SN74HC148DWRE4

SN54HC148, SN74HC148 SCLS109H – APRIL 2004 – REVISED MARCH 2022 SNx4HC148 8-Line to 3-Line Priority Encoders 1 Features 3 Description • • • • • • • The SNx4HC148 is an 8-input priority encoder. Added input enable (EI) and output enable (EO) signals allow for cascading multiple stages without added external circuitry. Wide operating voltage range of 2V to 6V Outputs can drive up to 10 LSTTL loads Low power consumption, 80-μA max ICC Typical tpd = 16ns ±4-mA output drive at 5V Low input current of 1μA max Encode eight data lines to 3-line binary (Octal) 2 Applications • • N-Bit encoding Code converters and generators (1) Device Information PART NUMBER PACKAGE BODY SIZE (NOM) SN74HC148D SOIC (16) 9.90 mm × 3.90 mm SN74HC148N PDIP (16) 19.31 mm × 6.35 mm SN74HC148NS SO (16) 10.20 mm × 5.30 mm SN54HC148J CDIP (16) 21.34 mm × 6.92 mm SNJ54HC148FK LCCC (20) 8.89 mm × 8.45 mm (1) For all available packages, see the orderable addendum at the end of the data sheet. Functional Block Diagram An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications, intellectual property matters and other important disclaimers. PRODUCTION DATA. SN54HC148, SN74HC148 www.ti.com SCLS109H – APRIL 2004 – REVISED MARCH 2022 Table of Contents 1 Features............................................................................1 2 Applications..................................................................... 1 3 Description.......................................................................1 4 Revision History.............................................................. 2 5 Pin Configuration and Functions...................................3 6 Specifications.................................................................. 4 6.1 Absolute Maximum Ratings........................................ 4 (1) 6.2 Recommended Operating Conditions ..................... 4 6.3 Thermal Information....................................................4 6.4 Electrical Characteristics.............................................5 6.5 Switching Characteristics ...........................................5 6.6 Operating Characteristics........................................... 6 7 Parameter Measurement Information............................ 7 8 Detailed Description........................................................8 8.1 Overview..................................................................... 8 8.2 Functional Block Diagram........................................... 8 8.3 Device Functional Modes............................................9 9 Application Information................................................ 10 10 Power Supply Recommendations..............................11 11 Layout........................................................................... 11 11.1 Layout Guidelines....................................................11 12 Device and Documentation Support..........................12 12.1 Documentation Support.......................................... 12 12.2 Receiving Notification of Documentation Updates..12 12.3 Support Resources................................................. 12 12.4 Trademarks............................................................. 12 12.5 Electrostatic Discharge Caution..............................12 12.6 Glossary..................................................................12 13 Mechanical, Packaging, and Orderable Information.................................................................... 12 4 Revision History NOTE: Page numbers for previous revisions may differ from page numbers in the current version. Changes from Revision G (April 2004) to Revision H (March 2022) Page • Updated the numbering, formatting, tables, figures, and cross-references throughout the document to reflect modern datasheet standards.............................................................................................................................. 1 2 Submit Document Feedback Copyright © 2022 Texas Instruments Incorporated Product Folder Links: SN54HC148 SN74HC148 SN54HC148, SN74HC148 www.ti.com SCLS109H – APRIL 2004 – REVISED MARCH 2022 5 Pin Configuration and Functions J, D, N or NS Package 16-Pin CDIP, SOIC, PDIP, SO Top View FK Package 20-Pin LCCC Top View Submit Document Feedback Copyright © 2022 Texas Instruments Incorporated Product Folder Links: SN54HC148 SN74HC148 3 SN54HC148, SN74HC148 www.ti.com SCLS109H – APRIL 2004 – REVISED MARCH 2022 6 Specifications 6.1 Absolute Maximum Ratings over operating free-air temperature range (unless otherwise noted) VCC (1) Supply voltage range MIN MAX -0.5 7 )(2) UNIT V IIK Input clamp current (VI < 0 or VI > VCC ±20 mA IOK Output clamp current (VO < 0 or VO > VCC)(2) ±20 mA IO Continuous output current (VO = 0 to VCC) ±25 mA VCC or GND Continuous current through ±50 mA TJ Junction temperature 150 °C Tstg Storage temperature 150 °C (1) (2) -65 Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings only and functional operation of the device at these or any other conditions beyond those indicated under recommended operating conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. The input and output voltage ratings may be exceeded if the input and output current ratings are observed. (1) 6.2 Recommended Operating Conditions SN54HC148 VCC MIN NOM 2 5 Supply voltage VCC = 2V VIH High-level input voltage VCC = 4.5V SN74HC148 6 VI Input voltage VO Output voltage TA (1) 5 6 3.15 4.2 4.2 VCC = 4.5V 0 0.5 0.5 1.35 0 VCC 0 V VCC V VCC = 4.5V 500 500 VCC = 6V 400 400 125 V VCC 1000 -55 V 1.8 VCC 1000 Operating free-air temperature UNIT V 1.35 1.8 0 VCC = 2V Input transition rise/fall time 2 3.15 VCC = 6V Δt/ΔVCC MAX 1.5 VCC = 2V Low-level input voltage NOM 1.5 VCC = 6V VIL MIN -40 85 ns °C All unused inputs of the device must be held at VCC or GND to ensure proper device operation. Refer to the TI application report Implications of Slow or Floating SMOS Inputs, literature number SCBA004. 6.3 Thermal Information THERMAL METRIC R θJA (1) 4 Junction-to-ambient thermal resistance(1) D (SOIC) DW (SOIC) N (PDIP) NS (SO) 16 PINS 16 PINS 16 PINS 16 PINS UNIT 73 57 67 64 °C/W For more information about traditional and new thermal metrics, see the Semiconductor and IC package thermal metrics application report. Submit Document Feedback Copyright © 2022 Texas Instruments Incorporated Product Folder Links: SN54HC148 SN74HC148 SN54HC148, SN74HC148 www.ti.com SCLS109H – APRIL 2004 – REVISED MARCH 2022 6.4 Electrical Characteristics TEST CONDITIONS(1) PARAMETER IOH = – 20 μA VOH High-level output voltage IOH = – 4 mA IOH = – 5.2 mA VOL VCC TA = 25°C SN54HC148 MAX MIN SN74HC148 MIN TYP MAX MIN 2 1.9 1.998 1.9 1.9 4.5 4.4 4.499 4.4 4.4 6 5.9 5.999 5.9 5.9 4.5 3.98 4.3 3.7 3.84 6 5.48 5.8 5.2 5.34 MAX V 2 0.002 0.1 0.1 0.1 IOL = 20 μA 4.5 0.001 0.1 0.1 0.1 6 0.001 0.1 0.1 0.1 IOL = 4 mA 4.5 0.17 0.26 0.4 0.33 Low-level output voltage UNIT V IOL = 5.2 mA 6 0.15 0.26 0.4 0.33 II Input hold current VI = VCC or 0 6 ±0.1 ±100 ±1000 ±1000 nA ICC Supply current VI = VCC or 0. IO = 0 8 160 80 μA Ci Input capacitance 3 10 10 10 pF (1) 6 2 to 6 VI = VIH or VIL, unless otherwise noted. 6.5 Switching Characteristics CL = 50pF, unless otherwise specified. See (Parameter Measurement Information) FROM (INPUT) PARAMETER 1-7 TO (OUTPUT) A0, A1, A2 EO 0-7 GS tpd Propagation Dealy A0, A1, A2 EI GS EO tt Transition time Any VCC TA = 25°C MIN SN54HC148 MIN MAX SN74HC148 TYP MAX MIN MAX 2 69 180 270 225 4.5 23 36 54 45 6 21 31 46 38 2 60 150 225 190 4.5 20 30 45 38 6 17 26 38 33 2 75 190 285 240 4.5 25 38 57 48 6 21 32 48 41 2 78 195 295 245 4.5 26 39 59 49 6 22 33 50 42 2 57 145 220 180 4.5 19 29 44 36 6 16 25 38 31 2 66 165 250 205 4.5 22 33 50 41 6 19 28 43 35 2 28 75 110 95 4.5 8 15 22 19 6 6 13 19 16 UNIT ns ns Submit Document Feedback Copyright © 2022 Texas Instruments Incorporated Product Folder Links: SN54HC148 SN74HC148 5 SN54HC148, SN74HC148 www.ti.com SCLS109H – APRIL 2004 – REVISED MARCH 2022 6.6 Operating Characteristics TA = 25°C Cpd 6 Power dissipation capacitance Test Conditions TYP UNIT No load 35 pF Submit Document Feedback Copyright © 2022 Texas Instruments Incorporated Product Folder Links: SN54HC148 SN74HC148 SN54HC148, SN74HC148 www.ti.com SCLS109H – APRIL 2004 – REVISED MARCH 2022 7 Parameter Measurement Information Phase relationships between waveforms were chosen arbitrarily. All input pulses are supplied by generators having the following characteristics: PRR ≤ 1 MHz, ZO = 50 Ω, tt < 6 ns. For clock inputs, fmax is measured when the input duty cycle is 50%. The outputs are measured one at a time with one input transition per measurement. Test Point From Output Under Test CL(1) (1) CL includes probe and test-fixture capacitance. Figure 7-1. Load Circuit for Push-Pull Outputs VCC Input 50% 90% tPLH tPHL 10% 10% 0V (1) tr(1) (1) VOH Output 50% VOL tPLH(1) VOH Output 50% 0V tf(1) 90% VOH 90% Output 50% tPHL(1) VCC 90% Input 50% 50% 10% 10% tr(1) tf(1) VOL (1) The greater between tr and tf is the same as tt. Figure 7-3. Voltage Waveforms, Input and Output Transition Times for Standard CMOS Inputs VOL (1) The greater between tPLH and tPHL is the same as tpd. Figure 7-2. Voltage Waveforms, Propagation Delays for Standard CMOS Inputs Submit Document Feedback Copyright © 2022 Texas Instruments Incorporated Product Folder Links: SN54HC148 SN74HC148 7 SN54HC148, SN74HC148 www.ti.com SCLS109H – APRIL 2004 – REVISED MARCH 2022 8 Detailed Description 8.1 Overview The ’HC148 devices feature priority decoding of the inputs to ensure that only the highest-order data line is encoded. These devices encode eight data lines to 3-line (4-2-1) binary (octal). Cascading circuitry (enable input EI and enable output EO) has been provided to allow octal expansion without the need for external circuitry. Data inputs and outputs are active at the low logic level. 8.2 Functional Block Diagram 8 Submit Document Feedback Copyright © 2022 Texas Instruments Incorporated Product Folder Links: SN54HC148 SN74HC148 SN54HC148, SN74HC148 www.ti.com SCLS109H – APRIL 2004 – REVISED MARCH 2022 8.3 Device Functional Modes Table 8-1. Function Table INPUTS OUTPUTS EI 0 1 2 3 4 5 6 7 A2 A1 A0 GS EO H X X X X X X X X H H H H H L H H H H H H H H H H H H L L X X X X X X X L L L L L H L X X X X X X L H L L H L H L X X X X X L H H L H L L H L X X X X L H H H L H H L H L X X X L H H H H H L L L H L X X L H H H H H H L H L H L X L H H H H H H H H L L H L L H H H H H H H H H H L H Submit Document Feedback Copyright © 2022 Texas Instruments Incorporated Product Folder Links: SN54HC148 SN74HC148 9 SN54HC148, SN74HC148 www.ti.com SCLS109H – APRIL 2004 – REVISED MARCH 2022 9 Application Information Figure 9-1. Priority Encoder for 16 Bits Because the ’HC148 devices are combinational logic circuits, wrong addresses can appear during input transients. Moreover, a change from high to low at EI can cause a transient low on GS when all inputs are high. This must be considered when strobing the outputs. 10 Submit Document Feedback Copyright © 2022 Texas Instruments Incorporated Product Folder Links: SN54HC148 SN74HC148 SN54HC148, SN74HC148 www.ti.com SCLS109H – APRIL 2004 – REVISED MARCH 2022 10 Power Supply Recommendations The power supply can be any voltage between the minimum and maximum supply voltage rating located in the Recommended Operating Conditions. Each VCC terminal should have a good bypass capacitor to prevent power disturbance. A 0.1-μF capacitor is recommended for this device. It is acceptable to parallel multiple bypass caps to reject different frequencies of noise. The 0.1-μF and 1-μF capacitors are commonly used in parallel. The bypass capacitor should be installed as close to the power terminal as possible for best results. 11 Layout 11.1 Layout Guidelines When using multiple-input and multiple-channel logic devices inputs must not ever be left floating. In many cases, functions or parts of functions of digital logic devices are unused; for example, when only two inputs of a triple-input AND gate are used or only 3 of the 4 buffer gates are used. Such unused input pins must not be left unconnected because the undefined voltages at the outside connections result in undefined operational states. All unused inputs of digital logic devices must be connected to a logic high or logic low voltage, as defined by the input voltage specifications, to prevent them from floating. The logic level that must be applied to any particular unused input depends on the function of the device. Generally, the inputs are tied to GND or VCC, whichever makes more sense for the logic function or is more convenient. Submit Document Feedback Copyright © 2022 Texas Instruments Incorporated Product Folder Links: SN54HC148 SN74HC148 11 SN54HC148, SN74HC148 www.ti.com SCLS109H – APRIL 2004 – REVISED MARCH 2022 12 Device and Documentation Support TI offers an extensive line of development tools. Tools and software to evaluate the performance of the device, generate code, and develop solutions are listed below. 12.1 Documentation Support 12.1.1 Related Documentation 12.2 Receiving Notification of Documentation Updates To receive notification of documentation updates, navigate to the device product folder on ti.com. Click on Subscribe to updates to register and receive a weekly digest of any product information that has changed. For change details, review the revision history included in any revised document. 12.3 Support Resources TI E2E™ support forums are an engineer's go-to source for fast, verified answers and design help — straight from the experts. Search existing answers or ask your own question to get the quick design help you need. Linked content is provided "AS IS" by the respective contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of Use. 12.4 Trademarks TI E2E™ is a trademark of Texas Instruments. All trademarks are the property of their respective owners. 12.5 Electrostatic Discharge Caution This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage. ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications. 12.6 Glossary TI Glossary This glossary lists and explains terms, acronyms, and definitions. 13 Mechanical, Packaging, and Orderable Information The following pages include mechanical, packaging, and orderable information. This information is the most current data available for the designated devices. This data is subject to change without notice and revision of this document. For browser-based versions of this data sheet, refer to the left-hand navigation. 12 Submit Document Feedback Copyright © 2022 Texas Instruments Incorporated Product Folder Links: SN54HC148 SN74HC148 PACKAGE OPTION ADDENDUM www.ti.com 10-Jul-2022 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Pins Package Drawing Qty Eco Plan (2) Lead finish/ Ball material MSL Peak Temp Op Temp (°C) Device Marking (3) Samples (4/5) (6) SN54HC148J ACTIVE CDIP J 16 1 Non-RoHS & Green SNPB N / A for Pkg Type -55 to 125 SN54HC148J Samples SN74HC148D ACTIVE SOIC D 16 40 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 85 HC148 Samples SN74HC148DE4 ACTIVE SOIC D 16 40 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 85 HC148 Samples SN74HC148DG4 ACTIVE SOIC D 16 40 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 85 HC148 Samples SN74HC148DR ACTIVE SOIC D 16 2500 RoHS & Green NIPDAU | SN Level-1-260C-UNLIM -40 to 85 HC148 Samples SN74HC148DRE4 ACTIVE SOIC D 16 2500 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 85 HC148 Samples SN74HC148DRG4 ACTIVE SOIC D 16 2500 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 85 HC148 Samples SN74HC148DT ACTIVE SOIC D 16 250 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 85 HC148 Samples SN74HC148N ACTIVE PDIP N 16 25 RoHS & Green NIPDAU N / A for Pkg Type -40 to 85 SN74HC148N Samples SN74HC148NSR ACTIVE SO NS 16 2000 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 85 HC148 Samples SNJ54HC148FK ACTIVE LCCC FK 20 1 Non-RoHS & Green SNPB N / A for Pkg Type -55 to 125 SNJ54HC 148FK Samples SNJ54HC148J ACTIVE CDIP J 16 1 Non-RoHS & Green SNPB N / A for Pkg Type -55 to 125 SNJ54HC148J Samples (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may reference these types of products as "Pb-Free". RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption. Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of