ISO7420E, ISO7420FE
ISO7421E, ISO7421FE
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SLLSE45E – DECEMBER 2010 – REVISED JANUARY 2013
Low-Power Dual Channel Digital Isolators
Check for Samples: ISO7420E, ISO7420FE, ISO7421E, ISO7421FE
FEATURES
APPLICATIONS
•
•
•
1
2
•
•
•
•
•
•
•
•
Signaling Rate > 50 Mbps
For Devices with Suffix F, Output is Low in
Default Mode
Low Power Consumption: Typical ICC per
Channel (3.3V Supplies):
– ISO7420: 1.4 mA at 1 Mbps, 2.5 mA at
25 Mbps
– ISO7421: 1.8 mA at 1 Mbps, 2.8 mA at
25 Mbps
Low Propagation Delay: 7 ns Typical (E-Grade)
Low Pulse Skew: 200 ps Typical (E-Grade)
Wide TA Range Specified: –40°C to 125°C
50 KV/μs Transient Immunity, Typical
Isolation Barrier Life: > 25 Years
Operates from 3V to 5.5V Supply Levels
Narrow Body SOIC-8 Package
Opto-Coupler Replacement in:
– Industrial FieldBus
– ProfiBus
– ModBus
– DeviceNet™ Data Buses
– Servo Control Interface
– Motor Control
– Power Supplies
– Battery Packs
SAFETY AND REGULATORY
APPROVALS
•
•
•
•
•
3000 VRMS / 4242 VPK Isolation per DIN EN
60747-5-2 (VDE 0884 Part 2)
2.5 KVRMS Isolation for 1 minute per UL 1577
CSA Component Acceptance Notice #5A
IEC 60950-1 and IEC 61010-1 End Equipment
Standards
All Agencies Approvals Completed
DESCRIPTION
ISO7420x and ISO7421x provide galvanic isolation up to 2500 VRMS for 1 minute per UL and 4242 VPK per VDE.
These devices have two isolated channels. Each channel has a logic input and output buffer separated by a
silicon dioxide (SiO2) insulation barrier. Used in conjunction with isolated power supplies, these devices prevent
noise currents on a data bus or other circuit from entering the local ground and interfering with or damaging
sensitive circuitry. The suffix F indicates low-output option in fail-safe conditions (see Table 1). E-grade devices
have no integrated noise filter and thus have fast propagation delays. CC-grade devices have integrated 10nsfilters for harsh environments where short noise pulses may be present at the device input pins.
These devices have TTL input thresholds and operate from 3V to 5.5V supplies. All inputs are 5V tolerant when
supplied from a 3.3V supply.
1
INA
2
INB
3
GND1
4
ISO7421
D Package
(Top View)
8
VCC2
VCC1
1
7
OUTA
OUTA
2
6
OUTB
INB
3
5
GND2
GND1
4
Isolation
VCC1
Isolation
ISO7420
D Package
(Top View)
8
VCC2
7
INA
6
OUTB
5
GND2
1
2
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
DeviceNet is a trademark of Texas Instruments.
UNLESS OTHERWISE NOTED this document contains
PRODUCTION DATA information current as of publication date.
Products conform to specifications per the terms of Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 2010–2013, Texas Instruments Incorporated
ISO7420E, ISO7420FE
ISO7421E, ISO7421FE
SLLSE45E – DECEMBER 2010 – REVISED JANUARY 2013
www.ti.com
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
PIN DESCRIPTIONS
PIN
NAME
I/O
DESCRIPTION
ISO7420x
ISO7421x
INA
2
7
I
Input, channel A
INB
3
3
I
Input, channel B
GND1
4
4
–
Ground connection for VCC1
GND2
5
5
–
Ground connection for VCC2
OUTA
7
2
O
Output, channel A
OUTB
6
6
O
Output, channel B
VCC1
1
1
–
Power supply, VCC1
VCC2
8
8
–
Power supply, VCC2
Table 1. FUNCTION TABLE (1)
INPUT SIDE
VCC
OUTPUT SIDE
VCC
PU
PU
INPUT
INA, INB
OUTPUT
OUTA, OUTB
ISO7420E /
ISO7421E
ISO7420Fx /
ISO7421Fx
H
H
H
L
L
L
Open
(1)
(2)
(3)
PD
PU
X
X
PD
X
H
(2)
L (3)
H
(2)
L (3)
Undetermined
Undetermined
PU = Powered up (VCC ≥ 3 V); PD = Powered down (VCC ≤ 2.4 V); X = Irrelevant; H = High level; L =
Low level; Z = High Impedance
In fail-safe condition, output defaults to high level
In fail-safe condition, output defaults to low level
AVAILABLE OPTIONS
PRODUCT
DATA
RATE
DEFAULT
OUTPUT
ISO7420E
High
ISO7420FE
Low
INTEGRATED
NOISE FILTER
RATED TA
MARKED
AS
SO7420
No Yes
Same
I7420F
–40°C to
125°C
50 Mbps
ISO7421E
High
ISO7421FE
Low
SO7421
No
2
CHANNEL
DIRECTION
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Opposite
I7421F
ORDERING
NUMBER
ISO7420ED (rail)
ISO7420EDR (reel)
ISO7420FED (rail)
ISO7420FEDR (reel)
ISO7421ED (rail)
ISO7421EDR (reel)
ISO7421FED (rail)
ISO7421FEDR (reel)
Copyright © 2010–2013, Texas Instruments Incorporated
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ISO7420E, ISO7420FE
ISO7421E, ISO7421FE
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SLLSE45E – DECEMBER 2010 – REVISED JANUARY 2013
ABSOLUTE MAXIMUM RATINGS (1)
VALUE
VCC
Supply voltage (2), VCC1, VCC2
–0.5 V to 6 V
VI
Voltage at IN, OUT
–0.5 V to 6 V
IO
Output current
ESD
Electrostatic
discharge
±15 mA
Human-body model
JEDEC Standard 22, Test Method A114-C.01
Field-induced charged-device
model
JEDEC Standard 22, Test Method C101
Machine model
ANSI/ESDS5.2-1996
±3 kV
All pins
±1.5 kV
±200 V
TJ(Max) Maximum junction temperature
Tstg
(1)
150°C
Storage temperature
-65°C to 150°C
Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings
only and functional operation of the device at these or any other conditions beyond those indicated under recommended operating
conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
All voltage values except differential I/O bus voltages are with respect to network ground terminal and are peak voltage values.
(2)
RECOMMENDED OPERATING CONDITIONS
MIN
VCC1, VCC2
Supply voltage
3.0
IOH
High-level output current
–4
IOL
Low-level output current
VIH
High-level input voltage
VIL
Low-level input voltage
tui
Input pulse duration
1 / tui
Signaling rate
TJ
(2)
TA
(1)
(2)
TYP
MAX
5.5
2
VCC
0
0.8
20
–40
-40
mA
V
V
ns
0
Ambient Temperature
V
mA
4
Junction temperature
UNIT
25
50 (1)
Mbps
136
°C
125
°C
Under typical conditions, E-grade devices are capable of signaling rate > 150 Mbps.
To maintain the recommended operating conditions for TJ, see the Package Thermal Characteristics table.
Copyright © 2010–2013, Texas Instruments Incorporated
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ISO7420E, ISO7420FE
ISO7421E, ISO7421FE
SLLSE45E – DECEMBER 2010 – REVISED JANUARY 2013
www.ti.com
ELECTRICAL CHARACTERISTICS
VCC1 and VCC2 = 5V ± 10%, TA = -40°C to 125°C
PARAMETER
TEST CONDITIONS
VOH
High-level output voltage
VOL
Low-level output voltage
VI(HYS)
Input threshold voltage hysteresis
IIH
High-level input current
IIL
Low-level input current
CMTI
Common-mode transient immunity
MIN
TYP
IOH = –4 mA; see Figure 1.
VCCx (1)– 0.8
4.6
IOH = –20 μA; see Figure 1.
VCCx (1)– 0.1
5
MAX
UNIT
V
IOL = 4 mA; see Figure 1.
0.2
0.4
IOL = 20 μA; see Figure 1.
0
0.1
V
400
mV
μA
10
INx at 0 V or VCC
μA
–10
VI = VCC or 0 V; see Figure 3.
25
50
kV/μs
SUPPLY CURRENT (All inputs switching with square wave clock signal for dynamic ICC measurement)
ISO7420x
ICC1
DC to 1 Mbps
ICC2
ICC1
DC Input: VI = VCC or 0 V,
AC Input: CL = 15pF
10 Mbps
ICC2
Supply current for VCC1 and VCC2
ICC1
25 Mbps
ICC2
ICC1
CL = 15pF
50 Mbps
ICC2
0.4
0.8
3.4
5
0.6
1
4.5
6
1
1.5
6.2
8
1.7
2.5
9
12
2.3
3.6
2.3
3.6
2.9
4.5
2.9
4.5
4.3
6
mA
ISO7421x
ICC1
DC to 1 Mbps
ICC2
ICC1
10 Mbps
ICC2
Supply current for VCC1 and VCC2
ICC1
25 Mbps
ICC2
ICC1
CL = 15pF
50 Mbps
ICC2
(1)
DC Input: VI = VCC or 0 V,
AC Input: CL = 15pF
4.3
6
6
8.5
6
8.5
mA
VCCx is the supply voltage for the output channel that is being measured
SWITCHING CHARACTERISTICS
VCC1 and VCC2 = 5V ± 10%, TA = -40°C to 125°C
PARAMETER
tPLH, tPHL
Propagation delay time
PWD (1)
Pulse width distortion |tPHL – tPLH|
tsk(o) (2)
Channel-to-channel output skew time
tsk(pp) (3)
Part-to-part skew time
tr
Output signal rise time
tf
Output signal fall time
tfs
Fail-safe output delay time from input power loss
(1)
(2)
(3)
4
TEST CONDITIONS
E-grade
CC-grade
ISO7420x
See Figure 1.
MIN
TYP
MAX
7
11
17
28
0.2
3
ISO7421x
0.3
3.7
ISO7420x
0.3
1
ISO7421x
0.3
2
ISO7420x
3.7
ISO7421x
4.9
See Figure 1.
See Figure 2.
UNIT
ns
ns
ns
ns
1.8
ns
1.7
ns
6
μs
Also known as pulse skew.
tsk(o) is the skew between outputs of a single device with all driving inputs connected together and the outputs switching in the same
direction while driving identical loads.
tsk(pp) is the magnitude of the difference in propagation delay times between any terminals of different devices switching in the same
direction while operating at identical supply voltages, temperature, input signals and loads.
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ISO7420E, ISO7420FE
ISO7421E, ISO7421FE
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SLLSE45E – DECEMBER 2010 – REVISED JANUARY 2013
ELECTRICAL CHARACTERISTICS
VCC1 = 5V ± 10%, VCC2 = 3.3V ± 10%, TA = -40°C to 125°C
PARAMETER
VOH
TEST CONDITIONS
High-level output voltage
VOL
Low-level output voltage
VI(HYS)
Input threshold voltage hysteresis
IIH
High-level input current
IIL
Low-level input current
CMTI
Common-mode transient immunity
MIN
TYP
VCC1 – 0.8
4.6
ISO7420x/7421x (3.3V side)
VCC2 - 0.4
3
ISO7421x (5V side)
VCC1 – 0.1
5
ISO7420x/7421x (3.3V side)
VCC2 – 0.1
3.3
IOH = –4 mA;
see Figure 1.
ISO7421x (5V side)
IOH = –20 μA;
see Figure 1,
MAX
UNIT
V
IOL = 4 mA; see Figure 1.
0.2
0.4
IOL = 20 μA; see Figure 1.
0
0.1
V
400
mV
μA
10
INx at 0 V or VCC
μA
–10
VI = VCC or 0 V; see Figure 3.
25
50
kV/μs
SUPPLY CURRENT (All inputs switching with square wave clock signal for dynamic ICC measurement)
ISO7420x
ICC1
DC to 1 Mbps
ICC2
ICC1
DC Input: VI = VCC or 0 V,
AC Input: CL = 15pF
10 Mbps
ICC2
Supply current for VCC1 and VCC2
ICC1
25 Mbps
ICC2
ICC1
CL = 15pF
50 Mbps
ICC2
0.4
0.8
2.6
3.7
0.6
1
3.3
4.3
1
1.5
4.4
5.6
1.7
2.5
6.2
7.5
2.3
3.6
1.8
2.8
2.9
4.5
2.2
3.2
4.3
6
2.8
4.1
6
8.5
3.8
5.5
mA
ISO7421x
ICC1
DC to 1 Mbps
ICC2
ICC1
DC Input: VI = VCC or 0 V,
AC Input: CL = 15pF
10 Mbps
ICC2
Supply current for VCC1 and VCC2
ICC1
25 Mbps
ICC2
ICC1
CL = 15pF
50 Mbps
ICC2
mA
SWITCHING CHARACTERISTICS
VCC1 = 5V ± 10%, VCC2 = 3.3V ± 10%, TA = -40°C to 125°C
PARAMETER
tPLH, tPHL
Propagation delay time
CC-grade
PWD (1)
Pulse width distortion |tPHL – tPLH|
tsk(o) (2)
Channel-to-channel output skew time
tsk(pp) (3)
Part-to-part skew time
tr
Output signal rise time
tf
Output signal fall time
tfs
Fail-safe output delay time from input power loss
(1)
(2)
(3)
TEST CONDITIONS
E-grade
ISO7420x
See Figure 1.
ISO7421x
MIN
TYP
MAX
8
13.5
18
32
0.3
3
0.5
5.6
ISO7420x
1.5
ISO7421x
0.5
3
ISO7420x
5.4
ISO7421x
6.3
See Figure 1.
See Figure 2.
UNIT
ns
ns
ns
ns
2
ns
2
ns
6
μs
Also known as pulse skew.
tsk(o) is the skew between outputs of a single device with all driving inputs connected together and the outputs switching in the same
direction while driving identical loads.
tsk(pp) is the magnitude of the difference in propagation delay times between any terminals of different devices switching in the same
direction while operating at identical supply voltages, temperature, input signals and loads.
Copyright © 2010–2013, Texas Instruments Incorporated
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ISO7420E, ISO7420FE
ISO7421E, ISO7421FE
SLLSE45E – DECEMBER 2010 – REVISED JANUARY 2013
www.ti.com
ELECTRICAL CHARACTERISTICS
VCC1 = 3.3V ± 10%, VCC2 = 5V ± 10%, TA = -40°C to 125°C
PARAMETER
VOH
TEST CONDITIONS
MIN
TYP
IOH = –4 mA; see
Figure 1.
ISO7421x (3.3V side)
VCC1 – 0.4
3
ISO7420x/7421x (5V side)
VCC2 – 0.8
4.6
IOH = –20 μA;
see Figure 1
ISO7421x (3.3V side)
VCC1 – 0.1
3.3
ISO7420x/7421x (5V side)
VCC2 – 0.1
High-level output voltage
VOL
Low-level output voltage
VI(HYS)
Input threshold voltage hysteresis
IIH
High-level input current
IIL
Low-level input current
CMTI
Common-mode transient immunity
MAX
UNIT
V
5
IOL = 4 mA; see Figure 1.
0.2
0.4
IOL = 20 μA; see Figure 1.
0
0.1
V
400
mV
μA
10
INx at 0 V or VCC
μA
–10
VI = VCC or 0 V; see Figure 3.
25
50
kV/μs
SUPPLY CURRENT (All inputs switching with square wave clock signal for dynamic ICC measurement)
ISO7420x
ICC1
DC to 1 Mbps
ICC2
ICC1
DC Input: VI = VCC or 0 V,
AC Input: CL = 15pF
10 Mbps
ICC2
Supply current for VCC1 and VCC2
ICC1
25 Mbps
ICC2
ICC1
CL = 15pF
0.2
5
0.4
0.6
4.5
6
0.6
0.9
6.2
8
1
1.3
9
12
1.8
2.8
2.3
3.6
2.2
3.2
2.9
4.5
2.8
4.1
50 Mbps
ICC2
0.4
3.4
mA
ISO7421x
ICC1
DC to 1 Mbps
ICC2
ICC1
DC Input: VI = VCC or 0 V,
AC Input: CL = 15pF
10 Mbps
ICC2
Supply current for VCC2 and VCC2
ICC1
25 Mbps
ICC2
ICC1
CL = 15pF
50 Mbps
ICC2
4.3
6
3.8
5.5
6
8.5
mA
SWITCHING CHARACTERISTICS
VCC1 = 3.3V ± 10%, VCC2 = 5V ± 10%, TA = -40°C to 125°C
PARAMETER
tPLH, tPHL
E-grade
Propagation delay time
TEST CONDITIONS
ISO7420x
ISO7421x
CC-grade
PWD (1)
Pulse width distortion |tPHL – tPLH|
tsk(o) (2)
Channel-to-channel output skew time
tsk(pp) (3)
Part-to-part skew time
tr
Output signal rise time
tf
Output signal fall time
tfs
Fail-safe output delay time from input power loss
(1)
(2)
(3)
6
See Figure 1.
MIN
TYP
MAX
7.5
12
7.5
14
18.5
32
ISO7420x
0.7
3
ISO7421x
0.7
3.6
ISO7420x
0.5
1.5
ISO7421x
0.5
3
ISO7420x
4.6
ISO7421x
8.5
See Figure 1.
See Figure 2.
UNIT
ns
ns
ns
ns
1.7
ns
1.6
ns
6
μs
Also known as pulse skew.
tsk(o) is the skew between outputs of a single device with all driving inputs connected together and the outputs switching in the same
direction while driving identical loads.
tsk(pp) is the magnitude of the difference in propagation delay times between any terminals of different devices switching in the same
direction while operating at identical supply voltages, temperature, input signals and loads.
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SLLSE45E – DECEMBER 2010 – REVISED JANUARY 2013
ELECTRICAL CHARACTERISTICS
VCC1 and VCC2 = 3.3 V ± 10%, TA = -40°C to 125°C
PARAMETER
TEST CONDITIONS
VOH
High-level output voltage
VOL
Low-level output voltage
VI(HYS)
Input threshold voltage hysteresis
IIH
High-level input current
IIL
Low-level input current
CMTI
Common-mode transient immunity
MIN
TYP
IOH = –4 mA; see Figure 1.
VCCx (1) – 0.4
3
IOH = –20 μA; see Figure 1.
VCCx (1) – 0.1
3.3
MAX
UNIT
V
IOL = 4 mA; see Figure 1.
0.2
0.4
IOL = 20 μA; see Figure 1.
0
0.1
V
400
mV
μA
10
INx at 0 V or VCC
μA
–10
VI = VCC or 0 V; see Figure 3.
25
50
kV/μs
SUPPLY CURRENT (All inputs switching with square wave clock signal for dynamic ICC measurement)
ISO7420x
ICC1
DC to 1 Mbps
ICC2
ICC1
DC Input: VI = VCC or 0 V,
AC Input: CL = 15pF
10 Mbps
ICC2
Supply current for VCC1 and VCC2
ICC1
25 Mbps
ICC2
ICC1
CL = 15pF
50 Mbps
ICC2
0.2
0.4
2.6
3.7
0.4
0.6
3.3
4.3
0.6
0.9
4.4
5.6
1
1.3
6.2
7.5
1.8
2.8
1.8
2.8
2.2
3.2
2.2
3.2
2.8
4.1
2.8
4.1
3.8
5.5
3.8
5.5
mA
ISO7421x
ICC1
DC to 1 Mbps
ICC2
ICC1
10 Mbps
ICC2
Supply current for VCC2 and VCC2
ICC1
25 Mbps
ICC2
ICC1
CL = 15pF
50 Mbps
ICC2
(1)
DC Input: VI = VCC or 0 V,
AC Input: CL = 15pF
mA
VCCx is the supply voltage for the output channel that is being measured
SWITCHING CHARACTERISTICS
VCC1 and VCC2 = 3.3 V ± 10%, TA = -40°C to 125°C
PARAMETER
tPLH, tPHL
Propagation delay time
PWD (1)
Pulse width distortion |tPHL – tPLH|
Channel-to-channel output skew time
tsk(pp) (3)
Part-to-part skew time
tr
Output signal rise time
tf
Output signal fall time
tfs
Fail-safe output delay time from input power loss
(3)
TYP
MAX
8.5
14
19.5
34
ISO7420x and ISO7421x
0.5
2
ISO7420x
0.4
2
ISO7421x
0.4
3
CC-grade
tsk(o) (2)
(1)
(2)
TEST CONDITIONS
E-grade
See Figure 1.
MIN
ISO7420x
6.2
ISO7421x
6.8
See Figure 1.
See Figure 2.
UNIT
ns
ns
ns
ns
2
ns
1.8
ns
6
μs
Also known as pulse skew.
tsk(o) is the skew between outputs of a single device with all driving inputs connected together and the outputs switching in the same
direction while driving identical loads.
tsk(pp) is the magnitude of the difference in propagation delay times between any terminals of different devices switching in the same
direction while operating at identical supply voltages, temperature, input signals and loads.
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SLLSE45E – DECEMBER 2010 – REVISED JANUARY 2013
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Isolation Barrier
PARAMETER MEASUREMENT INFORMATION
IN
Input
Generator
(1)
50 W
VI
VCC1
VI
OUT
1.4 V
1.4 V
0V
VO
CL
tPLH
(2)
tPHL
90%
10%
VCC/2
VO
VCC/2
VOH
VOL
tr
tf
S0412-01
(1)
The input pulse is supplied by a generator having the following characteristics: PRR ≤ 50 kHz, 50% duty cycle,
tr ≤ 3 ns, tf ≤ 3 ns, ZO = 50 Ω. At the input, a 50-Ω resistor is required to terminate the Input Generator signal. It is not
needed in an actual application.
(2)
CL = 15 pF and includes instrumentation and fixture capacitance within ±20%.
Figure 1. Switching Characteristic Test Circuit and Voltage Waveforms
VI
VCC1
VCC1
(1)
Isolation Barrier
0 V IN
or
VCC1
VI
2.7 V
0V
tfs
OUT
VO
CL
VOH
(1)
VO
50%
VO
50%
Fail-Safe HIGH (ISO742xE)
VOL
VOH
Fail-Safe LOW (ISO742xFx)
VOL
CL = 15 pF and includes instrumentation and fixture capacitance within ±20%.
Figure 2. Fail-Safe Output Delay-Time Test Circuit and Voltage Waveforms
S1
IN
C = 0.1 mF ±1%
Isolation Barrier
VCC1
GND1
VCC2
C = 0.1 mF ±1%
Pass-fail criteria –
output must remain
stable.
OUT
+
VOH or VOL
GND2
(1)
–
+ VCM –
(1)
CL = 15 pF and includes instrumentation and fixture capacitance within ±20%.
Figure 3. Common-Mode Transient Immunity Test Circuit
8
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DEVICE INFORMATION
IEC INSULATION AND SAFETY-RELATED SPECIFICATIONS FOR D-8 PACKAGE
over recommended operating conditions (unless otherwise noted)
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
UNIT
L(I01)
Minimum air gap (clearance)
Shortest terminal-to-terminal distance through air
4.8
mm
L(I02)
Minimum external tracking
(creepage)
Shortest terminal-to-terminal distance across the
package surface
4.3
mm
CTI
Tracking resistance (comparative
tracking index)
DIN IEC 60112 / VDE 0303 Part 1
>400
V
Minimum internal gap (internal
clearance)
Distance through the insulation
0.014
mm
RIO
Isolation resistance, input to
output (1)
CIO
Barrier capacitance, input to
output (1)
CI
Input capacitance (2)
(1)
(2)
>1012
Ω
11
Ω
VIO = 0.4 sin (2πft), f = 1 MHz
1
pF
VI = VCC/2 + 0.4 sin (2πft), f = 1 MHz, VCC = 5 V
1
pF
VIO = 500 V, TA < 100°C
VIO = 500 V, 100°C ≤ TA ≤ max
>10
All pins on each side of the barrier tied together creating a two-terminal device.
Measured from input pin to ground.
NOTE
Creepage and clearance requirements should be applied according to the specific
equipment isolation standards of an application. Care should be taken to maintain the
creepage and clearance distance of a board design to ensure that the mounting pads of
the isolator on the printed-circuit board do not reduce this distance.
Creepage and clearance on a printed-circuit board become equal in certain cases.
Techniques such as inserting grooves and/or ribs on a printed circuit board are used to
help increase these specifications.
INSULATION CHARACTERISTICS
over recommended operating conditions (unless otherwise noted)
PARAMETER (1)
VIORM
Maximum working insulation voltage
TEST CONDITIONS
(2)
Input-to-output test voltage per IEC
60747-5-2
VPR
SPECIFICATION
UNIT
566
VPEAK
Method a, After environmental tests subgroup 1,
VPR = VIORM x 1.6, t = 10 s,
Partial Discharge < 5 pC
906
Method b1,
VPR = VIORM x 1.875, t = 1 s (100% Production test)
Partial discharge < 5 pC
1062
After Input/Output safety test subgroup 2/3,
VPR = VIORM x 1.2, t = 10 s,
Partial discharge < 5 pC
680
VPEAK
VIOTM
Transient overvoltage per IEC 60747-5-2
VTEST = VIOTM
t = 60 sec (qualification)
t= 1 sec (100% production)
4242
VPEAK
VIOSM
Maximum surge voltage
Tested per IEC 60065 (Qualification Test)
4000
VPEAK
VTEST = VISO, t = 60 sec (qualification)
2500
VTEST = 1.2 x VISO, t = 1 sec (100% production)
3000
VIO = 500 V at TS
>109
VISO
Isolation voltage per UL
RS
Insulation resistance
Pollution degree
(1)
(2)
VRMS
Ω
2
Climatic Classification 40/125/21
For applications that require DC working voltages between GND1 and GND2, contact Texas Instruments for further details.
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Table 2. IEC 60664-1 RATINGS TABLE
PARAMETER
TEST CONDITIONS
Basic isolation group
SPECIFICATION
Material group
Installation classification
II
Rated mains voltage ≤ 150 VRMS
I–IV
Rated mains voltage ≤ 300 VRMS
I–III
Rated mains voltage ≤ 400 VRMS
I–II
REGULATORY INFORMATION
VDE
CSA
UL
Certified according to DIN EN 60747-5-2
(VDE 0884 Part 2)
Approved under CSA Component Acceptance Notice
#5A
Basic Insulation
Maximum Transient Overvoltage, 4242 VPK
Maximum Surge Voltage, 4000 VPK
Maximum Working Voltage, 566 VPK
Basic insulation per CSA 60950-1-07 and IEC 60950-1 Single / Basic Isolation Voltage,
(2nd Ed), 390 VRMS maximum working voltage
2500 VRMS (1)
File number: 40016131
File number: 220991
(1)
Recognized under UL 1577
Component Recognition Program
File number: E181974
Production tested ≥ 3000 VRMS for 1 second in accordance with UL 1577.
LIFE EXPECTANCY vs WORKING VOLTAGE
Life Expectancy – Years
100
VIORM at 566 V
28 Years
10
0
120
250
500
750
880
1000
VIORM – Working Voltage – VPK
G001
Figure 4. Life Expectancy vs Working Voltage
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SLLSE45E – DECEMBER 2010 – REVISED JANUARY 2013
IEC SAFETY LIMITING VALUES
Safety limiting intends to prevent potential damage to the isolation barrier upon failure of input or output circuitry. A failure of
the I/O can allow low resistance to ground or the supply and, without current limiting, dissipate sufficient power to overheat
the die and damage the isolation barrier, potentially leading to secondary system failures.
PARAMETER
TEST CONDITIONS
IS
Safety input, output, or supply
current
TS
Maximum case temperature
MIN
TYP
MAX
θJA = 212°C/W, VI = 5.5 V, TJ = 150°C, TA = 25°C
107
θJA = 212°C/W, VI = 3.6 V, TJ = 150°C, TA = 25°C
164
150
UNIT
mA
°C
The safety-limiting constraint is the absolute-maximum junction temperature specified in the Absolute Maximum
Ratings table. The power dissipation and junction-to-air thermal impedance of the device installed in the
application hardware determines the junction temperature. The assumed junction-to-air thermal resistance in the
Thermal Characteristics table is that of a device installed in the JESD51-3, Low-Effective-Thermal-Conductivity
Test Board for Leaded Surface-Mount Packages and is conservative. The power is the recommended maximum
input voltage times the current. The junction temperature is then the ambient temperature plus the power times
the junction-to-air thermal resistance.
PACKAGE THERMAL CHARACTERISTICS
(over recommended operating conditions unless otherwise noted)
PARAMETER
TEST CONDITIONS
θJA
Junction-to-air thermal resistance
θJB
Junction-to-board thermal resistance
θJC
Junction-to-case thermal resistance
PD
Device power dissipation
(1)
MIN
TYP
Low-K thermal resistance (1)
212
High-K thermal resistance (1)
122
VCC1 = VCC2 = 5.5 V, TJ = 150°C, CL = 15 pF,
Input a 100-Mbps 50% duty-cycle square wave
MAX
UNIT
°C/W
37
°C/W
69.1
°C/W
138
mW
Tested in accordance with the low-K or high-K thermal metric definitions of EIA/JESD51-3 for leaded surface-mount packages
Safety Limiting Current − mA
180
160
VCC1, VCC2 at 3.6 V
140
120
100
VCC1, VCC2 at 5.5 V
80
60
40
20
0
0
50
100
150
200
Case Temperature − °C
Figure 5. θJC Thermal Derating Curve per IEC 60747-5-2
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APPLICATION INFORMATION
VCC1
0.1mF
OUTPUT
INPUT
VCC2
2 mm
2 mm
max.
max.
ISO7421
from
from
VCC1
VCC2
8
1
OUTA
INA
7
2
INB
OUTB
6
3
5
4
GND1
0.1mF
INPUT
OUTPUT
GND2
S0417-01
Figure 6. Typical ISO7421x Application Circuit
Note: For detailed layout recommendations, see Application Note SLLA284, Digital Isolator Design Guide.
SUPPLY CURRENT EQUATIONS
Maximum Supply Current Equations:
(Calculated over recommended operating temperature range and Silicon process variation)
ISO7420
At VCC1 = VCC2 = 3.3V ± 10%
ICC1(max) = ICC1_Q (max) + 1.791 x 10-2 x f
ICC2(max) = ICC2_Q (max) + 1.687 x 10-2 x f + 3.570 x 10-3 x f x CL
(1)
(2)
At VCC1 = VCC2 = 5V ± 10%
ICC1(max) = ICC1_Q (max) + 3.152 x 10-2 x f
ICC2(max) = ICC2_Q (max) + 2.709 x 10-2 x f + 5.365 x 10-3 x f x CL
(3)
(4)
ISO7421
At VCC1 = VCC2 = 3.3V ± 10%
ICC1(max) = ICC1_Q (max) + 1.726 x 10-2 x f + 1.785 x 10-3 x f x CL
ICC2(max) = ICC2_Q (max) + 1.726 x 10-2 x f + 1.785 x 10-3 x f x CL
(5)
(6)
At VCC1 = VCC2 = 5V ± 10%
ICC1(max) = ICC1_Q (max) + 2.920 x 10-2 x f + 2.682 x 10-3 x f x CL
ICC2(max) = ICC2_Q (max) + 2.920 x 10-2 x f + 2.682 x 10-3 x f x CL
(7)
(8)
ICC1_Q (max) and ICC2_Q (max) are equivalent to the maximum supply currents measured in mA under DC input
conditions (provided in the specification tables of this data sheet); f is data rate in Mbps of both channels; CL is
the capacitive load in pF of both channels. ICC1(max) and ICC2(max) are measured in mA.
Typical Supply Current Equations:
(Calculated over recommended operating temperature range and Silicon process variation)
ISO7420
At VCC1 = VCC2 = 3.3V
ICC1(typ) = ICC1_Q (typ) + 1.528 x 10-2 x f
ICC2(typ) = ICC2_Q (typ) + 1.637 x 10-2 x f + 3.275 x 10-3 x f x CL
(9)
(10)
At VCC1 = VCC2 = 5V
ICC1(typ) = ICC1_Q (typ) + 2.640 x 10-2 x f
ICC2(typ) = ICC2_Q (typ) + 2.502 x 10-2 x f + 4.919 x 10-3 x f x CL
12
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(11)
(12)
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ISO7421
At VCC1 = VCC2 = 3.3V
ICC1(typ) = ICC1_Q (typ) + 1.567 x 10-2 x f + 1.640 x 10-3 x f x CL
ICC2(typ) = ICC2_Q (typ) + 1.567 x 10-2 x f + 1.640 x 10-3 x f x CL
(13)
(14)
At VCC1 = VCC2 = 5V
ICC1(typ) = ICC1_Q (typ) + 2.550 x 10-2 x f + 2.416 x 10-3 x f x CL
ICC2(typ) = ICC2_Q (typ) + 2.550 x 10-2 x f + 2.461 x 10-3 x f x CL
(15)
(16)
ICC1_Q (typ) and ICC2_Q (typ) are equivalent to the typical supply currents measured in mA under DC input
conditions (provided in the specification tables of this data sheet); f is data rate in Mbps of each channel; CL is
the capacitive load in pF of each channel. ICC1(typ) and ICC2(typ) are measured in mA.
Spacer
ISO742xE Input
VCC1 VCC1
VCC1
1 MW
500 W
Output
VCC2
IN
8W
OUT
13 W
ISO742xFx Input
VCC1
VCC1
500 W
IN
1 MW
Figure 7. Device I/O Schematics
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TYPICAL CHARACTERISTICS
ISO7420 SUPPLY CURRENT PER CHANNEL
vs
DATA RATE (NO LOAD)
ISO7420 SUPPLY CURRENT BOTH CHANNELS
vs
DATA RATE (NO LOAD)
12
6
TA = 25oC
No Load
o
TA = 25 C
No Load
ICC2 at 5 V
10
Supply Current - mA
Supply Current - mA
5
4
ICC2 at 3.3 V
3
2
ICC1 at 5 V
ICC2 at 5 V
8
ICC2 at 3.3 V
6
4
ICC1 at 5 V
2
1
ICC1 at 3.3 V
ICC1 at 3.3 V
0
0
0
20
40
60
80
100
0
120
40
60
80
Figure 9.
ISO7420 SUPPLY CURRENT PER CHANNEL
vs
DATA RATE (15 pF LOAD)
ISO7420 SUPPLY CURRENT BOTH CHANNELS
vs
DATA RATE (15 pF LOAD)
16
o
TA = 25 C
CL = 15 pF Load
7
TA = 25 C
CL = 15 pF Load
14
ICC2 at 5 V
ICC2 at 5 V
12
Supply Current - mA
6
ICC2 at 3.3 V
5
4
3
10
ICC2 at 3.3 V
8
6
4
ICC1 at 5 V
2
ICC1 at 5 V
2
1
ICC1 at 3.3 V
ICC1 at 3.3 V
14
120
Figure 8.
o
0
100
Data Rate - Mbps
8
Supply Current - mA
20
Data Rate - Mbps
0
0
20
40
60
80
100
120
0
20
40
60
Data Rate - Mbps
Data Rate - Mbps
Figure 10.
Figure 11.
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80
100
120
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SLLSE45E – DECEMBER 2010 – REVISED JANUARY 2013
TYPICAL CHARACTERISTICS (continued)
ISO7421 SUPPLY CURRENT PER CHANNEL
vs
DATA RATE (NO LOAD)
4
ISO7421 SUPPLY CURRENT BOTH CHANNELS
vs
DATA RATE (NO LOAD)
8
o
TA = 25 C
No Load
3.5
7
6
ICC1 and ICC2 at 5 V
Supply Current - mA
Supply Current - mA
3
2.5
2
1.5
ICC1 and ICC2 at 3.3 V
ICC1 and ICC2 at 5 V
5
4
3
ICC1 and ICC2 at 3.3 V
1
2
0.5
1
0
o
TA = 25 C
No Load
0
7
20
40
60
80
100
0
120
20
40
60
80
100
120
Data Rate - Mbps
Figure 12.
Figure 13.
ISO7421 SUPPLY CURRENT PER CHANNEL
vs
DATA RATE (15 pF LOAD)
ISO7421 SUPPLY CURRENT BOTH CHANNELS
vs
DATA RATE (15 pF LOAD)
10
o
TA = 25 C
CL15 pF
6
0
Data Rate - Mbps
o
TA = 25 C
CL15 pF
9
Supply Current - mA
Supply Current - mA
8
5
ICC1 and ICC2 at 5 V
4
3
ICC1 and ICC2 at 3.3 V
2
7
ICC1 and ICC2 at 5 V
6
5
4
ICC1 and ICC2 at 3.3 V
3
2
1
1
0
0
20
40
60
80
100
120
0
0
20
40
60
Data Rate - Mbps
Data Rate - Mbps
Figure 14.
Figure 15.
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100
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TYPICAL CHARACTERISTICS (continued)
'E-GRADE PROPAGATION DELAY TIME
vs
FREE-AIR TEMPERATURE
'E-GRADE PROPAGATION DELAY TIME
vs
FREE-AIR TEMPERATURE
10.5
VCC1 = VCC2 = 5 V,
CL = 15 pF
tpd - Propagation Delay Time - ns
tpd - Propagation Delay Time - ns
8
7.5
tPLH
7
tPHL
6.5
6
-50
-25
0
25
50
75
100
TA - Free-Air Temperature - °C
125
150
10
VCC1 = VCC2 = 3.3 V,
CL = 15 pF
tPLH
9.5
9
8.5
tPHL
8
7.5
-50
-25
0
25
50
75
100
TA - Free-Air Temperature - °C
Figure 16.
Figure 17.
INPUT VCC FAIL-SAFE VOLTAGE THRESHOLD
vs
FREE-AIR TEMPERATURE
HIGH-LEVEL OUTPUT VOLTAGE
vs
HIGH-LEVEL OUTPUT CURRENT
2.7
125
150
6
TA = 25°C
Fail-Safe Voltage Threshold - V
VOH - High-Level Output Voltage - V
FS+
2.65
2.6
2.55
2.5
FS2.45
2.4
-50
-25
0
25
50
75
100
TA - Free-Air Temperature - °C
Figure 18.
16
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125
150
5
4
Output VCC = 5 V
3
2
Output VCC = 3.3 V
1
0
-80
-70
-60
-50
-40
-30
-20
IOH - High-Level Output Current - mA
-10
0
Figure 19.
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SLLSE45E – DECEMBER 2010 – REVISED JANUARY 2013
TYPICAL CHARACTERISTICS (continued)
LOW-LEVEL OUTPUT VOLTAGE
vs
LOW-LEVEL OUTPUT CURRENT
ISO7420FE OUTPUT JITTER
vs
DATA RATE
1.4
6
1.2
5
Output Jitter (PK-PK) - ns
VOL - Low-Level Output Voltage - V
TA = 25°C
4
3
Output VCC = 3.3 V
2
OUTA and OUTB, 3.3V-Oper.
0.8
0.6
OUTA and OUTB, 5V-Oper.
0.4
Output VCC = 5 V
o
1
0
1
TA = 25 C
CL15 pF
0.2
0
10
20
30
40
50
60
0
70
0
20
40
60
IOL - Low-Level Output Current - mA
Data Rate - Mbps
Figure 20.
Figure 21.
80
100
120
ISO7421FE OUTPUT JITTER
vs
DATA RATE
1.6
Output Jitter (PK-PK) - ns
1.4
1.2
OUTA and OUTB, 3.3V-Oper.
1
0.8
0.6
OUTA and OUTB, 5V-Oper.
0.4
o
TA = 25 C
CL15 pF
0.2
0
0
20
40
60
80
100
120
Data Rate - Mbps
Figure 22.
TA = 25°C,
VCC1 = VCC2 = 3.3 V,
TA = 25°C,
VCC1 = VCC2 = 3.3 V,
Pattern: PRBS 27-1
Pattern: PRBS 27-1
Figure 23. ISO7420FE Typical Eye Diagram at 50 MBPS, 3.3
V Operation
Figure 24. ISO7420FE Typical Eye Diagram at 100 MBPS, 3.3
V Operation
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REVISION HISTORY
Changes from Original (December 2010) to Revision A
•
Page
Changed the Max values for Supply current for VCC1 and VCC2, CL = 15pF ......................................................................... 7
Changes from Revision A (December 2010) to Revision B
Page
•
Changed Feature bullet From: ISO7421: TBDmA at 1Mbps, TBDmA at 25Mbps To: ISO7421: 1.8mA at 1Mbps,
2.8mA at 25Mbps .................................................................................................................................................................. 1
•
Updated the ISO7421x Supply Current values for VCC1 and VCC2 = 5V ............................................................................... 4
•
Updated the ISO7421x Supply Current values for VCC1 = 5V and VCC2 = 3.3V ................................................................... 5
•
Updated the ISO7421x Supply Current values for VCC1 = 3.3V and VCC2 = 5V ................................................................... 6
•
Updated the ISO7421x Supply Current values for VCC1 and VCC2 = 3.3V ............................................................................ 7
Changes from Revision B (January 2011) to Revision C
Page
•
Added devices ISO7420FCC and ISO7421FCC .................................................................................................................. 1
•
Changed Feature bullet To: Low Propagation Delay: 7 ns Typical (E-Grade) ..................................................................... 1
•
Changed Feature bullet To: Low Pulse Skew: 200 Typical (E-Grade) ................................................................................. 1
•
Changed the SAFETY and REGULATORY APPROVALS list ............................................................................................. 1
•
Changed the data sheet DESCRIPTION .............................................................................................................................. 1
•
Changed PU to X in the last row of the FUNCTION TABLE ................................................................................................ 2
•
Changed the Available Options Table .................................................................................................................................. 2
•
Changed the Supply Current values for ISO7421x at 10, 25, and 50 Mbps ........................................................................ 4
•
Added CC-grade and valued to tPLH, tPHL in the Switching Characteristics table ................................................................. 4
•
Added ISO7421x values for Pulse width distortion, Channel-to-channel output skew time, and Part-to-part skew time .... 4
•
Changed the Supply Current values for ISO7421x at 10, 25, and 50 Mbps ........................................................................ 5
•
Added CC-grade and valued to tPLH, tPHL in the Switching Characteristics table ................................................................. 5
•
Added ISO7421x values for Pulse width distortion and Channel-to-channel output skew time ........................................... 5
•
Changed the Supply Current values for ISO7421x at 10, 25, and 50 Mbps ........................................................................ 6
•
Added CC-grade and valued to tPLH, tPHL in the Switching Characteristics table ................................................................. 6
•
Changed the Supply Current values for ISO7421x 25 and 50 Mbps ................................................................................... 7
•
Added CC-grade and valued to tPLH, tPHL in the Switching Characteristics table ................................................................. 7
•
Changed Note 1 Figure 1 ..................................................................................................................................................... 8
•
Changed Figure 2 ................................................................................................................................................................. 8
•
Changed Isolation resistance test conditions ....................................................................................................................... 9
•
Changed the values of VIORM and VPR in the INSULATION CHARACTERISTICS table ...................................................... 9
•
Changed the value of VIOTM in the INSULATION CHARACTERISTICS table From: 4000 To: 4242 ................................... 9
•
Changed Figure 5 ............................................................................................................................................................... 11
•
Added section: SUPPLY CURRENT EQUATIONS ............................................................................................................ 12
•
Added graphs Figure 12, Figure 13, Figure 14, and Figure 15 .......................................................................................... 14
•
Added graphs Figure 21 and Figure 22 .............................................................................................................................. 16
18
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Changes from Revision C (March 2011) to Revision D
Page
•
Changed SAFETY feature Bullet From: UL 1577 Approved; Other Approvals Pending To: All Agencies Approvals
Completed ............................................................................................................................................................................. 1
•
Changed the value of VOISM in the INSULATION CHARACTERISTICS table From: 4242 To: 4000 ............................... 9
•
Changed the REGULATORY INFORMATION table .......................................................................................................... 10
Changes from Revision D (December 2011) to Revision E
Page
•
Deleted devices ISO7420FCC and ISO7421FCC ................................................................................................................ 1
•
Changed Z to Undetermined for the OUTPUT OUTA, OUTB column of the FUNCTION TABLE ....................................... 2
•
Changed the NOTE: text ...................................................................................................................................................... 9
•
Added table Note to VIORM .................................................................................................................................................... 9
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PACKAGE OPTION ADDENDUM
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11-Apr-2013
PACKAGING INFORMATION
Orderable Device
Status
(1)
Package Type Package Pins Package
Drawing
Qty
Eco Plan
Lead/Ball Finish
(2)
MSL Peak Temp
Op Temp (°C)
Top-Side Markings
(3)
(4)
ISO7420ED
ACTIVE
SOIC
D
8
75
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 125
SO7420
ISO7420EDR
ACTIVE
SOIC
D
8
2500
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 125
SO7420
ISO7420FED
ACTIVE
SOIC
D
8
75
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 125
I7420F
ISO7420FEDR
ACTIVE
SOIC
D
8
2500
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 125
I7420F
ISO7421ED
ACTIVE
SOIC
D
8
75
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 125
SO7421
ISO7421EDR
ACTIVE
SOIC
D
8
2500
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 125
SO7421
ISO7421FED
ACTIVE
SOIC
D
8
75
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 125
I7421F
ISO7421FEDR
ACTIVE
SOIC
D
8
2500
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 125
I7421F
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
Addendum-Page 1
Samples
PACKAGE OPTION ADDENDUM
www.ti.com
11-Apr-2013
(4)
Multiple Top-Side Markings will be inside parentheses. Only one Top-Side Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a
continuation of the previous line and the two combined represent the entire Top-Side Marking for that device.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
OTHER QUALIFIED VERSIONS OF ISO7421E :
• Automotive: ISO7421E-Q1
NOTE: Qualified Version Definitions:
• Automotive - Q100 devices qualified for high-reliability automotive applications targeting zero defects
Addendum-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com
23-Nov-2013
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
A0
Diameter Width (mm)
(mm) W1 (mm)
B0
(mm)
K0
(mm)
P1
(mm)
W
Pin1
(mm) Quadrant
ISO7420EDR
SOIC
D
8
2500
330.0
12.4
6.4
5.2
2.1
8.0
12.0
Q1
ISO7420FEDR
SOIC
D
8
2500
330.0
12.4
6.4
5.2
2.1
8.0
12.0
Q1
ISO7421EDR
SOIC
D
8
2500
330.0
12.4
6.4
5.2
2.1
8.0
12.0
Q1
ISO7421FEDR
SOIC
D
8
2500
330.0
12.4
6.4
5.2
2.1
8.0
12.0
Q1
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
23-Nov-2013
*All dimensions are nominal
Device
Package Type
Package Drawing
Pins
SPQ
Length (mm)
Width (mm)
Height (mm)
ISO7420EDR
SOIC
D
8
2500
367.0
367.0
35.0
ISO7420FEDR
SOIC
D
8
2500
367.0
367.0
35.0
ISO7421EDR
SOIC
D
8
2500
367.0
367.0
35.0
ISO7421FEDR
SOIC
D
8
2500
367.0
367.0
35.0
Pack Materials-Page 2
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