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Table of Contents
User’s Guide
BQ25792EVM, BQ25798EVM and BQ25798BKUPEVM
(BMS034) Evaluation Module
ABSTRACT
This user's guide describes the characteristics, operation, and functionality of the BQ25792 and BQ25798
Evaluation Module (EVM). It will also describe the equipment, test setup, and software required to operate the
EVM. A complete schematic diagram, printed-circuit board (PCB) layouts, and bill of materials (BOM) are also
included in this document.
Throughout this user's guide, the abbreviations and terms EVM, BQ2579XEVM, BMS034, and evaluation
module are synonymous with the BQ25792EVM, BQ25798BKUPEVM, and BQ25798EVM.
p
WARNING
Hot surface! Contact may cause burns. Do not touch!
Some components may reach high temperatures >55°C when the board is powered on. The user must
not touch the board at any point during operation or immediately after operating, as high temperatures
may be present.
Table of Contents
1 Introduction.............................................................................................................................................................................3
1.1 EVM Features.................................................................................................................................................................... 3
1.2 I/O Descriptions..................................................................................................................................................................4
1.3 Recommended Operating Conditions................................................................................................................................ 6
2 Test Setup and Results.......................................................................................................................................................... 6
2.1 Equipment.......................................................................................................................................................................... 6
2.2 Equipment Setup................................................................................................................................................................6
2.3 Software Setup...................................................................................................................................................................7
2.4 Test Procedure................................................................................................................................................................... 9
3 PCB Layout Guidelines........................................................................................................................................................ 14
4 Board Layout, Schematic and Bill of Materials..................................................................................................................15
4.1 BMS034 Board Layout..................................................................................................................................................... 15
4.2 BQ2579XEVM (BMS034) Schematics............................................................................................................................. 19
4.3 Bill of Materials.................................................................................................................................................................22
5 Revision History................................................................................................................................................................... 25
List of Figures
Figure 2-1. Equipment Test Setup for Testing Battery Charging..................................................................................................7
Figure 2-2. Single-Bit Registers Section......................................................................................................................................9
Figure 2-3. Multi-Bit Register Section........................................................................................................................................ 10
Figure 2-4. 16-Bit Register Section............................................................................................................................................10
Figure 2-5. Icon Guide............................................................................................................................................................... 10
Figure 2-6. Chip Configuration................................................................................................................................................... 11
Figure 2-7. Charger Configuration............................................................................................................................................. 11
Figure 2-8. Single-Bit Register Section......................................................................................................................................12
Figure 2-9. Multi-Bit Register Section........................................................................................................................................ 13
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Figure 2-10. OTG Configuration Section................................................................................................................................... 13
Figure 2-11. Chip Configuration................................................................................................................................................. 13
Figure 4-1. BMS034A/B Top Layer............................................................................................................................................ 15
Figure 4-2. BMS034A/B Signal Layer 1.....................................................................................................................................16
Figure 4-3. BMS034A/B Signal Layer 2.....................................................................................................................................17
Figure 4-4. BMS034A/B Bottom Layer...................................................................................................................................... 18
Figure 4-5. BQ25792EVM (BMS034A/B-001) and BQ25798EVM (BMS034A/B-003) Schematic Page 1................................19
Figure 4-6. BQ25792EVM (BMS034A/B-001), BQ25798BKUPEVM (BMS034A/B-005) and BQ25798EVM (BMS034A/
B-003) Schematic Page 2...................................................................................................................................................... 20
Figure 4-7. BQ25798BKUPEVM (BMS034A/B-002) Schematic Page 1................................................................................... 21
List of Tables
Table 1-1. Device Data Sheet...................................................................................................................................................... 3
Table 1-2. EVM Connections....................................................................................................................................................... 4
Table 1-3. EVM Shunt and Switch Installation............................................................................................................................. 4
Table 1-4. Recommended Operating Conditions.........................................................................................................................6
Table 4-1. BQ2579XEVM Bill of Materials................................................................................................................................. 22
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Introduction
1 Introduction
The BQ25792 and BQ25798 (BQ25792/8) is an integrated switched-mode buck-boost battery charge
management device in QFN package. It is intended to charge 1- to 4-series cell Li-ion and Li-polymer batteries.
The charger features a narrow VDC architecture (NVDC) which allows the system to be regulated to a minimum
value even if the battery is completely discharged. Additionally, the BQ25792/8 supports input source detection
through D+ and D- which is compatible with USB2.0, USB3.0 power delivery, non-standard adapters, and high
voltage adapters. With dual input source selection, USB OTG support, and an integrated 16-bit multi-channel
analog-to-digital converter (ADC), the BQ25792/8 is a complete charging solution.
1.1 EVM Features
The BQ25792/8EVM is a complete module for evaluating the BQ25792/8 charger IC in the QFN package. Key
features of this EVM include:
• Synchronous Switch Mode Buck-Boost Charger for 1s-4s Battery Configuration for 5-A Charging with 10-mA
Resolution
• Support for 3.6-V to 24-V Wide Range of Input Sources USB Auto-Detect, USB PD and Wireless Input
• Dual Input Source Selector to Drive Bi-Directional Blocking NFETs
• Power up USB Port from Battery (USB OTG) with 2.8-V to 22-V OTG Output Voltage with 10-mV Resolution
• Low Battery Quiescent Current < 1 µA in Shutdown Mode
• BQ25798 has MPPT and backup mode features.
The device data sheet, listed in Table 1-1, provides detailed features and operation.
Table 1-1. Device Data Sheet
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Device
Data Sheet
BQ25792
SLUSDG1
BQ25798
SLUSDV2
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1.2 I/O Descriptions
Table 1-2 table lists the BQ2579XEVM board connections and ports.
Table 1-2. EVM Connections
Connector, Port
J1
Description
VIN1
Positive rail of the priority input adapter or power supply
GND
Ground
VIN2
Positive rail of the secondary input adapter or power supply
GND
Ground
SYSTEM
Positive rail of the charger system output voltage, typically connected to the system load
GND
Ground
VPMID
Positive rail of the charger output voltage for reverse mode (OTG). This output also shares the rail with
VBUS in forward mode
GND
Ground
BATTERY
Positive rail of the charger battery input
SNS_BATP
Input connected to the positive terminal of the battery for remote battery voltage measurement
GND
Ground
J6
USB port
USB Micro B port used for input source type detection and handshaking. Connected to either VIN1 or
VIN2
J7
EXTERNAL
THERMISTOR
Input connected to an external battery temperature sensing thermistor
GND
Ground
J8
Communication port
I2C communication port for use with the EV2300/2400 Interface Board
J9
Communication port
I2C communication port for use with the USB2ANY Interface Adapter (for future use)
J2
J3
J4
J5
Table 1-3 lists the shunt installations available on the EVM, and their respective descriptions.
Table 1-3. EVM Shunt and Switch Installation
Shunt
4
Description
BQ25792/6/8 Setting
JP1
ACDRV1 pin connection to control ACFET1-RBFET1. Connect this to _acdrv1 net (labeled
VAC1 FET) when utilizing the input protection MOSFETs. Connect this to GND when input
protection MOSFETs are not used or bypassed
ACDRV1 to VAC1 FETs (short
pins 1 to 2)
JP2
ACDRV2 pin connection to control ACFET2-RBFET2. Connect this to _acdrv2 net (labeled
VAC2 FET) when utilizing the input protection MOSFETs. Connect this to GND when input
protection MOSFETs are not used or bypassed
ACDRV2 to VAC2 FETs (short
pins 1 to 2)
JP3
VIN1/VAC1 to VBUS bypass connection. Connect this when the input protection MOSFET
feature is not desired. This connects the input source on VIN1 to VBUS.
Not Installed
JP4
VIN2/VAC2 to VBUS bypass connection. Connect this when the input protection MOSFET
feature is not desired. This connects the input source on VIN2 to VBUS.
Not Installed
JP5
BAT to BATTERY bypass connection. Connect this when the ship and shutdown mode
features are not desired and JP8 pins 1 and 2 are shorted.
Not Installed
JP6
USB Micro B input D– connection to charger D- pin. Connect this when the input source
detection and handshake features are desired.
Installed
JP7
USB port J6 positive rail to charger VBUS selection. Use shunt to select either VIN1/VAC1 or
VIN2/VAC2 as the connection for the USB port.
USB_VIN to VAC1
JP8
SDRV pin connection to control SFET. Short pins 1 to 2 of JP8 and install shunt across JP5
when ship and shutdown mode features are not desired. Short pins 2 to 3 of JP8 and remove
shunt from JP5 when ship and shutdown mode features are desired.
Short pins 2 to 3
JP9
BATP pin connection. BATP is always connected to J5 pin 2 for remote battery sense. If
Short pin 2 to J5 pin 1
off-board remote sense is not used, short pin 2 to J5 pin 1 (BATTERY) for the charger constant (BATTERY)
voltage sensing to occur at the J5 connector after the Q5 ship mode FET Short pin 2 to pin 3
(BAT pin) for the charger constant voltage sensing to occur on the PCB board close to the IC
before Q5 ship mode FET. Do not leave BATP pin floating.
JP10
Charger D+ and D- pin short connection. Connect this to simulate a DCP type adapter for the
input source detection and handshake feature. Remove in order to use the charger's D+/Ddetection feature.
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Introduction
Table 1-3. EVM Shunt and Switch Installation (continued)
Shunt
Description
BQ25792/6/8 Setting
JP11
USB Micro B input D+ connection to charger D+ pin. Connect this when the input source
detection and handshake features are desired.
Installed
JP12
REGN to TS resistor divider network connection. This must remain connected.
Installed
JP13
ILIM_HIZ pin setting for 500 mA. Connect to set the external input current limit setting to
500mA
Not Installed
JP14
ILIM_HIZ pin setting for 1.5 A. Install shunt to set the external input current limit setting to 1.5
A.
Installed
JP15
Thermistor COOL temperature setting. Connect jumper to simulate charger entering TCOOL
(T1-T2) temperature region.
Not Installed
JP16
Thermistor COLD temperature setting. Connect jumper to simulate charger entering TCOLD
(T5) temperature region.
Not Installed
JP21
ILIM_HIZ pin setting for HIZ mode. Connect to enter the charger high impedance (HIZ) mode
to disable the converter
Not Installed
JP22
PROG pin setting for 1S, 1.5 MHz. Connect to configure charger default setting to 1S charge
regulation voltage, 2 A charging current, and 1.5 MHz switching frequency
Not Installed
JP23
PROG pin setting for 1S, 750 kHz. Connect to configure charger default setting to 1S charge
regulation voltage, 2 A charging current, and 750 kHz switching frequency
Not Installed
JP24
PROG pin setting for 2S, 1.5 MHz. Connect to configure charger default setting to 2S charge
regulation voltage, 2 A charging current, and 1.5 MHz switching frequency
Installed
JP25
PROG pin setting for 2S, 750 kHz. Connect to configure charger default setting to 2S charge
regulation voltage, 2 A charging current, and 750 kHz switching frequency
Not Installed
JP26
PROG pin setting for 3S, 1.5 MHz. Connect to configure charger default setting to 3S charge
regulation voltage, 1 A charging current, and 1.5 MHz switching frequency
Not Installed
JP27
PROG pin setting for 3S, 750 kHz. Connect to configure charger default setting to 3S charge
regulation voltage, 1 A charging current, and 750 kHz switching frequency
Not Installed
JP28
PROG pin setting for 4S, 1.5 MHz. Connect to configure charger default setting to 4S charge
regulation voltage, 1 A charging current, and 1.5 MHz switching frequency
Not Installed
JP29
PROG pin setting for 4S, 750 kHz. Connect to configure charger default setting to 4S charge
regulation voltage, 1 A charging current, and 750 kHz switching frequency
Not Installed
JP30
Input connection for onboard PULLUP rail LDO. Connect to power onboard 3.3V pullup rail.
LDO input will be connected via diode-OR between VBUS and BAT
Installed
JP31
EV2400 internal pullup to PULLUP connection. Connect to use EV2400 internal 3.3 V pullup to Not Installed
drive the EVM PULLUP rail.
JP32
STAT pin LED indicator connection. This indicates the current charger Status
JP33
USB2ANY internal pullup to PULLUP connection. Connect to use the USB2ANY internal 3.3 V Not Installed
pullup to drive the EVM PULLUP rail
S1
QON control switch. Press to either exit Ship Mode or reset the System Power
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1.3 Recommended Operating Conditions
Table 1-4. Recommended Operating Conditions
Description
Max
Unit
3.6
24
V
Power supply current, which can be limited by charger's
input current limit feature (IINDPM)
0.01
3.3
A
V(BATTERY) voltage at J5
Battery voltage supported for precharge
2.2
3.8(1S), 7.6(2S),
11.4(3S), 15.2V(4S)
18.8
V
I(BATTERY) out of/into J5
Battery charge current
0.01
2 (1S, 2S), 1(3S, 4S)
5
A
System voltage regulation range
3.2
19
V
0
5
A
V(VINx) at J1 or J2
Power supply voltage to the external blocking FETs
which allow power to VBUS pin
I(INx) into J1 or J2
V(SYS) at J3
I(SYS) out of J3
Min
System load current
Typ
Note
If hotplugging adaptors with voltage greater than 15 volts, it is reccomended to install RSNUB1,
CSNUB1, RSNUB2, and CSBUB2 as listed on the schematic.
Note
If hotplugging 4S batteries and a shipFET is installed, it is reccomended to install component CSNUB3
as listed on the schematic
Note
If hotplugging 4S batteries and a shipFET is not installed, it is reccomended to install component
DVTS as listed on the schematic.
2 Test Setup and Results
2.1 Equipment
This section includes a list of supplies required to perform tests on the BQ25790EVM.
1. Power Supplies for VBUS pin: Power Supply #1 (PS1): A power supply capable of supplying up to 24 V at
3 A is required.
2. Battery Simulator for BAT pin: Load #1 (4-Quadrant Supply): A "Kepco" Load, BOP, 20-5M, DC 0 to ±20 V,
0 to ±6 A (or higher) or a Keithley 2450 3-A sourcemeter. When using both, a 1000-µF or higher, low ESR,
25-V rated or higher connected at the EVM battery and ground terminals is recommended.
Alternative Option: A 0–20 V/0–5 A, > 60-W DC electronic load set in a constant voltage loading mode in
parallel with a second power supply can be used. The second power supply is set to a voltage slightly below
the electronic load's constant voltage setting. When enabled, the charger's charge current then replaces the
current provided the second power supply.
3. System load simulator for SYS pin:Load #2 ( Electronic load set to constant resistance or Resistive Load):
10 Ω, 5 W (or higher).
4. Meters: (6x) "Fluke 75" multimeters, (equivalent or better).
Alternative Option: (4x) equivalent voltage meters and (2x) equivalent current meters. The current meters
must be capable of measuring at least 5 A. If used in series between the PS#1, Load#1 or Load#2, the
meters should be set for manual not auto ranging. Current meters add significant series resistance which
affects charger performance.
5. Computer: A computer with at least one USB port and a USB cable. A valid internet connection is required
when using the GUI Composer application.
6. PC Communication Interface:EV2300/2400 USB-Based PC Interface Board (when using Battery
Management Studio) or USB2ANY Interface Adapter (when using the GUI Composer application).
2.2 Equipment Setup
Use the following list to set up the EVM testing equipment. Refer to Figure 2-1 for the test setup connections to
the EVM:
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1. Review the EVM connections in Table 1-2.
2. Set PS#1 for 5.0-V, 3-A current limit and then turn off the supply. Connect PS#1 to J1 (VIN1 and PGND).
3. Connect a voltage meter across TP23 (VBUS) and TP44 (PGND) to measure the input voltage as seen from
the VBUS pins of the charger.
4. Connect a voltage meter across TP1 and TP2 (I_VAC1_SENSE) to measure the input current into the VBUS
pins through the VIN1 path. Alternatively, you may connect a current meter between PS1 and J1.
5. Set Load #1 to constant voltage mode, capable of sinking (for example, compliance) at least 3 A, and output
to 5.0 V, and then disable load. Connect Load #1 to J5 (BATTERY and PGND).
6. Connect a voltage meter across TP29 (BAT) and TP46 (PGND) to measure the battery voltage as seen from
the BAT pins of the charger.
7. Connect a voltage meter across TP19 and TP20 (I_BAT_SENSE) to measure the battery charge current out
of and discharge current into BAT pins. Alternatively, you may connect a current meter between Load #1 and
J5.
8. Connect a voltage meter across TP28 (SYS) and TP45 (PGND) to measure the system voltage as seen
from the SYS pins of the charger.
9. Install shunts as shown in Table 1-3.
VPMID
±
V
+
±
V
+
VVBUS
+
V
±
Power Supply #1
VSYS
Optional Load #2:
eLoad or
resistor
IVAC1
Load #1:
Battery
Simulator
V
USB2ANY
USB
V
10-pin
Connector
IBAT
OR
+
V±
VBAT
EV2300/2400
USB
4-pin Connector
Figure 2-1. Equipment Test Setup for Testing Battery Charging
2.3 Software Setup
The charger is controlled by a state machine that uses I2C registers and the state machine makes decisions
based off of the I2C registers. Software only helps with reading and writing to those registers.
2.3.1 BQSTUDIO using EV2400
Download the latest version of BQSTUDIOTEST. Double click the Battery Management Studio installation file
and follow the installation steps. The software supports Microsoft® Windows® XP, 7, and 10 operating systems.
Launch BQSTUDIO and select Charger. If the EVM configuration file for BQSTUDIO does not appear in the
Charger, close BQSTUDIO and either download the .BQZ file from the EVM product folder at www.ti.com or
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request the file via e2e.ti.com. The file must be saved into C:\XXX\BatteryManagementStudio\config, where XXX
is the directory you selected to install BQSTUDIO.
2.3.2 TI Charger GUI for USB2ANY
Navigate to the TI-CHARGER-GUI tool folder. Once at the tool page click on the "Evaluate in the cloud" button.
The browser will automatically be redirected to the TI Charger GUI landing page. From the landing page locate
the device desired for evaluation and click "Select Device." Note that the EVM must be powered and the
USB2ANY must be connected to both the EVM and the PC for a connection to be established. Also, update the
USB2ANY to the latest verision with the USB2ANY Explorer Software.
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Test Setup and Results
2.4 Test Procedure
2.4.1 Initial Settings
Use the following steps to enable the EVM test setup.
1. Make sure Section 2.2 steps have been followed.
2. Remove the shunt on JP17 to disable charge.
3. Make sure the PROG pin jumpers, JP22-JP29, are set to the desired frequency and cell count.
4. Make sure the TS Jumpers are installed to the correct posistions if a thermistor is being simulated.
5. If using BQStudio, launch the BQSTUDIO software and select Charger then BQ25792EVM, if not already
done.
6. If using TI Charger GUI, go to the TI Charger GUI website and select the charger from the list.
7. Turn on PS1 and Load #1:
• Measure ➡ VSYS-PGND (TP26 and TP48) = 8.55 V ±0.2 V
8. Verify PG LED (D13) is on.
Note
If the PG LED is not lit, confirm a valid PS1 is connected and the correct shunt configuration was
placed.
Note
If the device is not communicating and does not ACK, verify that Section 2.2 and the steps in
this section have been followed. Verify the voltage across TP42 (PULLUP) and TP49 (AGND) is
approximately 3.3 V.
2.4.2 Communication Verification
If using Battery Management Studio, use the following steps for communications verification:
1. In Battery Management Studio, select "READ REGISTER" at the top of the page. "Device ACK OK" should
appear at the top of the page.
2. Select Field View in the top right of the screen. Note there are two tabs, one for 8-bit registers and one
for 16-bit registers. In the 8-bit tab, there are sections for chip, charger and OTG single-bit and multi-bit
registers. In the 16-bit tab are the charger and OTG multi-bit registers for setting voltages and currents. In
addition, the ADC registers are on the 16-bit tab.
3. Prepare the charge mode charger register settings in the following way if not already set there by default:
• On the 8-bit Registers tab in the Chip Config Single-bit Registers section
– Change Watchdog Timer to disabled
– Check the "ShipFET Present?" check box
Figure 2-2. Single-Bit Registers Section
•
On the 8-bit Registers tab in the Charger Multi-bit Registers section
– Set the Precharge current to 240 mA
– Set ABS VINDPM to 4000 mV
– Set VSYSMIN to 7000 mV
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Figure 2-3. Multi-Bit Register Section
•
On the 16-bit Registers tab in the Charger Multi-bit Registers section
– Set the Charge Voltage charging regulation limit to 8400 mV
– Set the Charge Current to 500 mA.
– Set the input current regulation limit (IINDPM) to 3000 mA.
Figure 2-4. 16-Bit Register Section
If using TI Charger GUI, follow these steps.
1. In the TI Charger GUI homepage, select the charger you are using. You should see at the bottom-left,
Hardware Connected. Here is a brief description of what the icons on the left side panel mean:
Figure 2-5. Icon Guide
Note
If the EVM is powered but not communicating (for example, does not ACK), try updating the
USB2ANY firmware to the latest version using the software at . The software tells you to press the
reset button, on the opposite side of the USB connector to the LED, using a paper clip or narrow
pin.
2. Go to the Chip Configuration and set the Watchdog Timer to disabled and check the "ShipFET present?"
box.
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Figure 2-6. Chip Configuration
3. Go to the Charger Configuration and set
• VSYSMIN to 7 V
• Charge Voltage to 8.4 V
• Charge Current to 0.5 A
• Precharge current to 0.24 A
• IINDPM to 3 A
• ABS VINDPM to 0.4 V
Figure 2-7. Charger Configuration
2.4.3 Charge Mode Verification
Use the following steps for charge mode verification, including pre-charge, CC and CV phases for boost
operation:
1. PS1 and Load #1 should be on from Section 2.4.1. In the EVM GUI, it is generally recommended to
read REG22-REG27 (or READ ALL REGISTERS) one time in order to show all the interrupts (from status
changes, automated routine completion, faults) that occurred since the last read. Reading those registers a
second clears the interrupts. After reading the registers,
• Verify ➡ REG1B reports all Normal, meaning no DPM loops active and no WD timer fault (bits 7-4),
VAC1 Present (bit2), VBUS Present (bit 0) and Power Good (bit 3)
2. Reinstall the shunt on jumper J17 to enable charge
• Verify ➡ STAT LED (D13) is lit
3. Take measurements as follows, noting that you may have to adjust the output of the load to accommodate
for voltage drop across the leads from the load to the EVM:
• Measure ➡ VVBUS-PGND (TP23 and TP44) = 5.0 V ±0.2 V
• Measure ➡ VBAT-PGND (TP29 and TP46) = 5.0 V ±0.2 V
• Measure ➡ IBAT_SENSE (voltage across 0.01 ohm resistor between TP19 and TP20) = 240 mA ±60 mA
• Click READ ALL REGISTERS and Verify ➡ REG1Cb[7:5] reports pre charge
4. Increase Load #1 regulation voltage to 8.0 V and take measurements as follows, noting that you may have
to adjust the output of the load to accommodate for voltage drop across the leads from the load to the EVM:
• Measure ➡ VVBUS-PGND (TP23 and TP44) = 5.0 V ±0.2 V
• Measure ➡ VBAT-PGND (TP29 and TP46) = 8.0 V ±0.1 V
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• Measure ➡ IBAT_SENSE (voltage across 0.01-Ω resistor between TP19 and TP20) = 500 mA ±50 mA
• Measure ➡ IVAC1_SENSE (voltage across 0.01-Ω resistor between TP1 and TP2) = 900 mA ±60 mA
• Click READ ALL REGISTERS and Verify ➡ REG1Cb[7:5] reports fast charge
5. Increase Load #1 regulation voltage to 8.4 V and take measurements as follows:
• Measure ➡ VBAT-PGND (TP29 and TP46) = 8.4 V ±0.04 V
• Measure ➡ IBAT_SENSE (voltage across 0.01-Ω resistor between TP19 and TP20) = 0 mA ±10 mA
• Click READ ALL REGISTERS and Verify ➡ REG1Cb[7:5] reports termination
6. Helpful hints when changing voltages and register settings from those above during charge mode:
• If increasing charge current or adding a load at SYS J3 terminal, you will likely need to disable the
EN_ILIM bit using 8-bit register tab/Charger Single-bit Registers/REG14b[1] and increase the IINDPM
register setting in 16-bit register tab/Charger Multi-bit Registers/REG06b[8:0].
• If increasing the input voltage above 8 V for the charger to enter buck mode, you will need to increase the
VAC_OVP from 7 V default using 8-bit register tab/Charger Multi-bit Registers/REG10b[5:4].
• The battery configuration is set at startup using the PROG pin (Jumpers JP24 to JP31). The battery
configuration can also be changed using 16-bit register tab/Charger Multi-bit Registers/REG0Ab[7:6].
Note that the SYSMIN and charge current charge with cell configuration.
• The status, fault and interrupt bits report are helpful debug tools.
2.4.4 OTG Mode Verification
Use the following steps for OTG mode verification for boost operation:
1. Power up then turn off Load#2 output. Set to CR = 12 V/0.5 A = 24 Ω. Disconnect PS1 from J1 and attach
Load#2 to J1 (VIN1 and GND).
2. Increase Load #1 regulation voltage to 8.0 V and take measurements as follows:
• Measure ➡ VBAT-PGND (TP27 and TP46) = 8.0 V ±0.1 V
3. For BQStudio, prepare the OTG mode charger register settings in the following way:
• On the 8-bit Registers tab in the Chip Config Single-bit Registers section:
– Check the EN OTG Mode box
– Check the EN ACDRV1 box
• On the 8-bit Registers tab in the OTG Multi-bit Registers section:
– Set IOTG 1000 mA to change the OTG current limit.
Figure 2-8. Single-Bit Register Section
•
12
On the 16-bit Registers tab in the OTG Multi-bit Registers section:
– Set the OTG mode regulation voltage to 12000 mV
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Figure 2-9. Multi-Bit Register Section
For GUI composer, go to OTG Configuration Section and change the following registers:
• OTG Reg Voltage to 12 V
• IOTG Limit to 1 A.
Figure 2-10. OTG Configuration Section
Next go to the Chip configuration and check the EN OTG Mode box and EN ACDRV1 box.
Figure 2-11. Chip Configuration
4. Take measurements as follows:
• Measure ➡ VVBUS-PGND (TP21 and TP45) = 12.0 V ±0.2 V
• Measure ➡ VAC1-PGND (TP22 and TP45) = 12.0 V ±0.2 V
• Click READ ALL REGISTERS
– Verify ➡ REG1Bb[6] reports VINDPM or OTG
– Verify ➡ REG1Cb[4:1] reports VBUS Status as Normal OTG
5. Turn on Load#2 output set to CR of 24 Ω.
6. Take measurements as follows:
• Measure ➡ VAC1-PGND (TP22 and TP45) = 12.0 V ±0.2 V
• Measure ➡ IAC1-SENSE (TP1 and TP2) = 500 mA ±0.10 A
7. Lower the Load#2 CR to 10 Ω.
8. Take measurements as follows to confirm OTG current function:
• Measure ➡ VAC1-PGND (TP22 and TP45) < 12.0 V ±0.2 V
• Measure ➡ IAC1-SENSE (TP1 and TP2) = 1000 mA ±0.10 A
• Click READ ALL REGISTERS and Verify ➡ REG1Bb[7] reports IINDPM
9. Hints for further OTG testing:
• Enabling OTG mode is a two-step process, first enable OTG and then turn on the appropriate AC drive
FETs.
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PCB Layout Guidelines
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3 PCB Layout Guidelines
Careful placement of components is critical in order for the charger to meet specifications. The items below are
listed in order of placement priority.
1. Place high frequency decoupling capacitors for PMID and SYS (C3 and C18 on the EVM) as close possible
to their respective pins and ground pin on the same layer as the charger IC (in other words, no vias) in order
to have the smallest current loop.
2. Place bulk capacitors for PMID and SYS as close possible to their respective pins and the charger's ground
pin on the same layer as the charger IC on the same layer as the charger IC (in other words, no vias).
3. Place the REGN capacitor (C35) to ground and BTST capacitors (C6 and C8) to SW as close as possible to
their respective pins only using vias for 1 side of each component if necessary.
4. Place high frequency decoupling capacitors for VBUS and BAT pins as close as possible to their respective
pins. Use at least 2 vias per capacitor terminal if required.
5. Place bulk capacitors for VBUS and BAT pins as close as possible to their respective pins. Use at least 2
vias per capacitor terminal if required.
6. Place the inductor close to SW1 and SW2 pins. It is acceptable to use multiple vias to make these
connections as the vias are only adding small amounts of inductance and resistance to an inductor.
7. While this EVM has analog ground (AGND) and power ground (PGND) planes that connect close to the
charge GND pin, two grounds not required. Resistors and capacitors used for setting sensitive nodes (for
example, ILIM, TS) can use one common ground plane but with their ground terminals connected away from
high current ground return paths containing switching noise.
Note that this EVM has test points and jumpers requiring traces out to the PCB edges. Routing these traces
required some PCB layout compromises for less critical components than those listed in the first six items above.
14
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Board Layout, Schematic and Bill of Materials
4 Board Layout, Schematic and Bill of Materials
4.1 BMS034 Board Layout
Figure 4-1 through Figure 4-4 show the board layout for the BQ2579XEVMs.
Figure 4-1. BMS034A/B Top Layer
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Board Layout, Schematic and Bill of Materials
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Figure 4-2. BMS034A/B Signal Layer 1
16
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Figure 4-3. BMS034A/B Signal Layer 2
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Board Layout, Schematic and Bill of Materials
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Figure 4-4. BMS034A/B Bottom Layer
18
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4.2 BQ2579XEVM (BMS034) Schematics
Figure 4-5, Figure 4-6, and Figure 4-7 illustrate the schematics for the BQ2579XEVM.
Figure 4-5. BQ25792EVM (BMS034A/B-001) and BQ25798EVM (BMS034A/B-003) Schematic Page 1
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EXTERNAL
THERMISTOR
GND
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1
2
Board Layout, Schematic and Bill of Materials
1
2
EXT_TS
REGN
REGN
JP12
J7
1
2
TS
COOL
R18
5.23k
AGND
1
2
/QON
1
2
TS
COLD
JP15
JP13
R22
TS
WARM
1
2
EXT_TS
CHARGE
ENABLE
JP17
ILIM_HIZ
AGND
TS
HOT
JP19
ENABLE
HIZ
JP20
AGND
R23
100k
1
2
JP21
R25
10.0k
R26
4.87k
AGND
VBUS
1
2
S1
R21
127k
0
1
2
JP18
R24
30.1k
JP14
R20
255k
R19
7.68k
TS
NORMAL
/CE
1.5A
IINDPM
JP16
TS
1
2
1
2
500mA
IINDPM
AGND
BAT
PROG
D11
1
2
D12
1S
1.5MHz
JP22 2A ICHG
1
2
1S
750kHz
JP23 2A ICHG
1
2
1
2
2S
1.5MHz
JP24 2A ICHG
2S
750kHz
JP25 2A ICHG
1
2
1
2
3S
1.5MHz
JP26 1A ICHG
1
2
3S
750kHz
JP27 1A ICHG
4S
1.5MHz
1
2
4S
750kHz
JP28 1A ICHG
JP29 1A ICHG
U2
R35
1
2
10.0
JP30
2
IN
OUT
R36
1
C43
C44
GND
0.1uF
PULLUP
R27
3.00k
R28
4.70k
R29
6.04k
R30
8.20k
R31
10.5k
R32
13.7k
R33
17.4k
R34
27.0k
0
3
0.1uF
TLV76033DBZR
PULLUP
CONNECT
PGND
PGND
AGND
EV2400
PULLUP
JP31
4
3
2
1
1
2
R37
J8
PULLUP
PULLUP
PULLUP
VBUS
VBUS
SCL
SCL
/INT
/INT
BAT
BAT
SDA
SDA
/CE
/CE
REGN
REGN
10.0
SDA
R38
2.21k
1
SCL
R39
10.0k
R40
10.0k
R41
10.0k
R42
10.0k
D13
Green
PULLUP
PULLUP
ILIM_HIZ
PROG
STAT
STAT
ILIM_HIZ
/QON
/QON
2
AGND
PROG
TS
SCL
9
7
5
3
1
10
8
6
4
2
SCL
SDA
/INT
/CE
SDA
JP32
STAT
AGND
J9
TS
1
2
STAT LED
CONNECT
USB2ANY
PULLUP
1
2
JP33
R43
PULLUP
10.0
Figure 4-6. BQ25792EVM (BMS034A/B-001), BQ25798BKUPEVM (BMS034A/B-005) and BQ25798EVM (BMS034A/B-003) Schematic Page 2
20
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Figure 4-7. BQ25798BKUPEVM (BMS034A/B-002) Schematic Page 1
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Board Layout, Schematic and Bill of Materials
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4.3 Bill of Materials
Table 4-1 lists the BQ2579XEVM bill of materials.
Table 4-1. BQ2579XEVM Bill of Materials
Designator
QTY
Value
Description
C2, C4
2
Package Reference
Part Number
Manufacturer
1000pF
CAP, CERM, 1000 pF, 50 V, ±1%, C0G/NP0, 0402
0402
GRM1555C1H102FA01D
C6, C8
MuRata
2
0.047uF
CAP, CERM, 0.047 uF, 25 V, ±10%, X7R, 0402
0402
GRM155R71E473KA88D
MuRata
C11, C12, C19, C20, C21, C22,
C23, C29, C30, C31
10
10uF
CAP, CERM, 10 uF, 25 V, ±10%, X5R, 0805
0805
C2012X5R1E106K125AB
TDK
C13, C14, C15, C18, C32
5
0.1uF
CAP, CERM, 0.1 uF, 50 V,±10%, X7R, 0402
0402
C1005X7R1H104K050BE
TDK
C33, C34 (BQ25798BKUPEVM
only)
2
33uF
Aluminum Polymer Capacitor 33uF 20% 25V
SMD2 (7343-31)
ECASD41E336M040KA0
Murata
C35
1
4.7uF
CAP, CERM, 4.7 uF, 16 V, ±10%, X5R, 0603
0603
GRM188R61C475KAAJD
MuRata
C36
1
1000pF
CAP, CERM, 1000 pF, 50 V, ±5%, C0G/NP0, 0402
0402
GRM1555C1H102JA01D
MuRata
C38, C39
2
10uF
CAP, CERM, 10 uF, 25 V, ±20%, X5R, 0603
0603
GRT188R61E106ME13D
MuRata
C43, C44
2
0.1uF
CAP, CERM, 0.1 uF, 25 V, ±10%, X5R, 0402
0402
GRM155R61E104KA87D
MuRata
D2, D6
2
12V
Diode, Zener, 12 V, 300 mW, SOD-523
SOD-523
BZT52C12T-7
Diodes Inc.
D11, D12
2
30V
Diode, Schottky, 30 V, 0.2 A, SOD-323
SOD-323
BAT54HT1G
ON Semiconductor
D13
1
Green
LED, Green, SMD
1.6x0.8x0.8mm
LTST-C190GKT
Lite-On
H1, H2, H3, H4
4
Bumpon, Hemisphere, 0.44 X 0.20, Clear
Transparent Bumpon
SJ-5303 (CLEAR)
3M
J1, J2, J3, J4
4
Terminal Block, 5.08 mm, 2x1, Brass, TH
2x1 5.08 mm Terminal
Block
ED120/2DS
On-Shore Technology
J5
1
Terminal Block, 5.08 mm, 3x1, Brass, TH
3x1 5.08 mm Terminal
Block
ED120/3DS
On-Shore Technology
J6
1
Connector, Receptacle, Micro-USB Type B, R/A, Bottom
Mount SMT
7.5x2.45x5mm
47346-0001
Molex
J7
1
Terminal Block, 3.5 mm, 2x1, Tin, TH
Terminal Block, 3.5 mm,
2x1, TH
0393570002
Molex
J8
1
Header (friction lock), 100mil, 4x1, R/A, TH
4x1 R/A Header
0022053041
Molex
J9
1
Header (shrouded), 100mil, 5x2, High-Temperature, Gold, TH
5x2 Shrouded header
N2510-6002-RB
3M
JP1, JP2, JP7, JP8, JP9
5
Header, 100mil, 3x1, Tin, TH
Header, 3 PIN, 100mil,
Tin
PEC03SAAN
Sullins Connector
Solutions
JP3, JP4, JP5
3
Header, 100mil, 2x1, Gold, TH
Header, 100mil, 2x1, TH
HTSW-102-07-G-S
Samtec
JP6, JP10, JP11, JP12, JP13,
JP14, JP15, JP16, JP17, JP18,
JP19, JP20, JP21, JP22, JP23,
JP24, JP25, JP26, JP27, JP28,
JP29, JP30, JP31, JP32, JP33
25
Header, 100mil, 2x1, Tin, TH
Header, 2 PIN, 100mil,
Tin
PEC02SAAN
Sullins Connector
Solutions
L2
1
1uH
Inductor, Shielded, Ferrite, 1 uH, 11.1 A, 0.0078 ohm, SMD
SMD 7.1x3.0x6.5mm
SPM6530T-1R0M120
TDK
Q1, Q2, Q3, Q4
4
30V
MOSFET, N-CH, 30 V, 60 A, DNH0008A (VSONP-8)
DNH0008A
CSD17581Q3A
Texas Instruments
Q5
1
30V
MOSFET, N-CH, 30 V, 60 A, DQG0008A (VSON-CLIP-8)
DQG0008A
CSD17575Q3
Texas Instruments
R2, R6, R11, R12, R13
5
0.01
RES, 0.01, 1%, 1 W, 2010
2010
WSL2010R0100FEA18
Vishay-Dale
R4, R9
2
294
RES, 294, 1%, 0.1 W, AEC-Q200 Grade 0, 0603
0603
CRCW0603294RFKEA
Vishay-Dale
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Table 4-1. BQ2579XEVM Bill of Materials (continued)
Designator
QTY
Value
Description
R15
1
100
Package Reference
Part Number
Manufacturer
RES, 100, 1%, 0.1 W, 0603
0603
RC0603FR-07100RL
R17, R36
2
0
Yageo
RES, 0, 5%, 0.1 W, AEC-Q200 Grade 0, 0603
0603
CRCW06030000Z0EA
Vishay-Dale
R18
1
R19
1
5.23k
RES, 5.23 k, 1%, 0.063 W, AEC-Q200 Grade 0, 0402
0402
CRCW04025K23FKED
Vishay-Dale
7.68k
RES, 7.68 k, 1%, 0.063 W, AEC-Q200 Grade 0, 0402
0402
CRCW04027K68FKED
R20
Vishay-Dale
1
255k
RES, 255 k, 1%, 0.1 W, AEC-Q200 Grade 0, 0603
0603
CRCW0603255KFKEA
Vishay-Dale
R21
1
127k
RES, 127 k, 1%, 0.1 W, AEC-Q200 Grade 0, 0603
0603
CRCW0603127KFKEA
Vishay-Dale
R22
1
0
RES, 0, 1%, 0.5 W, 0805
0805
5106
Keystone
R23
1
100k
RES, 100 k, 1%, 0.1 W, 0603
0603
RC0603FR-07100KL
Yageo
R24
1
30.1k
RES, 30.1 k, 1%, 0.063 W, AEC-Q200 Grade 0, 0402
0402
CRCW040230K1FKED
Vishay-Dale
R25, R39, R40, R41, R42
5
10.0k
RES, 10.0 k, 1%, 0.063 W, AEC-Q200 Grade 0, 0402
0402
CRCW040210K0FKED
Vishay-Dale
R26
1
4.87k
RES, 4.87 k, 1%, 0.063 W, AEC-Q200 Grade 0, 0402
0402
CRCW04024K87FKED
Vishay-Dale
R27
1
3.57k
RES, 3.57 k, 1%, 0.1 W, AEC-Q200 Grade 0, 0603
0603
CRCW06033K57FKEA
Vishay-Dale
R28
1
4.75k
RES, 4.75 k, 1%, 0.1 W, AEC-Q200 Grade 0, 0603
0603
CRCW06034K75FKEA
Vishay-Dale
R29
1
6.20k
RES, 6.20 k, 1%, 0.1 W, 0603
0603
RC0603FR-076K2L
Yageo
R30
1
8.20k
RES, 8.20 k, 1%, 0.1 W, 0603
0603
RC0603FR-078K2L
Yageo
R31
1
10.5k
RES, 10.5 k, 1%, 0.1 W, AEC-Q200 Grade 0, 0603
0603
CRCW060310K5FKEA
Vishay-Dale
R32
1
14.0k
RES, 14.0 k, 1%, 0.1 W, AEC-Q200 Grade 0, 0603
0603
CRCW060314K0FKEA
Vishay-Dale
R33
1
18.0k
RES, 18.0 k, 1%, 0.1 W, AEC-Q200 Grade 0, 0603
0603
ERJ-3EKF1802V
Panasonic
R34
1
27.0k
RES, 27.0 k, 1%, 0.1 W, AEC-Q200 Grade 0, 0603
0603
ERJ-3EKF2702V
Panasonic
R35, R37, R43
3
10.0
RES, 10.0, 1%, 0.25 W, AEC-Q200 Grade 0, 1206
1206
ERJ-8ENF10R0V
Panasonic
R38
1
2.21k
RES, 2.21 k, 1%, 0.063 W, AEC-Q200 Grade 0, 0402
0402
CRCW04022K21FKED
Vishay-Dale
S1
1
Switch, Normally open, 2.3N force, 200k operations, SMD
KSR
KSR221GLFS
C&K Components
SH-JP1, SH-JP2, SH-JP6, SHJP7, SH-JP8, SH-JP9, SH-JP11,
SH-JP12, SH-JP14, SH-JP17,
SH-JP18, SH-JP24, SH-JP30,
SH-JP32
14
Shunt, 100mil, Gold plated, Black
Shunt
SNT-100-BK-G
Samtec
TP1, TP2, TP4, TP6, TP7, TP9,
TP11, TP13, TP14, TP15, TP16,
TP17, TP18, TP19, TP20, TP21,
TP22, TP30, TP31, TP32, TP33,
TP34, TP35, TP36, TP37, TP38,
TP39, TP40, TP41, TP42, TP43
31
Test Point, Miniature, White, TH
White Miniature
Testpoint
5002
Keystone
TP23, TP24, TP25, TP26
4
Test Point, Miniature, Red, TH
Red Miniature Testpoint
5000
Keystone
TP27, TP28
2
Test Point, Miniature, Orange, TH
Orange Miniature
Testpoint
5003
Keystone
TP29
1
Test Point, Miniature, Yellow, TH
Yellow Miniature
Testpoint
5004
Keystone
TP44, TP45, TP46, TP47, TP48,
TP49, TP50
7
Test Point, Compact, SMT
Testpoint_Keystone_Co
mpact
5016
Keystone
U1
1
BQ2579x HotRod
VQFN-HR29
BQ25792RQM
Texas Instruments
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Board Layout, Schematic and Bill of Materials
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Table 4-1. BQ2579XEVM Bill of Materials (continued)
Designator
QTY
Value
Description
Package Reference
Part Number
Manufacturer
100-mA, 30-V, Fixed-Output, Linear-Voltage Regulator,
DBZ0003A (SOT-23-3)
DBZ0003A
TLV76033DBZR
Texas Instruments
CAP, CERM, 1 uF, 25 V, ±10%, X7R, 0805
0805
GRM219R71E105KA88D
MuRata
U2
1
C1, C3, C26
0
1uF
C5, C7
0
2200pF
CAP, CERM, 2200 pF, 50 V, ±5%, C0G/NP0, 0603
0603
GRM1885C1H222JA01D
MuRata
C9, C10, C24, C27, C28
0
10uF
CAP, CERM, 10 uF, 25 V, ±10%, X5R, 0805
0805
C2012X5R1E106K125AB
TDK
C16, C17
0
0.01uF
CAP, CERM, 0.01 uF, 50 V, ±5%, X7R, 0402
0402
C0402C103J5RACTU
Kemet
C25
0
33uF
CAP, TA, 33 uF, 35 V, ±20%, 0.065 ohm, SMD
7343-31
T521D336M035ATE065
Kemet
C37
0
0.1uF
CAP, CERM, 0.1 uF, 50 V,±10%, X7R, 0402
0402
C1005X7R1H104K050BE
TDK
C40
0
10uF
CAP, CERM, 10 uF, 25 V, ±20%, X5R, 0603
0603
GRT188R61E106ME13D
MuRata
C41
0
1000pF
CAP, CERM, 1000 pF, 50 V, ±5%, C0G/NP0, 0402
0402
GRM1555C1H102JA01D
MuRata
C42
0
1000pF
CAP, CERM, 1000 pF, 50 V, ±1%, C0G/NP0, 0402
0402
GRM1555C1H102FA01D
MuRata
D1, D5, D10
0
40V
Diode, Schottky, 40 V, 0.38 A, SOD-523
SOD-523
ZLLS350TA
Diodes Inc.
D3, D4, D7, D8
0
30V
Diode, Schottky, 30 V, 1 A, SOD-123
SOD-123
MBR130T1G
Diodes Inc.
D9
0
12V
Diode, Zener, 12 V, 300 mW, SOD-523
SOD-523
BZT52C12T-7
Diodes Inc.
FID1, FID2, FID3, FID4, FID5,
FID6
0
Fiducial mark. There is nothing to buy or mount.
N/A
N/A
N/A
L1
0
1uH
Inductor, 1 uH, 3.2 A, 0.028 ohm, SMD
2.5x2mm
MPIM252010F1R0M-LF
Microgate
R1, R5, R14
0
0
RES, 0, 1%, 0.5 W, 0805
0805
5106
Keystone
R3, R8, R16
0
100k
RES, 100 k, 1%, 0.0625 W, 0402
0402
RC0402FR-07100KL
Yageo America
R7, R10
0
2.0
RES, 2.0, 5%, 0.1 W, AEC-Q200 Grade 0, 0603
0603
CRCW06032R00JNEA
Vishay-Dale
SH-JP3, SH-JP4, SH-JP5, SHJP10, SH-JP13, SH-JP15, SHJP16, SH-JP19, SH-JP20, SHJP21, SH-JP22, SH-JP23, SHJP25, SH-JP26, SH-JP27, SHJP28, SH-JP29, SH-JP31, SHJP33
0
1x2
Shunt, 100mil, Gold plated, Black
Shunt
SNT-100-BK-G
Samtec
TP3, TP5, TP8, TP10, TP12
0
Test Point, Miniature, White, TH
White Miniature
Testpoint
5002
Keystone
24
BQ25792EVM, BQ25798EVM and BQ25798BKUPEVM (BMS034) Evaluation Module
Copyright © 2022 Texas Instruments Incorporated
SLUUCB5E – JUNE 2020 – REVISED JULY 2022
Submit Document Feedback
www.ti.com
Revision History
5 Revision History
NOTE: Page numbers for previous revisions may differ from page numbers in the current version.
Changes from Revision D (September 2021) to Revision E (July 2022)
Page
• Changed Recommended Operating Conditions................................................................................................. 6
• Changed Equipment........................................................................................................................................... 6
• Changed Software Setup....................................................................................................................................7
• Changed Initial Settings......................................................................................................................................9
• Changed Communication Verification.................................................................................................................9
• Changed OTG Mode Verification......................................................................................................................12
• Updated Figure 4-7 ..........................................................................................................................................19
Changes from Revision C (June 2021) to Revision D (September 2021)
Page
• Updated Equipment Test Setup for Testing Battery Charging image..................................................................6
Changes from Revision B (December 2020) to Revision C (June 2021)
Page
• Changed BQ25796EVM to BQ25798BKUPEVM........................................................................................... 0
• Removed BQ25796 and added BQ25798BKUPEVM ....................................................................................... 1
• Deleted BQ25796. ............................................................................................................................................. 3
• Removed BQ25796............................................................................................................................................ 3
• Corrected typos in JP9, JP14 and JP31 descriptions.........................................................................................4
• Removed BQ25796.......................................................................................................................................... 15
• Renamed BQ25796EVM to BQ25798BKUPEVM............................................................................................ 19
• Updated Figure 4-7 ..........................................................................................................................................19
• For C22,C34, changed reference to BQ25798BKUPEVM and part number.................................................... 22
Changes from Revision A (September 2020) to Revision B (December 2020)
Page
• Added BQ25796 and BQ25798 features and data sheet literature numbers..................................................... 3
• Updated description for JP1, JP2, JP5, JP8, and JP9 shunts............................................................................ 4
• Deleted EVM revision E2 text. Added BQ25796 schematic and reference to BQ25798 schematic. ...............19
• Updated existing BOM to include BQ25796EVM components.........................................................................22
Changes from Revision * (June 2020) to Revision A (September 2020)
Page
• Deleted BQ25795EVM....................................................................................................................................... 3
• Deleted BQ25795. ............................................................................................................................................. 3
• Deleted BQ25795EVM from text and table.........................................................................................................3
• Deleted BQ25795EVM....................................................................................................................................... 4
• Updated Equipment Test Setup for Testing Battery Charging image..................................................................6
• Updated BMS034E2/A Top Layer image.......................................................................................................... 15
• Changed BMS034E1 to BMS034E2/A............................................................................................................. 15
• Updated both schematic images...................................................................................................................... 19
• Updated from BMS034E1 to BMS034E2/A...................................................................................................... 19
• Updated C37, D3 and D7 to non-populated .................................................................................................... 22
• Added D3, D4, D7 and D8 to MBR130T1G...................................................................................................... 22
SLUUCB5E – JUNE 2020 – REVISED JULY 2022
Submit Document Feedback
BQ25792EVM, BQ25798EVM and BQ25798BKUPEVM (BMS034) Evaluation
Module
Copyright © 2022 Texas Instruments Incorporated
25
STANDARD TERMS FOR EVALUATION MODULES
1.
Delivery: TI delivers TI evaluation boards, kits, or modules, including any accompanying demonstration software, components, and/or
documentation which may be provided together or separately (collectively, an “EVM” or “EVMs”) to the User (“User”) in accordance
with the terms set forth herein. User's acceptance of the EVM is expressly subject to the following terms.
1.1 EVMs are intended solely for product or software developers for use in a research and development setting to facilitate feasibility
evaluation, experimentation, or scientific analysis of TI semiconductors products. EVMs have no direct function and are not
finished products. EVMs shall not be directly or indirectly assembled as a part or subassembly in any finished product. For
clarification, any software or software tools provided with the EVM (“Software”) shall not be subject to the terms and conditions
set forth herein but rather shall be subject to the applicable terms that accompany such Software
1.2 EVMs are not intended for consumer or household use. EVMs may not be sold, sublicensed, leased, rented, loaned, assigned,
or otherwise distributed for commercial purposes by Users, in whole or in part, or used in any finished product or production
system.
2
Limited Warranty and Related Remedies/Disclaimers:
2.1 These terms do not apply to Software. The warranty, if any, for Software is covered in the applicable Software License
Agreement.
2.2 TI warrants that the TI EVM will conform to TI's published specifications for ninety (90) days after the date TI delivers such EVM
to User. Notwithstanding the foregoing, TI shall not be liable for a nonconforming EVM if (a) the nonconformity was caused by
neglect, misuse or mistreatment by an entity other than TI, including improper installation or testing, or for any EVMs that have
been altered or modified in any way by an entity other than TI, (b) the nonconformity resulted from User's design, specifications
or instructions for such EVMs or improper system design, or (c) User has not paid on time. Testing and other quality control
techniques are used to the extent TI deems necessary. TI does not test all parameters of each EVM.
User's claims against TI under this Section 2 are void if User fails to notify TI of any apparent defects in the EVMs within ten (10)
business days after delivery, or of any hidden defects with ten (10) business days after the defect has been detected.
2.3 TI's sole liability shall be at its option to repair or replace EVMs that fail to conform to the warranty set forth above, or credit
User's account for such EVM. TI's liability under this warranty shall be limited to EVMs that are returned during the warranty
period to the address designated by TI and that are determined by TI not to conform to such warranty. If TI elects to repair or
replace such EVM, TI shall have a reasonable time to repair such EVM or provide replacements. Repaired EVMs shall be
warranted for the remainder of the original warranty period. Replaced EVMs shall be warranted for a new full ninety (90) day
warranty period.
WARNING
Evaluation Kits are intended solely for use by technically qualified,
professional electronics experts who are familiar with the dangers
and application risks associated with handling electrical mechanical
components, systems, and subsystems.
User shall operate the Evaluation Kit within TI’s recommended
guidelines and any applicable legal or environmental requirements
as well as reasonable and customary safeguards. Failure to set up
and/or operate the Evaluation Kit within TI’s recommended
guidelines may result in personal injury or death or property
damage. Proper set up entails following TI’s instructions for
electrical ratings of interface circuits such as input, output and
electrical loads.
NOTE:
EXPOSURE TO ELECTROSTATIC DISCHARGE (ESD) MAY CAUSE DEGREDATION OR FAILURE OF THE EVALUATION
KIT; TI RECOMMENDS STORAGE OF THE EVALUATION KIT IN A PROTECTIVE ESD BAG.
www.ti.com
3
Regulatory Notices:
3.1 United States
3.1.1
Notice applicable to EVMs not FCC-Approved:
FCC NOTICE: This kit is designed to allow product developers to evaluate electronic components, circuitry, or software
associated with the kit to determine whether to incorporate such items in a finished product and software developers to write
software applications for use with the end product. This kit is not a finished product and when assembled may not be resold or
otherwise marketed unless all required FCC equipment authorizations are first obtained. Operation is subject to the condition
that this product not cause harmful interference to licensed radio stations and that this product accept harmful interference.
Unless the assembled kit is designed to operate under part 15, part 18 or part 95 of this chapter, the operator of the kit must
operate under the authority of an FCC license holder or must secure an experimental authorization under part 5 of this chapter.
3.1.2
For EVMs annotated as FCC – FEDERAL COMMUNICATIONS COMMISSION Part 15 Compliant:
CAUTION
This device complies with part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) This device may not
cause harmful interference, and (2) this device must accept any interference received, including interference that may cause
undesired operation.
Changes or modifications not expressly approved by the party responsible for compliance could void the user's authority to
operate the equipment.
FCC Interference Statement for Class A EVM devices
NOTE: This equipment has been tested and found to comply with the limits for a Class A digital device, pursuant to part 15 of
the FCC Rules. These limits are designed to provide reasonable protection against harmful interference when the equipment is
operated in a commercial environment. This equipment generates, uses, and can radiate radio frequency energy and, if not
installed and used in accordance with the instruction manual, may cause harmful interference to radio communications.
Operation of this equipment in a residential area is likely to cause harmful interference in which case the user will be required to
correct the interference at his own expense.
FCC Interference Statement for Class B EVM devices
NOTE: This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to part 15 of
the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential
installation. This equipment generates, uses and can radiate radio frequency energy and, if not installed and used in accordance
with the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference
will not occur in a particular installation. If this equipment does cause harmful interference to radio or television reception, which
can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one or more
of the following measures:
•
•
•
•
Reorient or relocate the receiving antenna.
Increase the separation between the equipment and receiver.
Connect the equipment into an outlet on a circuit different from that to which the receiver is connected.
Consult the dealer or an experienced radio/TV technician for help.
3.2 Canada
3.2.1
For EVMs issued with an Industry Canada Certificate of Conformance to RSS-210 or RSS-247
Concerning EVMs Including Radio Transmitters:
This device complies with Industry Canada license-exempt RSSs. Operation is subject to the following two conditions:
(1) this device may not cause interference, and (2) this device must accept any interference, including interference that may
cause undesired operation of the device.
Concernant les EVMs avec appareils radio:
Le présent appareil est conforme aux CNR d'Industrie Canada applicables aux appareils radio exempts de licence. L'exploitation
est autorisée aux deux conditions suivantes: (1) l'appareil ne doit pas produire de brouillage, et (2) l'utilisateur de l'appareil doit
accepter tout brouillage radioélectrique subi, même si le brouillage est susceptible d'en compromettre le fonctionnement.
Concerning EVMs Including Detachable Antennas:
Under Industry Canada regulations, this radio transmitter may only operate using an antenna of a type and maximum (or lesser)
gain approved for the transmitter by Industry Canada. To reduce potential radio interference to other users, the antenna type
and its gain should be so chosen that the equivalent isotropically radiated power (e.i.r.p.) is not more than that necessary for
successful communication. This radio transmitter has been approved by Industry Canada to operate with the antenna types
listed in the user guide with the maximum permissible gain and required antenna impedance for each antenna type indicated.
Antenna types not included in this list, having a gain greater than the maximum gain indicated for that type, are strictly prohibited
for use with this device.
2
www.ti.com
Concernant les EVMs avec antennes détachables
Conformément à la réglementation d'Industrie Canada, le présent émetteur radio peut fonctionner avec une antenne d'un type et
d'un gain maximal (ou inférieur) approuvé pour l'émetteur par Industrie Canada. Dans le but de réduire les risques de brouillage
radioélectrique à l'intention des autres utilisateurs, il faut choisir le type d'antenne et son gain de sorte que la puissance isotrope
rayonnée équivalente (p.i.r.e.) ne dépasse pas l'intensité nécessaire à l'établissement d'une communication satisfaisante. Le
présent émetteur radio a été approuvé par Industrie Canada pour fonctionner avec les types d'antenne énumérés dans le
manuel d’usage et ayant un gain admissible maximal et l'impédance requise pour chaque type d'antenne. Les types d'antenne
non inclus dans cette liste, ou dont le gain est supérieur au gain maximal indiqué, sont strictement interdits pour l'exploitation de
l'émetteur
3.3 Japan
3.3.1
Notice for EVMs delivered in Japan: Please see http://www.tij.co.jp/lsds/ti_ja/general/eStore/notice_01.page 日本国内に
輸入される評価用キット、ボードについては、次のところをご覧ください。
http://www.tij.co.jp/lsds/ti_ja/general/eStore/notice_01.page
3.3.2
Notice for Users of EVMs Considered “Radio Frequency Products” in Japan: EVMs entering Japan may not be certified
by TI as conforming to Technical Regulations of Radio Law of Japan.
If User uses EVMs in Japan, not certified to Technical Regulations of Radio Law of Japan, User is required to follow the
instructions set forth by Radio Law of Japan, which includes, but is not limited to, the instructions below with respect to EVMs
(which for the avoidance of doubt are stated strictly for convenience and should be verified by User):
1.
2.
3.
Use EVMs in a shielded room or any other test facility as defined in the notification #173 issued by Ministry of Internal
Affairs and Communications on March 28, 2006, based on Sub-section 1.1 of Article 6 of the Ministry’s Rule for
Enforcement of Radio Law of Japan,
Use EVMs only after User obtains the license of Test Radio Station as provided in Radio Law of Japan with respect to
EVMs, or
Use of EVMs only after User obtains the Technical Regulations Conformity Certification as provided in Radio Law of Japan
with respect to EVMs. Also, do not transfer EVMs, unless User gives the same notice above to the transferee. Please note
that if User does not follow the instructions above, User will be subject to penalties of Radio Law of Japan.
【無線電波を送信する製品の開発キットをお使いになる際の注意事項】 開発キットの中には技術基準適合証明を受けて
いないものがあります。 技術適合証明を受けていないもののご使用に際しては、電波法遵守のため、以下のいずれかの
措置を取っていただく必要がありますのでご注意ください。
1.
2.
3.
電波法施行規則第6条第1項第1号に基づく平成18年3月28日総務省告示第173号で定められた電波暗室等の試験設備でご使用
いただく。
実験局の免許を取得後ご使用いただく。
技術基準適合証明を取得後ご使用いただく。
なお、本製品は、上記の「ご使用にあたっての注意」を譲渡先、移転先に通知しない限り、譲渡、移転できないものとします。
上記を遵守頂けない場合は、電波法の罰則が適用される可能性があることをご留意ください。 日本テキサス・イ
ンスツルメンツ株式会社
東京都新宿区西新宿６丁目２４番１号
西新宿三井ビル
3.3.3
Notice for EVMs for Power Line Communication: Please see http://www.tij.co.jp/lsds/ti_ja/general/eStore/notice_02.page
電力線搬送波通信についての開発キットをお使いになる際の注意事項については、次のところをご覧ください。http:/
/www.tij.co.jp/lsds/ti_ja/general/eStore/notice_02.page
3.4 European Union
3.4.1
For EVMs subject to EU Directive 2014/30/EU (Electromagnetic Compatibility Directive):
This is a class A product intended for use in environments other than domestic environments that are connected to a
low-voltage power-supply network that supplies buildings used for domestic purposes. In a domestic environment this
product may cause radio interference in which case the user may be required to take adequate measures.
3
www.ti.com
4
EVM Use Restrictions and Warnings:
4.1 EVMS ARE NOT FOR USE IN FUNCTIONAL SAFETY AND/OR SAFETY CRITICAL EVALUATIONS, INCLUDING BUT NOT
LIMITED TO EVALUATIONS OF LIFE SUPPORT APPLICATIONS.
4.2 User must read and apply the user guide and other available documentation provided by TI regarding the EVM prior to handling
or using the EVM, including without limitation any warning or restriction notices. The notices contain important safety information
related to, for example, temperatures and voltages.
4.3 Safety-Related Warnings and Restrictions:
4.3.1
User shall operate the EVM within TI’s recommended specifications and environmental considerations stated in the user
guide, other available documentation provided by TI, and any other applicable requirements and employ reasonable and
customary safeguards. Exceeding the specified performance ratings and specifications (including but not limited to input
and output voltage, current, power, and environmental ranges) for the EVM may cause personal injury or death, or
property damage. If there are questions concerning performance ratings and specifications, User should contact a TI
field representative prior to connecting interface electronics including input power and intended loads. Any loads applied
outside of the specified output range may also result in unintended and/or inaccurate operation and/or possible
permanent damage to the EVM and/or interface electronics. Please consult the EVM user guide prior to connecting any
load to the EVM output. If there is uncertainty as to the load specification, please contact a TI field representative.
During normal operation, even with the inputs and outputs kept within the specified allowable ranges, some circuit
components may have elevated case temperatures. These components include but are not limited to linear regulators,
switching transistors, pass transistors, current sense resistors, and heat sinks, which can be identified using the
information in the associated documentation. When working with the EVM, please be aware that the EVM may become
very warm.
4.3.2
EVMs are intended solely for use by technically qualified, professional electronics experts who are familiar with the
dangers and application risks associated with handling electrical mechanical components, systems, and subsystems.
User assumes all responsibility and liability for proper and safe handling and use of the EVM by User or its employees,
affiliates, contractors or designees. User assumes all responsibility and liability to ensure that any interfaces (electronic
and/or mechanical) between the EVM and any human body are designed with suitable isolation and means to safely
limit accessible leakage currents to minimize the risk of electrical shock hazard. User assumes all responsibility and
liability for any improper or unsafe handling or use of the EVM by User or its employees, affiliates, contractors or
designees.
4.4 User assumes all responsibility and liability to determine whether the EVM is subject to any applicable international, federal,
state, or local laws and regulations related to User’s handling and use of the EVM and, if applicable, User assumes all
responsibility and liability for compliance in all respects with such laws and regulations. User assumes all responsibility and
liability for proper disposal and recycling of the EVM consistent with all applicable international, federal, state, and local
requirements.
5.
Accuracy of Information: To the extent TI provides information on the availability and function of EVMs, TI attempts to be as accurate
as possible. However, TI does not warrant the accuracy of EVM descriptions, EVM availability or other information on its websites as
accurate, complete, reliable, current, or error-free.
6.
Disclaimers:
6.1 EXCEPT AS SET FORTH ABOVE, EVMS AND ANY MATERIALS PROVIDED WITH THE EVM (INCLUDING, BUT NOT
LIMITED TO, REFERENCE DESIGNS AND THE DESIGN OF THE EVM ITSELF) ARE PROVIDED "AS IS" AND "WITH ALL
FAULTS." TI DISCLAIMS ALL OTHER WARRANTIES, EXPRESS OR IMPLIED, REGARDING SUCH ITEMS, INCLUDING BUT
NOT LIMITED TO ANY EPIDEMIC FAILURE WARRANTY OR IMPLIED WARRANTIES OF MERCHANTABILITY OR FITNESS
FOR A PARTICULAR PURPOSE OR NON-INFRINGEMENT OF ANY THIRD PARTY PATENTS, COPYRIGHTS, TRADE
SECRETS OR OTHER INTELLECTUAL PROPERTY RIGHTS.
6.2 EXCEPT FOR THE LIMITED RIGHT TO USE THE EVM SET FORTH HEREIN, NOTHING IN THESE TERMS SHALL BE
CONSTRUED AS GRANTING OR CONFERRING ANY RIGHTS BY LICENSE, PATENT, OR ANY OTHER INDUSTRIAL OR
INTELLECTUAL PROPERTY RIGHT OF TI, ITS SUPPLIERS/LICENSORS OR ANY OTHER THIRD PARTY, TO USE THE
EVM IN ANY FINISHED END-USER OR READY-TO-USE FINAL PRODUCT, OR FOR ANY INVENTION, DISCOVERY OR
IMPROVEMENT, REGARDLESS OF WHEN MADE, CONCEIVED OR ACQUIRED.
7.
4
USER'S INDEMNITY OBLIGATIONS AND REPRESENTATIONS. USER WILL DEFEND, INDEMNIFY AND HOLD TI, ITS
LICENSORS AND THEIR REPRESENTATIVES HARMLESS FROM AND AGAINST ANY AND ALL CLAIMS, DAMAGES, LOSSES,
EXPENSES, COSTS AND LIABILITIES (COLLECTIVELY, "CLAIMS") ARISING OUT OF OR IN CONNECTION WITH ANY
HANDLING OR USE OF THE EVM THAT IS NOT IN ACCORDANCE WITH THESE TERMS. THIS OBLIGATION SHALL APPLY
WHETHER CLAIMS ARISE UNDER STATUTE, REGULATION, OR THE LAW OF TORT, CONTRACT OR ANY OTHER LEGAL
THEORY, AND EVEN IF THE EVM FAILS TO PERFORM AS DESCRIBED OR EXPECTED.
www.ti.com
8.
Limitations on Damages and Liability:
8.1 General Limitations. IN NO EVENT SHALL TI BE LIABLE FOR ANY SPECIAL, COLLATERAL, INDIRECT, PUNITIVE,
INCIDENTAL, CONSEQUENTIAL, OR EXEMPLARY DAMAGES IN CONNECTION WITH OR ARISING OUT OF THESE
TERMS OR THE USE OF THE EVMS , REGARDLESS OF WHETHER TI HAS BEEN ADVISED OF THE POSSIBILITY OF
SUCH DAMAGES. EXCLUDED DAMAGES INCLUDE, BUT ARE NOT LIMITED TO, COST OF REMOVAL OR
REINSTALLATION, ANCILLARY COSTS TO THE PROCUREMENT OF SUBSTITUTE GOODS OR SERVICES, RETESTING,
OUTSIDE COMPUTER TIME, LABOR COSTS, LOSS OF GOODWILL, LOSS OF PROFITS, LOSS OF SAVINGS, LOSS OF
USE, LOSS OF DATA, OR BUSINESS INTERRUPTION. NO CLAIM, SUIT OR ACTION SHALL BE BROUGHT AGAINST TI
MORE THAN TWELVE (12) MONTHS AFTER THE EVENT THAT GAVE RISE TO THE CAUSE OF ACTION HAS
OCCURRED.
8.2 Specific Limitations. IN NO EVENT SHALL TI'S AGGREGATE LIABILITY FROM ANY USE OF AN EVM PROVIDED
HEREUNDER, INCLUDING FROM ANY WARRANTY, INDEMITY OR OTHER OBLIGATION ARISING OUT OF OR IN
CONNECTION WITH THESE TERMS, , EXCEED THE TOTAL AMOUNT PAID TO TI BY USER FOR THE PARTICULAR
EVM(S) AT ISSUE DURING THE PRIOR TWELVE (12) MONTHS WITH RESPECT TO WHICH LOSSES OR DAMAGES ARE
CLAIMED. THE EXISTENCE OF MORE THAN ONE CLAIM SHALL NOT ENLARGE OR EXTEND THIS LIMIT.
9.
Return Policy. Except as otherwise provided, TI does not offer any refunds, returns, or exchanges. Furthermore, no return of EVM(s)
will be accepted if the package has been opened and no return of the EVM(s) will be accepted if they are damaged or otherwise not in
a resalable condition. If User feels it has been incorrectly charged for the EVM(s) it ordered or that delivery violates the applicable
order, User should contact TI. All refunds will be made in full within thirty (30) working days from the return of the components(s),
excluding any postage or packaging costs.
10. Governing Law: These terms and conditions shall be governed by and interpreted in accordance with the laws of the State of Texas,
without reference to conflict-of-laws principles. User agrees that non-exclusive jurisdiction for any dispute arising out of or relating to
these terms and conditions lies within courts located in the State of Texas and consents to venue in Dallas County, Texas.
Notwithstanding the foregoing, any judgment may be enforced in any United States or foreign court, and TI may seek injunctive relief
in any United States or foreign court.
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2019, Texas Instruments Incorporated
5
IMPORTANT NOTICE AND DISCLAIMER
TI PROVIDES TECHNICAL AND RELIABILITY DATA (INCLUDING DATA SHEETS), DESIGN RESOURCES (INCLUDING REFERENCE
DESIGNS), APPLICATION OR OTHER DESIGN ADVICE, WEB TOOLS, SAFETY INFORMATION, AND OTHER RESOURCES “AS IS”
AND WITH ALL FAULTS, AND DISCLAIMS ALL WARRANTIES, EXPRESS AND IMPLIED, INCLUDING WITHOUT LIMITATION ANY
IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE OR NON-INFRINGEMENT OF THIRD
PARTY INTELLECTUAL PROPERTY RIGHTS.
These resources are intended for skilled developers designing with TI products. You are solely responsible for (1) selecting the appropriate
TI products for your application, (2) designing, validating and testing your application, and (3) ensuring your application meets applicable
standards, and any other safety, security, regulatory or other requirements.
These resources are subject to change without notice. TI grants you permission to use these resources only for development of an
application that uses the TI products described in the resource. Other reproduction and display of these resources is prohibited. No license
is granted to any other TI intellectual property right or to any third party intellectual property right. TI disclaims responsibility for, and you
will fully indemnify TI and its representatives against, any claims, damages, costs, losses, and liabilities arising out of your use of these
resources.
TI’s products are provided subject to TI’s Terms of Sale or other applicable terms available either on ti.com or provided in conjunction with
such TI products. TI’s provision of these resources does not expand or otherwise alter TI’s applicable warranties or warranty disclaimers for
TI products.
TI objects to and rejects any additional or different terms you may have proposed. IMPORTANT NOTICE
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2022, Texas Instruments Incorporated
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