DRV5032
SLVSDC7F – APRIL 2017 – REVISED FEBRUARY 2022
DRV5032 Ultra-Low-Power Digital-Switch Hall Effect Sensor
1 Features
3 Description
•
The DRV5032 device is an ultra-low-power digitalswitch Hall effect sensor, designed for the most
compact and battery-sensitive systems. The device
is offered in multiple magnetic thresholds, sampling
rates, output drivers, and packages to accommodate
various applications.
•
•
•
•
•
When the applied magnetic flux density exceeds the
BOP threshold, the device outputs a low voltage. The
output stays low until the flux density decreases to
less than BRP, and then the output either drives a
high voltage or becomes high impedance, depending
on the device version. By incorporating an internal
oscillator, the device samples the magnetic field and
updates the output at a rate of 20 Hz, or 5 Hz for the
lowest current consumption. Omnipolar and unipolar
magnetic responses are available.
2 Applications
•
•
•
•
•
•
•
Battery-critical position sensing
Electricity meter tamper detection
Cell Phone, laptop, or tablet case sensing
E-locks, smoke detectors, appliances
Medical devices, IoT systems
Valve or solenoid position detection
Contactless diagnostics or activation
The device operates from a VCC range of 1.65 V to
5.5 V, and is packaged in a standard SOT-23, TO-92
and small X2SON.
Device Information(1)
PART NUMBER
PACKAGE
DRV5032
(1)
BODY SIZE (NOM)
SOT-23 (3)
2.92 mm × 1.30 mm
X2SON (4)
1.10 mm × 1.40 mm
TO-92 (3)
4.00 mm × 3.15 mm
For all available packages, see the orderable addendum at
the end of the data sheet.
1.4
distance
VCC
DRV5032
VCC
OUT
N S
Controller
GPIO
GND
Copyright © 201 7, Texas Instrumen ts Incorpor ate d
Typical Schematic
Average Supply Current (PA)
•
•
Industry-leading ultra-low power consumption
– 5-Hz version: 0.54 µA with 1.8 V
– 20-Hz versions: 1.6 µA with 3 V
1.65-V to 5.5-V operating VCC range
Magnetic threshold options (maximum BOP):
– 3.9 mT, highest sensitivity
– 4.8 mT, high sensitivity
– 9.5 mT, medium sensitivity
– 63 mT, lowest sensitivity
Omnipolar and unipolar options
20-Hz and 5-Hz sampling rate options
Open-drain and push-pull output options
SOT-23, X2SON and TO-92 package options
–40°C to +85°C operating temperature range
1.2
1
0.8
0.6
0.4
1.65 V
3V
5.5 V
0.2
0
-40
-10
20
Temperature (qC)
50
80
D011
Current Consumption of 5-Hz Version
An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,
intellectual property matters and other important disclaimers. PRODUCTION DATA.
DRV5032
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SLVSDC7F – APRIL 2017 – REVISED FEBRUARY 2022
Table of Contents
1 Features............................................................................1
2 Applications..................................................................... 1
3 Description.......................................................................1
4 Revision History.............................................................. 2
5 Device Comparison......................................................... 3
6 Pin Configuration and Functions...................................3
7 Specifications.................................................................. 5
7.1 Absolute Maximum Ratings........................................ 5
7.2 ESD Ratings............................................................... 5
7.3 Recommended Operating Conditions.........................5
7.4 Thermal Information....................................................5
7.5 Electrical Characteristics.............................................6
7.6 Magnetic Characteristics.............................................7
7.7 Typical Characteristics................................................ 8
8 Detailed Description...................................................... 11
8.1 Overview................................................................... 11
8.2 Functional Block Diagram......................................... 11
8.3 Feature Description...................................................12
8.4 Device Functional Modes..........................................16
9 Application and Implementation.................................. 17
9.1 Application Information............................................. 17
9.2 Typical Applications.................................................. 17
9.3 Do's and Don'ts.........................................................21
10 Power Supply Recommendations..............................22
11 Layout........................................................................... 22
11.1 Layout Guidelines................................................... 22
11.2 Layout Examples.....................................................22
12 Device and Documentation Support..........................23
12.1 Documentation Support.......................................... 23
12.2 Receiving Notification of Documentation Updates..23
12.3 Support Resources................................................. 23
12.4 Trademarks............................................................. 23
12.5 Electrostatic Discharge Caution..............................23
12.6 Glossary..................................................................23
13 Mechanical, Packaging, and Orderable
Information.................................................................... 23
4 Revision History
NOTE: Page numbers for previous revisions may differ from page numbers in the current version.
Changes from Revision E (January 2020) to Revision F (February 2022)
Page
• Updated the numbering format for tables, figures, and cross-references throughout the document..................1
Changes from Revision D (November 2017) to Revision E (January 2020)
Page
• Added LPG (TO-92) package ............................................................................................................................ 1
• Added notes for the DU and FD package magnetic threshold operate points in the Magnetic Characteristics
table ................................................................................................................................................................... 7
• Added probability density function plots for BOP, BRP, and BHYS to the Typical Characteristics section............ 8
Changes from Revision C (September 2017) to Revision D (November 2017)
Page
• Added the DU device version to the data sheet ................................................................................................ 3
Changes from Revision B (August 2017) to Revision C (September 2017)
Page
• Changed the status of the AJ device version from Preview to Active ................................................................3
Changes from Revision A (May 2017) to Revision B (August 2017)
Page
• Added the ZE device version and the preview AJ device version...................................................................... 3
Changes from Revision * (April 2017) to Revision A (May 2017)
Page
• Added the FA and FD device versions............................................................................................................... 1
2
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5 Device Comparison
Table 5-1. Device Comparison
VERSION
MAXIMUM
THRESHOLD
DRV5032DU
3.9 mT
DRV5032FA
DRV5032FB
DRV5032FC
4.8 mT
DRV5032FD
MAGNETIC
RESPONSE
OUTPUT
TYPE
SAMPLING
RATE
PACKAGES
AVAILABLE
Unipolar
Push-pull
20 Hz
SOT-23, X2SON, TO-92
Omnipolar
Push-pull
20 Hz
SOT-23, X2SON, TO-92
Omnipolar
Push-pull
5 Hz
SOT-23, TO-92
Omnipolar
Open-drain
20 Hz
SOT-23, TO-92
Unipolar
Push-pull
20 Hz
X2SON, TO-92
DRV5032AJ
9.5 mT
Omnipolar
Open-drain
20 Hz
SOT-23, X2SON, TO-92
DRV5032ZE
63 mT
Omnipolar
Open-drain
20 Hz
SOT-23, TO-92
6 Pin Configuration and Functions
VCC
1
3
OUT
1
VCC
GND
2
3
OUT2
Figure 6-1. FA, FB, FC, AJ, ZE Versions DBZ
Package 3-Pin SOT-23 Top View
2
Figure 6-2. DU Version DBZ Package 3-Pin SOT-23
Top View
VCC
OUT
VCC
OUT1
1
4
1
4
Thermal
Pad
Thermal
Pad
2
2
3
GND
NC
Figure 6-3. FA, AJ Versions DMR Package 4-Pin
X2SON Top View
GND
3
GND OUT2
Figure 6-4. DU, FD Versions DMR Package 4-Pin
X2SON Top View
3
OUT
3
OUT2
2
GND
2
GND
1
VCC
1
VCC
Figure 6-5. FA, FB, FC, AJ, ZE Versions LPG
Package 3-Pin TO-92 Top View
Figure 6-6. DU, FD Versions LPG Package 3-Pin
TO-92 Top View
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Table 6-1. Pin Functions
PIN
SOT-23
(FA, FB,
FC, AJ, ZE)
SOT-23
(DU)
TO-92
(FA, FB,
FC, AJ,
ZE)
TO-92
(DU, FD)
X2SON
(FA, AJ)
X2SON
(DU, FD)
I/O
GND
3
3
2
2
2
2
—
Ground reference
OUT
2
—
3
—
4
—
O
Omnipolar output that responds to north and south magnetic poles
OUT1
—
—
—
—
—
4
O
Unipolar output that responds to north magnetic poles near the top
of the package
OUT2
—
2
—
3
—
3
O
Unipolar output that responds to south magnetic poles near the
top of the package
NC
—
—
—
—
3
—
—
No-connect. This pin is not connected to the silicon. It should be
left floating or tied to ground. It should be soldered to the board for
mechanical support.
VCC
1
1
1
1
1
1
—
1.65-V to 5.5-V power supply. TI recommends connecting this pin
to a ceramic capacitor to ground with a value of at least 0.1 µF.
Thermal
Pad
—
—
—
—
PAD
PAD
—
No-connect. This pin should be left floating or tied to ground. It
should be soldered to the board for mechanical support.
NAME
4
DESCRIPTION
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7 Specifications
7.1 Absolute Maximum Ratings
over operating free-air temperature range (unless otherwise noted)(1)
MIN
MAX
UNIT
–0.3
5.5
V
Power supply voltage
VCC
Power supply voltage slew rate
VCC
Output voltage
OUT, OUT1, OUT2
–0.3
Output current
OUT, OUT1, OUT2
–5
Unlimited
Magnetic flux density, BMAX
V
5
mA
Unlimited
Junction temperature, TJ
Storage temperature, Tstg
(1)
V / µs
VCC + 0.3
–65
T
105
°C
150
°C
Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress
ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under
Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device
reliability.
7.2 ESD Ratings
VALUE
V(ESD)
(1)
(2)
Electrostatic discharge
Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1)
±6000
Charged-device model (CDM), per JEDEC specification
JESD22-C101(2)
±750
UNIT
V
JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.
7.3 Recommended Operating Conditions
over operating free-air temperature range (unless otherwise noted)
MIN
MAX
UNIT
1.65
5.5
V
Output voltage
0
5.5
V
Output current
–5
5
mA
Operating ambient temperature
–40
85
°C
VCC
Power supply voltage
VO
IO
TA
7.4 Thermal Information
DRV5032
THERMAL METRIC(1)
DBZ (SOT-23)
DMR (X2SON)
LPG (TO-92)
UNIT
3 PINS
4 PINS
3 PINS
RθJA
Junction-to-ambient thermal resistance
356
159
183.1
°C/W
Rθ
Junction-to-case (top) thermal resistance
128
77
74.2
°C/W
JC(top)
RθJB
Junction-to-board thermal resistance
ψJT
Junction-to-top characterization parameter
ψJB
Junction-to-board characterization parameter
(1)
94
102
158.8
°C/W
11.4
0.9
15.2
°C/W
92
100
158.8
°C/W
For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application
report.
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7.5 Electrical Characteristics
for VCC = 1.65 V to 5.5 V, over operating free-air temperature range (unless otherwise noted)
PARAMETER
TEST CONDITIONS
MIN
TYP
VCC – 0.35
VCC – 0.1
MAX
UNIT
PUSH-PULL OUTPUT DRIVER
VOH
High-level output voltage
IOUT = –1 mA
VOL
Low-level output voltage
IOUT = 1 mA
V
0.1
0.3
V
5
100
nA
0.1
0.3
V
20
37
Hz
50
75
ms
3.5
µA
5
8.5
Hz
200
286
ms
1.8
µA
2
2.7
mA
100
µs
OPEN-DRAIN OUTPUT
IOZ
High impedance output leakage
current
VCC = 5.5 V, OUT = 5.5 V
VOL
Low-level output voltage
IOUT = 1 mA
DU, FA, FC, FD, AJ, ZE VERSIONS
fS
Frequency of magnetic sampling
tS
Period of magnetic sampling
ICC(AVG)
Average current consumption
13.3
27
VCC = 1.8 V
1.3
VCC = 3 V
1.6
VCC = 5 V
2.3
FB VERSION
fS
Frequency of magnetic sampling
tS
Period of magnetic sampling
ICC(AVG)
Average current consumption
3.5
117
VCC = 1.8 V
0.54
VCC = 3 V
0.69
VCC = 5 V
1.06
ALL VERSIONS
6
ICC(PK)
Peak current consumption
tON
Power-on time (see Figure 8-7)
55
tACTIVE
Active time period (see Figure 8-7)
40
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7.6 Magnetic Characteristics
for VCC = 1.65 V to 5.5 V, over operating free-air temperature range (unless otherwise noted)(1)
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
UNIT
–3.9
–2.5
–1.2
1.2
2.5
3.9
–3.5
–1.8
–0.9
OUT2 pin (south)
0.9
1.8
3.5
Each output
0.1
0.7
1.9
mT
DU VERSION
BOP
Magnetic threshold operate point
BRP
Magnetic threshold release point
BHYS
Magnetic hysteresis: |BOP – BRP|
OUT1 pin (north)(2)
OUT2 pin (south)
OUT1 pin (north)(2)
mT
mT
FA, FB, FC VERSIONS
BOP
Magnetic threshold operate point
±1.5
±3
±4.8
mT
BRP
Magnetic threshold release point
±0.5
±1.5
±3
mT
BHYS
Magnetic hysteresis: |BOP – BRP|
0.8
1.5
3
mT
–4.8
–3
–1.5
1.5
3
4.8
OUT1 pin (north)(2)
–3
–1.5
–0.5
OUT2 pin (south)
0.5
1.5
3
Each output
0.8
1.5
3
mT
FD VERSION
BOP
Magnetic threshold operate point
BRP
Magnetic threshold release point
BHYS
Magnetic hysteresis: |BOP – BRP|
OUT1 pin (north)(2)
OUT2 pin (south)
mT
mT
AJ VERSION
BOP
Magnetic threshold operate point
±4
±7
±9.5
mT
BRP
Magnetic threshold release point
±3
±5.6
±7.5
mT
BHYS
Magnetic hysteresis: |BOP – BRP|
0.5
1.4
3
mT
ZE VERSION
BOP
Magnetic threshold operate point
±33
±47
±63
mT
BRP
Magnetic threshold release point
±30
±43
±58
mT
BHYS
Magnetic hysteresis: |BOP – BRP|
1.2
4
8.5
mT
(1)
(2)
For a graphical description of magnetic thresholds, see the Magnetic Response section.
X2SON package only.
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3
1.4
2.5
1.2
Average Supply Current (PA)
Average Supply Current (PA)
7.7 Typical Characteristics
2
1.5
1
1.65 V
3V
5.5 V
0.5
0
-40
-10
20
Temperature (qC)
50
0.6
0.4
50
80
D011
Magnetic Threshold Release Point (mT)
6
6
FA, FB, FC, FD Versions
AJ Version
DU Version
5
4
3
-20
0
20
40
Temperature (°C)
60
80
5
4
FA, FB, FC, FD Versions
AJ Version
DU Version
3
2
1
-40
100
-20
0
D023
20
40
Temperature (°C)
60
80
100
D025
Figure 7-4. |BRP| vs. Temperature
8
6
Magnetic Threshold Release Point (mT)
Magnetic Threshold Operate Point (mT)
20
Temperature (qC)
Figure 7-2. ICC(AVG) vs. Temperature (5-Hz version)
Figure 7-3. |BOP| vs. Temperature
7
6
FA, FB, FC, FD Versions
AJ Version
DU Version
5
4
3
2.5
3.5
Supply Voltage (V)
4.5
5.5
5
4
FA, FB, FC, FD Versions
AJ Version
DU Version
3
2
1
1.5
D022
Figure 7-5. |BOP| vs. VCC
8
-10
D016
7
2
1.5
1.65 V
3V
5.5 V
0
-40
80
8
Magnetic Threshold Operate Point (mT)
0.8
0.2
Figure 7-1. ICC(AVG) vs. Temperature (20-Hz versions)
2
-40
1
2.5
3.5
Supply Voltage (V)
4.5
5.5
D024
Figure 7-6. |BRP| vs. VCC
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7.7 Typical Characteristics (continued)
60
Magnetic Threshold Release Point (mT)
Magnetic Threshold Operate Point (mT)
60
55
50
45
40
35
30
-40
-10
20
Temperature (°C)
50
55
50
45
40
35
30
-40
80
Figure 7-7. ZE Version |BOP| vs. Temperature
50
80
D021
45
Magnetic Threshold Release Point (mT)
Magnetic Threshold Operate Point (mT)
20
Temperature (°C)
Figure 7-8. ZE Version |BRP| vs. Temperature
50
49
48
47
46
45
1.5
2.5
3.5
Supply Voltage (V)
4.5
44
43
42
41
40
1.5
5.5
2.5
D018
Figure 7-9. ZE Version |BOP| vs. VCC
3.5
Supply Voltage (V)
4.5
5.5
D019
Figure 7-10. ZE Version |BRP| vs. VCC
2
2
1.5
1.5
Density
Density
-10
D020
1
0.5
1
0.5
0
0
4
5
6
7
8
Magnetic Threshold Operate Point (mT)
9
9.5
3
D102
TA = 25°C, VCC = 1.65 V to 5.5 V
4
5
6
Magnetic Threshold Release Point (mT)
7
7.5
D103
TA = 25°C, VCC = 1.65 V to 5.5 V
Figure 7-11. AJ Version BOP Probability Density Function
Figure 7-12. AJ Version BRP Probability Density Function
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7.7 Typical Characteristics (continued)
5
Density
4
3
2
1
0
0.5
1
1.5
2
Magnetic Hysteresis (mT)
2.5
3
D101
TA = 25°C, VCC = 1.65 V to 5.5 V
Figure 7-13. AJ Version BHYS Probability Density Function
10
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8 Detailed Description
8.1 Overview
The DRV5032 device is a magnetic sensor with a digital output that indicates when the magnetic flux density
threshold has been crossed. The device integrates a Hall effect element, analog signal conditioning, and a
low-frequency oscillator that enables ultra-low average power consumption. By operating from a 1.65-V to 5.5-V
supply, the device periodically measures magnetic flux density, updates the output, and enters a low-power
sleep state.
8.2 Functional Block Diagram
0.1 F
(min)
VCC
(1)
VCC
Voltage
Regulator
Ultra-low-power
Oscillator
REF
OUT / OUT1
Output
Control
Element Bias
Offset
Cancellation
(1)
VCC
Amp
OUT2
Temperature
Compensation
(1) Output type depe nds on de vice ve rsi on
GND
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8.3 Feature Description
8.3.1 Magnetic Flux Direction
The DRV5032 device is sensitive to the magnetic field component that is perpendicular to the top of the package
(as shown in Figure 8-1).
TO-92
B
B
B
SOT-23
X2SON
PCB
Figure 8-1. Direction of Sensitivity
The magnetic flux that travels from the bottom to the top of the package is considered positive in this data sheet.
This condition exists when a south magnetic pole is near the top of the package. The magnetic flux that travels
from the top to the bottom of the package results in negative millitesla values.
positive B
negative B
N
S
S
N
PCB
PCB
Figure 8-2. Flux Direction Polarity
12
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8.3.2 Device Version Comparison
The following table lists the available device versions.
VERSION
MAXIMUM
THRESHOLD
MAGNETIC
RESPONSE
OUTPUT
TYPE
SAMPLING
RATE
PACKAGES
AVAILABLE
DRV5032DU
3.9 mT
Unipolar
Push-pull
20 Hz
SOT-23, X2SON, TO-92
DRV5032FA
Omnipolar
Push-pull
20 Hz
SOT-23, X2SON, TO-92
DRV5032FB
Omnipolar
Push-pull
5 Hz
SOT-23, TO-92
Omnipolar
Open-drain
20 Hz
SOT-23, TO-92
Unipolar
Push-pull
20 Hz
X2SON, TO-92
4.8 mT
DRV5032FC
DRV5032FD
DRV5032AJ
9.5 mT
Omnipolar
Open-drain
20 Hz
SOT-23, X2SON, TO-92
DRV5032ZE
63 mT
Omnipolar
Open-drain
20 Hz
SOT-23, TO-92
8.3.2.1 Magnetic Threshold
Devices that have a lower magnetic threshold detect magnets at a farther distance. Higher thresholds generally
require a closer distance or larger magnet.
8.3.2.2 Magnetic Response
The FA, FB, FC, AJ, and ZE device versions have omnipolar functionality, and these versions all respond to the
north and south poles the same way as shown in Figure 8-3.
OUT
BHYS
BHYS
VCC
0V
BOP BRP
north
B
BRP BOP
0 mT
south
Figure 8-3. Omnipolar Functionality
The DU and FD device versions have unipolar functionality. Pin OUT1 only responds to flux in the top-down
direction (north), and pin OUT2 only responds to flux in the bottom-up direction (south).
OUT1
OUT2
BHYS
BHYS
VCC
VCC
0V
north
BOP BRP
0 mT
0V
B
south
north
0 mT
B
BRP BOP
south
Figure 8-4. Unipolar Functionality
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8.3.2.3 Output Type
The DU, FA, FB, and FD device versions have push-pull CMOS outputs that can drive a VCC or ground level.
The FC, AJ, and ZE device versions have open-drain outputs that can become high impedance or drive ground.
For these versions, an external pullup resistor must be used.
VCC
Output
Control
Output
Figure 8-5. Push-Pull Output (Simplified)
Output
Control
Output
Figure 8-6. Open-Drain Output (Simplified)
8.3.2.4 Sampling Rate
When the DRV5032 device powers up, it measures the first magnetic sample and sets the output within the tON
time. The output is latched, and the device enters an ultra-low-power sleep state. After each tS time, the device
measures a new sample and updates the output, if necessary. If the magnetic field does not change between
periods, the output does not change.
14
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VCC
1.65 V
tON
time
tS
ICC
tS
tACTIVE
ICC(PK)
time
Output
VCC
Invalid
1st sample
2nd sample
3rd sample
GND
time
Figure 8-7. Timing Diagram
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8.3.3 Hall Element Location
The sensing element inside the device is in the center of both packages when viewed from the top. Figure 8-8
shows the tolerances and side-view dimensions.
SOT-23
Top View
SOT-23
Side View
centered
650 µm
±70 µm
±80 µm
X2SON
Top View
X2SON
Side View
centered
250 µm
±60 µm
±50 µm
TO-92
Top View
2 mm
2 mm
TO-92
Side View
1.54 mm
1.61 mm
±50 µm
1030 µm
±115 µm
Figure 8-8. Hall Element Location
8.4 Device Functional Modes
The DRV5032 device has one mode of operation that applies when the Recommended Operating Conditions are
met.
16
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9 Application and Implementation
Note
Information in the following applications sections is not part of the TI component specification,
and TI does not warrant its accuracy or completeness. TI’s customers are responsible for
determining suitability of components for their purposes, as well as validating and testing their design
implementation to confirm system functionality.
9.1 Application Information
The DRV5032 device is typically used to detect the proximity of a magnet. The magnet is often attached to a
movable component in the system.
9.1.1 Output Type Tradeoffs
The push-pull output allows for the lowest system power consumption because there is no current leakage path
when the output drives high or low. The open-drain output involves a leakage path through the external pullup
resistor when the output drives low.
The open-drain outputs of multiple devices can be tied together to form a logical AND. In this setup, if any sensor
drives low, the voltage on the shared node becomes low. This can allow a single GPIO to measure an array of
sensors.
9.2 Typical Applications
9.2.1 General-Purpose Magnet Sensing
distance
VCC
DRV5032
VCC
OUT
N S
Controller
GPIO
GND
Copyright © 201 7, Texas Instrumen ts Incorpor ate d
Figure 9-1. Typical Application Diagram
9.2.1.1 Design Requirements
For this design example, use the parameters listed in Table 9-1.
Table 9-1. Design Parameters
DESIGN PARAMETER
EXAMPLE VALUE
VCC
3.3 V
Magnet
1-cm Cube NdFeB
Closest magnet distance
2.5 cm
Magnetic flux density at closest distance
7.8 mT
Magnetic flux density when magnet moves away
Close to 0 mT
9.2.1.2 Detailed Design Procedure
When designing a digital-switch magnetic sensing system, the user should consider these three variables: the
magnet, sensing distance, and threshold of the sensor.
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The DRV5032 device has a detection threshold specified by parameter BOP. To reliably activate the sensor, the
magnet must apply greater than the maximum specified BOP. In such a system, the sensor typically detects the
magnet before it has moved to the closest position. When the magnet moves away from the sensor, it must
apply less than the minimum specified BRP to reliably release the sensor.
Magnets are made from various ferromagnetic materials that have trade-offs in cost, drift with temperature,
absolute max temperature ratings, remanence or residual induction (Br), and coercivity (Hc). The Br and the
dimensions of a magnet determine the magnetic flux density (B) it produces in 3-dimensional space. For simple
magnet shapes, such as rectangular blocks and cylinders, there are simple equations that solve B at a given
distance centered with the magnet.
Thickness
Thickness
Width
Distance
Length
S
S
N
Distance
B
N
B
Diameter
Figure 9-2. Rectangular Block and Cylinder Magnets
Use Equation 1 for the rectangular block shown in Figure 9-2:
B
B = πr arctan
WL
2D 4D2 + W2 + L2
− arctan
2 D+T
Use Equation 2 for the cylinder shown in Figure 9-2:
B
B = 2r
where
•
•
•
•
•
D+T
−
2
2
0.5C + D + T
WL
4 D+T
2
(1)
+ W2 + L2
D
2
0.5C + D2
(2)
W is width.
L is length.
T is thickness (the direction of magnetization).
D is distance.
C is diameter.
An online tool that uses these formulas is located at http://www.ti.com/product/drv5033.
All magnetic materials generally have a lower Br at higher temperatures. Systems should have margin to
account for this, as well as for mechanical tolerances.
18
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9.2.1.3 Application Curve
60
Magnetic Flux Density (mT)
55
50
45
40
35
30
25
20
15
10
5
0
1
1.5
2
2.5
3
3.5
Distance (cm)
4
4.5
5
D017
Figure 9-3. Magnetic Profile of a 1-cm Cube NdFeB Magnet
9.2.2 Three-Position Switch
This application uses the DRV5032FD for a three-position switch.
1
2
3
PCB
Figure 9-4. Three-Position Slider Switch With Embedded Magnet
9.2.2.1 Design Requirements
For this design example, use the parameters listed in Table 9-2.
Table 9-2. Design Parameters
DESIGN PARAMETER
EXAMPLE VALUE
Hall effect device
DRV5032FD
VCC
5V
Switch travel distance
5 mm in each direction
Magnet
10-mm cylinder
Mechanical tolerance per position
±0.5 mm
9.2.2.2 Detailed Design Procedure
A standard 2-pole magnet produces strong perpendicular flux components near the outer edges of the poles,
and no perpendicular flux near the center at the north-south pole boundary. When the DRV5032FD is below the
center of the magnet, it receives close to 0 mT, and both outputs drive high. If the switch with the embedded
magnet moves left or right, the sensor receives a north or south field, and OUT1 or OUT2 drive low. This
provides 3 digital states of detection.
The length of the magnet should ideally be two times the distance of travel toward each side. Then, when the
switch is pushed to either side, the outer edge of the magnet is positioned directly above the sensor where it
applies the strongest perpendicular flux component.
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To determine the magnitude of magnetic flux density for a given magnet and distance, TI recommends to either
use simulation software, test with a linear Hall effect sensor, or test with a gaussmeter.
9.2.2.3 Application Curve
Figure 9-5 shows the typical magnetic flux lines around a 2-pole magnet.
Figure 9-5. Typical Magnetic Flux Lines
20
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9.3 Do's and Don'ts
The Hall element is sensitive to magnetic fields that are perpendicular to the top of the package, therefore a
correct magnet approach must be used for the sensor to detect the field. Figure 9-6 shows correct and incorrect
approaches.
CORRECT
S
S
N
N
N
S
INCORRECT
N
S
Figure 9-6. Correct and Incorrect Magnet Approaches
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10 Power Supply Recommendations
The DRV5032 device is powered from 1.65-V to 5.5-V DC power supplies. A decoupling capacitor close to the
device must be used to provide local energy with minimal inductance. TI recommends using a ceramic capacitor
with a value of at least 0.1 µF.
11 Layout
11.1 Layout Guidelines
Magnetic fields pass through most nonferromagnetic materials with no significant disturbance. It is common
practice to embed Hall effect sensors within plastic or aluminum enclosures and sensing magnets on the
outside. Magnetic fields also easily pass through most printed-circuit boards, which makes placing the magnet
on the opposite side possible.
11.2 Layout Examples
VCC
SEL
VCC
GND
Thermal
Pad
VCC
GND
GND
OUT
OUT
OUT
Figure 11-1. Layout Examples
22
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12 Device and Documentation Support
12.1 Documentation Support
12.1.1 Related Documentation
For related documentation see the following:
• Texas Instruments, DRV5032-SOLAR-EVM user's guide
• Texas Instruments, Power Gating Systems with Magnetic Sensors TI TechNote
• Texas Instruments, Low-Power Door and Window Sensor With Sub-1GHz and 10-Year Coin Cell Battery Life
• Texas Instruments, Magnetic Tamper Detection Using Low-Power Hall Effect Sensors
• Texas Instruments, Fault Monitoring for Overhead Fault Indicators Using Ultra-Low-Power
12.2 Receiving Notification of Documentation Updates
To receive notification of documentation updates, navigate to the device product folder on ti.com. Click on
Subscribe to updates to register and receive a weekly digest of any product information that has changed. For
change details, review the revision history included in any revised document.
12.3 Support Resources
TI E2E™ support forums are an engineer's go-to source for fast, verified answers and design help — straight
from the experts. Search existing answers or ask your own question to get the quick design help you need.
Linked content is provided "AS IS" by the respective contributors. They do not constitute TI specifications and do
not necessarily reflect TI's views; see TI's Terms of Use.
12.4 Trademarks
TI E2E™ is a trademark of Texas Instruments.
All trademarks are the property of their respective owners.
12.5 Electrostatic Discharge Caution
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled
with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may
be more susceptible to damage because very small parametric changes could cause the device not to meet its published
specifications.
12.6 Glossary
TI Glossary
This glossary lists and explains terms, acronyms, and definitions.
13 Mechanical, Packaging, and Orderable Information
The following pages include mechanical, packaging, and orderable information. This information is the most
current data available for the designated devices. This data is subject to change without notice and revision of
this document. For browser-based versions of this data sheet, refer to the left-hand navigation.
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PACKAGE OPTION ADDENDUM
www.ti.com
20-Sep-2022
PACKAGING INFORMATION
Orderable Device
Status
(1)
Package Type Package Pins Package
Drawing
Qty
Eco Plan
(2)
Lead finish/
Ball material
MSL Peak Temp
Op Temp (°C)
Device Marking
(3)
Samples
(4/5)
(6)
DRV5032AJDBZR
ACTIVE
SOT-23
DBZ
3
3000
RoHS & Green
SN
Level-1-260C-UNLIM
-40 to 85
(1M6W, 2AJ)
Samples
DRV5032AJDBZT
ACTIVE
SOT-23
DBZ
3
250
RoHS & Green
SN
Level-1-260C-UNLIM
-40 to 85
(1M6W, 2AJ)
Samples
DRV5032AJDMRR
ACTIVE
X2SON
DMR
4
3000
RoHS & Green
SN
Level-1-260C-UNLIM
-40 to 85
2AJ
Samples
DRV5032AJDMRT
ACTIVE
X2SON
DMR
4
250
RoHS & Green
SN
Level-1-260C-UNLIM
-40 to 85
2AJ
Samples
DRV5032AJLPG
ACTIVE
TO-92
LPG
3
1000
RoHS & Green
SN
N / A for Pkg Type
-40 to 85
32AJ
Samples
DRV5032AJLPGM
ACTIVE
TO-92
LPG
3
3000
RoHS & Green
SN
N / A for Pkg Type
-40 to 85
32AJ
Samples
DRV5032DUDBZR
ACTIVE
SOT-23
DBZ
3
3000
RoHS & Green
SN
Level-1-260C-UNLIM
-40 to 85
2DU
Samples
DRV5032DUDBZT
ACTIVE
SOT-23
DBZ
3
250
RoHS & Green
SN
Level-1-260C-UNLIM
-40 to 85
2DU
Samples
DRV5032DUDMRR
ACTIVE
X2SON
DMR
4
3000
RoHS & Green
SN
Level-1-260C-UNLIM
-40 to 85
2DU
Samples
DRV5032DUDMRT
ACTIVE
X2SON
DMR
4
250
RoHS & Green
SN
Level-1-260C-UNLIM
-40 to 85
2DU
Samples
DRV5032DULPG
ACTIVE
TO-92
LPG
3
1000
RoHS & Green
SN
N / A for Pkg Type
-40 to 85
32DU
Samples
DRV5032DULPGM
ACTIVE
TO-92
LPG
3
3000
RoHS & Green
SN
N / A for Pkg Type
-40 to 85
32DU
Samples
DRV5032FADBZR
ACTIVE
SOT-23
DBZ
3
3000
RoHS & Green
SN
Level-1-260C-UNLIM
-40 to 85
(1LVW, 2FA)
Samples
DRV5032FADBZT
ACTIVE
SOT-23
DBZ
3
250
RoHS & Green
SN
Level-1-260C-UNLIM
-40 to 85
(1LVW, 2FA)
Samples
DRV5032FADMRR
ACTIVE
X2SON
DMR
4
3000
RoHS & Green
SN
Level-1-260C-UNLIM
-40 to 85
2FA
Samples
DRV5032FADMRT
ACTIVE
X2SON
DMR
4
250
RoHS & Green
SN
Level-1-260C-UNLIM
-40 to 85
2FA
Samples
DRV5032FALPG
ACTIVE
TO-92
LPG
3
1000
RoHS & Green
SN
N / A for Pkg Type
-40 to 85
32FA
Samples
DRV5032FALPGM
ACTIVE
TO-92
LPG
3
3000
RoHS & Green
SN
N / A for Pkg Type
-40 to 85
32FA
Samples
DRV5032FBDBZR
ACTIVE
SOT-23
DBZ
3
3000
RoHS & Green
SN
Level-1-260C-UNLIM
-40 to 85
(1LWW, 2FB)
Samples
DRV5032FBDBZT
ACTIVE
SOT-23
DBZ
3
250
RoHS & Green
SN
Level-1-260C-UNLIM
-40 to 85
(1LWW, 2FB)
Samples
Addendum-Page 1
PACKAGE OPTION ADDENDUM
www.ti.com
Orderable Device
20-Sep-2022
Status
(1)
Package Type Package Pins Package
Drawing
Qty
Eco Plan
(2)
Lead finish/
Ball material
MSL Peak Temp
Op Temp (°C)
Device Marking
(3)
Samples
(4/5)
(6)
DRV5032FBLPG
ACTIVE
TO-92
LPG
3
1000
RoHS & Green
SN
N / A for Pkg Type
-40 to 85
32FB
Samples
DRV5032FBLPGM
ACTIVE
TO-92
LPG
3
3000
RoHS & Green
SN
N / A for Pkg Type
-40 to 85
32FB
Samples
DRV5032FCDBZR
ACTIVE
SOT-23
DBZ
3
3000
RoHS & Green
SN
Level-1-260C-UNLIM
-40 to 85
(1M7W, 2FC)
Samples
DRV5032FCDBZT
ACTIVE
SOT-23
DBZ
3
250
RoHS & Green
SN
Level-1-260C-UNLIM
-40 to 85
(1M7W, 2FC)
Samples
DRV5032FCLPG
ACTIVE
TO-92
LPG
3
1000
RoHS & Green
SN
N / A for Pkg Type
-40 to 85
32FC
Samples
DRV5032FCLPGM
ACTIVE
TO-92
LPG
3
3000
RoHS & Green
SN
N / A for Pkg Type
-40 to 85
32FC
Samples
DRV5032FDDMRR
ACTIVE
X2SON
DMR
4
3000
RoHS & Green
SN
Level-1-260C-UNLIM
-40 to 85
2FD
Samples
DRV5032FDDMRT
ACTIVE
X2SON
DMR
4
250
RoHS & Green
SN
Level-1-260C-UNLIM
-40 to 85
2FD
Samples
DRV5032FDLPG
ACTIVE
TO-92
LPG
3
1000
RoHS & Green
SN
N / A for Pkg Type
-40 to 85
32FD
Samples
DRV5032FDLPGM
ACTIVE
TO-92
LPG
3
3000
RoHS & Green
SN
N / A for Pkg Type
-40 to 85
32FD
Samples
DRV5032ZEDBZR
ACTIVE
SOT-23
DBZ
3
3000
RoHS & Green
SN
Level-1-260C-UNLIM
-40 to 85
(1M8W, 2ZE)
Samples
DRV5032ZEDBZT
ACTIVE
SOT-23
DBZ
3
250
RoHS & Green
SN
Level-1-260C-UNLIM
-40 to 85
(1M8W, 2ZE)
Samples
DRV5032ZELPG
ACTIVE
TO-92
LPG
3
1000
RoHS & Green
SN
N / A for Pkg Type
-40 to 85
32ZE
Samples
DRV5032ZELPGM
ACTIVE
TO-92
LPG
3
3000
RoHS & Green
SN
N / A for Pkg Type
-40 to 85
32ZE
Samples
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance
do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may
reference these types of products as "Pb-Free".
RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.
Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of
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