doherty MMIC
6. Characteristics
Table 6.
DC characteristics
Tcase = 25 C; per section unless otherwise specified.
Symbol Parameter
Conditions
Min
Typ Max
Unit
Section A
Carrier
VGSq
gate-source quiescent voltage
VDS = 28 V; ID = 90 mA
1.5
2.2
2.65
V
IGSS
gate leakage current
VGS = 1 V; VDS = 0 V
-
-
140
nA
VGSq
gate-source quiescent voltage
VDS = 28 V; ID = 90 mA
1.3
1.7
2.0
V
IGSS
gate leakage current
VGS = 1 V; VDS = 0 V
-
-
140
nA
VGS = 0 V; VDS = 28 V
-
-
1.4
A
VGS = 0 V; VDS = 28 V
-
-
1.4
A
Peaking
Final stages
IDSS
drain leakage current
Driver stages
IDSS
drain leakage current
Section B
Peaking
VGSq
gate-source quiescent voltage
VDS = 28 V; ID = 110 mA
1.5
2.2
2.65
V
IGSS
gate leakage current
VGS = 1 V; VDS = 0 V
-
-
140
nA
VGS = 0 V; VDS = 28 V
-
-
1.4
A
VGS = 0 V; VDS = 28 V
-
-
1.4
A
Final stages
IDSS
drain leakage current
Driver stages
IDSS
drain leakage current
Table 7.
RF Characteristics
Typical RF performance at Tcase = 25 C; VDS = 28 V; tp = 100 s; = 10 %; f = 2170 MHz.
Test signal: pulsed CW.
Symbol
Parameter
Conditions
Min
Typ
Max
Unit
26.8
28.8
30.8
dB
PL = 4 W
33
38
-
%
PL = PL(3dB)
45
50
-
%
Section A
IDq = 90 mA (carrier); PL(AV) = 4 W; VGSq(peaking) = VGSq(carrier) 0.45 V.
Gp
power gain
D
drain efficiency
RLin
input return loss
-
15
10
dB
PL(3dB)
output power at 3 dB gain compression
45
46.1
-
dBm
Section B
IDq = 110 mA; PL(AV) = 6.3 W.
BLM8AD22S-60ABG
Product data sheet
Gp
power gain
D
drain efficiency
30.3
31.8
33.3
dB
PL = 6.3 W
30
35
-
%
PL = PL(3dB)
43
48
-
%
RLin
input return loss
-
15
10
dB
PL(3dB)
output power at 3 dB gain compression
40.8
41.4
-
dBm
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Rev. 2 — 11 April 2019
© Ampleon Netherlands B.V. 2019. All rights reserved.
4 of 19
BLM8AD22S-60ABG
LDMOS 2-stage integrated Doherty MMIC
7. Application information
Table 8.
Typical performance
Tcase = 25 C; VDS = 28 V; IDq = 105 mA (driver and final stages). Test signal: 1-carrier LTE; PAR = 7.6 dB; unless otherwise
specified, measured in an Ampleon 2110 MHz to 2170 MHz frequency band combined integrated Doherty application circuit.
Symbol
Parameter
PL(3dB)
output power at 3 dB gain compression f = 2140 MHz
Conditions
Min Typ
Max Unit
[1]
-
47.9
-
[2]
-
23.7 -
dBm
s21/s21(norm) normalized phase response
f = 2140 MHz at 3 dB compression
point
D
drain efficiency
8.5 dB OBO (PL(AV) = 40 dBm;
PL(M) = 48.5 dBm); f = 2140 MHz
-
46.7
-
%
Gp
power gain
PL(AV) = 40 dBm; f = 2140 MHz
-
28.2
-
dB
Bvideo
video bandwidth
PL(AV) = 38 dBm set to obtain
IMD3 = 32 dBc; 2-tone CW;
f = 2140 MHz
-
180
-
MHz
Gflat
gain flatness
PL(AV) = 40 dBm; f = 2110 MHz to
2170 MHz
-
0.2
-
dB
ACPR20M
adjacent channel power ratio (20M)
PL(AV) = 40 dBm; f = 2140 MHz
-
34.7 -
dBc
G/T
gain variation with temperature
f = 2140 MHz
-
0.047 -
dB/C
-
0.042 -
dB/C
section A: Tcase = 40 C
-
>2.5
-
section B: Tcase > 0 C
-
>1
-
[3]
section A
section B
K
[1]
Rollett stability factor
f = 0.3 GHz to 6 GHz
[3]
Pulsed CW power sweep measurement ( = 10 %; tp = 100 s).
[2]
25 ms CW power sweep measurement.
[3]
S-parameters measured with dual path broadband demo board.
BLM8AD22S-60ABG
Product data sheet
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Rev. 2 — 11 April 2019
© Ampleon Netherlands B.V. 2019. All rights reserved.
5 of 19
BLM8AD22S-60ABG
LDMOS 2-stage integrated Doherty MMIC
50 mm
R2
R3
C1
C1
R1
FB1
C4 C4 C4 C4
C3
C2
C5
C6
80 mm
C5
C5
C7
X1
TM1
C5
C2
C1 R1
R3
FB1
C3
C4 C4 C4 C4
amp00860
Printed-Circuit Board (PCB): Rogers 4350; thickness = 0.508 mm.
See Table 9 for a list of components.
Fig 2.
Component layout
Table 9.
List of components
See Figure 2 for component layout.
BLM8AD22S-60ABG
Product data sheet
Component
Description
Value
Remarks
C1
multilayer ceramic chip capacitor
10 F, 10 V
Murata: SMD 0603
C2
multilayer ceramic chip capacitor
10 F, 35 V
TDK: SMD 0805
C3
multilayer ceramic chip capacitor
15 pF
Murata: SMD 0805
C4
multilayer ceramic chip capacitor
10 F, 50 V
Murata: SMD 1206
C5
multilayer ceramic chip capacitor
2.4 pF
Murata: SMD 0603
C6
multilayer ceramic chip capacitor
4.3 pF
Murata: SMD 0805
C7
multilayer ceramic chip capacitor
2.4 pF
Murata: SMD 0805
FB1
resistor
30
Murata: BLE32PN300SN1L
R1
resistor
5.1
Multicomp: SMD 0603
R2
resistor
15 k
Multicomp: SMD 0603
R3
resistor
825
Multicomp: SMD 0603
TM1
resistor
50
Multicomp: SMD 0603
X1
Hybrid coupler
2 dB
Anaren: X3C20F1-02S
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Rev. 2 — 11 April 2019
© Ampleon Netherlands B.V. 2019. All rights reserved.
6 of 19
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BLM8AD22S-60ABG
Product data sheet
28 V
C4
C2
C1
C4
C3
1
VGS(A_P)
C4 C4
BLM8AD22S-60ABG
VDS(A1)
R2
VGS(A_P)
R1
RF_OUT
2
Bias Peak
VGS(A_C)
VGS(A_C)
R3
3
R1
C1
Rev. 2 — 11 April 2019
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RF_IN_A
4
n.c.
5
n.c.
6
C5
RF_IN
n.c.
RF_OUT_
Bias Carrier
Asymmetric Doherty
7
VDS(A2)
C6
16
C5
C5
X1
2 dB Hybrid
Coupler
TM1
n.c.
C7
8
15
n.c.
10
RF_OUT_
VDS(B2)
C5
11
RF_IN_B
n.c.
R1
VGS(B_P)
12
Bias Carrier
VGS(B_P)
7 of 19
© Ampleon Netherlands B.V. 2019. All rights reserved.
13
R3
Class AB
VDS(B1)
C1
14
C3
C2
C4
28 V
Fig 3.
Electrical schematic
C4 C4
C4
amp00936
BLM8AD22S-60ABG
9
LDMOS 2-stage integrated Doherty MMIC
n.c.
BLM8AD22S-60ABG
LDMOS 2-stage integrated Doherty MMIC
7.1 Ruggedness
The BLM8AD22S-60ABG is capable of withstanding a load mismatch corresponding to
VSWR = 10 : 1 through all phases under the following conditions: VDS = 32 V;
IDq = 90 mA (carrier section A); VGSq(peaking) = VGSq(carrier) 0.45 V (section A);
IDq = 110 mA (section B); Pi corresponding to PL(5dB) OBO under ZS = 50 load;
f = 2170 MHz (1-carrier W-CDMA; PAR = 9.9 dB); Tcase = 25 C per section unless
otherwise specified.
7.2 Impedance information
Table 10. Typical impedance for optimum Doherty operation (section A)
Measured load-pull data; test signal: pulsed CW; Tcase = 25 C; VDS = 28 V; IDq = 90 mA (carrier);
VGSq(peaking) = VGSq(carrier) 0.45 V; ZS = 50 ; tp = 100 s; = 10 %. Typical values unless otherwise specified.
tuned for optimum Doherty operation
f
ZL
Gp(max)
PL
add [1]
add [2]
(MHz)
()
(dB)
(dBm)
(%)
(%)
2110
2.70 j6.46
30.28
46.79
49.7
46.7
2140
2.69 j6.42
29.85
46.68
50.6
46.5
2170
3.19 j6.58
29.66
46.50
50.9
46.2
Section A
[1]
at 3 dB compression point.
[2]
at 38.5 dBm (nearly 8 dB OBO point).
Table 11. Typical impedance (section B)
Measured load-pull data at 3 dB gain compression point; test signal: pulsed CW; Tcase = 25 C; VDS = 28 V; IDq = 110 mA;
ZS = 50 ; tp = 100 s; = 10 %. Typical values unless otherwise specified
f
tuned for maximum output power
(MHz)
tuned for maximum drain efficiency
ZL
Gp(max)
PL
D
AM/PM [1]
ZL
Gp(max)
PL
D
AM/PM [1]
()
(dB)
(dBm)
(%)
()
()
(dB)
(dBm)
(%)
()
Section B
2110
5.46 j3.02
33.98
42.31
55
2.5
3.32 j1.25
35.85
41.18
61.1
6.9
2140
6.20 j3.28
33.48
42.27
53
1.7
3.87 j1.43
35.40
41.47
60.4
5.1
2170
6.25 j3.27
33.37
42.25
53.1
1.8
3.30 j1.22
35.93
40.84
59.7
5.7
[1]
AM/PM conversion.
BLM8AD22S-60ABG
Product data sheet
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Rev. 2 — 11 April 2019
© Ampleon Netherlands B.V. 2019. All rights reserved.
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BLM8AD22S-60ABG
LDMOS 2-stage integrated Doherty MMIC
7.3 Graphs
amp00937
30
Gp
(dB)
-10
(1)
-5
-10
-20
-15
-30
-30
-25
-40
3000
-35
-50
1800
2000
2200
2400
2600
amp00938
5
RLin ____ φs21/φs21(norm)
(dB)
(deg)
(2)
10
0
2800
f (MHz)
(3)
(2)
(1)
26
Tcase = 25 °C; VDS = 28 V;
IDq1 + IDq2 = 105 mA (carrier and peaking stages);
VGS(carrier)(A) = 2.65 V (carrier stage)
VGS(peak)(A) = 2 V (peaking 1 stage)
VGS(peak)(B) = 1.4 V (peaking 2 stage)
Test signal: CW
30
34
38
42
46
PL (dBm)
50
Tcase = 25 °C; VDS = 28 V;
IDq1 + IDq2 = 105 mA (carrier and peaking stages);
VGS(carrier)(A) = 2.65 V (carrier stage)
VGS(peak)(A) = 2 V (peaking 1 stage)
VGS(peak)(B) = 1.4 V (peaking 2 stage)
Test signal: 25 ms CW power sweep
(1) magnitude of Gp
(1) f = 2110 MHz
(2) magnitude of RLin
(2) f = 2140 MHz
(3) f = 2170 MHz
Fig 4.
Wideband power gain and input return loss as
function of frequency; typical values
BLM8AD22S-60ABG
Product data sheet
Fig 5.
Normalized phase response as a function of
output power; typical values
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Rev. 2 — 11 April 2019
© Ampleon Netherlands B.V. 2019. All rights reserved.
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BLM8AD22S-60ABG
LDMOS 2-stage integrated Doherty MMIC
amp00939
30
Gp
(dB)
29
Gp
60
ηD
(%)
(1)
(2)
(3)
50
28
40
(1)
(2)
(3)
27
30
26
20
ηD
25
10
24
0
26
30
34
38
42
46
PL (dBm)
50
Tcase = 25 °C; VDS = 28 V;
IDq1 + IDq2 = 105 mA (carrier and peaking stages);
VGS(carrier)(A) = 2.65 V (carrier stage)
VGS(peak)(A) = 2 V (peaking 1 stage)
VGS(peak)(B) = 1.4 V (peaking 2 stage)
Test signal: pulsed CW power sweep ( = 10 %; tp = 100 s).
(1) f = 2110 MHz
(2) f = 2140 MHz
(3) f = 2170 MHz
Fig 6.
Power gain and drain efficiency as function of output power; typical values
amp00940
-10
IMD
(dBc)
-20
(1)
(2)
IMD3
-30
IMD7
-40
(1)
IMD5
-50
(1)
(2)
(2)
-60
-70
1
102
10
tone spacing (MHz)
103
Tcase = 25 °C; VDS = 28 V; PL(AV) = 6.3 W;
IDq1 + IDq2 = 105 mA (carrier and peaking stages);
VGS(carrier)(A) = 2.65 V (carrier stage)
VGS(peak)(A) = 2 V (peaking 1 stage)
VGS(peak)(B) = 1.4 V (peaking 2 stage)
Test signal: 2-tone power sweep; fc = 2140 MHz
(1) IMD low
(2) IMD high
Fig 7.
Intermodulation distortion as a function of tone spacing; typical values
BLM8AD22S-60ABG
Product data sheet
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Rev. 2 — 11 April 2019
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BLM8AD22S-60ABG
LDMOS 2-stage integrated Doherty MMIC
amp00941
30
Gp
(dB)
29
(1)
(2)
(3)
Gp
60
ηD
(%)
(1)
(2)
(3)
50
28
amp00942
-20
ACPR20M
(dBc)
(1)
(2)
(3)
-30
-30
40
-40
27
30
26
20
-40
ACPR20M
(1)
(2)
(3)
-50
-50
ACPR40M
ηD
25
-60
10
24
0
30
32
34
36
38
40
42
44
PL (dBm)
-60
-70
46
-70
25
Tcase = 25 °C; VDS = 28 V;
IDq1 + IDq2 = 105 mA (carrier and peaking stages);
VGS(carrier)(A) = 2.65 V (carrier stage)
VGS(peak)(A) = 2 V (peaking 1 stage)
VGS(peak)(B) = 1.4 V (peaking 2 stage)
1-carrier LTE; PAR = 7.6 dB at 0.01 % probability CCDF.
29
(1) f = 2110 MHz
(2) f = 2140 MHz
(2) f = 2140 MHz
(3) f = 2170 MHz
(3) f = 2170 MHz
Power gain and drain efficiency as function of
output power; typical values
BLM8AD22S-60ABG
Product data sheet
33
37
41
PL (dBm)
45
Tcase = 25 °C; VDS = 28 V;
IDq1 + IDq2 = 105 mA (carrier and peaking stages);
VGS(carrier)(A) = 2.65 V (carrier stage)
VGS(peak)(A) = 2 V (peaking 1 stage)
VGS(peak)(B) = 1.4 V (peaking 2 stage)
1-carrier LTE; PAR = 7.6 dB at 0.01 % probability CCDF.
(1) f = 2110 MHz
Fig 8.
-20
ACPR40M
(dBc)
Fig 9.
Adjacent channel power ratio as a function of
output power; typical values
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Rev. 2 — 11 April 2019
© Ampleon Netherlands B.V. 2019. All rights reserved.
11 of 19
BLM8AD22S-60ABG
LDMOS 2-stage integrated Doherty MMIC
amp00943
8.5
PARO
(dB)
7.5
(1)
(2)
(3)
PARO
6.5
50
PL(M)
(dBm)
47.5
45
5.5
42.5
(1)
(2)
(3)
4.5
3.5
40
37.5
PL(M)
2.5
35
30
32
34
36
38
40
42
44
PL (dBm)
46
Tcase = 25 °C; VDS = 28 V;
IDq1 + IDq2 = 105 mA (carrier and peaking stages);
VGS(carrier)(A) = 2.65 V (carrier stage)
VGS(peak)(A) = 2 V (peaking 1 stage)
VGS(peak)(B) = 1.4 V (peaking 2 stage)
1-carrier LTE; PAR = 7.6 dB at 0.01 % probability CCDF.
(1) f = 2110 MHz
(2) f = 2140 MHz
(3) f = 2170 MHz
Fig 10. Output peak-to-average ratio and peak output power as function of output power; typical values
BLM8AD22S-60ABG
Product data sheet
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Rev. 2 — 11 April 2019
© Ampleon Netherlands B.V. 2019. All rights reserved.
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BLM8AD22S-60ABG
LDMOS 2-stage integrated Doherty MMIC
8. Package outline
OMP-780-16G-1
(18.01)
0.22 B0.05
(15.44)
(2.15)
(0.75)
7.45
16
A
L 0.05 A
15
13.2 B0.3
9.78
9.96(1)
16
(4.47)
(7.04)
R1.38
P2 0.1Z
R0.16 max.
14
1
1 (12x)
C
metal protrusion 4x
(ground) in corners (2)
1.5
0.35 (14x) (3)
L 0.25 B
20.75 (1)
L 0.05 B
R1
DETAIL C
SCALE 25:1
+0.08
3.92 0.03
R0.32
B
20.57
0.10
0.95 B0.15
H
+4°
3.0° - 3°
Min. 5.5
Min. 7.8
(0.20) compound rim all around the
perimeter of the heatsink
+0.06
0.00 - 0.02 (6)
pin 17 (4)
Gage plane
0.35 (7)
R0.60 (4x)
L 0.25 B
Seating plane
5.5 (3)
Min. 15.5
Min. 18.5
Package outline drawing:
units in mm.
Tolerances unless otherwise stated:
Revision:
Angle: B 1° Revision date:
Dimension: B 0.05
OMP-780-16G-1
Third angle projection
0
3/1/2018
Sheet 1 of 2
Fig 11. Package outline OMP-780-16G-1 (sheet 1 of 2)
BLM8AD22S-60ABG
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 2 — 11 April 2019
© Ampleon Netherlands B.V. 2019. All rights reserved.
13 of 19
BLM8AD22S-60ABG
LDMOS 2-stage integrated Doherty MMIC
OMP-780-16G-1
Drawing Notes
Description
Items
Dimensions are excluding mold protrusion. Areas located adjacent to the leads have a maximum mold protrusion of 0.25
(1)
mm (per side) and 0.62 mm max. in length. In between the 14 leads the protrusion is 0.25 mm max. At all other areas the
mold protrusion is maximum 0.15 mm per side. See also detail B.
(2)
The metal protrusion (tie bars) in the corner will not stick out of the molding compound protrusions (detail A).
(3)
The lead dambar (metal) protrusions are not included. Add 0.14 mm max to the total lead dimension at the dambar location.
(4)
The hatched area indicated the exposed heatsink.
(5)
The leads and exposed heatsink are plated with matte Tin (Sn).
Dimension is measured with respect to the bottom of the heatsink Datum H. Positive value means that the bottom of the
(6)
heatsink is higher than the bottom of the lead.
(7)
Gage plane (foot length) to be measured from the seating plane.
location of metal protrusion (2)
B
DETAIL A
SCALE 25:1
A
0.6
2m
ax
.
(1)
lead dambar
location
5
0.2
1)
x.(
ma
5
0.1
ma
x.
(1)
DETAIL B
SCALE 50:1
Package outline drawing:
units in mm.
Tolerances unless otherwise stated:
Revision:
Angle: B 1° Revision date:
Dimension: B 0.05
OMP-780-16G-1
Third angle projection
0
3/1/2018
Sheet 2 of 2
Fig 12. Package outline OMP-780-16G-1 (sheet 2 of 2)
BLM8AD22S-60ABG
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 2 — 11 April 2019
© Ampleon Netherlands B.V. 2019. All rights reserved.
14 of 19
BLM8AD22S-60ABG
LDMOS 2-stage integrated Doherty MMIC
9. Handling information
CAUTION
This device is sensitive to ElectroStatic Discharge (ESD). Observe precautions for handling
electrostatic sensitive devices.
Such precautions are described in the ANSI/ESD S20.20, IEC/ST 61340-5, JESD625-A or
equivalent standards.
Table 12.
ESD sensitivity
ESD model
Class
Charged Device Model (CDM); According to ANSI/ESDA/JEDEC standard JS-002
C1 [1]
Human Body Model (HBM); According to ANSI/ESDA/JEDEC standard JS-001
1A [2]
[1]
CDM classification C1 is granted to any part that passes after exposure to an ESD pulse of 250 V.
[2]
HBM classification 1A is granted to any part that passes after exposure to an ESD pulse of 250 V.
10. Abbreviations
Table 13.
BLM8AD22S-60ABG
Product data sheet
Abbreviations
Acronym
Description
CCDF
Complementary Cumulative Distribution Function
CW
Continuous Wave
ESD
ElectroStatic Discharge
GEN8
Eighth Generation
GSM
Global System for Mobile Communications
LDMOS
Laterally Diffused Metal Oxide Semiconductor
LTE
Long Term Evolution
MIMO
Multiple Input Multiple Output
MMIC
Monolithic Microwave Integrated Circuit
MTF
Median Time to Failure
OBO
Output Back Off
PAR
Peak-to-Average Ratio
RoHS
Restriction of Hazardous Substances
SMD
Surface Mounted Device
W-CDMA
Wideband Code Division Multiple Access
All information provided in this document is subject to legal disclaimers.
Rev. 2 — 11 April 2019
© Ampleon Netherlands B.V. 2019. All rights reserved.
15 of 19
BLM8AD22S-60ABG
LDMOS 2-stage integrated Doherty MMIC
11. Revision history
Table 14.
Revision history
Document ID
Release date
Data sheet status
Change notice
Supersedes
BLM8AD22S-60ABG v.2
20190411
Product data sheet
-
BLM8AD22S-60ABG v.1
Modifications
BLM8AD22S-60ABG v.1
BLM8AD22S-60ABG
Product data sheet
•
•
•
•
•
•
•
•
•
•
•
Table 1 on page 1: table updated
Table 5 on page 3: table updated
Table 6 on page 4: table updated
Table 7 on page 4: table updated
Table 8 on page 5: table updated
Table 9 on page 6: table updated
Figure 3 on page 7: figure added
Section 7.1 on page 8: section title changed
Table 10 on page 8: table updated
Table 11 on page 8: table added
Section 7.3 on page 9: section added
20181214
Product data sheet
-
All information provided in this document is subject to legal disclaimers.
Rev. 2 — 11 April 2019
-
© Ampleon Netherlands B.V. 2019. All rights reserved.
16 of 19
BLM8AD22S-60ABG
LDMOS 2-stage integrated Doherty MMIC
12. Legal information
12.1 Data sheet status
Document status[1][2]
Product status[3]
Objective [short] data sheet
Development
This document contains data from the objective specification for product development.
Preliminary [short] data sheet
Qualification
This document contains data from the preliminary specification.
Product [short] data sheet
Production
This document contains the product specification.
Definition
[1]
Please consult the most recently issued document before initiating or completing a design.
[2]
The term ‘short data sheet’ is explained in section “Definitions”.
[3]
The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status
information is available on the Internet at URL http://www.ampleon.com.
12.2 Definitions
Draft — The document is a draft version only. The content is still under
internal review and subject to formal approval, which may result in
modifications or additions. Ampleon does not give any representations or
warranties as to the accuracy or completeness of information included herein
and shall have no liability for the consequences of use of such information.
Short data sheet — A short data sheet is an extract from a full data sheet
with the same product type number(s) and title. A short data sheet is intended
for quick reference only and should not be relied upon to contain detailed and
full information. For detailed and full information see the relevant full data
sheet, which is available on request via the local Ampleon sales office. In
case of any inconsistency or conflict with the short data sheet, the full data
sheet shall prevail.
Product specification — The information and data provided in a Product
data sheet shall define the specification of the product as agreed between
Ampleon and its customer, unless Ampleon and customer have explicitly
agreed otherwise in writing. In no event however, shall an agreement be valid
in which the Ampleon product is deemed to offer functions and qualities
beyond those described in the Product data sheet.
12.3 Disclaimers
Limited warranty and liability — Information in this document is believed to
be accurate and reliable. However, Ampleon does not give any
representations or warranties, expressed or implied, as to the accuracy or
completeness of such information and shall have no liability for the
consequences of use of such information. Ampleon takes no responsibility for
the content in this document if provided by an information source outside of
Ampleon.
In no event shall Ampleon be liable for any indirect, incidental, punitive,
special or consequential damages (including - without limitation - lost profits,
lost savings, business interruption, costs related to the removal or
replacement of any products or rework charges) whether or not such
damages are based on tort (including negligence), warranty, breach of
contract or any other legal theory.
Notwithstanding any damages that customer might incur for any reason
whatsoever, Ampleon’s aggregate and cumulative liability towards customer
for the products described herein shall be limited in accordance with the
Terms and conditions of commercial sale of Ampleon.
Right to make changes — Ampleon reserves the right to make changes to
information published in this document, including without limitation
specifications and product descriptions, at any time and without notice. This
document supersedes and replaces all information supplied prior to the
publication hereof.
Suitability for use — Ampleon products are not designed, authorized or
warranted to be suitable for use in life support, life-critical or safety-critical
systems or equipment, nor in applications where failure or malfunction of an
BLM8AD22S-60ABG
Product data sheet
Ampleon product can reasonably be expected to result in personal injury,
death or severe property or environmental damage. Ampleon and its
suppliers accept no liability for inclusion and/or use of Ampleon products in
such equipment or applications and therefore such inclusion and/or use is at
the customer’s own risk.
Applications — Applications that are described herein for any of these
products are for illustrative purposes only. Ampleon makes no representation
or warranty that such applications will be suitable for the specified use without
further testing or modification.
Customers are responsible for the design and operation of their applications
and products using Ampleon products, and Ampleon accepts no liability for
any assistance with applications or customer product design. It is customer’s
sole responsibility to determine whether the Ampleon product is suitable and
fit for the customer’s applications and products planned, as well as for the
planned application and use of customer’s third party customer(s). Customers
should provide appropriate design and operating safeguards to minimize the
risks associated with their applications and products.
Ampleon does not accept any liability related to any default, damage, costs or
problem which is based on any weakness or default in the customer’s
applications or products, or the application or use by customer’s third party
customer(s). Customer is responsible for doing all necessary testing for the
customer’s applications and products using Ampleon products in order to
avoid a default of the applications and the products or of the application or
use by customer’s third party customer(s). Ampleon does not accept any
liability in this respect.
Limiting values — Stress above one or more limiting values (as defined in
the Absolute Maximum Ratings System of IEC 60134) will cause permanent
damage to the device. Limiting values are stress ratings only and (proper)
operation of the device at these or any other conditions above those given in
the Recommended operating conditions section (if present) or the
Characteristics sections of this document is not warranted. Constant or
repeated exposure to limiting values will permanently and irreversibly affect
the quality and reliability of the device.
Terms and conditions of commercial sale — Ampleon products are sold
subject to the general terms and conditions of commercial sale, as published
at http://www.ampleon.com/terms, unless otherwise agreed in a valid written
individual agreement. In case an individual agreement is concluded only the
terms and conditions of the respective agreement shall apply. Ampleon
hereby expressly objects to applying the customer’s general terms and
conditions with regard to the purchase of Ampleon products by customer.
No offer to sell or license — Nothing in this document may be interpreted or
construed as an offer to sell products that is open for acceptance or the grant,
conveyance or implication of any license under any copyrights, patents or
other industrial or intellectual property rights.
Export control — This document as well as the item(s) described herein
may be subject to export control regulations. Export might require a prior
authorization from competent authorities.
All information provided in this document is subject to legal disclaimers.
Rev. 2 — 11 April 2019
© Ampleon Netherlands B.V. 2019. All rights reserved.
17 of 19
BLM8AD22S-60ABG
LDMOS 2-stage integrated Doherty MMIC
Non-automotive qualified products — Unless this data sheet expressly
states that this specific Ampleon product is automotive qualified, the product
is not suitable for automotive use. It is neither qualified nor tested in
accordance with automotive testing or application requirements. Ampleon
accepts no liability for inclusion and/or use of non-automotive qualified
products in automotive equipment or applications.
In the event that customer uses the product for design-in and use in
automotive applications to automotive specifications and standards, customer
(a) shall use the product without Ampleon’s warranty of the product for such
automotive applications, use and specifications, and (b) whenever customer
uses the product for automotive applications beyond Ampleon’s specifications
such use shall be solely at customer’s own risk, and (c) customer fully
indemnifies Ampleon for any liability, damages or failed product claims
resulting from customer design and use of the product for automotive
applications beyond Ampleon’s standard warranty and Ampleon’s product
specifications.
Translations — A non-English (translated) version of a document is for
reference only. The English version shall prevail in case of any discrepancy
between the translated and English versions.
12.4 Trademarks
Notice: All referenced brands, product names, service names and trademarks
are the property of their respective owners.
Any reference or use of any ‘NXP’ trademark in this document or in or on the
surface of Ampleon products does not result in any claim, liability or
entitlement vis-à-vis the owner of this trademark. Ampleon is no longer part of
the NXP group of companies and any reference to or use of the ‘NXP’
trademarks will be replaced by reference to or use of Ampleon’s own
trademarks.
13. Contact information
For more information, please visit: http://www.ampleon.com
For sales office addresses, please visit: http://www.ampleon.com/sales
BLM8AD22S-60ABG
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 2 — 11 April 2019
© Ampleon Netherlands B.V. 2019. All rights reserved.
18 of 19
BLM8AD22S-60ABG
LDMOS 2-stage integrated Doherty MMIC
14. Contents
1
1.1
1.2
1.3
2
2.1
2.2
3
4
5
6
7
7.1
7.2
7.3
8
9
10
11
12
12.1
12.2
12.3
12.4
13
14
Product profile . . . . . . . . . . . . . . . . . . . . . . . . . . 1
General description . . . . . . . . . . . . . . . . . . . . . 1
Features and benefits . . . . . . . . . . . . . . . . . . . . 1
Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Pinning information . . . . . . . . . . . . . . . . . . . . . . 2
Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 2
Ordering information . . . . . . . . . . . . . . . . . . . . . 3
Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 3
Thermal characteristics . . . . . . . . . . . . . . . . . . 3
Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . 4
Application information. . . . . . . . . . . . . . . . . . . 5
Ruggedness . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
Impedance information . . . . . . . . . . . . . . . . . . . 8
Graphs . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
Package outline . . . . . . . . . . . . . . . . . . . . . . . . 13
Handling information. . . . . . . . . . . . . . . . . . . . 15
Abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . . 15
Revision history . . . . . . . . . . . . . . . . . . . . . . . . 16
Legal information. . . . . . . . . . . . . . . . . . . . . . . 17
Data sheet status . . . . . . . . . . . . . . . . . . . . . . 17
Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 18
Contact information. . . . . . . . . . . . . . . . . . . . . 18
Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
Please be aware that important notices concerning this document and the product(s)
described herein, have been included in section ‘Legal information’.
© Ampleon Netherlands B.V. 2019.
All rights reserved.
For more information, please visit: http://www.ampleon.com
For sales office addresses, please visit: http://www.ampleon.com/sales
Date of release: 11 April 2019
Document identifier: BLM8AD22S-60ABG
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