SN74HC640PWR

SN54HC640, SN74HC640 SCLS303E – JANUARY 1996 – REVISED SEPTEMBER 2022 SNx4HC640 Octal Bus Transceivers With 3-State Outputs 1 Features 2 Description • • The SNx4HC640 is an octal bus transceiver with 3state outputs. All eight channels are controlled by the direction (DIR) pin and output enable OE pin. • • • • • Wide operating voltage range of 2V to 6V High-Current 3-state outputs can drive up to 10 LSTTL loads Low power consumption, 80-µA max ICC Typical tpd = 8ns ±4-mA output drive at 5V Low input current of 1µA max Inverting logic (1) Device Information PART NUMBER PACKAGE BODY SIZE (NOM) SN54HC640 J (CDIP, 20) 26.92 mm × 6.92 mm DW (SOIC, 20) 12.80 mm × 7.50 mm N (PDIP, 20) 25.40 mm × 6.35 mm NS (SO, 20) 15.00 mm × 5.30 mm PW (TSSOP, 20) 4.40 mm × 6.50 mm SN74HC640 (1) For all available packages, see the orderable addendum at the end of the data sheet. Pinout Top View An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications, intellectual property matters and other important disclaimers. PRODUCTION DATA. SN54HC640, SN74HC640 www.ti.com SCLS303E – JANUARY 1996 – REVISED SEPTEMBER 2022 Table of Contents 1 Features............................................................................1 2 Description.......................................................................1 3 Revision History.............................................................. 2 4 Pin Configuration and Functions...................................3 5 Specifications.................................................................. 4 5.1 Absolute Maximum Ratings........................................ 4 (1) 5.2 Recommended Operating Conditions ..................... 4 5.3 Thermal Information....................................................4 5.4 Electrical Characteristics.............................................5 5.5 Switching Characteristics ...........................................5 5.6 Operating Characteristics........................................... 6 6 Parameter Measurement Information............................ 7 7 Detailed Description........................................................8 7.1 Overview..................................................................... 8 7.2 Functional Block Diagram........................................... 8 7.3 Device Functional Modes............................................8 8 Power Supply Recommendations..................................9 9 Layout...............................................................................9 9.1 Layout Guidelines....................................................... 9 10 Device and Documentation Support..........................10 10.1 Documentation Support.......................................... 10 10.2 Receiving Notification of Documentation Updates..10 10.3 Support Resources................................................. 10 10.4 Trademarks............................................................. 10 10.5 Electrostatic Discharge Caution..............................10 10.6 Glossary..................................................................10 11 Mechanical, Packaging, and Orderable Information.................................................................... 10 3 Revision History NOTE: Page numbers for previous revisions may differ from page numbers in the current version. Changes from Revision D (August 2003) to Revision E (September 2022) Page • Updated the numbering, formatting, tables, figures, and cross-references throughout the document to reflect modern data sheet standards............................................................................................................................. 1 2 Submit Document Feedback Copyright © 2022 Texas Instruments Incorporated Product Folder Links: SN54HC640 SN74HC640 SN54HC640, SN74HC640 www.ti.com SCLS303E – JANUARY 1996 – REVISED SEPTEMBER 2022 4 Pin Configuration and Functions J, DW, N, NS, or PW Package 20-Pin CDIP, SOIC, PDIP, SO, TSSOP Top View Submit Document Feedback Copyright © 2022 Texas Instruments Incorporated Product Folder Links: SN54HC640 SN74HC640 3 SN54HC640, SN74HC640 www.ti.com SCLS303E – JANUARY 1996 – REVISED SEPTEMBER 2022 5 Specifications 5.1 Absolute Maximum Ratings over operating free-air temperature range (unless otherwise noted)(1) VCC Supply voltage range (2) IIK Input clamp current IOK Output clamp current IO Continuous output current VCC or GND Continuous current through TJ Junction temperature Tstg Storage temperature (1) (2) (2) MIN MAX -0.5 7 UNIT V (VI < 0 or VI > VCC) ±20 mA (VO < 0 or VO > VCC) ±20 mA (VO = 0 to VCC) ±35 mA ±70 mA 150 °C 150 °C -65 Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings only and functional operation of the device at these or any other conditions beyond those indicated under recommended operating conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. The input and output voltage ratings may be exceeded if the input and output current ratings are observed. (1) 5.2 Recommended Operating Conditions SN54HC640 VCC NOM MAX 2 5 6 Supply voltage VCC = 2 V VIH High-level input voltage VCC = 4.5 V SN74HC640 MIN VI Input voltage VO Output voltage TA (1) 5 6 3.15 4.2 4.2 VCC = 4.5 V 0 0.5 0.5 1.35 0 VCC 0 V VCC V VCC = 4.5 V 500 500 VCC = 6 V 400 400 125 V VCC 1000 – 55 V 1.8 VCC 1000 Operating free-air temperature UNIT V 1.35 1.8 0 VCC = 2 V Input transition rise/fall time 2 3.15 VCC = 6 V Δt/Δv MAX 1.5 VCC = 2 V Low-level input voltage NOM 1.5 VCC = 6 V VIL MIN – 40 85 ns °C All unused inputs of the device must be held at VCC or GND to ensure proper device operation. Refer to the TI application report Implications of Slow or Floating SMOS Inputs, literature number SCBA004. 5.3 Thermal Information (1) THERMAL METRIC RθJA (1) 4 Package thermal impedance DW (SOIC) N (PDIP) NS (SO) PW (TSSOP) 20 PINS 20 PINS 20 PINS 20 PINS UNIT 58 69 60 83 °C/W For more information about traditional and new thermal metrics, see the Semiconductor and IC package thermal metrics application report. Submit Document Feedback Copyright © 2022 Texas Instruments Incorporated Product Folder Links: SN54HC640 SN74HC640 SN54HC640, SN74HC640 www.ti.com SCLS303E – JANUARY 1996 – REVISED SEPTEMBER 2022 5.4 Electrical Characteristics TEST CONDITIONS(1) PARAMETER VCC (V) IOH = –20 μA VOH TYP MAX MIN MAX SN74HC640 MIN 1.9 1.998 1.9 1.9 4.5 4.4 4.400 4.4 4.4 6 5.9 5.999 5.9 5.9 4.5 3.98 4.3 3.7 3.84 6 5.48 5.8 5.2 5.34 IOH = –7.8 mA VOL MIN SN54HC640 2 High-level output voltage IOH = –6 mA TA = 25°C MAX V 2 0.002 0.1 0.1 0.1 IOL = 20 μA 4.5 0.001 0.1 0.1 0.1 6 0.001 0.1 0.1 0.1 IOL = 6 mA 4.5 0.17 0.26 0.4 0.33 Low-level output voltage UNIT V IOL = 7.8 mA 6 0.15 0.26 0.4 0.33 II Input hold current DIR or OE VI = VCC or 0 6 ±0.1 ±100 ±1000 ±1000 nA IOZ Off-state output current A or B VI = VCC or 0. IO = 0 6 ±0.01 ±0.5 ±10 ±5 μA ΔICC Supply-current change One input at 0.5V or 2.4 V, Other inputs at 0 or VCC 6 8 160 80 μA Ci Input capacitance 10 10 10 pF (1) DIR or OE 2 to 6 3 VI = VIH or VIL, unless otherwise noted. 5.5 Switching Characteristics CL = 50 pF. See Figure 6 PARAMETER tpd ten tdis tt Propagation delay Enable time Disable time FROM (INPUT) A or B OE OE Transition time TO (OUTPUT) Y A or B A or B A or B VCC (V) TA = 25°C MIN SN54HC640 MIN MAX SN75HC640 TYP MAX 2 29 105 160 MIN MAX 130 4.5 10 21 32 26 6 8 18 27 22 2 109 230 340 290 4.5 27 46 68 58 6 20 39 58 49 2 40 150 225 190 4.5 18 30 45 38 6 16 26 38 32 2 20 60 90 75 4.5 8 12 18 15 6 6 10 15 13 ns ns ns ns Submit Document Feedback Copyright © 2022 Texas Instruments Incorporated Product Folder Links: SN54HC640 SN74HC640 5 SN54HC640, SN74HC640 www.ti.com SCLS303E – JANUARY 1996 – REVISED SEPTEMBER 2022 5.5 Switching Characteristics CL = 150 pF. See Figure 6 PARAMETER tpd ten tt FROM (INPUT) TO (OUTPUT) VCC (V) A or B B or A Propagation delay Enable time OE A or B Transition time A or B TA = 25°C MIN SN54HC640 MIN MAX SN75HC640 TYP MAX MIN MAX 2 44 190 290 235 4.5 14 38 58 47 6 11 33 49 41 2 124 315 470 395 4.5 31 63 94 79 6 23 54 80 68 2 45 210 315 265 4.5 17 42 63 53 6 13 36 53 45 ns ns ns 5.6 Operating Characteristics TA = 25°C Cpd 6 Power dissipation capacitance Test Conditions TYP UNIT No load 40 pF Submit Document Feedback Copyright © 2022 Texas Instruments Incorporated Product Folder Links: SN54HC640 SN74HC640 SN54HC640, SN74HC640 www.ti.com SCLS303E – JANUARY 1996 – REVISED SEPTEMBER 2022 6 Parameter Measurement Information tpd is the maximum between tPLH and tPHL tt is the maximum between tTLH and tTHL tdisis the maximum between tPLZ and tPHZ ten is the maximum between tPZL and tPZH Figure 6-1. Load Circuit Figure 6-2. Figure 6-3. Voltage Waveforms Propagation Delay and Output Transition Times Figure 6-4. Voltage Waveforms Enable and Disable Times for 3-State Outputs Figure 6-5. Voltage Wavefroms Propagation Delay and Output Transition Times A. CL includes probe and test-fixture capacitance. B. Waveform 1 is for an output with internal conditions such that the output is low except when disabled by the output control. Waveform 2 is for an output with internal conditions such that the output is high except when disabled by the output control. C. Phase relationships between waveforms were chosen arbitrarily. All input pulses are supplied by generators having the following characteristics: PRR ≤ 1 MHz, ZO = 50 Ω, tr = 6 ns, tf = 6 ns. D. The outputs are measured one at a time with one input transition per measurement. Submit Document Feedback Copyright © 2022 Texas Instruments Incorporated Product Folder Links: SN54HC640 SN74HC640 7 SN54HC640, SN74HC640 www.ti.com SCLS303E – JANUARY 1996 – REVISED SEPTEMBER 2022 7 Detailed Description 7.1 Overview These octal bus transceivers are designed for asynchronous two-way communication between data buses. These devices transmit data from the A bus to the B bus or from the B bus to the A bus, depending upon the level at the direction-control (DIR) input. The output-enable (OE) input can be used to disable the device so the buses are effectively isolated. 7.2 Functional Block Diagram Figure 7-1. Functional Block Diagram 7.3 Device Functional Modes Table 7-1. Function Table (each transceiver) INPUTS(1) (1) 8 Operation OE DIR L L B data to A bus L H A data to B bus H X Isolation H = High Voltage Level, L = Low Voltage Level, X = Don’t Care Submit Document Feedback Copyright © 2022 Texas Instruments Incorporated Product Folder Links: SN54HC640 SN74HC640 SN54HC640, SN74HC640 www.ti.com SCLS303E – JANUARY 1996 – REVISED SEPTEMBER 2022 8 Power Supply Recommendations The power supply can be any voltage between the minimum and maximum supply voltage rating located in the Recommended Operating Conditions. Each VCC terminal should have a good bypass capacitor to prevent power disturbance. A 0.1-μF capacitor is recommended for this device. It is acceptable to parallel multiple bypass caps to reject different frequencies of noise. The 0.1-μF and 1-μF capacitors are commonly used in parallel. The bypass capacitor should be installed as close to the power terminal as possible for best results. 9 Layout 9.1 Layout Guidelines When using multiple-input and multiple-channel logic devices inputs must not ever be left floating. In many cases, functions or parts of functions of digital logic devices are unused; for example, when only two inputs of a triple-input AND gate are used or only 3 of the 4 buffer gates are used. Such unused input pins must not be left unconnected because the undefined voltages at the outside connections result in undefined operational states. All unused inputs of digital logic devices must be connected to a logic high or logic low voltage, as defined by the input voltage specifications, to prevent them from floating. The logic level that must be applied to any particular unused input depends on the function of the device. Generally, the inputs are tied to GND or VCC, whichever makes more sense for the logic function or is more convenient. Submit Document Feedback Copyright © 2022 Texas Instruments Incorporated Product Folder Links: SN54HC640 SN74HC640 9 SN54HC640, SN74HC640 www.ti.com SCLS303E – JANUARY 1996 – REVISED SEPTEMBER 2022 10 Device and Documentation Support TI offers an extensive line of development tools. Tools and software to evaluate the performance of the device, generate code, and develop solutions are listed below. 10.1 Documentation Support 10.1.1 Related Documentation 10.2 Receiving Notification of Documentation Updates To receive notification of documentation updates, navigate to the device product folder on ti.com. Click on Subscribe to updates to register and receive a weekly digest of any product information that has changed. For change details, review the revision history included in any revised document. 10.3 Support Resources TI E2E™ support forums are an engineer's go-to source for fast, verified answers and design help — straight from the experts. Search existing answers or ask your own question to get the quick design help you need. Linked content is provided "AS IS" by the respective contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of Use. 10.4 Trademarks TI E2E™ is a trademark of Texas Instruments. All trademarks are the property of their respective owners. 10.5 Electrostatic Discharge Caution This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage. ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications. 10.6 Glossary TI Glossary This glossary lists and explains terms, acronyms, and definitions. 11 Mechanical, Packaging, and Orderable Information The following pages include mechanical, packaging, and orderable information. This information is the most current data available for the designated devices. This data is subject to change without notice and revision of this document. For browser-based versions of this data sheet, refer to the left-hand navigation. 10 Submit Document Feedback Copyright © 2022 Texas Instruments Incorporated Product Folder Links: SN54HC640 SN74HC640 PACKAGE OPTION ADDENDUM www.ti.com 2-Sep-2022 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Pins Package Drawing Qty Eco Plan (2) Lead finish/ Ball material MSL Peak Temp Op Temp (°C) Device Marking (3) Samples (4/5) (6) 5962-8780901RA ACTIVE CDIP J 20 1 Non-RoHS & Green SNPB N / A for Pkg Type -55 to 125 5962-8780901RA SNJ54HC640J Samples SN54HC640J ACTIVE CDIP J 20 1 Non-RoHS & Green SNPB N / A for Pkg Type -55 to 125 SN54HC640J Samples SN74HC640DW ACTIVE SOIC DW 20 25 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 85 HC640 Samples SN74HC640DWR ACTIVE SOIC DW 20 2000 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 85 HC640 Samples SN74HC640N ACTIVE PDIP N 20 20 RoHS & Non-Green NIPDAU N / A for Pkg Type -40 to 85 SN74HC640N Samples SN74HC640NSR ACTIVE SO NS 20 2000 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 85 HC640 Samples SN74HC640PW ACTIVE TSSOP PW 20 70 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 85 HC640 Samples SN74HC640PWR ACTIVE TSSOP PW 20 2000 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 85 HC640 Samples SNJ54HC640J ACTIVE CDIP J 20 1 Non-RoHS & Green SNPB N / A for Pkg Type -55 to 125 5962-8780901RA SNJ54HC640J Samples (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may reference these types of products as "Pb-Free". RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption. Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of