LM9070SX

LM9070 www.ti.com SNVS130E – DECEMBER 1999 – REVISED APRIL 2013 LM9070 Low-Dropout System Voltage Regulator with Keep-Alive ON/OFF Control Check for Samples: LM9070 FEATURES DESCRIPTION • • • • The LM9070 is a 5V, 3% accurate, 250 mA lowdropout voltage regulator. The regulator features an active low delayed reset output flag which can be used to reset a microprocessor system on turn-ON and in the event that the regulator output falls out of regulation for any reason. An external capacitor programs a delay time interval before the reset output can return high. 1 2 • • • • • • • • • • Automotive Application Reliability 3% Output Voltage Tolerance Insensitive to Radiated RFI Dropout Voltage Less than 800 mV with 250 mA Output Current Externally Programmed Reset Delay Interval Keep-Alive Feature with 2 Logic Control Inputs 60V Load Dump Transient Protection Thermal Shutdown Short Circuit Protection and Disable Safety Features Reverse Battery Protection Low OFF Quiescent Current, 50 μA Maximum Wide Operating Temperature Range −40°C to +125°C TO-263 and 20-Pin Power Surface Mount Packages Lead Form Compatible with TLE4267 TO-220 Regulator Designed for automotive application the contains a variety of protection features reverse battery, over-voltage shutdown, shutdown, input transient protection and operating temperature range. LM9070 such as thermal a wide A unique two-input logic control scheme is used to enable or disable the regulator output. An ON/OFF input can be provided by an ignition switch derived signal while a second, Keep-Alive input, is generated by a system controller. This allows for a system to remain ON after ignition has been switched OFF. The system controller can then execute a power-down routine and after which command the regulator OFF to a low quiescent current state (60 μA max). Design techniques have been employed to allow the regulator to remain operational and not generate false reset signals when subjected to high levels of RF energy (300V/m from 2 MHz to 400 MHz). Connection Diagrams and Ordering Information Backside metal is internally connected to ground. Figure 1. 7 Lead TO-263 (Top View) Package Number KTW0007B Figure 2. 20-Pin SOIC Package 1 2 Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. All trademarks are the property of their respective owners. PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. Copyright © 1999–2013, Texas Instruments Incorporated LM9070 SNVS130E – DECEMBER 1999 – REVISED APRIL 2013 www.ti.com Tab is internally connected to ground. Tab is internally connected to ground. Figure 3. 7-Lead TO-220 Package (Odd numbered pins bent forward away from package body) Figure 4. 7-Lead TO-220 Package (Even numbered pins bent forward away from package body) These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates. Absolute Maximum Ratings (1) Input Voltage, DC −26V to +40V ON/OFF, Keep-Alive Inputs (through 1kΩ) −26V to +26V Positive Input Transient (t 100 mA) where the input voltage is applied through a long length of wire, which in effect adds a significant amount of inductance in series with the input. The drop in input current may create a positive input voltage transient which may take the PNP out of saturation. If the input voltage is held constant at the threshold where the PNP is going in and out of saturation, an oscillation may be created. This is only observed where significant series inductance is present in the input supply line and when the rise and fall time of the input supply is very slow. If the application and removal of the input voltage changes at a rate greater than 500 mV/μs, the input voltage moves through the dropout region of operation (VIN of 3V to 5.5V) too quickly for an oscillation to be established. MICROPROCESSOR SYSTEM REGULATOR WITH KEEP-ALIVE INTERVAL AT TURN-OFF Figure 23 illustrates a system application circuit utilizing both of the logic control inputs of the LM9070. Closing the ON/OFF switch powers ON the system. Once powered, the system controller sets the Keep-Alive line low. The NPN transistor is used only to signal the controller that the ON/OFF switch has been opened and the system is to be turned OFF. Upon detecting this high level at the ON/OFF Sense input line, the controller can then perform a power down routine. The system will remain fully powered until the controller commands total shut down by taking the Keep-Alive line high. The system then shuts OFF and reverts to a very low current drain standby condition until switched back on. 10 Submit Documentation Feedback Copyright © 1999–2013, Texas Instruments Incorporated Product Folder Links: LM9070 LM9070 www.ti.com SNVS130E – DECEMBER 1999 – REVISED APRIL 2013 Figure 23. System Application Circuit and Control Waveforms THERMAL MANAGEMENT The LM9070 is packaged in both a TO-263 surface mount power package and a narrow lead-pitch TO-220 package. To obtain operation over the highest possible load current and input voltage ranges, care must be taken to control the operating temperature of the device. Thermal shutdown protection is built in, with a threshold above 150°C. Conventional heat-sinking techniques can be used with the TO-220 package. When applying the TO-263 package, on board heat-sinking is important to prevent premature thermal shutdown. More copper foil area under the tab of the device will directly improve the operating θJ-A of the TO-263 package, which will reduce the junction temperature of the device. Submit Documentation Feedback Copyright © 1999–2013, Texas Instruments Incorporated Product Folder Links: LM9070 11 LM9070 SNVS130E – DECEMBER 1999 – REVISED APRIL 2013 www.ti.com The θJ-A value for the TO-263 package (still air, no additional heat sink) is rated at 80°C/W. The effective θJ-A value of the TO-263 package can be reduced by increasing the printed circuit board area that is connected (soldered) to the package tab. Using 1 ounce (1.4 mils thick) copper clad with no solder mask, an area of 0.5 square inches will reduce θJ-A to 50°C/W, an area of 1.0 square inches will reduce θJ-Ato 37°C/W, and an area of 1.6 square inches will reduce θJ-A to 32°C/W. If the printed circuit board uses a solder mask, the copper clad area under the solder mask should be increased by at least 50% to maintain a similar θJ-A rating. The use of a double sided PC board with soldered filled vias between two planes of copper, as shown in Figure 24, will improve thermal performance while optimizing the PC board surface area required. Using the double sided PC board arrangement shown in Figure 24, with 1 ounce (1.4 mils thick) copper clad with no solder mask and solder filled vias, an area of 0.5 square inches on both sides will reduce θJ-A to 43°C/W. Figure 24. Typical TO-263 PC Board Heatsinking 12 Submit Documentation Feedback Copyright © 1999–2013, Texas Instruments Incorporated Product Folder Links: LM9070 LM9070 www.ti.com SNVS130E – DECEMBER 1999 – REVISED APRIL 2013 REVISION HISTORY Changes from Revision D (April 2013) to Revision E • Page Changed layout of National Data Sheet to TI format .......................................................................................................... 12 Submit Documentation Feedback Copyright © 1999–2013, Texas Instruments Incorporated Product Folder Links: LM9070 13 PACKAGE OPTION ADDENDUM www.ti.com 10-Dec-2020 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Pins Package Drawing Qty Eco Plan (2) Lead finish/ Ball material MSL Peak Temp Op Temp (°C) Device Marking (3) (4/5) (6) LM9070SX/NOPB ACTIVE DDPAK/ TO-263 KTW 7 500 RoHS-Exempt & Green SN Level-3-245C-168 HR -40 to 125 LM9070S (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may reference these types of products as "Pb-Free". RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption. Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of