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TL4242-Q1
SLVS732G – JULY 2010 – REVISED APRIL 2017
TL4242-Q1 Adjustable LED Driver
1 Features
3 Description
•
•
The TL4242-Q1 device is an integrated adjustable
constant-current source, driving loads up to 500 mA.
One can adjust the output current level through an
external resistor. The device design is for supplying
high-power LEDs (for example, OSRAM Dragon LA
W57B) under the severe conditions of automotive
applications, resulting in constant brightness and
extended LED lifetime. The device comes in the DRJ
(WSON) and KTT (TO-263) package. Protection
circuits prevent damage to the device in case of
overload, short-circuit, reverse polarity, and overheat.
The device provides the connected LEDs protection
against reverse polarity as well as excess voltages up
to 45 V.
1
•
•
•
•
•
•
•
Qualified for Automotive Applications
AEC-Q100 Test Guidance With the Following
Results:
– Device Temperature Grade 2: –40°C to 105°C
Ambient Operating Temperature Range for
WSON package
– Device Temperature Grade 1: –40°C to 125°C
Ambient Operating Temperature Range for
TO-263 package
– Device HBM ESD Classification Level H1C
– Device CDM ESD Classification Level C3B
Adjustable Constant Current up to 500 mA (±5%)
Wide Input-Voltage Range up to 42 V
Low Dropout Voltage
Open-Load Detection
Overtemperature Protection
Short-Circuit Proof
Reverse-Polarity Proof
2 Applications
The integrated PWM input of the TL4242-Q1 device
permits LED brightness regulation by pulse-width
modulation (PWM). The high-input impedance of the
PWM input allows operating the LED driver as a
protected high-side switch.
Device Information(1)
PART NUMBER
TL4242-Q1
Automotive LED Lighting Applications Including:
•
•
•
•
•
•
Rear Light
Daytime Running Light
Fog Light
Position Light
Interior Light
Stop or Tail Light
PACKAGE
BODY SIZE (NOM)
TO-263 (7)
10.00 mm × 9.25 mm
WSON (8)
4.00 mm × 4.00 mm
(1) For all available packages, see the orderable addendum at
the end of the data sheet.
Typical Application Schematic
4.5-42 V Input
PWM
MCU
Status
PWM
I
ST
NC
GND
Q
REF
D
1
An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,
intellectual property matters and other important disclaimers. PRODUCTION DATA.
TL4242-Q1
SLVS732G – JULY 2010 – REVISED APRIL 2017
www.ti.com
Table of Contents
1
2
3
4
5
6
7
Features ..................................................................
Applications ...........................................................
Description .............................................................
Revision History.....................................................
Pin Configuration and Functions .........................
Specifications.........................................................
1
1
1
2
4
5
6.1
6.2
6.3
6.4
6.5
6.6
5
5
5
6
6
7
Absolute Maximum Ratings ......................................
ESD Ratings..............................................................
Recommended Operating Conditions.......................
Thermal Information ..................................................
Electrical Characteristics...........................................
Typical Characteristics .............................................
Detailed Description .............................................. 8
7.1 Overview ................................................................... 8
7.2 Functional Block Diagram ......................................... 8
7.3 Feature Description................................................... 8
7.4 Device Functional Modes.......................................... 9
8
Application and Implementation ........................ 10
8.1 Application Information............................................ 10
8.2 Typical Applications ................................................ 10
9 Power Supply Recommendations...................... 14
10 Layout................................................................... 14
10.1 Layout Guidelines ................................................. 14
10.2 Layout Example .................................................... 14
10.3 Thermal Considerations ........................................ 15
11 Device and Documentation Support ................. 16
11.1
11.2
11.3
11.4
11.5
Receiving Notification of Documentation Updates
Community Resources..........................................
Trademarks ...........................................................
Electrostatic Discharge Caution ............................
Glossary ................................................................
16
16
16
16
16
12 Mechanical, Packaging, and Orderable
Information ........................................................... 16
4 Revision History
Changes from Revision F (January 2015) to Revision G
Page
•
Changed the pinout drawings................................................................................................................................................. 4
•
Changed all occurrences in the data sheet of QFN and SFM to WSON and TO-263, respectively...................................... 4
•
Changed format of Pin Functions table .................................................................................................................................. 4
•
Changed the condition statement for the Electrical Characteristics table .............................................................................. 6
•
Added layout diagram for the TO-263 package ................................................................................................................... 15
•
Added Receiving Notification of Documentation Updates and Community Resources sections to the data sheet............. 16
Changes from Revision E (July 2013) to Revision F
•
Added Pin Configuration and Functions section, ESD Ratings table, Feature Description section, Device Functional
Modes, Application and Implementation section, Power Supply Recommendations section, Layout section, Device
and Documentation Support section, and Mechanical, Packaging, and Orderable Information section .............................. 1
Changes from Revision D (May 2013) to Revision E
•
Page
Added new graph to Typical Characteristics .......................................................................................................................... 7
Changes from Revision C (October 2012) to Revision D
•
Page
Page
Changed minimum storage temperature to –55ºC ................................................................................................................. 5
Changes from Revision B (September 2012) to Revision C
Page
•
Added Stoplight and Taillight Application section................................................................................................................. 12
•
Added Thermal Considerations section................................................................................................................................ 15
•
Added PCB Design Guideline section .................................................................................................................................. 15
2
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Changes from Revision A (August, 2012) to Revision B
•
Page
Manually appended mechanical data, thermal pad data, and package option addendum .................................................. 11
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5 Pin Configuration and Functions
DRJ Package
8-Pin WSON With Exposed Thermal Pad
Top View
KTT Package
7-Pin TO-263 With Exposed Thermal Pad
Top View
Not to scale
PWM
1
ST
2
GND
3
REF
4
Thermal
Pad
8
I
7
NC
6
Q
5
D
1
2
3
4
5
6
7
I
PWM
ST
GND
REF
D
Q
Not to scale
Pin Functions
PIN
NAME
4
NO.
I/O
DRJ
KTT
D
5
6
I
GND
3
4
—
I
8
1
I
DESCRIPTION
Status delay. To set status reaction delay, connect to GND with a capacitor. For no
delay, leave open.
Ground
Input. Connect directly to GND as close as possible to the device with a 100-nF ceramic
capacitor.
NC
7
—
—
PWM
1
2
I
No internal connection
Pulse-width modulation input. If not used, connect to the I pin.
Q
6
7
O
Output
REF
4
5
I
Reference input. Connect to a shunt resistor.
ST
2
3
O
Status output. Open-collector output. Connect to an external pullup resistor (RPULLUP ≥
4.7 kΩ).
Thermal pad
—
—
—
Solder the thermal pad directly to the PCB. Connect to ground or leave floating.
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6 Specifications
6.1 Absolute Maximum Ratings
over operating ambient temperature range (unless otherwise noted) (1)
Supply voltage (2), VCC
Input voltage, VI
Output voltage, VO
Output current, IO
MIN
MAX
UNIT
–42
45
V
D
–0.3
7
PWM
–40
40
REF
–1
16
Q
–1
41
ST
–0.3
40
PWM
±1
REF
±2
ST
±5
V
V
mA
Virtual-junction temperature, TJ
–40
150
°C
Storage temperature, Tstg
–55
150
°C
(1)
(2)
Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating
Conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
All voltage values are with respect to the network ground terminal.
6.2 ESD Ratings
VALUE
UNIT
DRJ Package
Human body model (HBM), per AEC Q100-002 (1)
V(ESD)
Electrostatic discharge
Charged device model (CDM), per
AEC Q100-011
±1500
Corner pins (1, 4, 5, and 8)
±1000
Other pins
±1000
Machine model (MM) AEC-Q100 Classification Level M3
±200
Human body model (HBM), per AEC Q100-002 (1)
±1500
V
KTT Package
V(ESD)
Electrostatic discharge
Charged device model (CDM), per
AEC Q100-011
Corner pins (1 and 7)
±1000
Other pins
±1000
Machine model (MM) AEC-Q100 Classification Level M3
(1)
V
±200
AEC Q100-002 indicates HBM stressing is done in accordance with the ANSI/ESDA/JEDEC JS-001 specification.
6.3 Recommended Operating Conditions
MIN
MAX
4.5
42
UNIT
V
16
V
VCC
Supply voltage
VST
Status (ST) output voltage
VPWM
PWM voltage
0
40
V
CD
Status delay (D) capacitance
0
2.2
μF
RREF
Reference (REF) resistor
Ω
TA
Operating ambient temperature
TJ
Operating junction temperature
0
10
WSON
–40
105
TO-263
–40
125
–40
150
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°C
°C
5
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6.4 Thermal Information
TL4242-Q1
THERMAL METRIC
(1)
DRJ (WSON)
KTT (TO263)
8 PINS
7 PINS
UNIT
RθJA
Junction-to-ambient thermal resistance
39
31.6
°C/W
RθJCtop
Junction-to-case (top) thermal resistance
31.5
34.7
°C/W
RθJB
Junction-to-board thermal resistance
15.5
8.2
°C/W
ψJT
Junction-to-top characterization parameter
0.3
0.7
°C/W
ψJB
Junction-to-board characterization parameter
15.6
8.2
°C/W
RθJCbot
Junction-to-case (bottom) thermal resistance
1.8
0.7
°C/W
(1)
For more information about traditional and new thermal metrics, see Semiconductor and IC Package Thermal Metrics
6.5 Electrical Characteristics
over recommended operating ambient temperature range, VI = 13.5 V, RREF = 0.47 Ω, VPWM,H, TJ = –40°C to 150°C, all
voltages with respect to ground (unless otherwise noted)
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
UNIT
OVERALL DEVICE
IqL
Supply current
VQ = 6.6 V
12
22
mA
IqOFF
Supply current, off mode
PWM = L, TJ < 85°C
0.1
2
μA
357
376
395
VQ – VREF = 6.6 V, RREF = 1 Ω
168
177
185
VQ – VREF = 6.6 V, RREF = 0.39 Ω
431
454
476
VQ – VREF = 5.4 V to 7.8 V, VI = 9 V
to 16 V
357
376
395
OUTPUT
VQ – VREF
IQ
Output current
(1)
= 6.6 V
IQmax
Output current limit
RREF = 0 Ω
600
Vdr
Drop voltage
IQ = 300 mA
0.35
mA
mA
0.7
V
PWM INPUT
VPWM,H
High-level PWM voltage
VPWM,L
Low-level PWM voltage
2.6
IPWM,H
High-level PWM input current
VPWM = 5 V
IPWM,L
Low-level PWM input current
VPWM = 0 V
tPWM,ON
Delay time, turnon
70% of IQnom, see Figure 7
tPWM,OFF
Delay time, turnoff
30% of IQnom, see Figure 7
V
0.7
V
220
500
μA
1
μA
0
15
40
μs
0
15
40
μs
–1
REFERENCE (REF)
VREF
Reference voltage
RREF = 0.39 Ω to 1 Ω
168
177
185
mV
IREF
Reference input current
VREF = 180 mV
–1
0.1
1
μA
15
25
STATUS OUTPUT (ST)
VIQL
Lower status-switching threshold
ST = L
VIQH
Upper status-switching threshold
ST = H
VSTL
Low-level status voltage
IST = 1.5 mA
ISTLK
Leakage current
VST = 5 V
30
mV
40
mV
0.4
V
5
μA
10
14
ms
10
20
μs
STATUS DELAY (D)
tSTHL
Delay time, status reaction
CD = 47 nF, ST H→L
tSTLH
Delay time, status release
CD = 47 nF, ST L→H
(1)
6
6
VQ – VREF equals the forward voltage sum of the connected LEDs (see Typical Application Schematic).
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6.6 Typical Characteristics
450
700
400
600
350
300
Output Current (mA)
Output Current (mA)
500
400
300
250
200
150
100
200
50
100
0
0
0.00
±50
0.25
0.50
0.75
1.00
1.25
1.50
1.75
2.00
0
2.25
5
10
External Reference (
15
20
25
30
C001
40
C002
Figure 1. Output Current vs External Resistance
Figure 2. Output Current vs Supply Voltage
178.5
60
50
178.0
40
177.5
PWM Current ( A)
Reference Voltage (mV)
35
Supply Voltage (V)
177.0
30
20
176.5
10
176.0
0
175.5
±10
±40
±20
0
20
40
60
80
100
120
140
0
10
Virtual Junction Temperature ( C)
20
30
40
PWM Voltage (V)
C003
C004
Figure 3. Reference Voltage vs Junction Temperature
Figure 4. PWM Pin Input Current vs PWM Voltage
250
ST Pin Voltage (mV)
200
150
100
50
0
0.0
0.5
1.0
1.5
2.0
2.5
3.0
3.5
4.0
Pulldown Current (mA)
C005
Figure 5. ST Pin Voltage vs ST Pin Pulldown Current
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7 Detailed Description
7.1 Overview
The TL4242-Q1 device is an integrated adjustable constant-current source, driving loads up to 500 mA. The
current can be set by an external resistor. And the load current can be modulated by a PWM input. The TL4242Q1 device integrates protections such as open load, overtemperature, and reverse polarity.
7.2 Functional Block Diagram
I
PWM
6
8
1
Q
Bias Supply
+
−
Bandgap
Reference
4
REF
Comparator
2
ST
Status
Delay
3
GND
5
D
7.3 Feature Description
The TL4242-Q1 device is an integrated adjustable constant-current source driving loads up to 500 mA. The
TL4242-Q1 device is qualified for automotive applications. The output current level can be adjusted via an
external resistor. Protection circuits prevent damage to the device in case of overload, short-circuit, reverse
polarity, and overtemperature. The connected LEDs are protected against reverse polarity as well as
overvoltages up to 45 V. The integrated PWM input of the TL4242-Q1 device permits LED brightness regulation
by pulse-width modulation. Due to the high input impedance of the PWM input, the LED driver can be operated
as a protected high-side switch.
The external shunt resistor in the ground path of the connected LEDs senses the LED current. A regulation loop
holds the voltage drop at the shunt resistor at a constant level of 177 mV (typical). The selection of the shunt
resistance, RREF, sets the constant-current level. Calculate the typical output current using Equation 1:
V
IQ,typ = REF
RREF
(1)
where VREF is the reference voltage (typically 177 mV) (see Electrical Characteristics). The equation applies for
RREF = 0.39 Ω to 10 Ω.
The output current is shown as a function of the reference resistance in Equation 1. With the PWM input, one
can regulate the LED brightness through the duty cycle. Also, PWM = L sets the TL4242-Q1 device in sleep
mode, resulting in a very low current consumption of < 1 μA (typical). The high impedance of the PWM input (see
Figure 4) permits the use of the PWM pin as an enable input.
8
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7.4 Device Functional Modes
7.4.1 Pulse-Width Modulation (PWM)
In general applications, PWM can be used to control the TL4242-Q1 device as a high-side driver. High level
enables the device. Low level disables the device. In LED lighting, PWM input provides a convenient way to
control the brightness of the LED load. Due to the high input impedance of the PWM input, the LED driver can be
operated as a protected high-side switch.
7.4.2 Status Output (ST)
The ST pin is an open-collector output. Connect the pin to an external pullup resistor (RPULLUP ≥ 4.7 kΩ). This
output provides information of open-load and overtemperature faults.
7.4.3 Reference (REF)
REF is used to set load current. In applications, the load current is sensed by a resistor in series with the load.
The voltage on the REF pin is regulated at 177 mV during normal operation. Therefore, the current of the load is
determined by VREF / RSENSE.
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8 Application and Implementation
NOTE
Information in the following applications sections is not part of the TI component
specification, and TI does not warrant its accuracy or completeness. TI’s customers are
responsible for determining suitability of components for their purposes. Customers should
validate and test their design implementation to confirm system functionality.
8.1 Application Information
The TL4242-Q1 device is usually used in the automotive lighting applications. A microcontroller is usually used to
generate PWM waveform to dimming the LED.
8.2 Typical Applications
8.2.1 Application Circuit
Figure 6 shows a typical application with the TL4242-Q1 LED driver. A supply current adjusted by the RREF
resistor drives the three LEDs, preventing brightness variations due to forward voltage spread of the LEDs. An
appropriate duty cycle applied to the PWM pin can compensate through software for the luminosity spread
arising from the LED production process. Therefore, it is not necessary to select LEDs for forward voltage or
luminosity classes. The minimum supply voltage should be equal to or greater than the sum of the LED forward
voltages, the TL4242-Q1 drop voltage (maximum 0.7 V at an LED current of 300 mA), and the maximum voltage
drop at the shunt resistor RREF of 185 mV.
VBAT
I
RO
SI
Microcontroller
Q
RADJ
GND
10 µF
D
10 kΩ
100 nF
PWM
ST
I
Q
TL4242-Q1
REF
GND
LED
Dragon
D
47 nF
0.47 Ω
0.25 W
RREF
Figure 6. Application Circuit
8.2.1.1 Design Requirements
10
DESIGN PARAMETER
EXAMPLE VALUE
RREF
0.47 Ω
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8.2.1.2 Detailed Design Procedure
The status output of the LED driver (ST) detects an open-load condition, enabling supervision of correct LED
operation. A voltage drop at the shunt resistor (RREF) below 25 mV (typical) detects an LED failure. In this case,
the status output pin (ST) goes low after a delay time adjustable by an optional capacitor connected to pin D.
Figure 7 shows the functionality and timing of ST and PWM. One can adjust the status delay through the
capacitor connected to pin D. Delay time scales linearly with the capacitance, CD:
CD
t STHL,typ +
10 ms
47 nF
(2)
CD
t STLH,typ +
10 ms
47 nF
(3)
Open
Load
VPWM
Open
Load
VPWM,H
VPWM,L
IQ
t
tPWM,ON
tPWM,OFF
IQ,nom
70%
30%
t
VD
tSTHL
VLD
t
VST
t
Figure 7. Function and Timing Diagram
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8.2.1.3 Application Curves
Figure 8. Start-Up Waveform
Figure 9. 50% Duty Cycle Waveform
8.2.2 Stoplight and Taillight Application
For many automobiles, the same set of LEDs illuminates both taillights and stop lights. Thus, the LEDs must
operate at two different brightness levels, full brightness for the stoplight and 10% to 25% brightness for the
taillight. The easiest way to achieve the different brightness is dimming by pulse-width modulation (PWM), which
holds the color spectrum of the LED over its whole brightness range. The maximum current that passes through
the LED is programmable by sense resistor RREF.
TL4242-Q1
Q
STOP
PWM
REF
Vin
TAIL
LED
Dragon
TLC555-Q1
VDD
OUT
RREF
Figure 10. Stoplight and Taillight Application Circuit
8.2.2.1 Design Requirements
DESIGN PARAMETER
EXAMPLE VALUE
RREF
1Ω
8.2.2.2 Detailed Design Procedure
Obtain the maximum current, IQmax, that passes through the LEDs by Equation 4:
VREF
I Qmax =
R REF
(4)
For example, if RREF equals 1 Ω, as VREF is a fixed value range from 168 mV to 185 mV, IQmax should be 168 mA
to 185 mA.
Figure 10 shows the application circuit of the stoplight and taillight including an automotive-qualified timer,
TLC555-Q1, the duty cycle of which is programmable by two external resistors. One can see that driving the
STOP signal high pulls the PWM pin constantly high, creating 100% duty cycle. Thus the LEDs operate at full
brightness. When the TAIL signal is high, the LEDs operate at 25% brightness because the TLC555-Q1 timer is
programmed at a fixed duty cycle of 25%.
12
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8.2.2.3 Application Curves
Figure 11. Stoplight Waveform
Figure 12. Taillight Waveform
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9 Power Supply Recommendations
It is recommended to put a 4.7-µF ceramic capacitor on the input pin. Also a 0.1-µF bypass capacitor can be put
at input pin for noise filtering. Input voltage should be between 4.5 V and 42 V.
10 Layout
10.1 Layout Guidelines
In order to prevent thermal shutdown, TJ must be less than 150ºC. If the input voltage is very high, the power
dissipation might be large. Currently there is the KTT (TO-263) package which has good thermal impedance, but
at the same time, the PCB layout is also very important. Good PCB design can optimize heat transfer, which is
absolutely essential for the long-term reliability of the device.
• Maximize the copper coverage on the PCB to increase the thermal conductivity of the board, because the
major heat-flow path from the package to the ambient is through the copper on the PCB. Maximum copper is
extremely important when there are not any heat sinks attached to the PCB on the other side of the package.
• Add as many thermal vias as possible directly under the package ground pad to optimize the thermal
conductivity of the board.
• All thermal vias should be either plated shut or plugged and capped on both sides of the board to prevent
solder voids. To ensure reliability and performance, the solder coverage should be at least 85 percent.
10.2 Layout Example
PWM
I
ST
NC
GND
Q
REF
D
Figure 13. TL4242-Q1 WSON Board Layout Diagram
14
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Layout Example (continued)
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Figure 14. TL4242-Q1 TO-263 Board Layout Diagram
10.3 Thermal Considerations
This device operates a thermal shutdown (TSD) circuit as a protection from overheating. For continuous normal
operation, the junction temperature should not exceed the thermal-shutdown trip point. If the junction temperature
exceeds the thermal-shutdown threshold, the output turns off. When the junction temperature falls below the
thermal-shutdown threshold, the output turns on again.
Calculate the power dissipated by the device according to Equation 5:
P = (VI - VO ) ´ I O + VI ´ I Q
(5)
In the formula, VI represents the input voltage of the device, VO stands for the output voltage, IO means the
output current of the LEDs, and IQ is the quiescent current dissipated by the device. The very small value of IQ
sometimes allows one to neglect it.
After determining the power dissipated by the device, calculate the junction temperature from the ambient
temperature and the device thermal impedance.
TJ = TA + RqJA ´ P
(6)
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11 Device and Documentation Support
11.1 Receiving Notification of Documentation Updates
To receive notification of documentation updates, navigate to the device product folder on ti.com. In the upper
right corner, click on Alert me to register and receive a weekly digest of any product information that has
changed. For change details, review the revision history included in any revised document.
11.2 Community Resources
The following links connect to TI community resources. Linked contents are provided "AS IS" by the respective
contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of
Use.
TI E2E™ Online Community TI's Engineer-to-Engineer (E2E) Community. Created to foster collaboration
among engineers. At e2e.ti.com, you can ask questions, share knowledge, explore ideas and help
solve problems with fellow engineers.
Design Support TI's Design Support Quickly find helpful E2E forums along with design support tools and
contact information for technical support.
11.3 Trademarks
E2E is a trademark of Texas Instruments.
All other trademarks are the property of their respective owners.
11.4 Electrostatic Discharge Caution
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
11.5 Glossary
SLYZ022 — TI Glossary.
This glossary lists and explains terms, acronyms, and definitions.
12 Mechanical, Packaging, and Orderable Information
The following pages include mechanical, packaging, and orderable information. This information is the mostcurrent data available for the designated devices. This data is subject to change without notice and without
revision of this document. For browser-based versions of this data sheet, see the left-hand navigation pane.
16
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Copyright © 2010–2017, Texas Instruments Incorporated
Product Folder Links: TL4242-Q1
PACKAGE OPTION ADDENDUM
www.ti.com
10-Dec-2020
PACKAGING INFORMATION
Orderable Device
Status
(1)
Package Type Package Pins Package
Drawing
Qty
Eco Plan
(2)
Lead finish/
Ball material
MSL Peak Temp
Op Temp (°C)
Device Marking
(3)
(4/5)
(6)
TL4242QKTTRQ1
ACTIVE
DDPAK/
TO-263
KTT
7
500
RoHS & Green
SN
Level-3-245C-168 HR
-40 to 125
TL4242Q
TL4242TDRJRQ1
ACTIVE
SON
DRJ
8
3000
RoHS & Green
NIPDAU
Level-3-260C-168 HR
-40 to 105
4242T
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance
do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may
reference these types of products as "Pb-Free".
RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.
Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of
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