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BQ6400RGZT

BQ6400RGZT

  • 厂商:

    BURR-BROWN(德州仪器)

  • 封装:

    VFQFN48

  • 描述:

    IC BATT MFUNC LI-ION 3-4C 48VQFN

  • 数据手册
  • 价格&库存
BQ6400RGZT 数据手册
Not Recommended for New Designs bq6400 www.ti.com ......................................................................................................................................................................................... SLUS841 – SEPTEMBER 2008 Single Chip 3 or 4 Cell Li-Ion Battery Management Controller With PowerPump™ Cell Balancing Technology FEATURES 1 • Advanced SmartSafety™ – Prevention – Optimal Cell Management – Diagnosis – Improved Sensing of Cell Problems – Fail Safe – Detection of Event Precursors • Rate-of-Change Detection of all Important Cell Characteristics: – Voltage – Impedance – Cell Temperature • PowerPump™ Active Cell Balancing Results in Longer Run Time and Cell Life • High Resolution 18-Bit Integrating Delta-Sigma Coulomb Counter for Precise Charge-Flow Measurements and Gas Gauging • Multiple Independent Δ-Σ A/Ds: One-per-cell Voltage, Plus Separate Temperature, Current and Safety • Simultaneous, Synchronous Measurement of Pack Current and Individual Cell Voltages • Very Low Power Consumption: < 250 µA Active, < 150 µA Standby, < 40 µA Ship, and < 1 A Under-Voltage Shutdown • Accurate, Advanced Temperature Monitoring of Cells and MOSFETs With up to 13 Sensors • Fully Programmable Voltage, Current, Balance and Temperature Protection Features • Cell Balancing Transfers Charge Efficiently From Cell to Cell During all Operating Conditions • Fail-Safe Operation of Pack Protection Circuits and MOSFETs • Designed for 3 to 4 Series Cell Battery Packs • Smart Battery System 1.1 Compliant • Integrated Support for Intel™ AMPS • Field Upgradeable Flash Memory 23 APPLICATIONS • • • Notebook Computer Battery Packs Portable Medical Equipment Portable Test Equipment DESCRIPTION The bq6400 Battery Management Controller is a complete Li-Ion control, monitoring, and safety solution designed for notebook computers and portable equipment. It is designed specifically to provide an enhanced, optimized solution for packs using three or four series cells. The bq6400 provides accurate gas gauging while providing control, communications and safety functions for the system. It provides simultaneous, synchronized voltage and temperature measurements using one A/D per-cell technology. Voltage measurements are also simultaneous with pack current measurements, eliminating system induced noise from measurements. This allows the precise, continuous, real-time calculation of cell impedance under all operating conditions, even during widely fluctuating loads. PowerPump™ technology transfers charge between cells to balance their voltage and capacity. Balancing is programmable during all battery modes: Charge, discharge, and rest. Highly efficient charge transfer circuitry nearly eliminates energy loss while providing true real-time balance between cells, resulting in longer run-time and improved cell cycle life. Temperature is sensed by one internal and up to 12 external sensors. This permits accurate temperature monitoring of each cell individually as well as pack protection MOSFETs. Internal firmware is then able to compensate for the temperature induced effects on cell capacity, impedance, and OCV on a cell-by-cell basis, resulting in superior charge/discharge and balancing control. Support for Intel™ Adaptive Mobile Power System (AMPS) requirements for battery and MOSFET control is built-in. User definable inputs require no external hardware translation logic. The bq6400 is completely user-configurable with parametric tables in flash memory to suit a variety of cell chemistries, operating conditions, safety control, and data reporting needs. It is easily configured using the supplied Battery Wizard™ graphical user interface. The device is fully programmed and requires no algorithm or firmware development. 1 2 3 Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. PowerPump, SmartSafety are trademarks of Texas Instruments. Intel is a trademark of Intel Corporation. PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. Copyright © 2008, Texas Instruments Incorporated Not Recommended for New Designs bq6400 SLUS841 – SEPTEMBER 2008 ......................................................................................................................................................................................... www.ti.com These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates. Voltage Balance Temp V1 PUMP 1 XT1* Voltage Balance Temp 1 Level Safety & FET Control FLASH CELL 3 V2 PUMP 2 XT2* EFCIC 8 bit RISC CPU Coulomb Counter CCBAT CCPACK Current A /D Internal Oscillator LED Control 6 Reset Logic RSTN I/O Safety LED1-5, LEDEN SMBCLK SMBDAT SMBus Watchdog Measure FUSE CSBAT CSPACK 2 nd Level Safety Internal Temperature Core / CPU PRE CHG DSG EFCID st SRAM Voltage Balance Temp 2.5V LDO-2 CELL 4 V3 PUMP 3 XT 3 2.5V LDO-1 Voltage Balance Temp CELL 1 V4 PUMP 4 XT 4 CELL 2 bq6400 BLOCK DIAGRAM ALERT Pack Interface * XT1 & XT2 inputs can optionally multiplex up to five (5) additional temperature sensors each . AVAILABLE OPTIONS (1) (1) 2 PRODUCT PACKAGE PACKAGE DESIGNATOR SPECIFIED TEMPERATURE RANGE ORDERING NUMBER TRANSPORT MEDIA QUANTITY bq6400 QFN-48 7×7mm RGZ –40°C to 85°C bq6400RGZR Reel For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI website at www.ti.com. Submit Documentation Feedback Copyright © 2008, Texas Instruments Incorporated Product Folder Link(s) :bq6400 Not Recommended for New Designs bq6400 www.ti.com ......................................................................................................................................................................................... SLUS841 – SEPTEMBER 2008 XT4 V4 SMBDAT SMBCLK 40 39 38 37 V3 XT3 42 41 V2 VLDO2 44 43 XT1 XT2 46 45 VSS V1 48 47 QFN-48 PACKAGE CHG 1 36 LED 5 DSG 2 35 LED 4 PRE 3 34 LED 3 EFCIC 4 33 LED 2 EFCID 5 32 LED 1 CCBAT 6 31 LEDEN CCPACK 7 30 FUSE VLDO1 8 29 XC CSBAT 9 28 MISO/ALERT CSPACK 10 27 MOSI NC 11 26 SCLK NC 12 25 RSTN 24 23 P4N NC 21 22 P4S P3N 19 20 P3S SDI3 18 17 P2N 16 13 15 P1N P2S SDO2 * SDI1 49 B TA SDO0 14 bq6400 *Tab connection located bottom center , see mechanical drawing for detail . TERMINAL FUNCTIONS TERMINAL NO. (1) NAME I/O (1) DESCRIPTION 1 CHG O Charge MOSFET control (Active high, enables current flow.) 2 DSG O Discharge MOSFET Control (Active high. Low opens MOSFET.) 3 PRE O Pre-Charge MOSFET control (Active high.) 4 EFCIC I External Charge FET Control, Intel™ AMPS compatible input 5 EFCID I 6 CCBAT IA Coulomb counter input (sense resistor), connect to battery negative 7 CCPACK IA Coulomb counter input (sense resistor), connect to pack negative 8 VLDO1 P Internal LDO-1 output, bypass with capacitor External Discharge FET Control, Intel™AMPS compatible input 9 CSBAT IA Current sense input (safety), connect to battery negative 10 CSPACK IA Current sense input (safety), connect to pack negative 11 N/C – Do not connect to this pin 12 N/C – Do not connect to this pin 13 SDO0 O Requires 100kΩ pull-up resistor to VLDO1 14 SDI1 I Connect to SDO0 via a capacitor 15 P1N O Charge balance gate drive, cell 1 North 16 P2S O Charge balance gate drive, cell 2 South 17 P2N O Charge balance gate drive, cell 2 North 18 SDO2 O Connect to SDI3 via capacitor 19 SDI3 I Connect to SDO2 via capacitor 20 P3S O Charge balance gate drive, cell 3 South 21 P3N O Charge balance gate drive, cell 3 North 22 P4S O Charge balance gate drive, cell 4 South 23 P4N O Charge balance gate drive, cell 4 North 24 N/C – Do not connect to this pin 25 RSTN I Device reset, active low I – input, IA – analog input, O – output, OA – analog output, OD – open drain output, p – power Submit Documentation Feedback Copyright © 2008, Texas Instruments Incorporated Product Folder Link(s) :bq6400 3 Not Recommended for New Designs bq6400 SLUS841 – SEPTEMBER 2008 ......................................................................................................................................................................................... www.ti.com TERMINAL FUNCTIONS (continued) TERMINAL NO. 4 NAME I/O (1) DESCRIPTION 26 SCLK – Do not connect to this pin 27 MOSI I Do not connect to this pin 28 MISO/ALERT O Optional ALERT output – asserted low on alarm condition (interrupt) 29 XC O Aux control 30 FUSE O Safety fuse control output, active high 31 LEDEN O LED common anode drive (hi), Aux Temp(n) input enable (low) 32 LED1 IO SOCi LED drive (active low), Aux Temp input 33 LED2 IO SOCi LED drive (active low), Aux Temp input 34 LED3 IO SOCi LED drive (active low), Aux Temp input 35 LED4 IO SOCi LED drive (active low), Aux Temp input 36 LED5 IO SOCi LED drive (active low), Aux Temp input 37 SMBCLK IO SMBus clock signal 38 SMBDAT IO SMBus data signal 39 V4 IA Cell 4 positive input 40 XT4 IA External temperature sensor 4 input 41 XT3 IA External temperature sensor 3 input 42 V3 IA Cell 3 positive input 43 VLDO2 P Internal LDO-2 output, bypass with capacitor 44 V2 IA Cell 2 positive input 45 XT2 IA External temperature sensor 2 input / mux temp input 2 46 XT1 IA External temperature sensor 1 input / mux temp input 1 47 V1 IA Cell 1 positive input 48 VSS IA Cell 1 negative input TAB TAB P Connect to VSS Submit Documentation Feedback Copyright © 2008, Texas Instruments Incorporated Product Folder Link(s) :bq6400 Not Recommended for New Designs bq6400 www.ti.com ......................................................................................................................................................................................... SLUS841 – SEPTEMBER 2008 ABSOLUTE MAXIMUM RATINGS (1) over operating free-air temperature range (unless otherwise noted) RANGE UNITS TA Operating free-air temperature (ambient) –40 to 85 °C TSTORAGE Storage temperature –65 to 150 °C V4-V3 Max cell voltage –0.5 to 5.0 V V3-V2 Max cell voltage –0.5 to 5.0 V V2-V1 Max cell voltage –0.5 to 5.0 V V1-VSS Max cell voltage –0.5 to 5.0 V Voltage on LED1-5 With respect to VSS 0.5 to 5.0 V V Voltage on CCBAT, CCPACK, CSBAT, CSPACK, XT1, XT2,SDIX, SDOX, LEDEN, FUSE Max voltage on any I/O pin (VSS – 0.5) to (VLDO1 + 0.5) Voltage on XT3, XT4 Maximum voltage range (V2 – 0.5) to (VLDO2 + 0.5) V EFCIC, EFCID With respect to VSS –0.5 to 5.5 V Voltage on SMBCLK, SMBDAT, ALERT With respect to VSS –0.5 to 6.0V V Voltage on PRE, CHG, DSG With respect to VSS –0.5 to (VLDO1 + 0.5) V Current through PRE, CHG, DSG, LEDEN, LED1-5 Maximum current source/sink 20 mA VLDO1 maximum current Maximum current draw from VLDO 20 mA ESD tolerance JEDEC, JESD22-A114 Human Body Model, R=1500 Ω, C=100 pF 2 kV Lead Temperature Soldering Total time < 3 seconds < 300 °C (1) Stresses or conditions in excess of those listed may cause permanent damage to the device. Exposure to these conditions for prolonged periods may adversely affect device reliability. These ratings are provided for reference only, and not meant to imply functional operation at these maxima or other circumstances beyond those indicated under recommended operating conditions. Submit Documentation Feedback Copyright © 2008, Texas Instruments Incorporated Product Folder Link(s) :bq6400 5 Not Recommended for New Designs bq6400 SLUS841 – SEPTEMBER 2008 ......................................................................................................................................................................................... www.ti.com ELECTRICAL CHARACTERISTICS TA = –40°C to 85°C (unless otherwise noted) PARAMETER TEST CONDITIONS MIN TYP MAX UNIT DC CHARACTERISTICS VCELL (1) Operating range Cells balanced IDD Operating mode current Measure / report state 250 µA ISTBY Standby mode current SMBCLK = SMBDAT = L 150 µA ISHIP Ship mode current 40 µA IECUV (2) Extreme cell under voltage shutdown current VOL VOH VIL 2.3 All cells < 2.7 V and any cell < ECUV setpoint 1.0 IOL < 4.0 mA (3) General I/O pins 4.5 IOH < –4.0 mA 0 µA 0.5 VLDO1–0.10 VLDO1× 0.25 VIH V V VLDO1× 0.75 VOLTAGE MEASUREMENT CHARACTERISTICS Measurement range 2.500 4.500 V Resolution
BQ6400RGZT 价格&库存

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