TL760M33QKTTRQ1

TL760M33-Q1 www.ti.com SGLS284I – OCTOBER 2005 – REVISED DECEMBER 2010 LOW-DROPOUT FIXED-VOLTAGE REGULATORS Check for Samples: TL760M33-Q1 FEATURES 1 • • • • • • KTT (TO-263) PACKAGE (TOP VIEW) OUTPUT GND Qualified for Automotive Applications ±3% Output Voltage Variation Across Load and Temperature Load-Dump Protection 500-mV Maximum Dropout Voltage at 500 mA Fixed 3.3-V Output Internal Thermal-Overload Protection Internal Overvoltage Protection Customer-Specific Configuration Control Can Be Supported Along With Major-Change Approval GND INPUT KVU (TO-252) PACKAGE (TOP VIEW) OUTPUT GND • • GND INPUT DESCRIPTION/ORDERING INFORMATION The TL760M33-Q1 low-dropout regulator offers a variety of fixed-voltage options that offer a maximum continuous input voltage of 26 V. Utilizing a pnp pass element, this regulator is capable of sourcing 500 mA of current, with a specified maximum dropout of 500 mV, making the TL760M33-Q1 ideal for low-voltage applications. Additionally, the TL760M33-Q1 regulator offers very tight output accuracy of ±3% across operating load and temperature ranges. Other convenient features the regulators provide are internal overcurrent limiting, thermal-overload protection, and overvoltage protection. The TL760M33-Q1 is load-dump protected to its maximum operating condition of 45 V. Stability has been optimized for typical automotive applications and low-cost capacitors. ORDERING INFORMATION (1) TA –40°C to 125°C (1) (2) VO (TYP) 3.3 V PACKAGE (2) ORDERABLE PART NUMBER TOP-SIDE MARKING TO-263 – KTT Reel of 500 TL760M33QKTTRQ1 TL760M33Q1 TO-252 – KVU Reel of 2500 TL760M33QKVURQ1 760M33Q1 For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI web site at www.ti.com. Package drawings, thermal data, and symbolization are available at www.ti.com/packaging. 1 Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. UNLESS OTHERWISE NOTED this document contains PRODUCTION DATA information current as of publication date. Products conform to specifications per the terms of Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. Copyright © 2005–2010, Texas Instruments Incorporated TL760M33-Q1 SGLS284I – OCTOBER 2005 – REVISED DECEMBER 2010 www.ti.com ABSOLUTE MAXIMUM RATINGS (1) over operating virtual junction temperature range (unless otherwise noted) VI Maximum input voltage TJ Operating virtual junction temperature Tstg Storage temperature range (1) 45 V 150°C –65°C to 150°C Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under recommended operating conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. PACKAGE THERMAL DATA (1) (1) PACKAGE BOARD qJA TO-252 (KVU) High K, JESD 51-5 30.3°C/W TO-263 (KTT) High K, JESD 51-5 26.9°C/W Maximum power dissipation is a function of TJ(max), qJA, and TA. The maximum allowable power dissipation at any allowable ambient temperature is PD = (TJ(max) – TA)/qJA. Operating at the absolute maximum TJ of 150°C can impact reliability. THERMAL RESISTANCE 1-oz copper, one-layer PCB THERMAL RESISTANCE VALUE RJA 55°C/W (area = 240 mm2) RJC 5.5°C/W from FET to tab RJC 0.1°C/W from die center to tab RECOMMENDED OPERATING CONDITIONS MIN VI Input voltage IO Output current TJ Operating virtual-junction temperature MAX UNIT 3.8 26 V 0 500 mA –40 150 °C UNIT ELECTRICAL CHARACTERISTICS VI = 6 V, IO = 500 mA, TJ = –40°C to 150°C (unless otherwise noted) TEST CONDITIONS (1) PARAMETER MIN TYP MAX IO = 5 mA to 500 mA, VI = 3.8 V to 26 V, TJ = 125°C 3.2 3.3 3.4 TJ = 150°C, IO = 5 mA to 300 mA, VI = 3.8 V to 26 V 3.2 3.3 3.4 IO = 250 mA 8 15 IO = 500 mA 20 30 25 VO Output voltage IQ Current consumption, IQ = II – IO VI = 6 V Line regulation VI = 3.8 V to 28 V 10 Power-supply ripple rejection f = 100 Hz, Vripple = 0.5 VPP, VI = 6 V 62 Load regulation IO = 5 mA to 500 mA PSRR VDO (1) (2) 2 Dropout voltage (2) 5 V mA mV dB 30 IO = 250 mA 400 IO = 500 mA 500 mV mV Pulse-testing techniques are used to maintain the virtual junction temperature as close to the ambient temperature as possible. Thermal effects must be taken into account separately. All characteristics are measured with a 0.1-mF capacitor across the input and a 22-mF tantalum capacitor, with equivalent series resistance of 1.5 Ω on the output. Measured when the output voltage, VO, has dropped 100 mV from the nominal value obtained when VI = 6 V Submit Documentation Feedback Copyright © 2005–2010, Texas Instruments Incorporated TL760M33-Q1 www.ti.com SGLS284I – OCTOBER 2005 – REVISED DECEMBER 2010 COMPENSATION-CAPACITOR SELECTION INFORMATION Equivalent Series Resistance, ESR (W) The TL760M is a low-dropout regulator. This means that the capacitance loading is important to the performance of the regulator because it is a vital part of the control loop. The capacitor value and the equivalent series resistance (ESR) both affect the control loop and must be defined for the load range. Figure 1 can be used to establish the capacitance value and ESR range for the best regulator performance. = 22 mF = 0.1 mF 1000 mF 400 mF 0.015 200 mF 22 mF 10 mF Load Current, IL (A) DIL DVL DVL = ESR x DIL Figure 1. Figure 2. TYPICAL APPLICATION SCHEMATIC 22 Figure 3. Copyright © 2005–2010, Texas Instruments Incorporated Submit Documentation Feedback 3 TL760M33-Q1 SGLS284I – OCTOBER 2005 – REVISED DECEMBER 2010 www.ti.com TYPICAL CHARACTERISTICS Figure 4. 4 Submit Documentation Feedback Figure 5. Copyright © 2005–2010, Texas Instruments Incorporated PACKAGE OPTION ADDENDUM www.ti.com 10-Dec-2020 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Pins Package Drawing Qty Eco Plan (2) Lead finish/ Ball material MSL Peak Temp Op Temp (°C) Device Marking (3) (4/5) (6) TL760M33QKTTRQ1 ACTIVE DDPAK/ TO-263 KTT 3 500 RoHS & Green SN Level-3-245C-168 HR -40 to 125 TL760M33Q1 TL760M33QKVURQ1 ACTIVE TO-252 KVU 3 2500 RoHS & Green SN Level-3-260C-168 HR -40 to 125 760M33Q1 (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may reference these types of products as "Pb-Free". RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption. Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of