BQ24765EVM

User's Guide SLUU415A – May 2010 – Revised October 2013 bq24765 EVM (HPA349) 1 2 3 4 Contents Introduction .................................................................................................................. 1 1.1 EVM Features ...................................................................................................... 1 1.2 General Description ................................................................................................ 2 1.3 I/O Description ...................................................................................................... 2 1.4 Controls and Key Parameters Setting ........................................................................... 3 1.5 Recommended Operating Conditions ........................................................................... 3 Test Summary ............................................................................................................... 3 2.1 Definitions ........................................................................................................... 3 2.2 Equipment ........................................................................................................... 4 2.3 Equipment Setup ................................................................................................... 4 2.4 Procedure ........................................................................................................... 6 PCB Layout Guideline ...................................................................................................... 8 Bill of Materials, Board Layout and Schematics ........................................................................ 9 4.1 Bill of Materials ..................................................................................................... 9 4.2 Board Layout ...................................................................................................... 11 4.3 Schematics ........................................................................................................ 18 List of Figures ........................................................................................... 1 Connections of the EV2300 Kit 2 Original test setup for HPA349 (bq24765 EVM) ........................................................................ 5 3 The Main Window of the bq24765 SMB Evaluation Software ........................................................ 6 4 Test Setup for HPA349 5 Top Layer ................................................................................................................... 11 6 2nd Layer .................................................................................................................... 12 7 3rd Layer..................................................................................................................... 13 8 Bottom Layer ............................................................................................................... 14 9 Top Assembly .............................................................................................................. 15 10 Bottom Assembly .......................................................................................................... 16 11 Top Silkscreen ............................................................................................................. 17 12 bq24765 EVM Schematic (Sheet 1 of 2) ............................................................................... 18 13 bq24745 EVM Schematic (Sheet 2 of 2) ............................................................................... 19 .................................................................................................... 5 7 List of Tables 1 Bill of Materials .............................................................................................................. 1 Introduction 1.1 EVM Features • • • 9 Evaluation Module For BQ24765 High Efficiency Integrated Power MOSFET Synchronous Buck Charger User-selectable 1-cell, 2-cell, 3-cell or 4-cell Li-ion Battery Voltage SLUU415A – May 2010 – Revised October 2013 Submit Documentation Feedback Copyright © 2010–2013, Texas Instruments Incorporated bq24765 EVM (HPA349) 1 Introduction • • • • • 1.2 www.ti.com Programmable Battery Voltage, Charge Current, and AC Adapter Current via SBS-Like SMBus Interface AC Adapter Operating Range 18 V–22 V LED Indication for Control and Status Signals. Test Points for Key Signals Available for Testing Purpose. Easy Probe Hook-up Jumpers Available. Easy to Change Connections. General Description The bq24765 evaluation module is a complete charger module for evaluating a multi cell integrated power MOSFETs synchronous notebook charge using the bq24765 devices. It is designed to deliver up to 8A of charge current to Li-Ion or Li-Pol applications. The charge current is programmable by SBS-like SMBus interface. The bq24765’s frequency is 700 kHz for small inductor The bq24765 has a highly integrated battery charge controller designed to work with external host commands. The charge voltage, charge current, and input current are programmable via SBS-like SMBus interface. The dynamic power management (DPM) function modifies the charge current depending on system load conditions, avoiding ac adapter overload. High accuracy current sense amplifiers enable accurate measurement of the ac adapter current, allowing monitoring of overall system power. For details, see bq24765 data sheet (SLUS999). 1.3 I/O Description Jack Description J1–ACPWR AC adapter, positive output J1–GND AC adapter, negative output J2–CE CE pin output J2–SDA SDA pin output, SMBus data line J2–SCL SCL pin output, SMBus clock line J3–VEXT External power supply, positive output J3–GND External power supply, negative output J4–ACOK ACOK pin J4–ICOUT ICOUT pin J4–VICM VICM pin J4–VREF J5–1 IC reference voltage VREF } ACDRV J5–2 J6–1 LED drive } BATDRV J6–2 J7–1 BATDRV signal LED drive } DIS CHG CE pin J7–2 GND J8–HI Pull-up voltage source J8–LEDPWR LED Pull-up power line J9–VREF IC reference voltage VREF J9–VDDSMB VDDSMB pin J9–EXT External voltage supply from J3 J10–GND Ground J10–BAT Connected to battery pack J10–SYS J11–1 Connected to system } BYPASS J11–2 2 ACDRV signal bq24765 EVM (HPA349) BYPASS signal LED drive SLUU415A – May 2010 – Revised October 2013 Submit Documentation Feedback Copyright © 2010–2013, Texas Instruments Incorporated Test Summary www.ti.com 1.4 Controls and Key Parameters Setting Jack Description Factory Setting J5 The conduction of the AC MOSFET is indicated by LED when on Jumper On J6 The conduction of the battery MOSFET is indicated by LED when on Jumper On J7 Disable charge process when on Jumper On J8 The pull-up power source supplies the LEDs when on. LED has no power source when off. Jumper On J9 VDDSMB voltage source setting Jumper On 2-3 (EXT and VDDSMB) 1-2 : Connect VREF to VDDSMB 2-3 : Connect external voltage source to VDDSMB J11 1.5 The conduction of the BYPASS MOSFET is indicated by LED when on Jumper On Recommended Operating Conditions Symbol Description Supply voltage, VIN Input voltage from ac adapter input Min Typ Max 18 19 22 Battery voltage, VBAT V Voltage applied at VBAT terminal of J8 0 3–16.8 20 V Supply current, IAC Maximum input current from ac adapter input 0 4.5 A Charge current, Ichrg Battery charge current 2 Operating junction temperature range, TJ 2 Test Summary 2.1 Definitions 0 3 or 4 Unit 8 A 125 °C Notes This procedure details how to configure the HPA349 evaluation board. On the test procedure the following naming conventions are followed. Refer to the HPA349 schematic for details. VXXX : LOADW: V(TPyyy): V(Jxx): V(TP(XXX)): V(XXX, YYY): I(JXX(YYY)): Jxx(BBB): Jxx ON : Jxx OFF: Jxx (-YY-) ON: Measure:→ A,B Observe → A,B External voltage supply name (VADP, VBT, VSBT) External load name (LOADR, LOADI) Voltage at internal test point TPyyy. For example, V(TP12) means the voltage at TP12. Voltage at jack terminal Jxx. Voltage at test point "XXX". For example, V(ACDET) means the voltage at the test point which is marked as "ACDET". Voltage across point XXX and YYY. Current going out from the YYY terminal of jack XX. Terminal or pin BBB of jack xx Internal jumper Jxx terminals are shorted Internal jumper Jxx terminals are open Internal jumper Jxx adjacent terminals marked as "YY" are shorted Check specified parameters A, B. If measured values are not within specified limits the unit under test has failed. Observe if A, B occur. If they do not occur, the unit under test has failed. SLUU415A – May 2010 – Revised October 2013 Submit Documentation Feedback Copyright © 2010–2013, Texas Instruments Incorporated bq24765 EVM (HPA349) 3 Test Summary 2.2 2.2.1 www.ti.com Equipment POWER SUPPLIES Power Supply #1 (PS#1): a power supply capable of supplying 20-V at 5-A is required. Power Supply #2 (PS#2): a power supply capable of supplying 5-V at 1-A is required. Power Supply #3 (PS#3): a power supply capable of supplying 20-V at 1-A is required. 2.2.2 LOAD #1 A 30V (or above), 5A (or above) electronic load that can operate at constant current mode 2.2.3 LOAD #2 A HP 6060B 3-60V/0-60A, 300W system DC electronic load Or: equivalent 2.2.4 METERS Seven Fluke 75 multimeters, (equivalent or better) Or: Four equivalent voltage meters and three equivalent current meters. The current meters must be capable of measuring 5A+ current. 2.2.5 COMPUTER A computer with at least one USB port and a USB cable. The EV2300 USB driver and the bq24765 SMB evaluation software must be properly installed. 2.2.6 EV2300 SMBUS COMMUNICATION KIT An EV2300 SMBUS communication kit is required to interface this EVM with the PC and can be purchased separately. 2.2.7 SOFTWARE (a) "Driver(USB EV2300) Installer XP2K-Last updated Jan28-04.zip": This is the EV2300 USB driver. Save and unzip to c:\temp (or other directory). Double click on the "setup.exe" file. Follow the installation steps. (b) "bq24765_v101.zip": This is the bq24765 SMB evaluation software. Save and unzip to c:\temp (or other directory). Double click on the "setup.exe" file. Follow the installation steps. This software needs to be installed after the EV2300 USB driver. 2.3 Equipment Setup (a) Set the power supply #1 for 0V ± 100mVDC, 5.0 ± 0.1A current limit and then turn off supply. (b) Connect the output of power supply #1 in series with a current meter (multimeter) to J1 (ACPWR, GND). (c) Connect a voltage meter across J1 (ACPWR, GND). (d) Set the power supply #2 for 3.3V ± 100mVDC, 1.0 ± 0.1A current limit and then turn off supply. (e) Connect the output of the power supply #2 to J3 (VEXT, GND). (f) Turn off Load #1. (g) Turn off Load #2. (h) Connect a voltage meter across J10 (BAT, GND). (i) Connect a voltage meter across J10 (SYS, GND). (j) Connect J2 (SDA, SCL) and J3 (GND) to the EV2300 kit "SMB" port. Connect the USB port of the EV2300 kit to the USB port of the computer. The connections are shown in Figure 1. 4 bq24765 EVM (HPA349) SLUU415A – May 2010 – Revised October 2013 Submit Documentation Feedback Copyright © 2010–2013, Texas Instruments Incorporated Test Summary HDQ EV2300 VCC HDQ VOUT GND I2C USB VOUT SDA SCL GND SMB www.ti.com NC SMBD SMBC GND HPA002 To Computer USB port 2003 SDA SCL GND To EVM Figure 1. Connections of the EV2300 Kit (k) J5: ON, J6: ON, J7: ON, J8: ON, J9(VDDSMB, EXT): ON, J11: ON. After the steps above, the test setup for HPA349 is shown in Figure 2. PH HPA272 HPA349 BAT SYS V J10 SYS DCIN U1 BAT V GND J1 Power supply #1 Iin I V ACPWR GND APPLICATION CIRCUIT APPLICATION CIRCUIT J8 D3 D 6 D8 D7 D 5 J9 J7 J11 J 5 J 6 D4 J4 A COK IC OU T VICM V REF CE SDA SCL VEXT GND J2 EV2300 USB J3 Power supply # 2 Figure 2. Original test setup for HPA349 (bq24765 EVM) (l) Turn on the computer. Open the bq24765 SMB evaluation software. The main window of the software is shown in Figure 3. SLUU415A – May 2010 – Revised October 2013 Submit Documentation Feedback Copyright © 2010–2013, Texas Instruments Incorporated bq24765 EVM (HPA349) 5 Test Summary www.ti.com Figure 3. The Main Window of the bq24765 SMB Evaluation Software 2.4 2.4.1 2.4.2 6 Procedure AC ADAPTER DETECTION THRESHOLD 2.4.1.1 Make sure EQUIPMENT SETUP steps are followed. Turn on PS#2. 2.4.1.2 Turn on PS#1. Measure → V(J10(SYS)) = 0 ± 500mV Measure → V(TP(VREF)) = 0V ± 1000mV Measure → V(TP(VDDP)) = 0V ± 500mV 2.4.1.3 Increase the output voltage of PS#1 until D5 (ACOK) on but do not exceed 20V. Measure → V(TP(ACIN)) = 2.4V ± 200mV Measure → V(J1(ACPWR)) = 17.9V ± 1V Measure → V(J10(SYS)) = 17.9V ± 1V Measure → V(TP(VREF)) = 3.3V ± 200mV Measure → V(TP(VDDP)) = 0V ± 500mV Observe → D3 (BYPASS) on, D6 (ACDRV) on. CHARGER Voltage Regulation bq24765 EVM (HPA349) SLUU415A – May 2010 – Revised October 2013 Submit Documentation Feedback Copyright © 2010–2013, Texas Instruments Incorporated Test Summary www.ti.com 2.4.3 2.4.2.1 Increase the voltage of PS#1 until V(J1(ACPWR)) = 19V ± 0.1V. Measure → V(J10(BAT, GND)) = 0V ± 1V 2.4.2.2 In the software main window, click all the "Read" buttons. Make sure there is no error information generated. Type in "512" (mA) in the Charge Current DAC and click "Write". This sets the battery charge current regulation threshold. Type in "12592" (mV) in the Charge Voltage DAC and click "Write". This sets the battery voltage regulation threshold. Type in "4608" (mA) in the Input Current DAC and click "Write". This sets the input current regulation threshold. 2.4.2.3 Uninstall J7 (Enable the charging). Observe → D4 (CHG EN) on. Measure → V(J10(BAT)) = 12.6V ± 200mV Measure → V(J4(ICOUT)) = 3.3V ± 300mV Measure → V(TP(VDDP)) = 6V ± 500mV CHARGE CURRENT AND AC CURRENT REGULATION (DPM) 2.4.3.1 Install J7 (Disable the charging). 2.4.3.2 Connect the Load #2 in series with a current meter (multimeter) to J10 (BAT, GND). Make sure a voltage meter is connected across J10 (BAT, GND). Turn on the Load #2. Use the constant voltage mode. Set the output voltage to 10.5V. 2.4.3.3 Connect the output of the Load #1 in series with a current meter (multimeter) to J10 (SYS, GND). Make sure a voltage meter is connected across J10 (SYS, GND). Turn on the power of the Load #1. Set the load current to 4.0A± 50mA but disable the output. The setup is now like Figure 4 for HPA349. Make sure Ibat = 0A± 10mA and Isys = 0A± 10mA. PH HPA272 HPA349 BAT SYS V J 10 Isys SYS DCIN U1 BAT V GND Ibat J1 Power supply #1 Iin I V I ACPWR GND I Load #1 Load #2 J4 APPLICATION CIRCUIT J8 D3 D6 D8 D7 D 5 J9 J7 J 11 J 5 J6 D4 A COK IC OU T VICM V REF CE SDA SCL VEXT GND J2 EV2300 USB J3 Power supply #2 Figure 4. Test Setup for HPA349 SLUU415A – May 2010 – Revised October 2013 Submit Documentation Feedback Copyright © 2010–2013, Texas Instruments Incorporated bq24765 EVM (HPA349) 7 PCB Layout Guideline 2.4.4 3 www.ti.com 2.4.3.4 Uninstall J7 (Enable the charging). Observe → D4 (CHG EN) on 2.4.3.5 Measure → Ibat = 500mA ± 200mA 2.4.3.6 Type in "2944" (mA) in the Charge Current DAC and click "Write". This sets the battery charge current regulation threshold to 2.944A. Measure → Ibat = 3000mA ± 300mA Measure → V(TP(VICM)):= 350mV ± 100mV Measure → V(J4(ICOUT)) = 3.3V ± 300mV Observe → D7 (LO PWR MODE) on 2.4.3.7 Enable the output of the Load #1. Measure → Isys = 4000mA ± 200mA, Ibat = 1000mA ± 500mA, Iin = 4600mA ± 500mA Measure → V(TP(VICM)) = 920mV ± 100mV Measure → V(J4(ICOUT)) = 0V ± 300mV Observe → D7 (LO PWR MODE) off 2.4.3.8 Turn off the Load #1. Measure → Isys = 0 ± 100mA, Ibat = 3000mA ± 300mA. POWER PATH SELECTION 2.4.4.1 Install J7 (Disable the charging) Observe → D4 (CHG EN) off 2.4.4.2 Replace Load #2 and current meter with PS#3. Make sure a voltage meter is connected across J10 (BAT, GND). Enable the output of the PS #3. Make sure the output voltage is 10.5V ± 500mV. 2.4.4.3 Measure → V(J10(SYS)) = 19V ± 1V (adapter connected to system) Observe → D3 (BYPASS) on, D6 (ACDRV) on, D8 (BATDRV) off. 2.4.4.4 Turn off PS#1. Measure → V(J10(SYS)) = 10.5V ± 1V (battery connected to system) 2.4.4.5 Observe → D3 (BYPASS) off, D6 (ACDRV) off, D8 (BATDRV) on. PCB Layout Guideline 1. It is critical that the exposed power pad on the backside of the bq24765 package be soldered to the PCB ground. Make sure there are sufficient thermal vias right underneath the IC, connecting to the ground plane on the other layers. 2. The control stage and the power stage should be routed separately. At each layer, the signal ground and the power ground are connected only at the power pad. 3. AC current sense resistor must be connected to CSSP and CSSN with a Kelvin contact. The area of this loop must be minimized. The decoupling capacitors for these pins should be placed as close to the IC as possible. 4. Charge current sense resistor must be connected to CSOP, CSON with a Kelvin contact. The area of this loop must be minimized. The decoupling capacitors for these pins should be placed as close to the IC as possible. 5. Decoupling capacitors for DCIN, VREF, VDDP should be placed underneath the IC (on the bottom layer) and make the interconnections to the IC as short as possible. 6. Decoupling capacitors for BAT, VICM must be placed close to the corresponding IC pins and make the interconnections to the IC as short as possible. 8 bq24765 EVM (HPA349) SLUU415A – May 2010 – Revised October 2013 Submit Documentation Feedback Copyright © 2010–2013, Texas Instruments Incorporated Bill of Materials, Board Layout and Schematics www.ti.com 4 Bill of Materials, Board Layout and Schematics 4.1 Bill of Materials Table 1. Bill of Materials bq24765 RefDes Value Description Size Part Number Mfr 1 C1 2.2 µF Capacitor, Ceramic, 25V, X5R, 10% 1210 Std Std 3 C13, C27, C29 0.1 µF Capacitor, Ceramic, 50V, X7R, 10% 0603 STD STD 1 C14 100 pF Capacitor, Ceramic, 50V, C0G, 5% 0603 STD STD 3 C15, C19, C21 1 µF Capacitor, Ceramic, 25V, X5R, 10% 0805 Std Std 4 C16, C18, C23, C26 10 µF Capacitor, Ceramic, 25V, X5R, 10% 1210 Std Std 2 C2, C10 Open Capacitor, Ceramic, 25V, X5R, 10% 1210 Std Std 2 C24, C30 10 µF Capacitor, Ceramic, 25V, X5R, 10% 1206 STD STD 1 C25 Open Capacitor, Ceramic, 50V, X7R, 10% 0603 STD STD 1 C3 Open Capacitor, Ceramic, 25V, X5R, 10% 0805 Std Std 1 C31 OPEN Capacitor, Ceramic, 50V, X7R, 10% 0805 STD STD 2 C4, C11 10 nF Capacitor, Ceramic, 50V, X7R, 10% 0603 Std Std 1 C5 2000 pF Capacitor, Ceramic, 50-V, C0G, 5% 0603 Std Std 1 C6 51 pF Capacitor, Ceramic, 50-V, C0G, 5% 0603 Std Std 6 C7, C12, C17, C20, C22, C28 0.1 µF Capacitor, Ceramic, 50V, X7R, 10% 0805 Std Std 1 C8 130 pF Capacitor, Ceramic, 50-V, C0G, 5% 0603 Std Std 1 C9 1 µF Capacitor, Ceramic, 25V, X5R, 10% 0603 Std Std 1 D1 BAT54 Diode, Schottky, 200-mA, 30-V SOT23 BAT54 Vishay-Liteon 1 D2 BAT54C Diode, Dual Schottky, 200-mA, 30-V SOT23 BAT54C Vishay-Liteon 6 D3–D8 Green Diode, LED, Green, 2.1-V, 20-mA, 6-mcd 0603 LTST-C190GKT Lite On 1 D9 OPEN Diode, Schottky, 2A, 40V SMB SS24 IR 1 J1 D120/2DS Terminal Block, 2-pin, 15-A, 5.1mm 0.40 x 0.35 inch D120/2DS OST 1 J10 D120/3DS Terminal Block, 3-pin, 15-A, 5.1mm 0.60 x 0.35 inch D120/3DS OST 1 J2 ED555/3DS Terminal Block, 3-pin, 6-A, 3.5mm 0.41 x 0.25 inch ED555/3DS OST 1 J3 ED555/2DS Terminal Block, 2-pin, 6-A, 3.5mm 0.27 x 0.25 inch ED555/2DS OST 1 J4 ED555/4DS Terminal Block, 4-pin, 6-A, 3.5mm 0.55 x 0.25 ED555/4DS OST 5 J5–J8, J11 PTC36SAAN Header, 2-pin, 100mil spacing, (36-pin strip) 0.100 inch x 2 PTC36SAAN Sullins 1 J9 PTC36SAAN Header, 3-pin, 100mil spacing, (36-pin strip) 0.100 inch x 3 PTC36SAAN Sullins 1 L1 3.3 µH Inductor, SMT, 6A, 28milliohm 0.255 x 0.270 inch IHLP2525CZER3R3M01 Vishay 3 Q1, Q2, Q3 Si4435DY MOSFET, P-ch, 30-V, 8.0-A, 20-milliohm SO8 Si4435DY Siliconix 1 Q13 NDS0605 MOSFET,P-ch, -60 V, 180-mA, 5 Ohms SOT-23 NDS0605 Vishay 3 Q14–Q16 TP0610K Mosfet, P-Ch, 60V, Rds 6 ohms, Id 185 mA SOT-23 TP0610K Vishay-Siliconix 9 Q4–Q12 2N7002DICT MOSFET, N-ch, 60-V, 115-mA, 1.2-Ohms SOT23 2N7002DICT Vishay-Liteon 2 R1, R40 4.02 Resistor, Chip, 0.5W, 1% 1210 Std Std 1 R12 7.5k Resistor, Chip, 1/16W, 1% 0603 STD STD 1 R13 4.7k Resistor, Chip, 1/16W, 1% 0603 STD STD 1 R15 1400k Resistor, Chip, 1/10W, 5% 0805 Std Std 1 R17 0 Resistor, Chip, 1/16W, 5% 0402 Std Std 2 R18, R26 0.01 Resistor, Chip, 1/2W, 1% 2010 Std Std 1 R2 430k Resistor, Chip, 1/16W, 1% 0603 STD STD 1 R21 3.9 Resistor, Chip, 1/16W, 1% 0402 Std Std 1 R22 1Meg Resistor, Chip, 1/16W, 5% 0402 Std Std 8 R25, R27, R28, R29, R32, R33, R37, R38 100k Resistor, Chip, 1/16W, 5% 0402 Std Std 1 R3 66.5k Resistor, Chip, 1/16W, 1% 0603 STD STD 6 R30, R31, R34, R35, R36, R39 2.2k Resistor, Chip, 1/16W, 5% 0603 STD STD SLUU415A – May 2010 – Revised October 2013 Submit Documentation Feedback Copyright © 2010–2013, Texas Instruments Incorporated bq24765 EVM (HPA349) 9 Bill of Materials, Board Layout and Schematics www.ti.com Table 1. Bill of Materials (continued) bq24765 RefDes Value Description Size Part Number Mfr 11 R4, R5, R8, R10, R11, R14, R16, R19, R20, R23, R24 10k Resistor, Chip, 1/16W, 5% 0402 Std Std 1 R41 OPEN Resistor, Chip, 1/16W, 5% 0402 Std Std 1 R42 100 Resistor, Chip, 1/16W, 1% 0402 Std Std 1 R43 OPEN Resistor, Chip, 0.5W, 1% 1210 STD STD 1 R44 10 Resistor, Chip, 0.25W, 1% 1206 STD STD 1 R6 200k Resistor, Chip, 1/16W, 1% 0402 Std Std 1 R7 49.9k Resistor, Chip, 1/16W, 1% 0402 Std Std 1 R9 200k Resistor, Chip, 1/16W, 1% 0603 STD STD 1 TP1 5001 Test Point, Black, Thru Hole Color Keyed 0.100 x 0.100 inch 5001 Keystone 4 TP2, TP18–TP20 131-4244-00 Adaptor, 3.5-mm probe clip (or 131-5031-00) 0.200 inch 131-4244-00 Tektronix 12 TP21–TP32 5002 Test Point, White, Thru Hole Color Keyed 0.100 x 0.100 inch 5002 Keystone 1 U1 bq24765RUV IC, SMBus-Controlled Level 2 Multichemistry Battery Charger with Integrated Power MOSFETs, CE, and Input Current Comparator QFN-34 bq24765RUV TI 6 SJ5–SJ9,SJ11 929950-00 Shorting jumpers, 2-pin, 100mil spacing, 929950-00 3M/ESD Bumpons, cylindrical, black SJ5514-0 3M 4 1 10 PCB HPA349 bq24765 EVM (HPA349) 4.5 x 4.5 inch 4 layer 2oz. PCB 4.5x4.5 inch PCB SLUU415A – May 2010 – Revised October 2013 Submit Documentation Feedback Copyright © 2010–2013, Texas Instruments Incorporated Bill of Materials, Board Layout and Schematics www.ti.com 4.2 Board Layout Figure 5. Top Layer SLUU415A – May 2010 – Revised October 2013 Submit Documentation Feedback Copyright © 2010–2013, Texas Instruments Incorporated bq24765 EVM (HPA349) 11 Bill of Materials, Board Layout and Schematics www.ti.com Figure 6. 2nd Layer 12 bq24765 EVM (HPA349) SLUU415A – May 2010 – Revised October 2013 Submit Documentation Feedback Copyright © 2010–2013, Texas Instruments Incorporated Bill of Materials, Board Layout and Schematics www.ti.com Figure 7. 3rd Layer SLUU415A – May 2010 – Revised October 2013 Submit Documentation Feedback Copyright © 2010–2013, Texas Instruments Incorporated bq24765 EVM (HPA349) 13 Bill of Materials, Board Layout and Schematics www.ti.com Figure 8. Bottom Layer 14 bq24765 EVM (HPA349) SLUU415A – May 2010 – Revised October 2013 Submit Documentation Feedback Copyright © 2010–2013, Texas Instruments Incorporated Bill of Materials, Board Layout and Schematics www.ti.com Figure 9. Top Assembly SLUU415A – May 2010 – Revised October 2013 Submit Documentation Feedback Copyright © 2010–2013, Texas Instruments Incorporated bq24765 EVM (HPA349) 15 Bill of Materials, Board Layout and Schematics www.ti.com Figure 10. Bottom Assembly 16 bq24765 EVM (HPA349) SLUU415A – May 2010 – Revised October 2013 Submit Documentation Feedback Copyright © 2010–2013, Texas Instruments Incorporated Bill of Materials, Board Layout and Schematics www.ti.com Figure 11. Top Silkscreen SLUU415A – May 2010 – Revised October 2013 Submit Documentation Feedback Copyright © 2010–2013, Texas Instruments Incorporated bq24765 EVM (HPA349) 17 Bill of Materials, Board Layout and Schematics 4.3 www.ti.com Schematics Figure 12. bq24765 EVM Schematic (Sheet 1 of 2) 18 bq24765 EVM (HPA349) SLUU415A – May 2010 – Revised October 2013 Submit Documentation Feedback Copyright © 2010–2013, Texas Instruments Incorporated Bill of Materials, Board Layout and Schematics www.ti.com Figure 13. bq24745 EVM Schematic (Sheet 2 of 2) SLUU415A – May 2010 – Revised October 2013 Submit Documentation Feedback Copyright © 2010–2013, Texas Instruments Incorporated bq24765 EVM (HPA349) 19 EVALUATION BOARD/KIT/MODULE (EVM) ADDITIONAL TERMS Texas Instruments (TI) provides the enclosed Evaluation Board/Kit/Module (EVM) under the following conditions: The user assumes all responsibility and liability for proper and safe handling of the goods. Further, the user indemnifies TI from all claims arising from the handling or use of the goods. Should this evaluation board/kit not meet the specifications indicated in the User’s Guide, the board/kit may be returned within 30 days from the date of delivery for a full refund. THE FOREGOING LIMITED WARRANTY IS THE EXCLUSIVE WARRANTY MADE BY SELLER TO BUYER AND IS IN LIEU OF ALL OTHER WARRANTIES, EXPRESSED, IMPLIED, OR STATUTORY, INCLUDING ANY WARRANTY OF MERCHANTABILITY OR FITNESS FOR ANY PARTICULAR PURPOSE. EXCEPT TO THE EXTENT OF THE INDEMNITY SET FORTH ABOVE, NEITHER PARTY SHALL BE LIABLE TO THE OTHER FOR ANY INDIRECT, SPECIAL, INCIDENTAL, OR CONSEQUENTIAL DAMAGES. Please read the User's Guide and, specifically, the Warnings and Restrictions notice in the User's Guide prior to handling the product. This notice contains important safety information about temperatures and voltages. For additional information on TI's environmental and/or safety programs, please visit www.ti.com/esh or contact TI. No license is granted under any patent right or other intellectual property right of TI covering or relating to any machine, process, or combination in which such TI products or services might be or are used. TI currently deals with a variety of customers for products, and therefore our arrangement with the user is not exclusive. TI assumes no liability for applications assistance, customer product design, software performance, or infringement of patents or services described herein. REGULATORY COMPLIANCE INFORMATION As noted in the EVM User’s Guide and/or EVM itself, this EVM and/or accompanying hardware may or may not be subject to the Federal Communications Commission (FCC) and Industry Canada (IC) rules. For EVMs not subject to the above rules, this evaluation board/kit/module is intended for use for ENGINEERING DEVELOPMENT, DEMONSTRATION OR EVALUATION PURPOSES ONLY and is not considered by TI to be a finished end product fit for general consumer use. It generates, uses, and can radiate radio frequency energy and has not been tested for compliance with the limits of computing devices pursuant to part 15 of FCC or ICES-003 rules, which are designed to provide reasonable protection against radio frequency interference. Operation of the equipment may cause interference with radio communications, in which case the user at his own expense will be required to take whatever measures may be required to correct this interference. General Statement for EVMs including a radio User Power/Frequency Use Obligations: This radio is intended for development/professional use only in legally allocated frequency and power limits. Any use of radio frequencies and/or power availability of this EVM and its development application(s) must comply with local laws governing radio spectrum allocation and power limits for this evaluation module. It is the user’s sole responsibility to only operate this radio in legally acceptable frequency space and within legally mandated power limitations. Any exceptions to this are strictly prohibited and unauthorized by Texas Instruments unless user has obtained appropriate experimental/development licenses from local regulatory authorities, which is responsibility of user including its acceptable authorization. For EVMs annotated as FCC – FEDERAL COMMUNICATIONS COMMISSION Part 15 Compliant Caution This device complies with part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) This device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation. Changes or modifications not expressly approved by the party responsible for compliance could void the user's authority to operate the equipment. FCC Interference Statement for Class A EVM devices This equipment has been tested and found to comply with the limits for a Class A digital device, pursuant to part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference when the equipment is operated in a commercial environment. This equipment generates, uses, and can radiate radio frequency energy and, if not installed and used in accordance with the instruction manual, may cause harmful interference to radio communications. Operation of this equipment in a residential area is likely to cause harmful interference in which case the user will be required to correct the interference at his own expense. FCC Interference Statement for Class B EVM devices This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential installation. This equipment generates, uses and can radiate radio frequency energy and, if not installed and used in accordance with the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation. If this equipment does cause harmful interference to radio or television reception, which can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one or more of the following measures: • Reorient or relocate the receiving antenna. • Increase the separation between the equipment and receiver. • Connect the equipment into an outlet on a circuit different from that to which the receiver is connected. • Consult the dealer or an experienced radio/TV technician for help. For EVMs annotated as IC – INDUSTRY CANADA Compliant This Class A or B digital apparatus complies with Canadian ICES-003. Changes or modifications not expressly approved by the party responsible for compliance could void the user’s authority to operate the equipment. Concerning EVMs including radio transmitters This device complies with Industry Canada licence-exempt RSS standard(s). Operation is subject to the following two conditions: (1) this device may not cause interference, and (2) this device must accept any interference, including interference that may cause undesired operation of the device. Concerning EVMs including detachable antennas Under Industry Canada regulations, this radio transmitter may only operate using an antenna of a type and maximum (or lesser) gain approved for the transmitter by Industry Canada. To reduce potential radio interference to other users, the antenna type and its gain should be so chosen that the equivalent isotropically radiated power (e.i.r.p.) is not more than that necessary for successful communication. This radio transmitter has been approved by Industry Canada to operate with the antenna types listed in the user guide with the maximum permissible gain and required antenna impedance for each antenna type indicated. Antenna types not included in this list, having a gain greater than the maximum gain indicated for that type, are strictly prohibited for use with this device. Cet appareil numérique de la classe A ou B est conforme à la norme NMB-003 du Canada. Les changements ou les modifications pas expressément approuvés par la partie responsable de la conformité ont pu vider l’autorité de l'utilisateur pour actionner l'équipement. Concernant les EVMs avec appareils radio Le présent appareil est conforme aux CNR d'Industrie Canada applicables aux appareils radio exempts de licence. L'exploitation est autorisée aux deux conditions suivantes : (1) l'appareil ne doit pas produire de brouillage, et (2) l'utilisateur de l'appareil doit accepter tout brouillage radioélectrique subi, même si le brouillage est susceptible d'en compromettre le fonctionnement. Concernant les EVMs avec antennes détachables Conformément à la réglementation d'Industrie Canada, le présent émetteur radio peut fonctionner avec une antenne d'un type et d'un gain maximal (ou inférieur) approuvé pour l'émetteur par Industrie Canada. Dans le but de réduire les risques de brouillage radioélectrique à l'intention des autres utilisateurs, il faut choisir le type d'antenne et son gain de sorte que la puissance isotrope rayonnée équivalente (p.i.r.e.) ne dépasse pas l'intensité nécessaire à l'établissement d'une communication satisfaisante. Le présent émetteur radio a été approuvé par Industrie Canada pour fonctionner avec les types d'antenne énumérés dans le manuel d’usage et ayant un gain admissible maximal et l'impédance requise pour chaque type d'antenne. Les types d'antenne non inclus dans cette liste, ou dont le gain est supérieur au gain maximal indiqué, sont strictement interdits pour l'exploitation de l'émetteur. SPACER SPACER SPACER SPACER SPACER SPACER SPACER SPACER 【Important Notice for Users of EVMs for RF Products in Japan】 】 This development kit is NOT certified as Confirming to Technical Regulations of Radio Law of Japan If you use this product in Japan, you are required by Radio Law of Japan to follow the instructions below with respect to this product: 1. 2. 3. Use this product in a shielded room or any other test facility as defined in the notification #173 issued by Ministry of Internal Affairs and Communications on March 28, 2006, based on Sub-section 1.1 of Article 6 of the Ministry’s Rule for Enforcement of Radio Law of Japan, Use this product only after you obtained the license of Test Radio Station as provided in Radio Law of Japan with respect to this product, or Use of this product only after you obtained the Technical Regulations Conformity Certification as provided in Radio Law of Japan with respect to this product. Also, please do not transfer this product, unless you give the same notice above to the transferee. Please note that if you could not follow the instructions above, you will be subject to penalties of Radio Law of Japan. Texas Instruments Japan Limited (address) 24-1, Nishi-Shinjuku 6 chome, Shinjuku-ku, Tokyo, Japan http://www.tij.co.jp 【無線電波を送信する製品の開発キットをお使いになる際の注意事項】 本開発キットは技術基準適合証明を受けておりません。 本製品のご使用に際しては、電波法遵守のため、以下のいずれかの措置を取っていただく必要がありますのでご注意ください。 1. 2. 3. 電波法施行規則第6条第1項第1号に基づく平成18年3月28日総務省告示第173号で定められた電波暗室等の試験設備でご使用いただく。 実験局の免許を取得後ご使用いただく。 技術基準適合証明を取得後ご使用いただく。 なお、本製品は、上記の「ご使用にあたっての注意」を譲渡先、移転先に通知しない限り、譲渡、移転できないものとします。 　　　上記を遵守頂けない場合は、電波法の罰則が適用される可能性があることをご留意ください。 日本テキサス・インスツルメンツ株式会社 東京都新宿区西新宿６丁目２４番１号 西新宿三井ビル http://www.tij.co.jp SPACER SPACER SPACER SPACER SPACER SPACER SPACER SPACER SPACER SPACER SPACER SPACER SPACER SPACER SPACER SPACER SPACER EVALUATION BOARD/KIT/MODULE (EVM) WARNINGS, RESTRICTIONS AND DISCLAIMERS For Feasibility Evaluation Only, in Laboratory/Development Environments. Unless otherwise indicated, this EVM is not a finished electrical equipment and not intended for consumer use. It is intended solely for use for preliminary feasibility evaluation in laboratory/development environments by technically qualified electronics experts who are familiar with the dangers and application risks associated with handling electrical mechanical components, systems and subsystems. It should not be used as all or part of a finished end product. Your Sole Responsibility and Risk. You acknowledge, represent and agree that: 1. 2. 3. 4. You have unique knowledge concerning Federal, State and local regulatory requirements (including but not limited to Food and Drug Administration regulations, if applicable) which relate to your products and which relate to your use (and/or that of your employees, affiliates, contractors or designees) of the EVM for evaluation, testing and other purposes. You have full and exclusive responsibility to assure the safety and compliance of your products with all such laws and other applicable regulatory requirements, and also to assure the safety of any activities to be conducted by you and/or your employees, affiliates, contractors or designees, using the EVM. Further, you are responsible to assure that any interfaces (electronic and/or mechanical) between the EVM and any human body are designed with suitable isolation and means to safely limit accessible leakage currents to minimize the risk of electrical shock hazard. Since the EVM is not a completed product, it may not meet all applicable regulatory and safety compliance standards (such as UL, CSA, VDE, CE, RoHS and WEEE) which may normally be associated with similar items. You assume full responsibility to determine and/or assure compliance with any such standards and related certifications as may be applicable. You will employ reasonable safeguards to ensure that your use of the EVM will not result in any property damage, injury or death, even if the EVM should fail to perform as described or expected. You will take care of proper disposal and recycling of the EVM’s electronic components and packing materials. Certain Instructions. It is important to operate this EVM within TI’s recommended specifications and environmental considerations per the user guidelines. Exceeding the specified EVM ratings (including but not limited to input and output voltage, current, power, and environmental ranges) may cause property damage, personal injury or death. If there are questions concerning these ratings please contact a TI field representative prior to connecting interface electronics including input power and intended loads. Any loads applied outside of the specified output range may result in unintended and/or inaccurate operation and/or possible permanent damage to the EVM and/or interface electronics. Please consult the EVM User's Guide prior to connecting any load to the EVM output. If there is uncertainty as to the load specification, please contact a TI field representative. During normal operation, some circuit components may have case temperatures greater than 60°C as long as the input and output are maintained at a normal ambient operating temperature. These components include but are not limited to linear regulators, switching transistors, pass transistors, and current sense resistors which can be identified using the EVM schematic located in the EVM User's Guide. When placing measurement probes near these devices during normal operation, please be aware that these devices may be very warm to the touch. As with all electronic evaluation tools, only qualified personnel knowledgeable in electronic measurement and diagnostics normally found in development environments should use these EVMs. Agreement to Defend, Indemnify and Hold Harmless. You agree to defend, indemnify and hold TI, its licensors and their representatives harmless from and against any and all claims, damages, losses, expenses, costs and liabilities (collectively, "Claims") arising out of or in connection with any use of the EVM that is not in accordance with the terms of the agreement. This obligation shall apply whether Claims arise under law of tort or contract or any other legal theory, and even if the EVM fails to perform as described or expected. Safety-Critical or Life-Critical Applications. If you intend to evaluate the components for possible use in safety critical applications (such as life support) where a failure of the TI product would reasonably be expected to cause severe personal injury or death, such as devices which are classified as FDA Class III or similar classification, then you must specifically notify TI of such intent and enter into a separate Assurance and Indemnity Agreement. Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265 Copyright © 2013, Texas Instruments Incorporated IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest issue. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and complete. 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