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SN65DSI83-Q1
SLLSEW7A – DECEMBER 2016 – REVISED JUNE 2018
SN65DSI83-Q1 Automotive Single-Channel MIPI® DSI to Single-Link LVDS Bridge
1 Features
3 Description
•
•
The SN65DSI83-Q1 DSI-to-LVDS bridge features a
single-channel MIPI D-PHY receiver front-end
configuration with four lanes per channel operating at
1 Gbps per lane and a maximum input bandwidth of 4
Gbps. The bridge decodes MIPI DSI 18-bpp RGB666
and 24-bpp RGB888 packets and converts the
formatted video data-stream to an LVDS output
operating at pixel clocks operating from 25 MHz to
154 MHz, offering a Single-Link LVDS with four data
lanes per link.
•
•
•
•
•
•
•
•
•
•
•
•
Qualified for Automotive Applications
AEC-Q100 Qualified With the Following Results:
– Device Temperature Grade 2: –40°C to
+105°C Ambient Operating Temperature
– Device HBM ESD Classification Level 3A
– Device CDM ESD Classification Level C6
Implements MIPI® D-PHY Version 1.00.00
Physical Layer Front-End and Display Serial
Interface (DSI) Version 1.02.00
Single-Channel DSI Receiver Configurable for
One, Two, Three, or Four D-PHY Data Lanes Per
Channel Operating up to 1 Gbps Per Lane
Supports 18-bpp and 24-bpp DSI Video Packets
with RGB666 and RGB888 Formats
Maximum Resolution up to 60 fps WUXGA 1920 ×
1200 at 18 bpp and 24 bpp Color With Reduced
Blanking. Suitable for 60 fps 1366 × 768 / 1280 ×
800 at 18 bpp and 24 bpp
Output for Single-Link LVDS
Supports Single Channel DSI to Single-Link LVDS
Operating Mode
LVDS Output Clock Range of 25 MHz to 154 MHz
LVDS Pixel Clock May be Sourced from FreeRunning Continuous D-PHY Clock or External
Reference Clock (REFCLK)
1.8-V Main VCC Power Supply
Low Power Features Include SHUTDOWN Mode,
Reduced LVDS Output Voltage Swing, Common
Mode, and MIPI Ultra-Low Power State (ULPS)
Support
LVDS Channel SWAP, LVDS PIN Order Reverse
Feature for Ease of PCB Routing
Packaged in 64-pin 10-mm × 10-mm HTQFP
(PAP) PowerPAD™ IC Package
2 Applications
•
•
•
•
•
•
•
The SN65DSI83-Q1 device can support up to
WUXGA 1920 × 1200 at 60 frames per second, at 24
bpp with reduced blanking. The SN65DSI83-Q1
device is also suitable for applications using 60 fps
1366 × 768/1280 × 800 at 18 bpp and 24 bpp. Partial
line buffering is implemented to accommodate the
data stream mismatch between the DSI and LVDS
interfaces.
The SN65DSI83-Q1 device is implemented in a small
outline 10-mm × 10-mm HTQFP package with a
0.5-mm pitch, and operates across a temperature
range from –40°C to +105°C.
Device Information(1)
PART NUMBER
SN65DSI83-Q1
PACKAGE
BODY SIZE (NOM)
HTQFP (64)
10.00 mm × 10.00 mm
(1) For all available packages, see the orderable addendum at
the end of the data sheet.
SN65DSI83-Q1 Schematic
TFT LCD Display
DA[3:0]P
DA[3:0]N
Application
Processor
With DSI
Output
DACP/N
SCL/SDA
Single-Channel
DSI to Dual
LVDS Bridge
SN65SDSI83-Q1
A_Y0:3N
A_Y0:3P
A_CLKN/P
24-Bit TCON
1
IRQ
EN
Copyright © 2016, Texas Instruments Incorporated
Infotainment Head Unit With Integrated Display
Infotainment Head Unit With Remote Display
Infotainment Rear-Seat Entertainment
Hybrid Automotive Cluster
Portable Navigation Device
Navigation
Industrial Human Machine Interface (HMI) and
Displays
1
An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,
intellectual property matters and other important disclaimers. PRODUCTION DATA.
SN65DSI83-Q1
SLLSEW7A – DECEMBER 2016 – REVISED JUNE 2018
www.ti.com
Table of Contents
1
2
3
4
5
6
7
8
Features ..................................................................
Applications ...........................................................
Description .............................................................
Revision History.....................................................
Pin Configuration and Functions .........................
Specifications.........................................................
1
1
1
2
3
6
6.1
6.2
6.3
6.4
6.5
6.6
6
6
6
6
7
9
Absolute Maximum Ratings ......................................
ESD Ratings..............................................................
Recommended Operating Conditions.......................
Thermal Information ..................................................
Electrical Characteristics...........................................
Switching Characteristics.........................................
Parameter Measurement Information ................ 10
Detailed Description ............................................ 13
8.1
8.2
8.3
8.4
Overview .................................................................
Functional Block Diagram .......................................
Feature Description.................................................
Programming...........................................................
13
13
13
21
8.5 Register Maps ......................................................... 23
9
Application and Implementation ........................ 37
9.1 Application Information............................................ 37
9.2 Typical Application .................................................. 38
10 Power Supply Recommendations ..................... 43
10.1 VCC Power Supply................................................. 43
10.2 VCORE Power Supply ......................................... 43
11 Layout................................................................... 43
11.1 Layout Guidelines ................................................. 43
11.2 Layout Example .................................................... 44
12 Device and Documentation Support ................. 45
12.1
12.2
12.3
12.4
12.5
12.6
Documentation Support ........................................
Receiving Notification of Documentation Updates
Community Resource............................................
Trademarks ...........................................................
Electrostatic Discharge Caution ............................
Glossary ................................................................
45
45
45
45
45
45
13 Mechanical, Packaging, and Orderable
Information ........................................................... 46
4 Revision History
Changes from Original (December 2016) to Revision A
Page
•
Deleted figure RESET and Initialization Timing Definition While VCC is High ...................................................................... 12
•
Changed the paragraph following Figure 8 ......................................................................................................................... 15
•
Changed Recommended Initialization Sequence To: Initialization Sequence ..................................................................... 16
•
Changed Table 2 .................................................................................................................................................................. 16
•
Changed item 3 in Video Stop and Restart Sequence From: Drive all DSI input lanes including DSI CLK lane to
LP11. To: Drive all DSI data lanes to LP11, but keep the DSI CLK lanes in HS. ............................................................... 37
2
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SLLSEW7A – DECEMBER 2016 – REVISED JUNE 2018
5 Pin Configuration and Functions
ADDR
VCC
RSVD
RSVD
RSVD
RSVD
VCC
RSVD
RSVD
VCC
RSVD
RSVD
GND
RSVD
RSVD
VCC
64
63
62
61
60
59
58
57
56
55
54
53
52
51
50
49
PAP Package
64-Pin HTQFP With PowerPAD™
Top View
RSVD2
1
48
VCC
EN
2
47
A_Y0N
VCC
3
46
A_Y0P
RSVD
4
45
A_Y1N
RSVD
5
44
A_Y1P
RSVD
6
43
VCC
RSVD
7
42
A_Y2N
RSVD
8
41
A_Y2P
RSVD
9
40
VCC
RSVD
10
39
A_CLKN
RSVD
11
38
A_CLKP
RSVD
12
37
A_Y3N
RSVD
13
36
A_Y3P
VCC
14
35
VCC
SCL
15
34
RSVD1
SDA
16
33
IRQ
Thermal
32
VCC
31
VCORE
30
DA3N
29
DA3P
28
DA2N
27
DA2P
26
GND
25
DACN
24
DACP
23
GND
22
DA1N
21
DA1P
20
DA0N
19
DA0P
18
VCC
REFCLK
17
Pad
Not to scale
See the Layout section for layout information.
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SN65DSI83-Q1
SLLSEW7A – DECEMBER 2016 – REVISED JUNE 2018
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Pin Functions
PIN
NAME
NO.
ADDR
64
A_CLKP
38
A_CLKN
39
A_Y0P
46
A_Y0N
47
A_Y1P
44
A_Y1N
45
A_Y2P
41
A_Y2N
42
A_Y3P
36
A_Y3N
37
DA0P
19
DA0N
20
DA1P
21
DA1N
22
DA2P
27
DA2N
28
DA3P
29
DA3N
30
DACP
24
DACN
25
EN
TYPE
DESCRIPTION
I/O
Local I2C interface target address select. See Table 3. In normal operation this pin is an
input. When the ADDR pin is programmed high, it must be tied to the same 1.8-V power
rails where the SN65DSI83-Q1 VCC 1.8-V power rail is connected
O
LVDS channel A, LVDS clock output
O
LVDS channel A, LVDS data output 0
O
LVDS channel A, LVDS data output 1
O
LVDS channel A, LVDS data output 2
O
LVDS channel A, LVDS data output 3. A_Y3P and A_Y3N must be left not connected
(NC) for 18-bpp panels
I
MIPI D-PHY channel A, data lane 0; data rate up to 1 Gbps
I
MIPI D-PHY channel A, data lane 1; data rate up to 1 Gbps
I
MIPI D-PHY channel A, data lane 2; data rate up to 1 Gbps
I
MIPI D-PHY channel A, data lane 3; data rate up to 1 Gbps
I
MIPI D-PHY channel A, clock lane; data rate up to 1 Gbps
2
I
Chip enable and reset. The device is reset (shutdown) when the EN pin is low
GND
23, 26, 52
G
Reference ground
IRQ
33
O
Interrupt signal
REFCLK
17
I
This pin is an optional external reference clock for the LVDS pixel clock. If an external
reference clock is not used, this pin must be pulled to ground with an external resistor.
The source of the reference clock must be placed as close as possible with a series
resistor near the source to reduce EMI
4
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SLLSEW7A – DECEMBER 2016 – REVISED JUNE 2018
Pin Functions (continued)
PIN
NAME
NO.
TYPE
DESCRIPTION
4
5
6
7
8
9
10
11
12
RSVD
13
50
RSVD
Reserved and leave them unconnected
51
53
54
56
57
59
60
61
62
RSVD1
34
I/O
Reserved. This pin must be left unconnected for normal operation
RSVD2
1
I
Reserved. This pin must be left unconnected for normal operation
SCL
15
I
Local I2C interface clock
SDA
16
I/O
Local I2C interface data
—
1.8-V power supply
3
14
18
32
35
VCC
40
43
48
49
55
58
63
VCORE
31
P
1.1-V output from the voltage regulator. This pin must have a 1-µF external capacitor to
ground
PowerPAD
—
—
Reference ground
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SLLSEW7A – DECEMBER 2016 – REVISED JUNE 2018
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6 Specifications
6.1 Absolute Maximum Ratings
over operating free-air temperature range (unless otherwise noted) (1)
VCC
MIN
MAX
UNIT
–0.3
2.175
V
CMOS input pins
–0.5
2.175
V
DSI input pins (DAxP, DAxN)
–0.4
1.4
V
Supply voltage
Input voltage
TA
Operating free-air temperature
–40
105
°C
TJ
Junction temperature
–40
115
°C
Tstg
Storage temperature
–65
150
°C
(1)
Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended
Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
6.2 ESD Ratings
VALUE
Electrostatic
discharge
V(ESD)
(1)
Human-body model (HBM), per AEC Q100-002 (1)
±4000
Charged-device model (CDM), per AEC Q100-011
±1000
UNIT
V
AEC Q100-002 indicates that HBM stressing shall be in accordance with the ANSI/ESDA/JEDEC JS-001 specification.
6.3 Recommended Operating Conditions
over operating free-air temperature range (unless otherwise noted)
MIN
NOM
MAX
UNIT
1.65
1.8
1.95
V
VCC
VCC power supply
VPSN
Supply noise on any VCC pin
V(DSI)
DSI input pin voltage
ƒ(I2C)
Local I2C input frequency
ƒHS(CLK)
DSI high-speed (HS) clock input frequency
tsu
DSI HS data to clock setup time; see Figure 1
0.15
UI (1)
th
DSI HS data to clock hold time; see Figure 1
0.15
UI (1)
ZOD(LVDS)
LVDS output differential impedance
TC
Case temperature
(1)
ƒ(noise) > 1 MHz
0.05
V
–50
1350
mV
400
kHz
500
MHz
40
90
132
Ω
92.2
°C
The unit interval (UI) is one half of the period of the HS clock; at 500 MHz the minimum setup and hold time is 150 ps.
6.4 Thermal Information
SN65DSI83-Q1
THERMAL METRIC (1)
PAP (HTQFP)
UNIT
64 PINS
RθJA
Junction-to-ambient thermal resistance
36.1
°C/W
RθJC(top)
Junction-to-case (top) thermal resistance
18.2
°C/W
RθJB
Junction-to-board thermal resistance
20.6
°C/W
ψJT
Junction-to-top characterization parameter
0.8
°C/W
ψJB
Junction-to-board characterization parameter
20.5
°C/W
RθJC(bot)
Junction-to-case (bottom) thermal resistance
2.2
°C/W
(1)
6
For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application
report.
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SLLSEW7A – DECEMBER 2016 – REVISED JUNE 2018
6.5 Electrical Characteristics
over operating free-air temperature range (unless otherwise noted)
PARAMETER
TEST CONDITIONS
MIN
TYP (1)
MAX
UNIT
VIL
Low-level control signal input voltage
VIH
High-level control signal input voltage
VOH
High-level output voltage
IOH = –4 mA
VOL
Low-level output voltage
IOL = 4 mA
0.4
V
ILKG
Input failsafe leakage current
VCC = 0; VCC(PIN) = 1.8 V
±30
μA
IIH
High level input current
Any input terminal
±30
μA
IIL
Low level input current
Any input terminal
±30
μA
IOZ
High-impedance output current
CMOS output terminals
±10
μA
IOS
Short-circuit output current
Any output driving GND short
±50
mA
ICC
Device active current
See
77
124
mA
IULPS
Device standby current
All data and clock lanes are in ultra-low
power state (ULPS)
7.7
14
mA
IRST
Shutdown current
EN = 0
130
µA
REN
EN control input resistor
(1)
(2)
0.3 × VCC
0.7 × VCC
(2)
V
V
1.25
V
200
kΩ
All typical values are at VCC = 1.8 V and TA = 25°C
SN65DSI83-Q1: SINGLE Channel DSI to SINGLE Channel DSI, 1280 × 800
(a) Number of LVDS lanes = 3 data lanes + 1 CLK lane
(b) Number of DSI lanes = 4 data lanes + 1 CLK lane
(c) LVDS CLK OUT = 83 M
(d) DSI CLK = 500 M
(e) RGB888, LVDS 18 bpp
Maximum values are at VCC = 1.95 V and TA = 85°C
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Electrical Characteristics (continued)
over operating free-air temperature range (unless otherwise noted)
PARAMETER
TEST CONDITIONS
MIN
TYP (1)
MAX
UNIT
MIPI DSI INTERFACE
VIH-LP
LP receiver input high threshold
See Figure 2
VIL-LP
LP receiver input low threshold
See Figure 2
|VID|
HS differential input voltage
|VIDT|
HS differential input voltage threshold
VIL-ULPS
LP receiver input low threshold; ultra-low
power state (ULPS)
VCM-HS
HS common mode voltage; steady-state
ΔVCMHS
HS common mode peak-to-peak variation
including symbol delta and interference
VIH-HS
HS single-ended input high voltage
See Figure 2
VIL-HS
HS single-ended input low voltage
See Figure 2
VTERM-
HS termination enable; single-ended input
voltage (both Dp AND Dn apply to enable)
Termination is switched simultaneous for
Dn and Dp
EN
RDIFF-
880
mV
100
70
HS mode differential input impedance
550
mV
270
mV
50
mV
300
mV
330
mV
100
mV
460
mV
–40
mV
80
450
mV
125
Ω
HS
LVDS OUTPUT
|VOD|
|VOD|
Steady-state differential output voltage
A_Y x P/N
Steady-state differential output voltage for
A_CLKP/N
Δ|VOD|
Change in steady-state differential output
voltage between opposite binary states
VOC(SS)
Steady state common-mode output voltage (3)
CSR 0×19.3:2=00
100 Ω near end termination
180
245
330
CSR 0×19.3:2=01
100 Ω near end termination
215
293
392
CSR 0×19.3:2=10
100 Ω near end termination
250
341
455
CSR 0×19.3:2=11
100 Ω near end termination
290
389
515
CSR 0×19.3:2=00
200 Ω near end termination
150
204
275
CSR 0×19.3:2=01
200 Ω near end termination
200
271
365
CSR 0×19.3:2=10
200 Ω near end termination
250
337
450
CSR 0×19.3:2=11
200 Ω near end termination
300
402
535
CSR 0×19.3:2=00
near end termination
140
191
262
CSR 0×19.3:2=01
100 Ω near end termination
168
229
315
CSR 0×19.3:2=10
100 Ω near end termination
195
266
365
CSR 0×19.3:2=11
100 Ω near end termination
226
303
415
CSR 0×19.3:2=00
200 Ω near end termination
117
159
220
CSR 0×19.3:2=01
200 Ω near end termination
156
211
295
CSR 0×19.3:2=10
200 Ω near end termination
195
263
362
CSR 0×19.3:2=11
200 Ω near end termination
234
314
435
Peak-to-peak common-mode output voltage
RLVDS_D
Pulldown resistance for disabled LVDS outputs
mV
RL = 100 Ω
CSR 0×19.6 = 1 and CSR 0×1B.6 = 1
Figure 3
CSR 0×19.6 = 0 see Figure 3
VOC(PP)
mV
35
0.75
0.9
1.13
1
1.25
1.5
see Figure 3
35
1
mV
V
mV
kΩ
IS
(3)
8
Tested at VCC = 1.8V , TA = –40°C for MIN, TA = 25°C for TYP, TA = 105°C for MAX.
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6.6
SLLSEW7A – DECEMBER 2016 – REVISED JUNE 2018
Switching Characteristics
over operating free-air temperature range (unless otherwise noted)
PARAMETER
TEST CONDITIONS
MIN
TYP (1)
MAX
UNIT
300
ps
40
ns
DSI
tGS
DSI LP glitch suppression pulse width
LVDS
tc
Output clock period
tw
High-level output clock (CLK) pulse duration
6.49
t0
Delay time, CLK↑ to 1st serial bit position
t1
Delay time, CLK↑ to 2nd serial bit position
t2
Delay time, CLK↑ to 3rd serial bit position
t3
Delay time, CLK↑ to 4th serial bit position
t4
Delay time, CLK↑ to 5th serial bit position
t5
t6
tr
Differential output rise time
tf
Differential output fall time
4/7 tc
ns
–0.15
0.15
ns
1/7 tc – 0.15
1/7 tc + 0.15
ns
2/7 tc – 0.15
2/7 tc + 0.15
ns
3/7 tc – 0.15
3/7 tc + 0.15
ns
4/7 tc – 0.15
4/7 tc + 0.15
ns
Delay time, CLK↑ to 6th serial bit position
5/7 tc – 0.15
5/7 tc + 0.15
ns
Delay time, CLK↑ to 7th serial bit position
6/7 tc – 0.15
6/7 tc + 0.15
ns
180
500
ps
tc = 6.49 ns;
Input clock jitter < 25 ps
(REFCLK)
See Figure 4
See Figure 4
EN, ULPS, RESET
ten
Enable time from EN or ULPS
tc(o) = 12.9 ns
1
ms
tdis
Disable time to standby; see
tc(o) = 12.9 ns
0.1
ms
treset
Reset yime
10
FREFCLK
REFCLK freqeuncy. Supported frequencies:
25 MHz - 154 MHz
25
154
tr, tf
REFCLK rise and fall time
100 × 10–12
1×10–9
s
tpj
REFCLK peak-to-peak phase jitter
50
ps
Duty
REFCLK duty cycle
ms
REFCLK
40%
50%
60%
0.5%
1%
2%
MHz
REFCLK or DSI CLK (DACP/N)
SSC_CLKIN
(1)
(2)
SSC enabled Input CLK center spread depth (2)
Modulation frequency
30
60
kHz
All typical values are at VCC = 1.8 V and TA = 25°C
For EMI reduction purpose, the SN65DSI83-Q1 supports the center spreading of the LVDS CLK output through the REFCLK or DSI
CLK input. The center spread CLK input to the REFCLK or DSI CLK is passed through to the LVDS CLK output A_CLKP/N.
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7 Parameter Measurement Information
Figure 1. DSI HS Mode Receiver Timing Definitions
1.3 V
LP-RX
Input HIGH
VIH(LP)
VIL(LP)
VID
LP-RX
Input LOW
VIH(HS)
VCM(HS)max
HS-RX
Common Mode
Range
VCM(HS)min
GND
VIL(HS)
Low Power (LP)
Mode Receiver
High Speed (HS) Mode
Receiver
Figure 2. DSI Receiver Voltage Definitions
10
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Parameter Measurement Information (continued)
49.9
A_YnP
±1% (2 PLCS)
VOD
A_YnN
VOC
100 %
80%
VOD(H)
0V
VOD(L)
20%
0%
tf
tr
VOC(PP)
VOC(s)
VOC(s)
0V
Figure 3. Test Load and Voltage Definitions for LVDS Outputs
CLK
td(6)
td(5)
td(4)
td(3)
td(2)
td(1)
td(0)
Yn
VOD(H)
0V
VOD(L)
td(0) to td(6)
Figure 4. SN65DSI83-Q1 LVDS Timing Definitions
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Parameter Measurement Information (continued)
ULPS (LP00) State
DSI lane
ten
tdis
A_CLKP/N
(LVDS_CHA_CLK)
(1)
See the ULPS section of the data sheet for the ULPS entry and exit sequence.
(2)
ULPS entry and exit protocol and timing requirements must be met according to the MIPI DPHY specification.
Figure 5. ULPS Timing Definition
12
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8 Detailed Description
8.1 Overview
The SN65DSI83-Q1 DSI to LVDS bridge device features a single-channel MIPI® D-PHY receiver front-end
configuration with four lanes per channel operating at 1 Gbps per lane; a maximum input bandwidth of 4 Gbps.
The bridge decodes MIPI DSI 18-bpp RGB666 and 24-bpp RGB888 packets and converts the formatted video
data stream to an LVDS output operating at pixel clocks operating from 25 MHz to 154 MHz, offering a SingleLink LVDS with four data lanes per link.
8.2 Functional Block Diagram
AVCC
ERR
AGND
VCC
ULPS
LANE ERR
MERGE
GND
LPRX
DA0P
DA0N
8
18
HSRX
DATA LANE 0
18
LVDS
SERIALIZER
EOT
DA1P
DA1N
DA2P
DA2N
DA3P
DA3N
DATA LANE 1
(Circuit same as DATA LANE 0)
8
DATA LANE 2
(Circuit same as DATA LANE 0)
8
DATA LANE 3
(Circuit same as DATA LANE 0)
8
32
DACN
DSI PACKET
PROCESSORS
DE
VS
HS
CHANNEL
FORMATTER
ULPS
ULPS
DACP
SOT
A_Y0P
A_Y0N
A_Y1P
A_Y1N
A_Y2P
A_Y2N
A_CLKP
A_CLKN
A_Y3P
A_Y3N
PARTIAL
LPRX
LPRX
LVDSPLL
PLL
Lock
HSRX
HSRX
CLOCK CIRCUITS
PIXEL CLOCK
CLK LANE
PLL Lock
Logic Clocks
SCL
CSR
HS Clock
Sourced
M /N Pixel
Clock PLL
2
LOCAL I2C
CSR READ
CSR WRITE
SDA
IRQ
ADDR
Clock Dividers
Reset
SN65DSI83-Q1
REFCLK
EN
RSVD1
RSVD2
8.3 Feature Description
8.3.1 Clock Configurations and Multipliers
The LVDS clock may be derived from the DSI channel A clock, or from an external reference clock source. When
the MIPI D-PHY channel A HS clock is used as the LVDS clock source, the D-PHY clock lane must operate in
HS free-running (continuous) mode. This feature eliminates the need for an external reference clock reducing
system costs.
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Feature Description (continued)
The reference clock source is selected by HS_CLK_SRC (CSR 0×0A.0) programmed through the local I2C
interface. If an external reference clock is selected, it is multiplied by the factor in REFCLK_MULTIPLIER (CSR
0×0B.1:0) to generate the LVDS output clock. When an external reference clock is selected, it must be between
25 MHz and 154 MHz. If the DSI channel A clock is selected, it is divided by the factor in DSI_CLK_DIVIDER
(CSR 0×0B.7:3) to generate the LVDS output clock. Additionally, LVDS_CLK_RANGE (CSR 0×0A.3:1) and
CH_DSI_CLK_RANGE(CSR 0×12) must be set to the frequency range of the LVDS output clock and DSI
Channel A input clock respectively for the internal PLL to operate correctly. After these settings are programmed,
PLL_EN (CSR 0×0D.0) must be set to enable the internal PLL.
8.3.2 ULPS
The SN65DSI83-Q1 device supports the MIPI defined ULPS. While the device is in the ULPS, the CSR registers
are accessible via I2C interface. ULPS sequence must be issued to all active DSI CLK and, or DSI data lanes of
the enabled DSI channels for the SN65DSI83-Q1 device to enter the ULPS. The following sequence must be
followed to enter and exit the ULPS.
1. The host issues a ULPS entry sequence to all DSI CLK and data lanes enabled.
2. When the host is ready to exit the ULPS mode, the host issues a ULPS exit sequence to all DSI CLK and
data lanes that need to be active in normal operation.
3. Wait for the PLL_LOCK bit (CSR 0×0A.7) to be set.
4. Set the SOFT_RESET bit (CSR 0×09.0).
5. Device resumes normal operation (that is, video streaming resumes on the panel).
8.3.3 LVDS Pattern Generation
The SN65DSI83-Q1 device supports a pattern generation feature on LVDS channels. This feature can be used
to test the LVDS output path and LVDS panels in a system platform. The pattern generation feature can be
enabled by setting the CHA_TEST_PATTERN bit at address 0×3C. No DSI data is received while the pattern
generation feature is enabled.
There are three modes available for LVDS test pattern generation. The mode of test pattern generation is
determined by register configuration, as shown in Table 1.
Table 1. Video Registers
ADDRESS BIT
REGISTER NAME
0×20.7:0
CHA_ACTIVE_LINE_LENGTH_LOW
0×21.3:0
CHA_ACTIVE_LINE_LENGTH_HIGH
0×24.7:0
CHA_VERTICAL_DISPLAY_SIZE_LOW
0×25.3:0
CHA_VERTICAL_DISPLAY_SIZE_HIGH
0×2C.7:0
CHA_HSYNC_PULSE_WIDTH_LOW
0×2D.1:0
CHA_HSYNC_PULSE_WIDTH_HIGH
0×30.7:0
CHA_VSYNC_PULSE_WIDTH_LOW
0×31.1:0
CHA_VSYNC_PULSE_WIDTH_HIGH
0×34.7:0
CHA_HORIZONTAL_BACK_PORCH
0×36.7:0
CHA_VERTICAL_BACK_PORCH
0×38.7:0
CHA_HORIZONTAL_FRONT_PORCH
0×3A.7:0
CHA_VERTICAL_FRONT_PORCH
8.3.4 Reset Implementation
When the EN pin is deasserted (low), the SN65DSI83-Q1 device is in SHUTDOWN or RESET state. In this state,
CMOS inputs are ignored, the MIPI D-PHY inputs are disabled and outputs are high impedance. Transitioning
the EN input from a low to a high level after the VCC supply has reached the minimum operating voltage as
shown in Figure 6 is critical. This transition is achieved by a control signal to the EN input, or by an external
capacitor connected between EN and GND.
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VCC
1.65 V
EN
tVCC
ten
Figure 6. Cold-Start VCC Ramp Up to EN
When implementing the external capacitor, the size of the external capacitor depends on the power up ramp of
the VCC supply, where a slower ramp-up results in a larger value external capacitor. Consider an approximately
200-nF capacitor as a reasonable first estimate for the size of the external capacitor.
Figure 7 and Figure 8 show both EN implementations.
VCC
GPO
EN
C
EN
R(EN) = 200 kΩ
C
SN65DSI83-Q1
Controller
SN65DSI83-Q1
Figure 7. External Capacitor Controlled EN
Figure 8. EN Input from Active Controller
When the SN65DSI83-Q1 is reset while VCC is high, the EN pin must be held low for at least 10 ms before being
asserted high as described in Table 2 to be sure that the device is properly reset. The DSI CLK lane MUST be in
HS and the DSI data lanes MUST be driven to LP11 while the device is in reset before the EN pin is asserted
per the timing described in Table 2.
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8.3.5 Initialization Sequence
Use the following initialization sequence to setup the SN65DSI83-Q1. This sequence is required for proper
operation of the device. Steps 9 through 11 in the sequence are optional. Also see Figure 6.
Table 2. Initialization Sequence
INITIALIZATION
SEQUENCE
NUMBER
INITIALIZATION SEQUENCE DESCRIPTION
Init seq 1
Power on
Init seq 2
After power is applied and stable, the DSI CLK lanes MUST be in HS state and the DSI data lanes MUST be driven
to LP11 state
Init seq 3
Set EN pin to Low
Wait 10 ms
(1)
Init seq 4
Tie EN pin to High
Wait 10 ms
(1)
Init seq 5
Initialize all CSR registers to their appropriate values based on the implementation (The SN65DSI8x is not
functional until the CSR registers are initialized)
Init seq 6
Set the PLL_EN bit (CSR 0x0D.0)
Wait 10 ms
(1)
Init seq 7
Set the SOFT_RESET bit (CSR 0x09.0)
Wait 10 ms
(1)
Init seq 8
Wait 5 ms
Change DSI data lanes to HS state and start DSI video stream
(1)
Init seq 9
Read back all resisters and confirm they were correctly written
Init seq 10
Wait 1 ms
Init seq 11
(1)
Write 0xFF to CSR 0xE5 to clear the error registers
(1)
Read CSR 0xE5. If CSR 0xE5!= 0x00, then go back to step #2 and re-initialize
Minimum recommended delay. It is fine to exceed these.
8.3.6 LVDS Output Formats
The SN65DSI83-Q1 device processes DSI packets and produces video data driven to the LVDS interface in an
industry standard format. Single-Link LVDS is supported by the SN65DSI83-Q1 device. During conditions such
as the default condition, and some video synchronization periods, where no video stream data is passing from
the DSI input to the LVDS output, the SN65DSI83-Q1 device transmits zero value pixel data on the LVDS
outputs while maintaining transmission of the vertical sync and horizontal sync status.
Figure 9 illustrates a Single-Link LVDS 18-bpp application.
Figure 10 illustrates a Single-Link 24-bpp application using Format 2, controlled by CHA_24BPP_FORMAT1
(CSR 0×18.1). In data Format 2, the two MSB per color are transferred on the Y3P/N LVDS lane.
Figure 11 illustrates a 24-bpp Single-Link application using Format 1. In data Format 1, the two LSB per color are
transferred on the Y3P/N LVDS lane.
Figure 12 illustrates a Single-Link LVDS application where 24-bpp data is received from DSI and converted to
18 bpp data for transmission to an 18-bpp panel. This application is configured by setting
CHA_24BPP_FORMAT1 (CSR 0×18.1) to 1 and CHA_24BPP_MODE (CSR 0×18.3) to 0. In this configuration,
the SN65DSI83-Q1 device does not transmit the 2 LSB per color since the Y3P and Y3N LVDS lane is disabled.
NOTE
Figure 9, Figure 10, Figure 11, and Figure 12 only illustrate a few example applications for
the SN65DSI83-Q1 device. Other applications are also supported.
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A_CLKP/N
cycle ‘n-1’
cycle ‘n’
A_Y0P/N
G0
R5
R4
R3
R2
R1
R0
A_Y1P/N
B1
B0
G5
G4
G3
G2
G1
A_Y2P/N
DE
VS
HS
B5
B4
B3
B2
A_Y3P/N
DE = Data Enable; A_Y3P/N are Output Low
Figure 9. LVDS Output Data; Single-Link 18 bpp
A_CLKP/N
cycle ‘n-1’
cycle ‘n’
A_Y0P/N
G0
R5
R4
R3
R2
R1
R0
A_Y1P/N
B1
B0
G5
G4
G3
G2
G1
A_Y2P/N
DE
VS
HS
B5
B4
B3
B2
A_Y3P/N
0
B7
B6
G7
G6
R7
R6
DE = Data Enable
Figure 10. LVDS Output Data (Format 2); Single-Link 24 bpp
A_CLKP/N
cycle ‘n-1’
cycle ‘n’
A_Y0P/N
G2
R7
R6
R5
R4
R3
R2
A_Y1P/N
B3
B2
G7
G6
G5
G4
G3
A_Y2P/N
DE
VS
HS
B7
B6
B5
B4
A_Y3P/N
0
B1
B0
G1
G0
R1
R0
DE = Data Enable
Figure 11. LVDS Output Data (Format 1); Single-Link 24 bpp
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A_CLKP/N
cycle ‘n-1’
cycle ‘n’
A_Y0P/N
G2
R7
R6
R5
R4
R3
R2
A_Y1P/N
B3
B2
G7
G6
G5
G4
G3
A_Y2P/N
DE
VS
HS
B7
B6
B5
B4
A_Y3P/N
DE = Data Enable; A_Y3P and A_Y3N are output low; A_Y3P and A_Y3N are output low
Figure 12. LVDS Output Data (Format 1); 24 bpp to Single-Link 18 bpp Conversion
8.3.7 DSI Lane Merging
The SN65DSI83-Q1 supports four DSI data lanes per input channel, and may be configured to support one, two,
or three DSI data lanes per channel. Unused DSI input pins on the SN65DSI83-Q1 must be left unconnected or
driven to LP11 state.The bytes received from the data lanes are merged in HS mode to form packets that carry
the video stream. DSI data lanes are bit and byte aligned.
Figure 13 shows the lane merging function for each channel; 4-Lane, 3-Lane, and 2-Lane modes are illustrated.
HS BYTES TRANSMITTED (n) IS INTEGER MULTIPLE OF 3
HS BYTES TRANSMITTED (n) IS INTEGER MULTIPLE OF 4
LANE 0
SOT
BYTE 0
BYTE 4
BYTE 8
BYTE n-4
EOT
LANE 0
SOT
BYTE 0
BYTE 3
BYTE 6
BYTE n-3
EOT
LANE 1
SOT
BYTE 1
BYTE 5
BYTE 9
BYTE n-3
EOT
LANE 1
SOT
BYTE 1
BYTE 4
BYTE 7
BYTE n-2
EOT
LANE 2
SOT
BYTE 2
BYTE 6
BYTE 10
BYTE n-2
EOT
LANE 2
SOT
BYTE 2
BYTE 5
BYTE 8
BYTE n-1
EOT
LANE 3
SOT
BYTE 3
BYTE 7
BYTE 11
BYTE n-1
EOT
HS BYTES TRANSMITTED (n) IS 1 LESS THAN INTEGER MULTIPLE OF 3
HS BYTES TRANSMITTED (n) IS 1 LESS THAN INTEGER MULTIPLE OF 4
LANE 0
SOT
BYTE 0
BYTE 4
BYTE 8
BYTE n-3
EOT
LANE 1
SOT
BYTE 1
BYTE 5
BYTE 9
BYTE n-2
EOT
LANE 2
SOT
BYTE 2
BYTE 6
BYTE 10
BYTE n-1
EOT
LANE 3
SOT
BYTE 3
BYTE 7
BYTE 11
EOT
LANE 0
SOT
BYTE 0
BYTE 3
BYTE 6
BYTE n-2
EOT
LANE 1
SOT
BYTE 1
BYTE 4
BYTE 7
BYTE n-1
EOT
LANE 2
SOT
BYTE 2
BYTE 5
BYTE 8
EOT
HS BYTES TRANSMITTED (n) IS 2 LESS THAN INTEGER MULTIPLE OF 3
HS BYTES TRANSMITTED (n) IS 2 LESS THAN INTEGER MULTIPLE OF 4
LANE 0
SOT
BYTE 0
BYTE 4
BYTE 8
BYTE n-2
EOT
LANE 1
SOT
BYTE 1
BYTE 5
BYTE 9
BYTE n-1
EOT
LANE 2
SOT
BYTE 2
BYTE 6
BYTE 10
EOT
LANE 3
SOT
BYTE 3
BYTE 7
BYTE 11
EOT
LANE 0
SOT
BYTE 0
BYTE 3
BYTE 6
BYTE n-1
LANE 1
SOT
BYTE 1
BYTE 4
BYTE 7
EOT
LANE 2
SOT
BYTE 2
BYTE 5
BYTE 8
EOT
3 DSI Data Lane Configuration
HS BYTES TRANSMITTED (n) IS INTEGER MULTIPLE OF 2
HS BYTES TRANSMITTED (n) IS 3 LESS THAN INTEGER MULTIPLE OF 4
LANE 0
SOT
BYTE 0
BYTE 4
BYTE 8
BYTE n-1
LANE 1
SOT
BYTE 1
BYTE 5
BYTE 9
EOT
LANE 2
SOT
BYTE 2
BYTE 6
BYTE 10
EOT
LANE 3
SOT
BYTE 3
BYTE 7
BYTE 11
EOT
4 DSI Data Lane Configuration (default)
EOT
EOT
LANE 0
SOT
BYTE 0
BYTE 2
BYTE 4
BYTE n-2
EOT
LANE 1
SOT
BYTE 1
BYTE 3
BYTE 5
BYTE n-1
EOT
HS BYTES TRANSMITTED (n) IS 1 LESS THAN INTEGER MULTIPLE OF 2
LANE 0
SOT
BYTE 0
BYTE 2
BYTE 4
BYTE n-1
LANE 1
SOT
BYTE 1
BYTE 3
BYTE 5
EOT
EOT
2 DSI Data Lane Configuration
Figure 13. SN65DSI83-Q1 DSI Lane Merging Illustration
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8.3.8 DSI Pixel Stream Packets
The SN65DSI83-Q1 processes 18-bpp (RGB666) and 24-bpp (RGB888) DSI packets as shown in Figure 14,
Figure 15, and Figure 16.
2 Bytes
DATA TYPE (0x2E)
VIRTUAL CHANNEL
1 Byte
1 Byte
WORD COUNT
WORD COUNT Bytes
18 bpp Loosely Packed Pixel Stream
ECC
CRC CHECKSUM
(Variable Size Payload)
Packet Payload
Packet Header
1 Byte
01
2 Bytes
1 Byte
1 Byte
1 Byte
1 Byte
Packet Footer
1 Byte
1 Byte
1 Byte
1 Byte
2
7
2
7
2
7
2
7
2
7
2
7
2
7
2
7
2
7
R0
R5
G0
G5
B0
B5
R0
R5
G0
G5
B0
B5
R0
R5
G0
G5
B0
B5
6-bits
RED
6-bits
GREEN
6-bits
BLUE
6-bits
RED
First Pixel in Packet
6-bits
GREEN
6-bits
BLUE
6-bits
RED
6-bits
GREEN
Second Pixel in Packet
6-bits
BLUE
Third Pixel in Packet
Variable Size Payload (Three Pixels Per Nine Bytes of Payload)
Figure 14. 18-bpp (Loosely Packed) DSI Packet Structure
2 Bytes
DATA TYPE (0x1E)
VIRTUAL CHANNEL
1 Byte
1 Byte
WORD COUNT
WORD COUNT Bytes
18 bpp Packed Pixel Stream
ECC
0
R0
5
Packet Payload
1 Byte
6 7 0
R5 G0
6-bits
RED
CRC CHECKSUM
(Variable Size Payload)
Packet Header
1 Byte
2 Bytes
3
4
G5 B 0
6-bits
GREEN
First Pixel in Packet
1 Byte
7 01
2
7
B 5 R0
6-bits
BLUE
1 Byte
0
5
R5 G0
6-bits
RED
1 Byte
6 7 0
G5 B 0
6-bits
GREEN
Second Pixel in Packet
3
4
B 5 R0
6-bits
BLUE
Packet Footer
1 Byte
7 01
2
7
R5 G0
6-bits
RED
1 Byte
0
G5 B 0
6-bits
GREEN
5
1 Byte
6 7 0
B 5 R0
6-bits
BLUE
3
4
7 01
R5 G0
6-bits
RED
Third Pixel in Packet
1 Byte
2
G5 B 0
6-bits
GREEN
7
B5
6-bits
BLUE
Fourth Pixel in Packet
Variable Size Payload (Four Pixels Per Nine Bytes of Payload)
Figure 15. 18-bpp (Tightly Packed) DSI Packet Structure
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2 Bytes
DATA TYPE (0x3E)
VIRTUAL CHANNEL
1 Byte
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1 Byte
WORD COUNT
WORD COUNT Bytes
24 bpp Packed Pixel Stream
ECC
CRC CHECKSUM
(Variable Size Payload)
Packet Payload
Packet Header
1 Byte
1 Byte
0
7
0
R0
R7
G0
8-bits
RED
2 Bytes
1 Byte
7
0
7
G 7 B0
8-bits
GREEN
1 Byte
B7
8-bits
BLUE
1 Byte
0
7
0
R0
R7
G0
8-bits
RED
First Pixel in Packet
Packet Footer
1 Byte
7
0
7
G 7 B0
8-bits
GREEN
1 Byte
B7
0
7
R0
8-bits
BLUE
1 Byte
R7
8-bits
RED
Second Pixel in Packet
1 Byte
0
7
G0
G7 B 0
0
8-bits
GREEN
7
B7
8-bits
BLUE
Third Pixel in Packet
Variable Size Payload (Three Pixels Per Nine Bytes of Payload)
Figure 16. 24-bpp DSI Packet Structure
8.3.9 DSI Video Transmission Specifications
The SN65DSI83-Q1 supports burst video mode and non-burst video mode with sync events or with sync pulses
packet transmission as described in the DSI specification. The burst mode supports time-compressed pixel
stream packets that leave added time per scan line for power savings LP mode. The SN65DSI83-Q1 requires a
transition to LP mode once per frame to enable PHY synchronization with the DSI host processor; however, for a
robust and low-power implementation, the transition to LP mode is recommended on every video line.
Figure 17 shows the DSI video transmission applied to SN65DSI83-Q1 applications. In all applications, the LVDS
output rate must be less than or equal to the DSI input rate. The first line of a video frame shall start with a VSS
packet, and all other lines start with VSE or HSS. The position of the synchronization packets in time is of utmost
importance since this has a direct impact on the visual performance of the display panel; that is, these packets
generate the HS and VS (horizontal and vertical sync) signals on the LVDS interface after the delay programmed
into CHA_SYNC_DELAY_LOW/HIGH (CSR 0×28.7:0 and 0×29.3:0).
As required in the DSI specification, the SN65DSI83-Q1 requires that pixel stream packets contain an integer
number of pixels (i.e. end on a pixel boundary); it is recommended to transmit an entire scan line on one pixel
stream packet. When a scan line is broken in to multiple packets, inter-packet latency shall be considered such
that the video pipeline (ie. pixel queue or partial line buffer) does not run empty (i.e. under-run); during scan line
processing, if the pixel queue runs empty, the SNDSI83-Q1 transmits zero data (18’b0 or 24’b0) on the LVDS
interface.
NOTE
When the HS clock is used as a source for the LVDS pixel clock, the LP mode transitions
apply only to the data lanes, and the DSI clock lane remains in the HS mode during the
entire video transmission.
The SN65DSI83-Q1 does not support the DSI Virtual Channel capability or reverse
direction (peripheral to processor) transmissions.
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One Video Frame
NOP/ ...
LP
RGB
Vertical sync / blanking
t W (HS )
HS
NOP/
LP
DSI
Channel(s)
NOP/
LP
NOP/
LP
HSS
t LINE
NOP/
LP
RGB
...
t W(HS)
(1)
HS
(1)
t PD
HS (1)
t PD
VS (2)
VS (2)
VS
DE (3)
DE (3)
DE (3)
DATA
...
Active Video Line LVDS Transfer Function
HSS
DSI
Channel A
NOP/
LP
Vertical sync / blanking
t LINE
HSS
VSS
t LINE
NOP/
LP
NOP/
LP
Active Lines
Vertical Blanking Period LVDS Transfer Function
DSI
Channel A
RGB
t LINE
HSS
NOP/
LP
t LINE
HSS
...
t LINE
HSS
NOP/
LP
NOP/
LP
HSS
NOP/
LP
t LINE
NOP/
LP
HSS
VSS
DSI
Channel A
t LINE
HSS
t LINE
t LINE
0x000
DATA
0x000
(2)
0x000
DATA
PixelStream Data
0x000 (4)
LEGEND
(1) The assertion of HS is delayed (t PD) by a programmable number of pixel clocks from the
last bit of VSS/HSS packet received on DSI. The HS pulse width (tW(HS) ) is also programmable.
The illustration shows HS active low.
(2) VS is signaled for a programmable number of lines (tLINE ) and is asserted when HS is
asserted for the first line of the frame . VS is de -asserted when HS is asserted after the
number of lines programmed has been reached. The illustration shows VS active low
VSS
DSI Sync Event Packet: V Sync Start
HSS
DSI Sync Event Packet: H Sync Start
RGB
A sequence of DSI Pixel Stream Packets
and Null Packets
NOP/LP
DSI Null Packet , Blanking Packet , or a
transition to LP Mode
(3) DE is asserted when active pixel data is transmitted on LVDS , and polarity is set
independent to HS/VS. The illustration shows DE active high
(4) After the last pixel in an active line is output to LVDS, the LVDS data is output zero
Figure 17. DSI Channel Transmission and Transfer Function
8.4 Programming
8.4.1 Local I2C Interface Overview
The SN65DSI83-Q1 device local I2C interface is enabled when EN is input high, access to the CSR registers is
supported during ULPS. The SCL and SDA pins are used for I2C clock and I2C data respectively. The
SN65DSI83-Q1 device I2C interface conforms to the 2-wire serial interface defined by the I2C Bus Specification,
Version 2.1 (January 2000) and supports fast mode transfers up to 400 kbps.
The device address byte is the first byte received following the start condition from the master device. The 7-bit
device address for SN65DSI83-Q1 device is factory preset to 010110X with the least significant bit being
determined by the ADDR control input. Table 3 clarifies the SN65DSI83-Q1 device target address.
Table 3. SN65DSI83-Q1 I2C Target Address Description
(1) (2)
BIT 7 (MSB)
BIT 6
BIT 5
BIT 4
BIT 3
BIT 2
BIT 1
BIT 0 (W/R)
0
1
0
1
1
0
ADDR
0/1
(1)
(2)
When ADDR = 1, Address cycle is 0×5A (write) and 0×5B (read)
When ADDR = 0, Address cycle is 0×58 (write) and 0×59 (read)
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The following procedure is followed to write to the SN65DSI83-Q1 device I2C registers:
1. The master initiates a write operation by generating a start condition (S), followed by the SN65DSI83-Q1
device 7-bit address and a zero-value W/R bit to indicate a write cycle.
2. The SN65DSI83-Q1 device acknowledges the address cycle.
3. The master presents the subaddress (I2C register within SN65DSI83-Q1 device) to be written, consisting of
one byte of data, MSB-first.
4. The SN65DSI83-Q1 device acknowledges the subaddress cycle.
5. The master presents the first byte of data to be written to the I2C register.
6. The SN65DSI83-Q1 device acknowledges the byte transfer.
7. The master may continue presenting additional bytes of data to be written, with each byte transfer completing
with an acknowledge from the SN65DSI83-Q1 device.
8. The master terminates the write operation by generating a stop condition (P).
The following procedure is followed to read the SN65DSI83-Q1 I2C registers:
1. The master initiates a read operation by generating a start condition (S), followed by the SN65DSI83-Q1
device 7-bit address and a one-value W/R bit to indicate a read cycle.
2. The SN65DSI83-Q1 device acknowledges the address cycle.
3. The SN65DSI83-Q1 device transmits the contents of the memory registers MSB-first starting at register 00h.
If a write to the SN65DSI83-Q1 I2C register occurred prior to the read, then the SN65DSI83-Q1 device starts
at the subaddress specified in the write.
4. The SN65DSI83-Q1 device waits for either an acknowledge (ACK) or a not-acknowledge (NACK) from the
master after each byte transfer; the I2C master acknowledges reception of each data byte transfer.
5. If an ACK is received, the SN65DSI83-Q1 device transmits the next byte of data.
6. The master terminates the read operation by generating a stop condition (P).
The following procedure is followed for setting a starting subaddress for I2C reads:
1. The master initiates a write operation by generating a start condition (S), followed by the SN65DSI83-Q1
device 7-bit address and a zero-value W/R bit to indicate a write cycle.
2. The SN65DSI83-Q1 device acknowledges the address cycle.
3. The master presents the subaddress (I2C register within the SN65DSI83-Q1 device) to be written, consisting
of one byte of data, MSB first.
4. The SN65DSI83-Q1 device acknowledges the subaddress cycle.
5. The master terminates the write operation by generating a stop condition (P).
22
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8.5 Register Maps
8.5.1 Control and Status Registers Overview
Many of the SN65DSI83-Q1 functions are controlled by the Control and Status Registers (CSR). All CSR
registers are accessible through the local I2C interface.
See the following tables for the SN65DSI83-Q1 CSR descriptions. Reserved or undefined bit fields should not be
modified. Otherwise, the device may operate incorrectly.
8.5.1.1 CSR Bit Field Definitions – ID Registers
8.5.1.1.1 Registers 0x00 – 0x08
Figure 18. Registers 0x00 – 0x08
7
6
5
4
3
2
1
0
Reserved
R
LEGEND: R/W = Read/Write; R = Read only; -n = value after reset
Table 4. Registers 0x00 – 0x08 Field Descriptions
Bit
Field
Type
7-0
Reserved
R
Reset
Description
Reserved
Addresses 0x08 - 0x00 = {0x01, 0x20, 0x20, 0x20, 0x44, 0x53,
0x49, 0x38, 0x35}
8.5.1.2 CSR Bit Field Definitions – Reset and Clock Registers
8.5.1.2.1 Register 0x09
Figure 19. Register 0x09
7
6
5
4
Reserved
R
3
2
1
0
SOFT_RESET
W
LEGEND: R/W = Read/Write; R = Read only; -n = value after reset
Table 5. Register 0x09 Field Descriptions
Bit
Field
Type
7-1
Reserved
R
SOFT_RESET
W
0
Reset
Description
Reserved
0
This bit automatically clears when set to ‘1’ and returns zeros
when read. This bit must be set after the CSR’s are updated.
This bit must also be set after making any changes to the DIS
clock rate or after changing between DSI burst and non-burst
modes.
0 – No action (default)
1 – Reset device to default condition excluding the CSR bits.
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8.5.1.2.2 Register 0x0A
Figure 20. Register 0x0A
7
PLL_EN_STAT
R
6
5
Reserved
R
4
3
2
LVDS_CLK_RANGE
R/W
1
0
HS_CLK_SRC
R/W
LEGEND: R/W = Read/Write; R = Read only; -n = value after reset
Table 6. Register 0x0A Field Descriptions
Bit
Field
Type
Reset
Description
PLL_EN_STAT
R
0
0 – PLL not enabled (default)
1 – PLL enabled
Note: After PLL_EN_STAT = 1, wait at least 3ms for PLL to lock.
6-4
Reserved
R
3-1
LVDS_CLK_RANGE
R/W
101
This field selects the frequency range of the LVDS output clock.
000 – 25 MHz ≤ LVDS_CLK < 37.5 MHz
001 – 37.5 MHz ≤ LVDS_CLK < 62.5 MHz
010 – 62.5 MHz ≤ LVDS_CLK < 87.5 MHz
011 – 87.5 MHz ≤ LVDS_CLK < 112.5 MHz
100 – 112.5 MHz ≤ LVDS_CLK < 137.5 MHz
101 – 137.5 MHz ≤ LVDS_CLK ≤ 154 MHz (default)
110 – Reserved
111 – Reserved
HS_CLK_SRC
R/W
0
0 – LVDS pixel clock derived from input REFCLK (default)
1 – LVDS pixel clock derived from MIPI D-PHY channel A HS
continuous clock
7
0
8.5.1.2.3 Register 0x0B
Figure 21. Register 0x0B
7
6
5
DSI_CLK_DIVIDER
R/W
4
3
2
Reserved
R
1
0
REFCLK_MULTIPLIER
R/W
LEGEND: R/W = Read/Write; R = Read only; -n = value after reset
Table 7. Register 0x0B Field Descriptions
Bit
Field
Type
Reset
Description
7-3
DSI_CLK_DIVIDER
R/W
00000
When CSR 0x0A.0 = ‘1’, this field controls the divider used to
generate the LVDS output clock from the MIPI D-PHY Channel
A HS continuous clock. When CSR 0x0A.0 = ‘0’, this field must
be programmed to 00000.
00000 – LVDS clock = source clock (default)
00001 – Divide by 2
00010 – Divide by 3
00011 – Divide by 4
•
•
•
10111 – Divide by 24
11000 – Divide by 25
11001 through 11111 – Reserved
Reserved
R
REFCLK_MULTIPLIER
R/W
00
When CSR 0x0A.0 = ‘0’, this field controls the multiplier used to
generate the LVDS output clock from the input REFCLK. When
CSR 0x0A.0 = ‘1’, this field must be programmed to 00.
00 – LVDS clock = source clock (default)
01 – Multiply by 2
10 – Multiply by 3
11 – Multiply by 4
2
1-0
24
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8.5.1.2.4 Register 0x0D
Figure 22. Register 0x0D
7
6
5
4
Reserved
R
3
2
1
0
PLL_EN
R/W
LEGEND: R/W = Read/Write; R = Read only; -n = value after reset
Table 8. Register 0x0D Field Descriptions
Bit
Field
Type
7-1
Reserved
R
0
PLL_EN
R/W
Reset
Description
Reserved
0
When this bit is set, the PLL is enabled with the settings
programmed into CSR 0x0A and CSR 0x0B. The PLL should be
disabled before changing any of the settings in CSR 0x0A and
CSR 0x0B. The input clock source must be active and stable
before the PLL is enabled.
0 – PLL disabled (default)
1 – PLL enabled
8.5.1.3 CSR Bit Field Definitions – DSI Registers
8.5.1.3.1 Register 0x10
Figure 23. Register 0x10
7
6
Reserved
5
4
3
CHA_DSI_LANES
R
2
R/W
1
Reserved
0
SOT_ERR_TO
L_DIS
R
LEGEND: R/W = Read/Write; R = Read only; -n = value after reset
Table 9. Register 0x10 Field Descriptions
Bit
Field
Type
7-5
Reserved
R
4-3
CHA_DSI_LANES
R/W
2-1
Reserved
R
SOT_ERR_TOL_DIS
R/W
0
Reset
Description
Reserved
11
This field controls the number of lanes that are enabled for DSI
Channel A.
00 – Four lanes are enabled
01 – Three lanes are enabled
10 – Two lanes are enabled
11 – One lane is enabled (default)
Note: Unused DSI input pins on the SN65DSI83-Q1 should be
left unconnected.
Reserved
0
0 – Single bit errors are tolerated for the start of transaction SoT
leader sequence (default)
1 – No SoT bit errors are tolerated
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8.5.1.3.2 Register 0x11
Figure 24. Register 0x11
7
6
CHA_DSI_DATA_EQ
R/W
5
4
3
2
CHA_DSI_CLK_EQ
R/W
Reserved
R
1
0
Reserved
R
LEGEND: R/W = Read/Write; R = Read only; -n = value after reset
Table 10. Register 0x11 Field Descriptions
Bit
Field
Type
Reset
Description
7-6
CHA_DSI_DATA_EQ
R/W
00
This field controls the equalization for the DSI Channel A Data
Lanes
00 – No equalization (default)
01 – 1 dB equalization
10 – Reserved
11 – 2 dB equalization
5-4
Reserved
R
3-2
CHA_DSI_CLK_EQ
R/W
1-0
Reserved
R
Reserved
00
This field controls the equalization for the DSI Channel A Clock
00 – No equalization (default)
01 – 1 dB equalization
10 – Reserved
11 – 2 dB equalization
Reserved
8.5.1.3.3 Register 0x12
Figure 25. Register 0x12
7
6
5
4
3
CHA_DSI_CLK_RANGE
R/W
2
1
0
LEGEND: R/W = Read/Write; R = Read only; -n = value after reset
Table 11. Register 0x12 Field Descriptions
26
Bit
Field
Type
Reset
Description
7-0
CHA_DSI_CLK_RANGE
R/W
0
This field specifies the DSI Clock frequency range in 5 MHz
increments for the DSI Channel A Clock
0x00 through 0x07 – Reserved
0x08 – 40 ≤ frequency < 45 MHz
0x09 – 45 ≤ frequency < 50 MHz
...
0x63 – 495 ≤ frequency < 500 MHz
0x64 – 500 MHz
0x65 through 0xFF – Reserved
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8.5.1.4 CSR Bit Field Definitions – LVDS Registers
8.5.1.4.1 Register 0x18
Figure 26. Register 0x18
7
DE_NEG_POL
ARITY
R/W
6
HS_NEG_POL
ARITY
R/W
5
VS_NEG_POL
ARITY
R/W
4
Reserved
R
3
CHA_24BPP_
MODE
R/W
2
Reserved
R
1
CHA_24BPP_F
ORMAT1
R/W
0
Reserved
R
LEGEND: R/W = Read/Write; R = Read only; -n = value after reset
Table 12. Register 0x18 Field Descriptions
Bit
Field
Type
Reset
Description
7
DE_NEG_POLARITY
R/W
0
0 – DE is positive polarity driven ‘1’ during active pixel
transmission on LVDS (default)
1 – DE is negative polarity driven ‘0’ during active pixel
transmission on LVDS
6
HS_NEG_POLARITY
R/W
1
0 – HS is positive polarity driven ‘1’ during corresponding sync
conditions
1 – HS is negative polarity driven ‘0’ during corresponding sync
(default)
5
VS_NEG_POLARITY
R/W
1
0 – VS is positive polarity driven ‘1’ during corresponding sync
conditions
1 – VS is negative polarity driven ‘0’ during corresponding sync
(default)
4
Reserved
R
3
CHA_24BPP_MODE
R/W
2
Reserved
R
1
CHA_24BPP_FORMAT1
R/W
0
Reserved
R
Reserved. Do not write to this filed. Must remain at default.
0
0 – Force 18bpp; LVDS channel A lane 4 (A_Y3P/N) is disabled
(default)
1 – Force 24bpp; LVDS channel A lane 4 (B_Y3P/N) is enabled
Reserved. Do not write to this filed. Must remain at default.
0
This field selects the 24bpp data format
0 – LVDS channel A lane A_Y3P/N transmits the 2 most
significant bits (MSB) per color; Format 2 (default)
1 – LVDS channel B lane A_Y3P/N transmits the 2 least
significant bits (LSB) per color; Format 1
Note1: This field must be ‘0’ when 18bpp data is received from
DSI.
Note2: If this field is set to ‘1’ and CHA_24BPP_MODE is ‘0’, the
SN65DSI83-Q1 will convert 24bpp data to 18bpp data for
transmission to an 18bpp panel. In this configuration, the
SN65DSI83-Q1 will not transmit the 2 LSB per color on LVDS
channel A, because LVDS channel A lane A_Y3P/N is disabled.
Reserved. Do not write to this filed. Must remain at default.
8.5.1.4.2 Register 0x19
Figure 27. Register 0x19
7
Reserved
R
6
CHA_LVDS_V
OCM
R/W
5
Reserved
4
3
2
CHA_LVDS_VOD_SWING
R
R/W
1
0
Reserved
R
LEGEND: R/W = Read/Write; R = Read only; -n = value after reset
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Table 13. Register 0x19 Field Descriptions
Bit
Field
Type
7
Reserved
R
6
CHA_LVDS_VOCM
R/W
5-4
Reserved
R
3-2
CHA_LVDS_VOD_SWING
R/W
1-0
Reserved
R
Reset
Description
Reserved. Do not write to this filed. Must remain at default.
0
This field controls the common mode output voltage for LVDS
Channel A
0 – 1.2V (default)
1 – 0.9V (CSR 0x1B.5:4 CHA_LVDS_CM_ADJUST must be set
to ‘01b’)
Reserved. Do not write to this filed. Must remain at default.
01
This field controls the differential output voltage for LVDS
Channel A. See the Electrical Characteristics table for |VOD| for
each setting:
00, 01 (default), 10, 11.
Reserved. Do not write to this filed. Must remain at default.
8.5.1.4.3 Register 0x1A
Figure 28. Register 0x1A
7
6
Reserved
R
5
CHA_REVERS
E_LVDS
R/W
4
3
Reserved
2
R
1
CHA_LVDS_TE
RM
R/W
0
Reserved
R
LEGEND: R/W = Read/Write; R = Read only; -n = value after reset
Table 14. Register 0x1A Field Descriptions
Bit
Field
Type
7-6
Reserved
R
CHA_REVERSE_LVDS
R/W
5
Reset
Description
Reserved. Do not write to this filed. Must remain at default.
0
This bit controls the order of the LVDS pins for Channel A.
0 – Normal LVDS Channel A pin order. LVDS Channel A pin
order is the same as listed in the Terminal Assignments Section.
(default)
1 – Reversed LVDS Channel A pin order. LVDS Channel A pin
order is remapped as follows:
•
•
•
•
•
•
•
•
•
•
4-2
28
Reserved
R
1
CHA_LVDS_TERM
R/W
0
Reserved
R
A_Y0P → A_Y3P
A_Y0N → A_Y3N
A_Y1P → A_CLKP
A_Y1N → A_CLKN
A_Y2P → A_Y2P
A_Y2N → A_Y2N
A_CLKP → A_Y1P
A_CLKN → A_Y1N
A_Y3P → A_Y0P
A_Y3N → A_Y0N
Reserved. Do not write to this filed. Must remain at default.
1
This bit controls the near end differential termination for LVDS
Channel A. This bit also affects the output voltage for LVDS
Channel A.
0 – 100Ω differential termination
1 – 200Ω differential termination (default)
Reserved. Do not write to this filed. Must remain at default.
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8.5.1.4.4 Register 0x1B
Figure 29. Register 0x1B
7
6
Reserved
R
5
4
CHA_LVDS_CM_ADJUST
R/W
3
2
1
0
Reserved
R
LEGEND: R/W = Read/Write; R = Read only; -n = value after reset
Table 15. Register 0x1B Field Descriptions
Bit
Field
Type
7-6
Reserved
R
5-4
CHA_LVDS_CM_ADJUST
R/W
3-0
Reserved
R
Reset
Description
Reserved
00
This field can be used to adjust the common mode output
voltage for LVDS Channel A.
00 – No change to common mode voltage (default)
01 – Adjust common mode voltage down 3%
10 – Adjust common mode voltage up 3%
11 – Adjust common mode voltage up 6%
Reserved
Note for all video registers:
1. TEST PATTERN GENERATION PURPOSE ONLY registers are for test pattern generation use only. Others
are for normal operation unless the test pattern generation feature is enabled.
8.5.1.5 CSR Bit Field Definitions – Video Registers
8.5.1.5.1 Register 0x20
Figure 30. Register 0x20
7
6
5
4
3
CHA_ACTIVE_LINE_LENGTH_LOW
R/W
2
1
0
LEGEND: R/W = Read/Write; R = Read only; -n = value after reset
Table 16. Register 0x20 Field Descriptions
Bit
Field
Type
Reset
Description
7-0
CHA_ACTIVE_LINE_LENGTH_LO
W
R/W
0
This field controls the length in pixels of the active horizontal line
line that are received on DSI Channel A and output to LVDS
Channel A in single LVDS Channel mode(CSR 0x18.4=1),
Channel A and B in dual LVDS Channel mode(CSR 0x18.4=0).
The value in this field is the lower 8 bits of the 12-bit value for
the horizontal line length.
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8.5.1.5.2 Register 0x21
Figure 31. Register 0x21
7
6
5
4
3
Reserved
R
2
1
CHA_ACTIVE_LINE_LENGTH_HIGH
R/W
0
LEGEND: R/W = Read/Write; R = Read only; -n = value after reset
Table 17. Register 0x21 Field Descriptions
Bit
Field
Type
7-4
Reserved
R
3-0
CHA_ACTIVE_LINE_LENGTH_HIG
H
R/W
Reset
Description
Reserved
0
This field controls the length in pixels of the active horizontal line
that are received on DSI Channel A and output to LVDS
Channel A in single LVDS Channel mode(CSR 0x18.4=1),
Channel A and B in dual LVDS Channel mode(CSR 0x18.4=0).
The value in this field is the upper 4 bits of the 12-bit value for
the horizontal line length.
8.5.1.5.3 Register 0x24
Figure 32. Register 0x24
7
6
5
4
3
CHA_VERTICAL_DISPLAY_SIZE_LOW
R/W
2
1
0
LEGEND: R/W = Read/Write; R = Read only; -n = value after reset
Table 18. Register 0x24 Field Descriptions
Bit
Field
7-0
CHA_VERTICAL_DISPLAY_SIZE_L R/W
OW
Type
Reset
Description
0
TEST PATTERN GENERATION PURPOSE ONLY. This field
controls the vertical display size in lines for LVDS Channel A in
single LVDS Channel mode(CSR 0x18.4=1), Channel A and B in
dual LVDS Channel mode(CSR 0x18.4=0. The value in this field
is the lower 8 bits of the 12-bit value for the vertical display size.
8.5.1.5.4 Register 0x25
Figure 33. Register 0x25
7
6
5
4
3
Reserved
R
2
1
CHA_VERTICAL_DISPLAY_SIZE_HIGH
R/W
0
LEGEND: R/W = Read/Write; R = Read only; -n = value after reset
Table 19. Register 0x25 Field Descriptions
Bit
Field
Type
7-4
Reserved
R
3-0
CHA_VERTICAL_DISPLAY_SIZE_
HIGH
R/W
Reset
Description
Reserved
0
TEST PATTERN GENERATION PURPOSE ONLY. This field
controls the vertical display size in lines for LVDS Channel A in
single LVDS Channel mode(CSR 0x18.4=1), Channel A and B in
dual LVDS Channel mode(CSR 0x18.4=0). The value in this
field is the upper 4 bits of the 12-bit value for the vertical display
size
8.5.1.5.5 Register 0x28
30
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Figure 34. Register 0x28
7
6
5
4
3
CHA_SYNC_DELAY_LOW
R/W
2
1
0
LEGEND: R/W = Read/Write; R = Read only; -n = value after reset
Table 20. Register 0x28 Field Descriptions
Bit
Field
Type
Reset
Description
7-0
CHA_SYNC_DELAY_LOW
R/W
0
This field controls the delay in pixel clocks from when an HSync
or VSync is received on the DSI to when it is transmitted on the
LVDS interface for Channel A in single LVDS Channel
mode(CSR 0x18.4=1), Channel A and B in dual LVDS Channel
mode(CSR 0x18.4=0). The delay specified by this field is in
addition to the pipeline and synchronization delays in the
SN65DSI83-Q1. The additional delay is approximately 10 pixel
clocks. The Sync delay must be programmed to at least 32 pixel
clocks to ensure proper operation. The value in this field is the
lower 8 bits of the 12-bit value for the Sync delay.
8.5.1.5.6 Register 0x29
Figure 35. Register 0x29
7
6
5
4
3
Reserved
R
2
1
CHA_SYNC_DELAY_HIGH
R/W
0
LEGEND: R/W = Read/Write; R = Read only; -n = value after reset
Table 21. Register 0x29 Field Descriptions
Bit
Field
Type
7-4
Reserved
R
3-0
CHA_SYNC_DELAY_HIGH
R/W
Reset
Description
Reserved
0
This field controls the delay in pixel clocks from when an HSync
or VSync is received on the DSI to when it is transmitted on the
LVDS interface for Channel A in single LVDS Channel
mode(CSR 0x18.4=1), Channel A and B in dual LVDS Channel
mode(CSR 0x18.4=0). The delay specified by this field is in
addition to the pipeline and synchronization delays in the
SN65DSI83-Q1. The additional delay is approximately 10 pixel
clocks. The Sync delay must be programmed to at least 32 pixel
clocks to ensure proper operation. The value in this field is the
upper 4 bits of the 12-bit value for the Sync delay.
8.5.1.5.7 Register 0x2C
Figure 36. Register 0x2C
7
6
5
4
3
CHA_HSYNC_PULSE_WIDTH_LOW
R/W
2
1
0
LEGEND: R/W = Read/Write; R = Read only; -n = value after reset
Table 22. Register 0x2C Field Descriptions
Bit
Field
Type
Reset
Description
7-0
CHA_HSYNC_PULSE_WIDTH_LO
W
R/W
0
This field controls the width in pixel clocks of the HSync Pulse
Width for LVDS Channel A in single LVDS Channel mode(CSR
0x18.4=1), Channel A and B in dual LVDS Channel mode(CSR
0x18.4=0). The value in this field is the lower 8 bits of the 10-bit
value for the HSync Pulse Width.
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8.5.1.5.8 Register 0x2D
Figure 37. Register 0x2D
7
6
5
4
3
2
Reserved
R
1
0
CHA_HSYNC_PULSE_WIDTH_
HIGH
R/W
LEGEND: R/W = Read/Write; R = Read only; -n = value after reset
Table 23. Register 0x2D Field Descriptions
Bit
Field
Type
7-2
Reserved
R
1-0
CHA_HSYNC_PULSE_WIDTH_HIG R/W
H
Reset
Description
Reserved
0
This field controls the width in pixel clocks of the HSync Pulse
Width for LVDS Channel A in single LVDS Channel mode(CSR
0x18.4=1), Channel A and B in dual LVDS Channel mode(CSR
0x18.4=0). The value in this field is the upper 2 bits of the 10-bit
value for the HSync Pulse Width.
8.5.1.5.9 Register 0x30
Figure 38. Register 0x30
7
6
5
4
3
CHA_VSYNC_PULSE_WIDTH_LOW
R/W
2
1
0
LEGEND: R/W = Read/Write; R = Read only; -n = value after reset
Table 24. Register 0x30 Field Descriptions
Bit
Field
Type
Reset
Description
7-0
CHA_VSYNC_PULSE_WIDTH_LO
W
R/W
0
This field controls the length in lines of the VSync Pulse Width
for LVDS Channel A in single LVDS Channel mode(CSR
0x18.4=1), Channel A and B in dual LVDS Channel mode(CSR
0x18.4=0). The value in this field is the lower 8 bits of the 10-bit
value for the VSync Pulse Width.
8.5.1.5.10 Register 0x31
Figure 39. Register 0x31
7
6
5
4
3
2
Reserved
R
1
0
CHA_VSYNC_PULSE_WIDTH_
HIGH
R/W
LEGEND: R/W = Read/Write; R = Read only; -n = value after reset
Table 25. Register 0x31 Field Descriptions
Bit
Field
Type
7-2
Reserved
R
1-0
CHA_VSYNC_PULSE_WIDTH_HIG R/W
H
Reset
Description
Reserved
0
This field controls the length in lines of the VSync Pulse Width
for LVDS Channel A in single LVDS Channel mode(CSR
0x18.4=1), Channel A and B in dual LVDS Channel mode(CSR
0x18.4=0). The value in this field is the upper 2 bits of the 10-bit
value for the VSync Pulse Width.
8.5.1.5.11 Register 0x34
32
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Figure 40. Register 0x34
7
6
5
4
3
CHA_HORIZONTAL_BACK_PORCH
R/W
2
1
0
LEGEND: R/W = Read/Write; R = Read only; -n = value after reset
Table 26. Register 0x34 Field Descriptions
Bit
Field
Type
Reset
Description
7-0
CHA_HORIZONTAL_BACK_PORC
H
R/W
0
This field controls the time in pixel clocks between the end of the
HSync Pulse and the start of the active video data for LVDS
Channel A in single LVDS Channel mode(CSR 0x18.4=1),
Channel A and B in dual LVDS Channel mode(CSR 0x18.4=0).
8.5.1.5.12 Register 0x36
Figure 41. Register 0x36
7
6
5
4
3
CHA_VERTICAL_BACK_PORCH
R/W
2
1
0
LEGEND: R/W = Read/Write; R = Read only; -n = value after reset
Table 27. Register 0x36 Field Descriptions
Bit
Field
Type
Reset
Description
7-0
CHA_VERTICAL_BACK_PORCH
R/W
0
TEST PATTERN GENERATION PURPOSE ONLY. This field
controls the number of lines between the end of the VSync
Pulse and the start of the active video data for LVDS Channel A
in single LVDS Channel mode(CSR 0x18.4=1), Channel A and B
in dual LVDS Channel mode(CSR 0x18.4=0).
8.5.1.5.13 Register 0x38
Figure 42. Register 0x38
7
6
5
4
3
CHA_HORIZONTAL_FRONT_PORCH
R/W
2
1
0
LEGEND: R/W = Read/Write; R = Read only; -n = value after reset
Table 28. Register 0x38 Field Descriptions
Bit
Field
Type
Reset
Description
7-0
CHA_HORIZONTAL_FRONT_POR
CH
R/W
0
TEST PATTERN GENERATION PURPOSE ONLY. This field
controls the time in pixel clocks between the end of the active
video data and the start of the HSync Pulse for LVDS Channel A
in single LVDS Channel mode(CSR 0x18.4=1), Channel A and B
in dual LVDS Channel mode(CSR 0x18.4=0).
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8.5.1.5.14 Register 0x3A
Figure 43. Register 0x3A
7
6
5
4
3
CHA_VERTICAL_FRONT_PORCH
R/W
2
1
0
LEGEND: R/W = Read/Write; R = Read only; -n = value after reset
Table 29. Register 0x3A Field Descriptions
Bit
Field
Type
Reset
Description
7-0
CHA_VERTICAL_FRONT_PORCH
R/W
0
TEST PATTERN GENERATION PURPOSE ONLY. This field
controls the number of lines between the end of the active video
data and the start of the VSync Pulse for LVDS Channel A in
single LVDS Channel mode(CSR 0x18.4=1), Channel A and B in
dual LVDS Channel mode(CSR 0x18.4=0).
8.5.1.5.15 Register 0x3C
Figure 44. Register 0x3C
7
6
Reserved
5
4
CHA_TEST_PA
TTERN
R/W
R
3
2
1
0
Reserved
R
LEGEND: R/W = Read/Write; R = Read only; -n = value after reset
Table 30. Register 0x3C Field Descriptions
Bit
Field
Type
7-5
Reserved
R
CHA_TEST_PATTERN
R/W
Reserved
R
4
3-0
Reset
Description
Reserved
0
TEST PATTERN GENERATION PURPOSE ONLY. When this
bit is set, the SN65DSI83-Q1 will generate a video test pattern
based on the values programmed into the Video Registers for
LDS Channel A in single LVDS Channel mode(CSR 0x18.4=1),
Channel A and B in dual LVDS Channel mode(CSR 0x18.4=0).
Reserved
8.5.1.6 CSR Bit Field Definitions – IRQ Registers
8.5.1.6.1 Register 0xE0
Figure 45. Register 0xE0
7
6
5
4
Reserved
R
3
2
1
0
IRQ_EN
R/W
LEGEND: R/W = Read/Write; R = Read only; -n = value after reset
Table 31. Register 0xE0 Field Descriptions
34
Bit
Field
Type
7-1
Reserved
R
0
IRQ_EN
R/W
Reset
Description
Reserved
0
When enabled by this field, the IRQ output is driven high to
communicate IRQ events.
0 – IRQ output is high-impedance (default)
1 – IRQ output is driven high when a bit is set in registers 0xE5
that also has the corresponding IRQ_EN bit set to enable the
interrupt condition
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8.5.1.6.2 Register 0xE1
Figure 46. Register 0xE1
7
CHA_SYNCH_
ERR_EN
R/W
6
CHA_CRC_ER
R_EN
R/W
5
CHA_UNC_EC
C_ERR_EN
R/W
4
3
2
CHA_COR_EC CHA_LLP_ERR CHA_SOT_BIT
C_ERR_EN
_EN
_ERR_EN
R/W
R/W
R/W
1
Reserved
R
0
PLL_UNLOCK_
EN
R/W
LEGEND: R/W = Read/Write; R = Read only; -n = value after reset
Table 32. Register 0xE1 Field Descriptions
Bit
Field
Type
Reset
Description
7
CHA_SYNCH_ERR_EN
R/W
0
0 – CHA_SYNCH_ERR is masked
1 – CHA_SYNCH_ERR is enabled to generate IRQ events
6
CHA_CRC_ERR_EN
R/W
0
0 – CHA_CRC_ERR is masked
1 – CHA_CRC_ERR is enabled to generate IRQ events
5
CHA_UNC_ECC_ERR_EN
R/W
0
0 – CHA_UNC_ECC_ERR is masked
1 – CHA_UNC_ECC_ERR is enabled to generate IRQ events
4
CHA_COR_ECC_ERR_EN
R/W
0
0 – CHA_COR_ECC_ERR is masked
1 – CHA_COR_ECC_ERR is enabled to generate IRQ events
3
CHA_LLP_ERR_EN
R/W
0
0 – CHA_LLP_ERR is masked
1 – CHA_ LLP_ERR is enabled to generate IRQ events
2
CHA_SOT_BIT_ERR_EN
R/W
0
0 – CHA_SOT_BIT_ERR is masked
1 – CHA_SOT_BIT_ERR is enabled to generate IRQ events
1
Reserved
R
0
PLL_UNLOCK_EN
R/W
Reserved
0
0 – PLL_UNLOCK is masked
1 – PLL_UNLOCK is enabled to generate IRQ events
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8.5.1.6.3 Register 0xE5
Figure 47. Register 0xE5
7
CHA_SYNCH_
ERR
R/W
6
CHA_CRC_ER
R
R/W
5
CHA_UNC_EC
C_ERR
R/W
4
3
2
CHA_COR_EC CHA_LLP_ERR CHA_SOT_BIT
C_ERR
_ERR
R/W
R/W
R/W
1
Reserved
0
PLL_UNLOCK
R
R/W
LEGEND: R/W = Read/Write; R = Read only; -n = value after reset
Table 33. Register 0xE5 Field Descriptions
Bit
36
Field
Type
Reset
Description
7
CHA_SYNCH_ERR
R/W
0
When the DSI channel A packet processor detects an HS or VS
synchronization error, that is, an unexpected sync packet; this
bit is set; this bit is cleared by writing a ‘1’ value.
6
CHA_CRC_ERR
R/W
0
When the DSI channel A packet processor detects a data
stream CRC error, this bit is set; this bit is cleared by writing a
‘1’ value.
5
CHA_UNC_ECC_ERR
R/W
0
When the DSI channel A packet processor detects an
uncorrectable ECC error, this bit is set; this bit is cleared by
writing a ‘1’ value.
4
CHA_COR_ECC_ERR
R/W
0
When the DSI channel A packet processor detects a correctable
ECC error, this bit is set; this bit is cleared by writing a ‘1’ value.
3
CHA_LLP_ERR
R/W
0
When the DSI channel A packet processor detects a low level
protocol error, this bit is set; this bit is cleared by writing a ‘1’
value.
Low level protocol errors include SoT and EoT sync errors,
Escape Mode entry command errors, LP transmission sync
errors, and false control errors. Lane merge errors are reported
by this status condition.
2
CHA_SOT_BIT_ERR
R/W
0
When the DSI channel A packet processor detects an SoT
leader sequence bit error, this bit is set; this bit is cleared by
writing a ‘1’ value.
1
Reserved
R
0
PLL_UNLOCK
R/W
Reserved
1
This bit is set whenever the PLL Lock status transitions from
LOCK to UNLOCK.
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9 Application and Implementation
NOTE
Information in the following applications sections is not part of the TI component
specification, and TI does not warrant its accuracy or completeness. TI’s customers are
responsible for determining suitability of components for their purposes. Customers should
validate and test their design implementation to confirm system functionality.
9.1 Application Information
The SN65DSI83-Q1 device is primarily targeted for portable applications such as tablets and smart phones that
utilize the MIPI DSI video format. The SN65DSI83-Q1 device can be used between a GPU with DSI output and a
video panel with LVDS inputs.
9.1.1 Video STOP and Restart Sequence
When the system requires to stop outputting video to the display, TI recommends to use the following sequence
for the SN65DSI83-Q1 device:
1. Clear the PLL_EN bit to 0 (CSR 0×0D.0).
2. Stop video streaming on DSI inputs.
3. Drive all DSI data lanes to LP11, but keep the DSI CLK lanes in HS.
When the system is ready to restart the video streaming.
1. Start video streaming on DSI inputs.
2. Set the PLL_EN bit to 1 (CSR 0×0D.0).
3. Wait for minimum of 3 ms.
4. Set the SOFT_RESET bit (0×09.0).
9.1.2 Reverse LVDS Pin Order Option
For ease of PCB routing, the SN65DSI83-Q1 device supports reversing the pin order via configuration register
programming. The order of the LVDS pin for LVDS channel A can be reversed by setting the address 0×1A bit 5
CHA_REVERSE_LVDS. See the corresponding register bit definition for details.
9.1.3 IRQ Usage
The SN65DSI83-Q1 device provides an IRQ pin that can be used to indicate when certain errors occur on DSI.
The IRQ output is enabled through the IRQ_EN bit (CSR 0×E0.0). The IRQ pin is asserted when an error occurs
on DSI, the corresponding error enable bit is set, and the IRQ_EN bit is set. An error is cleared by writing a 1 to
the corresponding error status bit.
NOTE
If the SOFT_RESET bit is set while the DSI video stream is active, some of the error
status bits may be set.
NOTE
If the DSI video stream is stopped, some of the error status bits may be set. These error
status bits must be cleared before restarting the video stream.
NOTE
If the DSI video stream starts before the device is configured, some of the error status bits
may be set. TI recommends to start streaming after the device is correctly configured as
recommended in the initialization sequence in the Initialization Sequence section.
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9.2 Typical Application
Figure 48 shows a typical application using the SN65DSI83-Q1 device for a single channel DSI receiver to
interface a single-channel DSI application processor to an LVDS single-link 18 bit-per-pixel panel supporting
1280 × 800 WXGA resolutions at 60 frames per second.
SN65DSI83-Q1 A_Y0N
DA1P
DA1N
DA2P
DA2N
DA3P
DA3N
100Ω
A_Y1N
A_Y1P
100Ω
To column driver
A_Y2N
A_Y2P
100Ω
To row driver
A_CLKN
A_CLKP
100Ω
18bpp TCON
DA0P
DA0N
Application
Processor
A_Y0P
A_Y3N
A_Y3P
DACP
DACN
SCL
SDA
IRQ
EN
ADDR
REFCLK
GND
1.8V
VCC
C1
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Figure 48. Typical WXGA 18-bpp Panel Application
9.2.1 Design Requirements
Table 34 shows the SN65DSI83-Q1 desgin parameters.
Table 34. Design Parameters
DESIGN PARAMETERS
EXAMPLE VALUE
VCC
1.8 V (±5%)
Clock source (REFCLK or DSIA_CLK)
DSIA_CLK
REFCKL frequency
N/A
DSIA clock frequency
500 MHz
PANEL INFORMATION
Pixel clock (MHz)
38
83 MHz
Horizontal active (pixels)
1280
Horizontal blanking (pixels)
384
Vertical active (lines)
800
Vertical blanking (lines)
30
Horizontal sync offset (pixels)
64
Horizontal sync pulse width (pixels)
128
Vertical sync offset (lines)
3
Vertical sync pulse width (lines)
7
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Table 34. Design Parameters (continued)
DESIGN PARAMETERS
EXAMPLE VALUE
PANEL INFORMATION (continued)
Horizontal sync pulse polarity
Negative
Vertical sync pulse polarity
Negative
Color bit depth (6 bpc or 8 bpc)
6-bit
Number of LVDS lanes
1 × [3 Data Lanes + 1 Clock Lane]
DSI INFORMATION
Number of DSI lanes
1 × [4 Data Lanes + 1 Clock Lane]
DSI clock frequency(MHz)
500 MHz
Dual DSI configuration(odd/even or left/right)
N/A
9.2.2 Detailed Design Procedure
The video resolution parameters required by the panel need to be programmed into the SN65DSI83-Q1 device.
For this example, the parameters programmed are the following:
Horizontal Active = 1280 or 0×500
CHA_ACTIVE_LINE_LENGTH_LOW = 0×00
CHA_ACTIVE_LINE_LENGTH_HIGH = 0×05
Vertical Active = 800 or 0×320
CHA_VERTICAL_DISPLAY_SIZE_LOW = 0×20
CHA_VERTICAL_DISPLAY_SIZE_HIGH = 0×03
Horizontal Pulse Width = 128 or 0×80
CHA_HSYNC_PULSE_WIDTH_LOW = 0×80
CHA_HSYNC_PULSE_WIDTH_HIGH = 0×00
Vertical Pulse Width = 7
CHA_VSYNC_PULSE_WIDTH_LOW = 0×07
CHA_VSYNC_PULSE_WIDTH_HIGH = 0×00
Horizontal Backporch = HorizontalBlanking – (HorizontalSyncOffset + HorizontalSyncPulseWidth)
Horizontal Backporch = 384 – (64 + 128)
Horizontal Backporch = 192 or 0×C0
CHA_HORIZONTAL_BACK_PORCH = 0×C0
Vertical Backporch = VerticalBlanking – (VerticalSyncOffset +VerticalSyncPulseWidth)
Vertical Backporch = 30 – (3 + 7)
Vertical Backporch = 20 or 0×14
CHA_VERTICAL_BACK_PORCH = 0×14
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Horizontal Frontporch = HorizontalSyncOffset
Horizontal Frontporch = 64 or 0×40
CHA_HORIZONTAL_FRONT_PORCH = 0×40
Vertical Frontporch = VerticalSyncOffset
Vertical Frontporch = 3
CHA_VERTICAL_FRONT_PORCH = 0×03
The pattern generation feature can be enabled by setting the CHA_TEST_PATTERN bit at address 0×3C and
configuring the TEST PATTERN GENERATION PURPOSE ONLY register as shown in Table 30.
LVDS clock is derived from the DSI channel A clock. When the MIPI D-PHY channel A HS clock is used as the
LVDS clock source, it is divided by the factor in DSI_CLK_DIVIDER (CSR 0×0B.7:3) to generate the LVDS
output clock. Additionally, LVDS_CLK_RANGE (CSR 0×0A.3:1) and CH_DSI_CLK_RANGE(CSR 0×12) must be
set to the frequency range of the LVDS output clock and DSI Channel A input clock respectively for the internal
PLL to operate correctly. After these settings are programmed, PLL_EN (CSR 0×0D.0) must be set to enable the
internal PLL.
LVDS_CLK_RANGE = 2 – 62.5 MHz ≤ LVDS_CLK < 87.5 MHz
HS_CLK_SRC = 1 – LVDS pixel clock derived from MIPI D-PHY channel A
DSI_CLK_DIVIDER = 00101 – Divide by 6
CHA_DSI_LANES = 00 – Four lanes are enabled
CHA_DSI_CLK_RANGE = 0×64 – 500 MHz
40
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9.2.2.1 Example Script
This example configures the SN65DSI83-Q1 device for the following configuration:
=====SOFTRESET=======
09 01
======PLL_EN(bit 0) - Enable LAST after addr 0A and 0B configured======
0D 00
======HS_CLK_SRC bit0===
======LVDS_CLK_Range bit 3:1======
0A 05
======DSI_CLK_DIVIDER bit7:3=====
======RefCLK multiplier(bit1:0)======
======00 - LVDSclk=source clk, 01 - x2, 10 -x3, 11 - x4======
0B 28
======DSI Ch Confg Left_Right Pixels(bit7 - 0 for A ODD, B EVEN, 1 for the other config)======
======DSI Ch Mode(bit6:5) 00 - Dual, 01 - single, 10 - two single =======
======SOT_ERR_TOL_DIS(bit0)=======
10 26
====500M====
12 64
======bit7: DE_Pol, bit6:HS_Pol, bit5:VS_Pol, bit4: LVDS Link Cfg, bit3:CHA 24bpp, bit2: CHB 24bpp,
bit1: CHA 24bpp fmt1, bit0: CHB 24bpp fmt1======
18 72
19 00
======CHA_LINE_LENGTH_LOW========
20 00
======CHA_LINE_LENGTH_HIGH========
21 05
======CHA_VERTICAL_DISPLAY_SIZE_LOW========
24 00
======CHA_VERTICAL_DISPLAY_SIZE_HIGH========
25 04
======CHA_SYNC_DELAY_LOW========
28 20
======CHA_SYNC_DELAY_HIGH========
29 01
======CHA_HSYNC_PULSE_WIDTH_LOW========
2C 80
======CHA_HSYNC_PULSE_WIDTH_HIGH========
2D 00
======CHA_VSYNC_PULSE_WIDTH_LOW========
30 07
======CHA_VSYNC_PULSE_WIDTH_HIGH========
31 00
======CHA_HOR_BACK_PORCH========
34 C0
======CHA_VER_BACK_PORCH========
36 00
======CHA_HOR_FRONT_PORCH========
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38 00
======CHA_VER_FRONT_PORCH========
3A 00
======CHA/CHB TEST PATTERN(bit4 CHA, bit0 CHB)========
3C 00
======PLL_EN(bit 0) - Enable LAST after addr 0A and 0B configured======
0D 01
======Read======
00
======Read======
00
9.2.3 Application Curve
120
ICC (mA)
115
110
105
100
95
1.6
1.65
1.7
1.75
1.8
1.85
VCC (V)
1.9
1.95
2
D001
B. SN65DSI83-Q1: SINGLE Channel DSI to SINGLE Channel DSI, 1280 × 800
a.
number of LVDS lanes = 3 data lanes + 1 CLK lane
b.
number of DSI lanes = 4 data lanes + 1 CLK lane
c.
LVDS CLK OUT = 83 M
d.
DSI CLK = 500 M
e.
RGB666, LVDS 18 bpp
Figure 49. Power Consumption
42
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10 Power Supply Recommendations
10.1 VCC Power Supply
Each VCC power supply pin must have a 100-nF capacitor to ground connected as close as possible to the
SN65DSI83-Q1 device. It is recommended to have one bulk capacitor (1 µF to 10 µF) on it. It is also
recommended to have the pins connected to a solid power plane.
10.2 VCORE Power Supply
This pin must have a 100-nF capacitor to ground connected as close as possible to the SN65DSI83-Q1 device. It
is recommended to have one bulk capacitor (1 µF to 10 µF) on it. It is also recommended to have the pins
connected to a solid power plane.
11 Layout
11.1 Layout Guidelines
11.1.1 Package Specific
For the PAP package, to minimize the power supply noise floor, provide good decoupling near the SN65DSI83Q1 device power pins. The use of four ceramic capacitors (2 × 0.1 μF and 2 × 0.01 μF) provides good
performance. At the least, TI recommends to install one 0.1-μF and one 0.01-μF capacitor near the SN65DSI83Q1 device. To avoid large current loops and trace inductance, the trace length between decoupling capacitor and
device power inputs pins must be minimized. Placing the capacitor underneath the SN65DSI83-Q1 device on the
bottom of the PCB is often a good choice.
11.1.2 Differential Pairs
• Differential pairs must be routed with controlled 100-Ω differential impedance (± 20%) or 50-Ω single-ended
impedance (±15%).
• Keep away from other high speed signals
• Keep lengths to within 5 mils of each other.
• Length matching must be near the location of mismatch.
• Each pair must be separated at least by 3 times the signal trace width.
• The use of bends in differential traces must be kept to a minimum. When bends are used, the number of left
and right bends must be as equal as possible and the angle of the bend must be ≥ 135 degrees. This
arrangement minimizes any length mismatch caused by the bends and therefore minimizes the impact that
bends have on EMI.
• Route all differential pairs on the same of layer.
• The number of vias must be kept to a minimum. It is recommended to keep the via count to 2 or less.
• Keep traces on layers adjacent to ground plane.
• Do NOT route differential pairs over any plane split.
• Adding Test points cause impedance discontinuity and therefore negatively impacts signal performance. If
test points are used, they must be placed in series and symmetrically. They must not be placed in a manner
that causes a stub on the differential pair.
11.1.3 Ground
TI recommends that only one board ground plane be used in the design. This provides the best image plane for
signal traces running above the plane. The thermal pad of the SN65DSI83-Q1 must be connected to this plane
with vias.
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SLLSEW7A – DECEMBER 2016 – REVISED JUNE 2018
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IRQ
VCC
1.8V
A_Y3N
A_Y3P
A_CLKN
A_CLKP
VCC
1.8V
A_Y2P
A_Y2N
VCC
1.8V
A_Y1N
A_Y1P
A_Y0N
VCC 1.8V
NC pin must not be connected to any signal,
power or ground
A_Y0P
11.2 Layout Example
Place Vcc decoupling caps as close to
Vcc as possible
VCC
1.8V
VCC 1.8V
1uF
DA3N
DA3P
GND
DA2N
DA2P
VCC
1.8V
GND
DACN
GND
DACP
GND
VCC 1.8V
DA1N
DA1P
DA0N
DA0P
VCC 1.8V
VCC 1.8V
VCC 1.8V
4.7NŸ
10NŸ
GND
1
4.7NŸ
VCC 1.8V
4.7NŸ
VCC 1.8V
SCL
EN
Differential pairs must be routed with controlled
100- differential impedance
VCC 1.8V
VCC 1.8V
SDA
Copyright © 2016, Texas Instruments Incorporated
Figure 50. SN65DSI83-Q1 Layout Example
44
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SN65DSI83-Q1
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SLLSEW7A – DECEMBER 2016 – REVISED JUNE 2018
12 Device and Documentation Support
12.1 Documentation Support
12.1.1 Related Documentation
For related documentation see the following:
• SN65DSI8x Video Configuration Guide and Configuration Tool Software Users Manual
• SN65DSI83, SN65DSI84, and SN65DSI85 Hardware Implementation Guide
12.2 Receiving Notification of Documentation Updates
To receive notification of documentation updates, navigate to the device product folder on ti.com. In the upper
right corner, click on Alert me to register and receive a weekly digest of any product information that has
changed. For change details, review the revision history included in any revised document.
12.3 Community Resource
The following links connect to TI community resources. Linked contents are provided "AS IS" by the respective
contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of
Use.
TI E2E™ Online Community TI's Engineer-to-Engineer (E2E) Community. Created to foster collaboration
among engineers. At e2e.ti.com, you can ask questions, share knowledge, explore ideas and help
solve problems with fellow engineers.
Design Support TI's Design Support Quickly find helpful E2E forums along with design support tools and
contact information for technical support.
12.4 Trademarks
PowerPAD, E2E are trademarks of Texas Instruments.
MIPI is a registered trademark of Arasan Chip Systems, Inc.
All other trademarks are the property of their respective owners.
12.5 Electrostatic Discharge Caution
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
12.6 Glossary
SLYZ022 — TI Glossary.
This glossary lists and explains terms, acronyms, and definitions.
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13 Mechanical, Packaging, and Orderable Information
The following pages include mechanical, packaging, and orderable information. This information is the most
current data available for the designated devices. This data is subject to change without notice and revision of
this document. For browser-based versions of this data sheet, refer to the left-hand navigation.
46
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PACKAGE OPTION ADDENDUM
www.ti.com
10-Dec-2020
PACKAGING INFORMATION
Orderable Device
Status
(1)
Package Type Package Pins Package
Drawing
Qty
Eco Plan
(2)
Lead finish/
Ball material
MSL Peak Temp
Op Temp (°C)
Device Marking
(3)
(4/5)
(6)
SN65DSI83TPAPRQ1
ACTIVE
HTQFP
PAP
64
1000
RoHS & Green
NIPDAU
Level-3-260C-168 HR
-40 to 105
DSI83TQ1
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance
do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may
reference these types of products as "Pb-Free".
RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.
Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of