TLV810SDBZR

TLV810M, TLV810R TLV810S, TLV810Z SBVS158A – APRIL 2011 – REVISED JUNE 2011 www.ti.com 3-Pin Voltage Supervisors with Active-High, Push-Pull Reset Check for Samples: TLV810M, TLV810R, TLV810S, TLV810Z FEATURES DESCRIPTION • • • The TLV810 family of supervisory circuits provides circuit initialization and timing supervision, primarily for DSPs and processor-based systems. 1 2 • • • • 3-Pin SOT23 Package Supply Current: 9 µA (Typical) Precision Supply Voltage Monitor: 2.5 V, 3 V, 3.3 V, 5 V Power-On Reset Generator with Fixed Delay Time of 200 ms Pin-for-Pin Compatible with MAX810 Temperature Range: –40°C to +125°C Push-Pull, RESET Output APPLICATIONS • • • • • • • • DSPs, Microcontrollers, and Microprocessors Wireless Communication Systems Portable/Battery-Powered Equipment Programmable Controls Intelligent Instruments Industrial Equipment Notebook and Desktop Computers Automotive Systems During power-on, RESET is asserted when the supply voltage (VDD) becomes higher than 1.1 V. Thereafter, the supervisory circuit monitors VDD and keeps RESET active as long as VDD remains below the threshold voltage VIT. An internal timer delays the return of the output to the inactive state (low) to ensure proper system reset. The delay time (td(typ) = 200 ms) starts after VDD has risen above the threshold voltage, VIT. When the supply voltage drops below the VIT threshold voltage, the output becomes active (high) again. No external components are required. All the devices in this family have a fixed sense-threshold voltage (VIT) set by an internal voltage divider. The product spectrum is designed for supply voltages of 2.5 V, 3 V, 3.3 V, and 5 V. The circuits are available in a 3-pin SOT-23 package. The TLV810 devices are characterized for operation over a temperature range of –40°C to +125°C. DEVICE FAMILY COMPARISON DEVICE FUNCTION TLV803 Open-Drain, RESET Output TLV809 Push-Pull, RESET Output TLV810 Push-Pull, RESET Output TYPICAL APPLICATION 3.3-V LDO 3.3 V 5V OUT IN GND VDD TLV810 DBZ Package (Top View) VDD DSP/FPGA/ASIC TLV810S GND 1 RESET RESET GND 3 RESET VDD GND 2 1 2 Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. All trademarks are the property of their respective owners. PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. Copyright © 2011, Texas Instruments Incorporated TLV810M, TLV810R TLV810S, TLV810Z SBVS158A – APRIL 2011 – REVISED JUNE 2011 www.ti.com This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage. ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications. PACKAGE/ORDERING INFORMATION (1) PRODUCT THRESHOLD VOLTAGE PACKAGELEAD PACKAGE DESIGNATOR SPECIFIED OPERATING TEMPERATURE PACKAGE MARKING TLV810Z 2.25 V SOT23-3 DBZ –40°C to +125°C VOVQ TLV810R TLV810S TLV810M (1) 2.64 V 2.93 V 4.38 V SOT23-3 SOT23-3 SOT23-3 –40°C to +125°C DBZ –40°C to +125°C DBZ –40°C to +125°C DBZ VOWQ VOXQ VOYQ ORDERING INFORMATION TRANSPORT MEDIA, QUANTITY TLV810ZDBZR Tape and Reel, 3000 TLV810ZDBZT Tape and Reel, 250 TLV810RDBZR Tape and Reel, 3000 TLV810RDBZT Tape and Reel, 250 TLV810SDBZR Tape and Reel, 3000 TLV810SDBZT Tape and Reel, 250 TLV810MDBZR Tape and Reel, 3000 TLV810MDBZT Tape and Reel, 250 For the most current package and ordering information, see the Package Option Addendum at the end of this data sheet, or visit the device product folders at www.ti.com. ABSOLUTE MAXIMUM RATINGS (1) Over operating free-air temperature range (unless otherwise noted). VALUE Voltage VDD (2) All other pins (2) MIN MAX 0 7 –0.3 7 V 5 mA Maximum low output current, IOL Current Temperature (2) V –5 mA Input clamp current, IIK (VI < 0 or VI > VDD) ±20 mA Output clamp current, IOK (VO < 0 or VO > VDD) ±20 mA Maximum high output current, IOH Operating free-air temperature range, TA –40 +125 °C Storage temperature range, Tstg –65 +150 °C +260 °C Soldering temperature (1) UNIT Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. All voltage values are with respect to GND. For reliable operation the device should not be operated at 7 V for more than t = 1000h continuously. THERMAL INFORMATION TLV810 THERMAL METRIC (1) DBZ UNITS 3 PINS θJA Junction-to-ambient thermal resistance 286.9 θJCtop Junction-to-case (top) thermal resistance 105.6 θJB Junction-to-board thermal resistance 124.4 ψJT Junction-to-top characterization parameter 25.8 ψJB Junction-to-board characterization parameter 107.9 θJCbot Junction-to-case (bottom) thermal resistance — (1) 2 °C/W For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953. Copyright © 2011, Texas Instruments Incorporated TLV810M, TLV810R TLV810S, TLV810Z SBVS158A – APRIL 2011 – REVISED JUNE 2011 www.ti.com RECOMMENDED OPERATING CONDITIONS At specified temperature range (unless otherwise noted). MIN MAX UNIT VDD Supply voltage 1.1 6 V TA Operating free-air temperature range –40 +125 °C ELECTRICAL CHARACTERISTICS Over recommended operating free-air temperature range (unless otherwise noted). PARAMETER VOH VOL High-level output voltage Low-level output voltage TEST CONDITIONS MIN VDD = 2.0 V to 6 V, IOH = –500 µA VDD – 0.2 VDD = 3.3 V, IOH = –2 mA VDD – 0.4 VDD = 6 V, IOH = –4 mA, TA = –40°C to +85°C VDD – 0.4 VDD = 6 V, IOH = –4 mA, TA = +85°C to +125°C VDD – 0.5 TYP VDD = 2.5 V to 6 V, IOL = 500 µA 0.2 VDD = 3.3 V, IOL = 2 mA 0.4 VIT– Negative-going input threshold voltage (2) VOH ≥ VDD – 0.2 V, IOH = –50 µA Vhys Hysteresis 2.25 2.30 TLV810R 2.58 2.64 2.70 TLV810S 2.87 2.93 2.99 TLV810M 4.28 4.38 4.48 TLV810S (1) (2) Supply current V 30 IOH = –50 µA, TA = +25°C TLV810M IDD V 2.20 TLV810R V 0.4 1.1 TLV810Z TLV810Z UNIT V VDD = 6 V, IOL = 4 mA Power-up reset voltage (1) MAX 35 mV 40 60 VDD = 2 V, output unconnected 9 15 VDD = 6 V, output unconnected 20 30 µA The lowest supply voltage at which RESET becomes valid. tr, VDD ≤ 66.7 ms/V. To ensure best stability of the threshold voltage, a bypass capacitor ( 0.1-µF ceramic) should be placed near the supply terminals. Copyright © 2011, Texas Instruments Incorporated 3 TLV810M, TLV810R TLV810S, TLV810Z SBVS158A – APRIL 2011 – REVISED JUNE 2011 www.ti.com SWITCHING CHARACTERISTICS At TA = +25°C, unless otherwise noted. PARAMETER TEST CONDITIONS tw Pulse width at VDD VDD = 1.08 VIT– to 0.92 VIT– td Delay time VDD ≥ VIT– + 0.2 V; see Timing Diagram MIN TYP 120 200 MAX UNIT 280 ms µs 1 TIMING DIAGRAM VIT- + Vhys VIT- VDD 1.1 V 1.1 V RESET td Valid Output FUNCTIONAL BLOCK DIAGRAM TLV810 VDD R1 _ VDD + R2 Reset Logic + Timer (1) RESET (1) GND Reference Voltage of 1.137 V (1) 4 Oscillator Parasitic diode. Copyright © 2011, Texas Instruments Incorporated TLV810M, TLV810R TLV810S, TLV810Z SBVS158A – APRIL 2011 – REVISED JUNE 2011 www.ti.com TYPICAL CHARACTERISTICS At TA = +25°C, VIT– = 4.38 V, and VDD = 5.0 V, unless otherwise noted. LOW-LEVEL OUTPUT VOLTAGE vs LOW-LEVEL OUTPUT CURRENT SUPPLY CURRENT vs SUPPLY VOLTAGE 1.2 25 +125°C +85°C +25°C 0°C -40°C 1 20 IDD (mA) VOL (V) 0.8 +125°C +85°C +25°C 0°C -40°C 0.6 15 10 0.4 5 0.2 VDD = 2.5 V 0 0 0 1 2 3 4 5 0 1 2 IOL (mA) 5 6 Figure 2. HIGH-LEVEL OUTPUT VOLTAGE vs HIGH-LEVEL OUTPUT CURRENT NORMALIZED INPUT THRESHOLD VOLTAGE vs FREE-AIR TEMPERATURE AT VDD 1.001 VDD = 2.5 V 1 Normalized VIT- (V) 2.5 2 VOH (V) 4 Figure 1. 3 1.5 +125°C +85°C +25°C 0°C -40°C 1 0.5 0.999 0.998 0.997 0.996 0.995 0 0.994 0 -1 -2 -3 -4 -5 -40 -25 -10 5 IOH (mA) 20 35 50 65 Temperature (°C) Figure 3. Figure 4. MINIMUM PULSE DURATION AT VDD vs VDD THRESHOLD OVERDRIVE VOLTAGE (TLV810M) DELAY TIME vs TEMPERATURE 1.6 80 95 110 125 80 95 110 125 230 1.4 220 1.2 210 1 td (ms) Minimum Pulse Duration at VDD (ms) 3 VDD (V) 0.8 0.6 +125°C +85°C +25°C 0°C -40°C 0.4 0.2 200 190 180 170 0 0 0.5 1 1.5 (VIT-) - VDD (V) Figure 5. Copyright © 2011, Texas Instruments Incorporated 2 2.5 -40 -25 -10 5 20 35 50 65 Temperature (°C) Figure 6. 5 TLV810M, TLV810R TLV810S, TLV810Z SBVS158A – APRIL 2011 – REVISED JUNE 2011 www.ti.com APPLICATION INFORMATION VDD TRANSIENT REJECTION The TLV810 has built-in rejection of fast transients on the VDD pin. The rejection of transients depends on both the duration and the amplitude of the transient. The amplitude of the transient is measured from the bottom of the transient to the negative threshold voltage of the TLV810, as shown in Figure 7. VDD VITTransient Amplitude tw Duration Figure 7. Voltage Transient Measurement The TLV810 does not respond to transients that are fast duration/low amplitude or long duration/small amplitude. Figure 5 shows the relationship between the transient amplitude and the duration needed to trigger a reset. Any combination of duration and amplitude above the curve generates a reset signal. RESET DURING POWER UP/DOWN The TLV810 output is valid when VDD is greater than 1.1 V. When VDD is less than 1.1 V, the output is undefined. Figure 8 shows a typical waveform for the power-up sequence. VIT- + Vhys VDD 1.1 V RESET td Valid Output Figure 8. Power-Up Response 6 Copyright © 2011, Texas Instruments Incorporated TLV810M, TLV810R TLV810S, TLV810Z SBVS158A – APRIL 2011 – REVISED JUNE 2011 www.ti.com BIDIRECTIONAL RESET PINS Some microcontrollers have bidirectional reset pins that act as both inputs and outputs. In a situation where both the TLV810 and the microcontroller are attempting to drive the RESET line, a series resistor should be placed between the output of the TLV810 and the RESET pin of the microcontroller to protect against excessive current flow. Figure 9 shows the connection of the TLV810 to a microcontroller using a series resistor to drive a bidirectional RESET line. 3.3 V VCC VDD Microprocessor TLV810S RESET 47 kW RST GND Figure 9. Connection to Bidirectional Reset Pin Copyright © 2011, Texas Instruments Incorporated 7 PACKAGE OPTION ADDENDUM www.ti.com 15-Jul-2022 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Pins Package Drawing Qty Eco Plan (2) Lead finish/ Ball material MSL Peak Temp Op Temp (°C) Device Marking (3) (4/5) (6) TLV810MDBZR LIFEBUY SOT-23 DBZ 3 3000 RoHS & Green NIPDAUAG Level-1-260C-UNLIM -40 to 125 VOYQ TLV810MDBZT LIFEBUY SOT-23 DBZ 3 250 RoHS & Green NIPDAUAG Level-1-260C-UNLIM -40 to 125 VOYQ TLV810RDBZR LIFEBUY SOT-23 DBZ 3 3000 RoHS & Green NIPDAUAG Level-1-260C-UNLIM -40 to 125 VOWQ TLV810RDBZT LIFEBUY SOT-23 DBZ 3 250 RoHS & Green NIPDAUAG Level-1-260C-UNLIM -40 to 125 VOWQ TLV810SDBZR LIFEBUY SOT-23 DBZ 3 3000 RoHS & Green NIPDAUAG Level-1-260C-UNLIM -40 to 125 VOXQ TLV810SDBZT LIFEBUY SOT-23 DBZ 3 250 RoHS & Green NIPDAUAG Level-1-260C-UNLIM -40 to 125 VOXQ TLV810ZDBZR LIFEBUY SOT-23 DBZ 3 3000 RoHS & Green NIPDAUAG Level-1-260C-UNLIM -40 to 125 VOVQ TLV810ZDBZT LIFEBUY SOT-23 DBZ 3 250 RoHS & Green NIPDAUAG Level-1-260C-UNLIM -40 to 125 VOVQ (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may reference these types of products as "Pb-Free". RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption. Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of