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TMP102AIDRLR

TMP102AIDRLR

  • 厂商:

    BURR-BROWN(德州仪器)

  • 封装:

    SOT563-6

  • 描述:

    温湿度传感器 SOT-563 1.4~3.6V 10µA

  • 数据手册
  • 价格&库存
TMP102AIDRLR 数据手册
Order Now Product Folder Support & Community Tools & Software Technical Documents Reference Design TMP102 SBOS397H – AUGUST 2007 – REVISED DECEMBER 2018 TMP102 Low-Power Digital Temperature Sensor With SMBus and Two-Wire Serial Interface in SOT563 1 Features 3 Description • The TMP102 device is a digital temperature sensor ideal for NTC/PTC thermistor replacement where high accuracy is required. The device offers an accuracy of ±0.5°C without requiring calibration or external component signal conditioning. Device temperature sensors are highly linear and do not require complex calculations or lookup tables to derive the temperature. The on-chip 12-bit ADC offers resolutions down to 0.0625°C. 1 • • • • • • SOT563 Package (1.6-mm × 1.6-mm) is a 68% Smaller Footprint than SOT-23 Accuracy Without Calibration: – 2.0°C (max) from –25°C to 85°C – 3.0°C (max) from –40°C to 125°C Low Quiescent Current: – 10-μA Active (max) – 1-μA Shutdown (max) Supply Range: 1.4 to 3.6 V Resolution: 12 Bits Digital Output: SMBus, Two-Wire, and I2C Interface Compatibility NIST Traceable 2 Applications • • • • • • • • • The 1.6-mm × 1.6-mm SOT563 package is 68% smaller footprint than an SOT-23 package. The TMP102 device features SMBus™, two-wire and I2C interface compatibility, and allows up to four devices on one bus. The device also features an SMBus alert function. The device is specified to operate over supply voltages from 1.4 to 3.6 V with the maximum quiescent current of 10 µA over the full operating range. The TMP102 device is ideal for extended temperature measurement in a variety of communication, computer, consumer, environmental, industrial, and instrumentation applications. The device is specified for operation over a temperature range of –40°C to 125°C. Portable and Battery-Powered Applications Power-supply Temperature Monitoring Computer Peripheral Thermal Protection Notebook Computers Battery Management Office Machines Thermostat Controls Electromechanical Device Temperatures General Temperature Measurements: – Industrial Controls – Test Equipment – Medical Instrumentations The TMP102 production units are 100% tested against sensors that are NIST-traceable and are verified with equipment that are NIST-traceable through ISO/IEC 17025 accredited calibrations. Device Information(1) PART NUMBER TMP102 PACKAGE BODY SIZE (NOM) SOT563 (6) 1.60 mm × 1.20 mm (1) For all available packages, see the orderable addendum at the end of the data sheet. Simplified Schematic Supply Voltage 1.4 V to 3.6 V Supply Bypass Capacitor Pullup Resistors Block Diagram Temperature 0.01 µF 5k SCL 1 Diode Temp. Sensor Control Logic 6 DS A/D Converter Serial Interface 5 OSC Config. and Temp. Register SDA TMP102 Two-Wire Host Controller 1 2 3 SCL GND ALERT SDA V+ 6 GND 2 V+ 5 4 ADD0 ALERT 3 4 ADD0 1 An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications, intellectual property matters and other important disclaimers. PRODUCTION DATA. TMP102 SBOS397H – AUGUST 2007 – REVISED DECEMBER 2018 www.ti.com Table of Contents 1 2 3 4 5 6 7 Features .................................................................. Applications ........................................................... Description ............................................................. Revision History..................................................... Pin Configuration and Functions ......................... Specifications......................................................... 1 1 1 2 4 4 6.1 6.2 6.3 6.4 6.5 6.6 6.7 4 4 5 5 5 6 7 Absolute Maximum Ratings ..................................... Handling Ratings....................................................... Recommended Operating Conditions....................... Thermal Information .................................................. Electrical Characteristics........................................... Timing Requirements ............................................... Typical Characteristics .............................................. Detailed Description .............................................. 8 7.1 Overview ................................................................... 8 7.2 Functional Block Diagram ......................................... 8 7.3 Feature Description................................................... 8 7.4 Device Functional Modes........................................ 14 7.5 Programming........................................................... 15 8 Application and Implementation ........................ 21 8.1 Application Information............................................ 21 8.2 Typical Application .................................................. 21 9 Power Supply Recommendations...................... 23 10 Layout................................................................... 23 10.1 Layout Guidelines ................................................. 23 10.2 Layout Example .................................................... 23 11 Device and Documentation Support ................. 24 11.1 11.2 11.3 11.4 11.5 11.6 Documentation Support ....................................... Receiving Notification of Documentation Updates Community Resources.......................................... Trademarks ........................................................... Electrostatic Discharge Caution ............................ Glossary ................................................................ 24 24 24 24 24 24 12 Mechanical, Packaging, and Orderable Information ........................................................... 24 4 Revision History NOTE: Page numbers for previous revisions may differ from page numbers in the current version. Changes from Revision G (September 2018) to Revision H Page • Changed Absolute Maximum Ratings for voltage at SCL, SDA and ADD0 pin ..................................................................... 4 • Changed Absolute Maximum Ratings for voltage at ALERT pin............................................................................................ 4 Changes from Revision F (September 2018) to Revision G Page • Changed input voltage maximum value from: 3.6 V to: 4 V................................................................................................... 4 • Changed output voltage maximum value from: 3.6 V to: ((V+) + 0.5) and ≤ 4 V ................................................................... 4 • Changed Junction-to-ambient thermal resistance from 200 °C/W to 210.3 °C/W ................................................................. 5 • Changed Junction-to-case (top) thermal resistance from 73.7 °C/W to 105.0 °C/W ............................................................. 5 • Changed Junction-to-board thermal resistance from 34.4 °C/W to 87.5 °C/W ...................................................................... 5 • Changed Junction-to-top characterization parameter from 3.1 °C/W to 6.1 °C/W ................................................................. 5 • Changed Junction-to-board characterization parameter from 34.2 °C/W to 87.0 °C/W......................................................... 5 • Added the Receiving Notification of Documentation Updates section ................................................................................ 24 Changes from Revision E (April 2015) to Revision F Page • Added TI Design .................................................................................................................................................................... 1 • Added NIST Features bullet .................................................................................................................................................. 1 • Added last paragraph of Description section ......................................................................................................................... 1 Changes from Revision D (December 2014) to Revision E Page • Changed the MAX value for the Supply voltage from 3.6 to 4 in the Absolute Maximum Ratings table ............................... 4 • Changed MIN, TYP, and MAX values for the Temperature Accuracy (temperature error) parameter .................................. 5 • Changed the frequency from 2.85 to 3.4 MHz in the POWER SUPPLY section of the Electrical Characteristics table ....... 6 • Changed the Temperature Error vs Temperature graph in the Typical Characteristics section ............................................ 7 2 Submit Documentation Feedback Copyright © 2007–2018, Texas Instruments Incorporated Product Folder Links: TMP102 TMP102 www.ti.com • SBOS397H – AUGUST 2007 – REVISED DECEMBER 2018 Changed the Temperature Error at 25°C graph in the Typical Characteristics section ......................................................... 7 Changes from Revision C (October 2012) to Revision D Page • Added Handling Rating table, Feature Description section, Device Functional Modes, Application and Implementation section, Power Supply Recommendations section, Layout section, Device and Documentation Support section, and Mechanical, Packaging, and Orderable Information section ............................................................... 4 • Changed parameters in Timing Requirements ...................................................................................................................... 6 Changes from Revision B (October 2008) to Revision C • Page Changed values for Data Hold Time parameter in Timing Requirements .......................................................................... 12 Submit Documentation Feedback Copyright © 2007–2018, Texas Instruments Incorporated Product Folder Links: TMP102 3 TMP102 SBOS397H – AUGUST 2007 – REVISED DECEMBER 2018 www.ti.com 5 Pin Configuration and Functions DRL Package 6-Pin SOT563 Top View 1 GND 2 ALERT 3 CBZ SCL 6 SDA 5 V+ 4 ADD0 Pin Functions PIN NO. NAME I/O DESCRIPTION 1 SCL I 2 GND — Serial clock. Open-drain output; requires a pullup resistor. Ground 3 ALERT O Overtemperature alert. Open-drain output; requires a pullup resistor. 4 ADD0 I Address select. Connect to GND or V+ 5 V+ I Supply voltage, 1.4 V to 3.6 V 6 SDA I/O Serial data. Open-drain output; requires a pullup resistor. 6 Specifications 6.1 Absolute Maximum Ratings over operating free-air temperature range (unless otherwise noted) (1) MIN MAX UNIT 4 V 4 V ((V+) + 0.3) and ≤ 4 V 150 °C 150 °C 150 °C Supply Voltage Voltage at SCL, SDA and ADD0 (2) –0.5 Voltage at ALERT Operating temperature –55 Junction temperature Storage temperature, Tstg (1) (2) –60 Stresses above these ratings may cause permanent damage. Exposure to absolute maximum conditions for extended periods may degrade device reliability. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those specified is not supported. Input voltage rating applies to all TMP102 input voltages. 6.2 Handling Ratings VALUE V(ESD) (1) (2) 4 Electrostatic discharge Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001 (1) ±2000 Charged-device model (CDM), per JEDEC specification JESD22-C101 (2) ±1000 Machine model (MM) ±200 UNIT V Level listed above is the passing level per ANSI, ESDA, and JEDEC JS-001. JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process. Level listed above is the passing level per EIA-JEDEC JESD22-C101. JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process. Submit Documentation Feedback Copyright © 2007–2018, Texas Instruments Incorporated Product Folder Links: TMP102 TMP102 www.ti.com SBOS397H – AUGUST 2007 – REVISED DECEMBER 2018 6.3 Recommended Operating Conditions over operating free-air temperature range (unless otherwise noted) MIN NOM 3.3 V+ Supply voltage 1.4 TA Operating free-air temperature –40 MAX UNIT 3.6 V 125 °C 6.4 Thermal Information TMP102 THERMAL METRIC (1) DRL (SOT563) UNIT 6 PINS RθJA Junction-to-ambient thermal resistance 210.3 °C/W RθJC(top) Junction-to-case (top) thermal resistance 105.0 °C/W RθJB Junction-to-board thermal resistance 87.5 °C/W ψJT Junction-to-top characterization parameter 6.1 °C/W ψJB Junction-to-board characterization parameter 87.0 °C/W (1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report (SPRA953). 6.5 Electrical Characteristics At TA = 25°C and VS = 1.4 to 3.6 V, unless otherwise noted. PARAMETER TEST CONDITIONS MIN TYP MAX UNIT 125 °C TEMPERATURE INPUT Range –40 Accuracy (temperature error) –25°C to 85°C –40°C to 125°C vs supply Resolution ±0.5 ±2 ±1 ±3 0.2 0.5 °C °C/V 0.0625 °C 3 pF DIGITAL INPUT/OUTPUT Input capacitance VIH Input logic high VIL Input logic low IIN Input current 3.6 –0.5 0.3 × (V+) V 1 μA 0 < VIN < 3.6 V SDA VOL 0.7 × (V+) Output logic ALERT V+ > 2 V, IOL = 3 mA 0 0.4 V+ < 2 V, IOL = 3 mA 0 0.2 × (V+) V+ > 2 V, IOL = 3 mA 0 0.4 V+ < 2 V, IOL = 3 mA 0 0.2 × (V+) Resolution 12 Conversion time 26 Conversion modes CR1 = 0, CR0 = 0 0.25 CR1 = 0, CR0 = 1 1 CR1 = 1, CR0 = 0 (default) 4 CR1 = 1, CR0 = 1 8 Timeout time 30 V V Bit 35 ms Conv/s 40 ms Submit Documentation Feedback Copyright © 2007–2018, Texas Instruments Incorporated Product Folder Links: TMP102 5 TMP102 SBOS397H – AUGUST 2007 – REVISED DECEMBER 2018 www.ti.com Electrical Characteristics (continued) At TA = 25°C and VS = 1.4 to 3.6 V, unless otherwise noted. PARAMETER TEST CONDITIONS MIN TYP MAX UNIT +3.6 V POWER SUPPLY Operating supply range IQ ISD Average quiescent current Shutdown current +1.4 Serial bus inactive, CR1 = 1, CR0 = 0 (default) 7 Serial bus active, SCL frequency = 400 kHz 15 Serial bus active, SCL frequency = 3.4 MHz 85 Serial bus inactive 0.5 Serial bus active, SCL frequency = 400 kHz 10 Serial bus active, SCL frequency = 3.4 MHz 80 10 μA 1 μA TEMPERATURE Specified range –40 125 °C Operating range –55 150 °C 6.6 Timing Requirements See the Timing Diagrams section for additional information. FAST MODE MIN V+ 0.001 TYP HIGH-SPEED MODE MAX MIN 0.4 0.001 TYP MAX UNIT ƒ(SCL) SCL operating frequency t(BUF) Bus-free time between STOP and START condition 2.85 MHz 600 160 ns t(HDSTA) Hold time after repeated START condition. After this period, the first clock is generated. 600 160 ns t(SUSTA) repeated start condition setup time 600 160 ns t(SUSTO) STOP condition setup time 600 160 ns t(HDDAT) Data hold time 100 t(SUDAT) Data setup time 100 25 ns t(LOW) SCL-clock low period V+ , see Figure 7 1300 210 ns t(HIGH) SCL-clock high period See Figure 7 600 60 ns tFD Data fall time See Figure 7 300 See Figure 7 300 ns 1000 ns See Figure 7 900 25 105 80 ns ns tRD Data rise time SCLK ≤ 100 kHz, see Figure 7 tFC Clock fall time See Figure 7 300 40 ns tRC Clock rise time See Figure 7 300 40 ns 6 Submit Documentation Feedback Copyright © 2007–2018, Texas Instruments Incorporated Product Folder Links: TMP102 TMP102 www.ti.com SBOS397H – AUGUST 2007 – REVISED DECEMBER 2018 6.7 Typical Characteristics 20 10 18 9 16 8 14 7 12 10 ISD (μA) IQ (μA) At TA = 25°C and V+ = 3.3 V, unless otherwise noted. 3.6 V Supply 8 6 6 5 3.6 V Supply 4 3 4 1.4 V Supply 1.4 V Supply 2 2 1 0 -60 -40 -20 0 20 40 60 80 0 100 120 140 160 -60 Temperature (°C) -40 -20 0 20 40 60 80 100 120 140 160 Temperature (°C) Four conversions per second Figure 1. Average Quiescent Current vs Temperature 100 38 90 36 80 34 70 32 IQ (μA) 1.4 V Supply 30 60 50 40 28 26 24 20 22 10 +25 °C -55 °C 0 20 -40 -20 0 20 40 60 80 1k 100 120 140 160 100k 1M 10M Bus Frequency (Hz) Figure 3. Conversion Time vs Temperature Figure 4. Quiescent Current vs Bus Frequency (Temperature at 3.3-V Supply) 1 70 Mean Mean + 3 V Mean 3 V 0.8 0.6 60 50 Population 0.4 0.2 0 -0.2 40 30 20 -0.4 -0.6 D002 Figure 5. Temperature Error vs Temperature 0.4 0.3 0.2 0.1 0 0.35 140 0.25 120 0.15 100 0.05 20 40 60 80 Temperature (qC) -0.1 0 -0.05 -20 -0.2 -40 -0.15 0 -0.3 10 -0.8 -1 -60 10k Temperature (°C) -0.25 -60 Temperature Error (qC) +125 °C 30 3.6 V Supply -0.35 Conversion Time (ms) Figure 2. Shutdown Current vs Temperature 40 D001 Temperature Error (qC) Figure 6. Temperature Error at 25°C Submit Documentation Feedback Copyright © 2007–2018, Texas Instruments Incorporated Product Folder Links: TMP102 7 TMP102 SBOS397H – AUGUST 2007 – REVISED DECEMBER 2018 www.ti.com 7 Detailed Description 7.1 Overview The TMP102 device is a digital temperature sensor that is optimal for thermal-management and thermalprotection applications. The TMP102 device is two-wire, SMBus and I2C interface-compatible. The device is specified over an operating temperature range of –40°C to 125°C. See Functional Block Diagram for a block diagram of the TMP102 device. The temperature sensor in the TMP102 device is the chip itself. Thermal paths run through the package leads as well as the plastic package. The package leads provide the primary thermal path because of the lower thermal resistance of the metal. An alternative version of the TMP102 device is available. The TMP112 device has highest accuracy, the same micro-package, and is pin-to-pin compatible. Table 1. Advantages of TMP112 versus TMP102 DEVICE COMPATIBLE INTERFACES PACKAGE SUPPLY CURRENT SUPPLY VOLTAGE (MIN) SUPPLY VOLTAGE (MAX) RESOLUTION LOCAL SENSOR ACCURACY (MAX) SPECIFIED CALIBRATION DRIFT SLOPE TMP112 I2C SMBus SOT563 1.2 × 1.6 × 0.6 10 µA 1.4 V 3.6 V 12 bit 0.0625°C 0.5°C: (0°C to 65°C) 1°C: (-40°C to 125°C) Yes TMP102 I2C SMBus SOT563 1.2 × 1.6 × 0.6 10 µA 1.4 V 3.6 V 12 bit 0.0625°C 2°C: (25°C to 85°C) 3°C: (-40°C to 125°C) No 7.2 Functional Block Diagram Temperature SCL GND ALERT 1 2 3 Diode Temp. Sensor Control Logic 6 DS A/D Converter Serial Interface 5 OSC Config. and Temp. Register 4 SDA V+ ADD0 7.3 Feature Description 7.3.1 Digital Temperature Output The digital output from each temperature measurement is stored in the read-only temperature register. The temperature register of the TMP102 device is configured as a 12-bit, read-only register (configuration register EM bit = 0, see the Extended Mode (EM) section), or as a 13-bit, read-only register (configuration register EM bit = 1) that stores the output of the most recent conversion. Two bytes must be read to obtain data and are listed in Table 8 and Table 9. Byte 1 is the most significant byte (MSB), followed by byte 2, the least significant byte (LSB). The first 12 bits (13 bits in extended mode) are used to indicate temperature. The least significant byte does not have to be read if that information is not needed. The data format for temperature is summarized in Table 2 and Table 3. One LSB equals 0.0625°C. Negative numbers are represented in binary twos-complement format. Following power-up or reset, the temperature register reads 0°C until the first conversion is complete. Bit D0 of byte 2 indicates normal mode (EM bit = 0) or extended mode (EM bit = 1) , and can be used to distinguish between the two temperature register data formats. The unused bits in the temperature register always read 0. 8 Submit Documentation Feedback Copyright © 2007–2018, Texas Instruments Incorporated Product Folder Links: TMP102 TMP102 www.ti.com SBOS397H – AUGUST 2007 – REVISED DECEMBER 2018 Feature Description (continued) Table 2. 12-Bit Temperature Data Format (1) (1) TEMPERATURE (°C) DIGITAL OUTPUT (BINARY) HEX 128 0111 1111 1111 7FF 127.9375 0111 1111 1111 7FF 100 0110 0100 0000 640 80 0101 0000 0000 500 75 0100 1011 0000 4B0 50 0011 0010 0000 320 25 0001 1001 0000 190 0.25 0000 0000 0100 004 0 0000 0000 0000 000 –0.25 1111 1111 1100 FFC –25 1110 0111 0000 E70 –55 1100 1001 0000 C90 The resolution for the Temp ADC in Internal Temperature mode is 0.0625°C/count. Table 2 does not list all temperatures. Use the following rules to obtain the digital data format for a given temperature or the temperature for a given digital data format. To convert positive temperatures to a digital data format: 1. Divide the temperature by the resolution 2. Convert the result to binary code with a 12-bit, left-justified format, and MSB = 0 to denote a positive sign. Example: (50°C) / (0.0625°C / LSB) = 800 = 320h = 0011 0010 0000 To convert a positive digital data format to temperature: 1. Convert the 12-bit, left-justified binary temperature result, with the MSB = 0 to denote a positive sign, to a decimal number. 2. Multiply the decimal number by the resolution to obtain the positive temperature. Example: 0011 0010 0000 = 320h = 800 × (0.0625°C / LSB) = 50°C To convert negative temperatures to a digital data format: 1. Divide the absolute value of the temperature by the resolution, and convert the result to binary code with a 12-bit, left-justified format. 2. Generate the twos complement of the result by complementing the binary number and adding one. Denote a negative number with MSB = 1. Example: (|–25°C|) / (0.0625°C / LSB) = 400 = 190h = 0001 1001 0000 Two's complement format: 1110 0110 1111 + 1 = 1110 0111 0000 To convert a negative digital data format to temperature: 1. Generate the twos compliment of the 12-bit, left-justified binary number of the temperature result (with MSB = 1, denoting negative temperature result) by complementing the binary number and adding one. This represents the binary number of the absolute value of the temperature. 2. Convert to decimal number and multiply by the resolution to get the absolute temperature, then multiply by –1 for the negative sign. Example: 1110 0111 0000 has twos compliment of 0001 1001 0000 = 0001 1000 1111 + 1 Convert to temperature: 0001 1001 0000 = 190h = 400; 400 × (0.0625°C / LSB) = 25°C = (|–25°C|); (|–25°C|) × (–1) = –25°C Submit Documentation Feedback Copyright © 2007–2018, Texas Instruments Incorporated Product Folder Links: TMP102 9 TMP102 SBOS397H – AUGUST 2007 – REVISED DECEMBER 2018 www.ti.com Table 3. 13-Bit Temperature Data Format TEMPERATURE (°C) DIGITAL OUTPUT (BINARY) HEX 150 0 1001 0110 0000 0960 128 0 1000 0000 0000 0800 127.9375 0 0111 1111 1111 07FF 100 0 0110 0100 0000 0640 80 0 0101 0000 0000 0500 75 0 0100 1011 0000 04B0 50 0 0011 0010 0000 0320 25 0 0001 1001 0000 0190 0.25 0 0000 0000 0100 0004 0 0 0000 0000 0000 0000 –0.25 1 1111 1111 1100 1FFC –25 1 1110 0111 0000 1E70 –55 1 1100 1001 0000 1C90 7.3.2 Serial Interface The TMP102 device operates as a slave device only on the two-wire bus and SMBus. Connections to the bus are made through the open-drain I/O lines, SDA and SCL. The SDA and SCL pins feature integrated spike suppression filters and Schmitt triggers to minimize the effects of input spikes and bus noise. The TMP102 device supports the transmission protocol for both fast (1 kHz to 400 kHz) and high-speed (1 kHz to 2.85 MHz) modes. All data bytes are transmitted MSB first. 7.3.3 Bus Overview The device that initiates the transfer is called a master, and the devices controlled by the master are called slaves. The bus must be controlled by a master device that generates the serial clock (SCL), controls the bus access, and generates the START and STOP conditions. To address a specific device, a START condition is initiated, indicated by pulling the data-line (SDA) from a high to low logic level when SCL is high. All slaves on the bus shift in the slave address byte on the rising edge of the clock, with the last bit indicating whether a read or write operation is intended. During the ninth clock pulse, the slave being addressed responds to the master by generating an acknowledge and by pulling SDA pin low. A data transfer is then initiated and sent over eight clock pulses followed by an acknowledge bit. During the data transfer the SDA pin must remain stable when SCL is high, because any change in SDA pin when SCL pin is high is interpreted as a START signal or STOP signal. When all data have been transferred, the master generates a STOP condition indicated by pulling SDA pin from low to high, when the SCL pin is high. 7.3.4 Serial Bus Address To communicate with the TMP102, the master must first address slave devices via a slave address byte. The slave address byte consists of seven address bits, and a direction bit indicating the intent of executing a read or write operation. The TMP102 features an address pin to allow up to four devices to be addressed on a single bus. Table 4 describes the pin logic levels used to properly connect up to four devices. 10 Submit Documentation Feedback Copyright © 2007–2018, Texas Instruments Incorporated Product Folder Links: TMP102 TMP102 www.ti.com SBOS397H – AUGUST 2007 – REVISED DECEMBER 2018 Table 4. Address Pin and Slave Addresses DEVICE TWO-WIRE ADDRESS A0 PIN CONNECTION 1001000 Ground 1001001 V+ 1001010 SDA 1001011 SCL 7.3.5 Writing and Reading Operation Accessing a particular register on the TMP102 device is accomplished by writing the appropriate value to the pointer register. The value for the pointer register is the first byte transferred after the slave address byte with the R/W bit low. Every write operation to the TMP102 device requires a value for the pointer register (see Figure 8). When reading from the TMP102 device, the last value stored in the pointer register by a write operation determines which register is read by a read operation. To change the register pointer for a read operation, a new value must be written to the pointer register. This action is accomplished by issuing a slave address byte with the R/W bit low, followed by the pointer register byte. No additional data are required. The master then generates a START condition and sends the slave address byte with the R/W bit high to initiate the read command. See Figure 7 for details of this sequence. If repeated reads from the same register are desired, continually sending the Pointer Register bytes is not necessary because the TMP102 remembers the Pointer Register value until it is changed by the next write operation. Register bytes are sent with the most significant byte first, followed by the least significant byte. 7.3.6 Slave Mode Operations The TMP102 can operate as a slave receiver or slave transmitter. As a slave device, the TMP102 never drives the SCL line. 7.3.6.1 Slave Receiver Mode The first byte transmitted by the master is the slave address, with the R/W bit low. The TMP102 then acknowledges reception of a valid address. The next byte transmitted by the master is the pointer register. The TMP102 then acknowledges reception of the pointer register byte. The next byte or bytes are written to the register addressed by the pointer register. The TMP102 acknowledges reception of each data byte. The master can terminate data transfer by generating a START or STOP condition.. 7.3.6.2 Slave Transmitter Mode The first byte transmitted by the master is the slave address, with the R/W bit high. The slave acknowledges reception of a valid slave address. The next byte is transmitted by the slave and is the most significant byte of the register indicated by the pointer register. The master acknowledges reception of the data byte. The next byte transmitted by the slave is the least significant byte. The master acknowledges reception of the data byte. The master terminates data transfer by generating a Not-Acknowledge on reception of any data byte, or generating a START or STOP condition. 7.3.7 SMBus Alert Function The TMP102 device supports the SMBus alert function. When the TMP102 device operates in Interrupt Mode (TM = 1), the ALERT pin can be connected as an SMBus alert signal. When a master senses that an ALERT condition is present on the ALERT line, the master sends an SMBus alert command (0001 1001) to the bus. If the ALERT pin is active, the device acknowledges the SMBus alert command and responds by returning the slave address on the SDA line. The eighth bit (LSB) of the slave address byte indicates if the ALERT condition was caused by the temperature exceeding THIGH or falling below TLOW. For POL = 0, the LSB is low if the temperature is greater than or equal to THIGH; this bit is high if the temperature is less than TLOW. The polarity of this bit is inverted if POL = 1. See Figure 10 for details of this sequence. If multiple devices on the bus respond to the SMBus alert command, arbitration during the slave address portion of the SMBus alert command determines which device clears the ALERT status. The device with the lowest twowire address wins the arbitration. If the TMP102 device wins the arbitration, its ALERT pin inactivates at the completion of the SMBus alert command. If the TMP102 device loses the arbitration, its ALERT pin remains active. Submit Documentation Feedback Copyright © 2007–2018, Texas Instruments Incorporated Product Folder Links: TMP102 11 TMP102 SBOS397H – AUGUST 2007 – REVISED DECEMBER 2018 www.ti.com 7.3.8 General Call The TMP102 device responds to a two-wire general call address (000 0000) if the eighth bit is 0. The device acknowledges the general call address and responds to commands in the second byte. If the second byte is 0000 0110, the TMP102 device internal registers are reset to power-up values. The TMP102 device does not support the general address acquire command. 7.3.9 High-Speed (HS) Mode In order for the two-wire bus to operate at frequencies above 400 kHz, the master device must issue an HSMode master code (0000 1xxx) as the first byte after a START condition to switch the bus to high-speed operation. The TMP102 device does not acknowledge this byte, but switches the input filters on SDA and SCL and the output filters on SDA to operate in HS-mode, allowing transfers of up to 2.85 MHz. After the HS-Mode master code has been issued, the master transmits a two-wire slave address to initiate a data transfer operation. The bus continues to operate in HS-Mode until a STOP condition occurs on the bus. Upon receiving the STOP condition, the TMP102 device switches the input and output filters back to fast-mode operation.. 7.3.10 Timeout Function The TMP102 device resets the serial interface if SCL is held low for 30 ms (typ) between a start and stop condition. The TMP102 device releases the SDA line if the SCL pin is pulled low and waits for a start condition from the host controller. To avoid activating the time-out function, maintaining a communication speed of at least 1 kHz for SCL operating frequency is necessary.. 7.3.11 Timing Diagrams The TMP102 device is two-wire, SMBus, and I2C-interface compatible. Figure 7, Figure 8, Figure 9, and Figure 10 list the various operations on the TMP102 device. Parameters for Figure 7 are defined in the Timing Requirements table. The bus definitions are defined as follows: Acknowledge Each receiving device, when addressed, is obliged to generate an acknowledge bit. A device that acknowledges must pull down the SDA line during the acknowledge clock pulse in such a way that the SDA line is stable low during the high period of the Acknowledge clock pulse. Setup and hold times must be taken into account. On a master receive, the termination of the data transfer can be signaled by the master generating a not-acknowledge (1) on the last byte that has been transmitted by the slave. Bus Idle Both SDA and SCL lines remain high. Data Transfer The number of data bytes transferred between a START and a STOP condition is not limited and is determined by the master device. The TMP102 device can also be used for single byte updates. To update only the MS byte, terminate the communication by issuing a START or STOP communication on the bus. Start Data Transfer A change in the state of the SDA line, from high to low, when the SCL line is high, defines a START condition. Each data transfer is initiated with a START condition. Stop Data Transfer A change in the state of the SDA line from low to high when the SCL line is high defines a STOP condition. Each data transfer is terminated with a repeated START or STOP condition. t(LOW) tFC t(HDSTA) tRC SCL t(HDSTA) t(HIGH) t(HDDAT) t(SUSTO) t(SUSTA) t(SUDAT) SDA t(BUF) P tRD S tFD S P Figure 7. Two-Wire Timing Diagram 12 Submit Documentation Feedback Copyright © 2007–2018, Texas Instruments Incorporated Product Folder Links: TMP102 TMP102 www.ti.com SBOS397H – AUGUST 2007 – REVISED DECEMBER 2018 1 9 1 9 SCL ¼ 1 SDA 0 0 1 0 A1(1) A0(1) 0 R/W Start By Master 0 0 0 0 0 P1 P0 ACK By Device ¼ ACK By Device Frame 2 Pointer Register Byte Frame 1 Two-Wire Slave Address Byte 1 9 1 9 SCL (Continued) SDA (Continued) D6 D7 D5 D4 D3 D2 D1 D7 D0 D6 D5 D4 D3 D2 D1 D0 ACK By Device ACK By Device Stop By Master Frame 4 Data Byte 2 Frame 3 Data Byte 1 NOTE: (1) The value of A0 and A1 are determined by the ADD0 pin. Figure 8. Two-Wire Timing Diagram for Write Word Format 1 9 1 9 SCL ¼ SDA 1 0 0 1 0 A1 (1) A0 (1) R/W Start By Master 0 0 0 0 0 0 P1 P0 ACK By Device ACK By Device Frame 1 Two-Wire Slave Address Byte Stop By Master Frame 2 Pointer Register Byte 1 9 1 9 SCL (Continued) ¼ SDA (Continued) 1 0 0 1 0 A1 (1) A0 (1) D7 R/W Start By Master D6 D5 ACK By Device Frame 3 Two-Wire Slave Address Byte 1 D4 D3 D2 D1 D0 From Device ¼ ACK By Master (2) Frame 4 Data Byte 1 Read Register 9 SCL (Continued) SDA (Continued) D7 D6 D5 D4 D3 D2 D1 D0 ACK By From Device Master (3) Stop By Master Frame 5 Data Byte 2 Read Register NOTE: (1) The value of A0 and A1 are determined by the ADD0 pin. (2) Master should leave SDA high to terminate a single-byte read operation. (3) Master should leave SDA high to terminate a two-byte read operation. Figure 9. Two-Wire Timing Diagram for Read Word Format Submit Documentation Feedback Copyright © 2007–2018, Texas Instruments Incorporated Product Folder Links: TMP102 13 TMP102 SBOS397H – AUGUST 2007 – REVISED DECEMBER 2018 www.ti.com ALERT 1 9 1 9 SCL SDA 0 0 0 1 1 0 0 1 R/W Start By Master 0 0 1 A1 ACK By Device Frame 1 SMBus ALERT Response Address Byte A0 Status From Device NACK By Master Stop By Master Frame 2 Slave Address From Device NOTE: (1) The value of A0 and A1 are determined by the ADD0 pin. Figure 10. Timing Diagram for SMBus Alert 7.4 Device Functional Modes 7.4.1 Continuos-Conversion Mode The default mode of the TMP102 device is continuos conversion mode. During continuos-conversion mode, the ADC performs continuos temperature conversions and stores each results to the temperature register, overwriting the result from the previous conversion. The conversion rate bits, CR1 and CR0, configure the TMP102 device for conversion rates of 0.25 Hz, 1 Hz, 4 Hz, or 8 Hz. The default rate is 4 Hz. The TMP102 device has a typical conversion time of 26 ms. To achieve different conversion rates, the TMP102 device makes a conversion and then powers down to wait for the appropriate delay set by CR1 and CR0. Table 5 lists the settings for CR1 and CR0. Table 5. Conversion Rate Settings CR1 CR0 CONVERSION RATE 0 0 0.25 Hz 0 1 1 Hz 1 0 4 Hz (default) 1 1 8 Hz After power-up or general-call reset, the TMP102 immediately starts a conversion, as shown in Figure 11. The first result is available after 26 ms (typical). The active quiescent current during conversion is 40 μA (typical at +27°C). The quiescent current during delay is 2.2 μA (typical at +27°C). Delay (1) 26ms 26ms Startup (1) Start of Conversion Delay is set by CR1 and CR0. Figure 11. Conversion Start 7.4.2 Extended Mode (EM) The Extended-Mode bit configures the device for Normal mode operation (EM = 0) or Extended mode operation (EM = 1). In Normal mode, the Temperature Register and high- and low-limit registers use a 12-bit data format. Normal mode is used to make the TMP102 device compatible with the TMP75 device. Extended mode (EM = 1) allows measurement of temperatures above 128°C by configuring the Temperature Register, and high- and low-limit registers for 13-bit data format. 14 Submit Documentation Feedback Copyright © 2007–2018, Texas Instruments Incorporated Product Folder Links: TMP102 TMP102 www.ti.com SBOS397H – AUGUST 2007 – REVISED DECEMBER 2018 7.4.3 Shutdown Mode (SD) The Shutdown-mode bit saves maximum power by shutting down all device circuitry other than the serial interface, reducing current consumption to typically less than 0.5 μA. Shutdown mode enables when the SD bit is 1; the device shuts down when current conversion is completed. When SD is equal to 0, the device maintains a continuous conversion state. 7.4.4 One-Shot/Conversion Ready (OS) The TMP102 device features a one-shot temperature measurement mode. When the device is in Shutdown Mode, writing a 1 to the OS bit starts a single temperature conversion. During the conversion, the OS bit reads '0'. The device returns to the shutdown state at the completion of the single conversion. After the conversion, the OS bit reads 1. This feature reduces power consumption in the TMP102 device when continuous temperature monitoring is not required. As a result of the short conversion time, the TMP102 device achieves a higher conversion rate. A single conversion typically takes 26 ms and a read can take place in less than 20 μs. When using One-Shot Mode, 30 or more conversions per second are possible. 7.4.5 Thermostat Mode (TM) The thermostat-mode bit indicates to the device whether to operate in comparator mode (TM = 0) or Interrupt mode (TM = 1). 7.4.5.1 Comparator Mode (TM = 0) In Comparator mode (TM = 0), the Alert pin is activated when the temperature equals or exceeds the value in the T(HIGH) register and remains active until the temperature falls below the value in the T(LOW)register. For more information on the comparator mode, see the High- and Low-Limit Registers section. 7.4.5.2 Interrupt Mode (TM = 1) In Interrupt mode (TM = 1), the Alert pin is activated when the temperature exceeds T(HIGH) or goes below T(LOW) registers. The Alert pin is cleared when the host controller reads the temperature register. For more information on the interrupt mode, see the High- and Low-Limit Registers section. 7.5 Programming 7.5.1 Pointer Register Figure 12 illustrates the internal register structure of the TMP102 device. The 8-bit Pointer Register of the device is used to address a given data register. The Pointer Register uses the two least-significant bytes (LSBs) (see Table 15 and Table 16) to identify which of the data registers must respond to a read or write command. Table 6 identifies the bits of the Pointer Register byte. During a write command, P2 through P7 must always be '0'. Table 7 describes the pointer address of the registers available in the TMP102 device. The power-up reset value of P1 and P0 is 00. By default, the TMP102 device reads the temperature on power up. Submit Documentation Feedback Copyright © 2007–2018, Texas Instruments Incorporated Product Folder Links: TMP102 15 TMP102 SBOS397H – AUGUST 2007 – REVISED DECEMBER 2018 www.ti.com Programming (continued) Pointer Register Temperature Register SCL Configuration Register I/O Control Interface TLOW Register SDA THIGH Register Figure 12. Internal Register Structure Table 6. Pointer Register Byte P7 P6 P5 0 0 0 P4 P3 P2 0 0 0 P1 P0 Register Bits Table 7. Pointer Addresses P1 P0 REGISTER 0 0 Temperature Register (Read Only) 0 1 Configuration Register (Read/Write) 1 0 TLOW Register (Read/Write) 1 1 THIGH Register (Read/Write) 7.5.2 Temperature Register The Temperature Register of the TMP102 is configured as a 12-bit, read-only register (Configuration Register EM bit = 0, see the Extended Mode section), or as a 13-bit, read-only register (Configuration Register EM bit = 1) that stores the output of the most recent conversion. Two bytes must be read to obtain data, and are described in Table 8 and Table 9. Note that byte 1 is the most significant byte, followed by byte 2, the least significant byte. The first 12 bits (13 bits in Extended mode) are used to indicate temperature. The least significant byte does not have to be read if that information is not needed. Table 8. Byte 1 of Temperature Register (1) (1) 16 D7 D6 D5 D4 D3 D2 D1 T11 T10 T9 T8 T7 T6 T5 D0 T4 (T12) (T11) (T10) (T9) (T8) (T7) (T6) (T5) Extended mode 13-bit configuration shown in parenthesis. Submit Documentation Feedback Copyright © 2007–2018, Texas Instruments Incorporated Product Folder Links: TMP102 TMP102 www.ti.com SBOS397H – AUGUST 2007 – REVISED DECEMBER 2018 Table 9. Byte 2 of Temperature Register (1) (1) D7 D6 D5 D4 D3 D2 D1 D0 T3 T2 T1 T0 0 0 0 0 (T4) (T3) (T2) (T1) (T0) (0) (0) (1) Extended mode 13-bit configuration shown in parenthesis. 7.5.3 Configuration Register The Configuration Register is a 16-bit read/write register used to store bits that control the operational modes of the temperature sensor. Read/write operations are performed MSB first. Table 10 and Table 11 list the format and the power-up or reset value of the configuration register. For compatibility, Table 10 and Table 11 correspond to the configuration register in the TMP75 device and TMP275 device (for more information see the device data sheets, SBOS288 and SBOS363, respectively). All registers are updated byte by byte. Table 10. Byte 1 of Configuration and Power-Up or Reset Format D7 D6 D5 D4 D3 D2 D1 D0 OS R1 R0 F1 F0 POL TM SD 0 1 1 0 0 0 0 0 Table 11. Byte 2 of Configuration and Power-Up or Reset Format D7 D6 D5 D4 D3 D2 D1 D0 CR1 CR0 AL EM 0 0 0 0 1 0 1 0 0 0 0 0 7.5.3.1 Shutdown Mode (SD) The Shutdown-mode bit saves maximum power by shutting down all device circuitry other than the serial interface, reducing current consumption to typically less than 0.5 μA. Shutdown mode enables when the SD bit is 1; the device shuts down when current conversion is completed. When SD is equal to 0, the device maintains a continuous conversion state 7.5.3.2 Thermostat Mode (TM) The Thermostat mode bit indicates to the device whether to operate in Comparator mode (TM = 0) or Interrupt mode (TM = 1). For more information on comparator and interrupt modes, see the High- and Low-Limit Registers section. 7.5.3.3 Polarity (POL) The polarity bit allows the user to adjust the polarity of the ALERT pin output. If the POL bit is set to 0 (default), the ALERT pin becomes active low. When the POL bit is set to 1, the ALERT pin becomes active high and the state of the ALERT pin is inverted. The operation of the ALERT pin in various modes is illustrated in Figure 13. Submit Documentation Feedback Copyright © 2007–2018, Texas Instruments Incorporated Product Folder Links: TMP102 17 TMP102 SBOS397H – AUGUST 2007 – REVISED DECEMBER 2018 www.ti.com THIGH Measured Temperature TLOW Device ALERT PIN (Comparator Mode) POL = 0 Device ALERT PIN (Interrupt Mode) POL = 0 Device ALERT PIN (Comparator Mode) POL = 1 Device ALERT PIN (Interrupt Mode) POL = 1 Read Read Read Time Figure 13. Output Transfer Function Diagrams 7.5.3.4 Fault Queue (F1/F0) A fault condition exists when the measured temperature exceeds the user-defined limits set in the THIGH and TLOW registers. Additionally, the number of fault conditions required to generate an alert may be programmed using the fault queue. The fault queue is provided to prevent a false alert as a result of environmental noise. The fault queue requires consecutive fault measurements in order to trigger the alert function. Table 12 defines the number of measured faults that may be programmed to trigger an alert condition in the device. For THIGH and TLOW register format and byte order, see the High- and Low-Limit Registers section. Table 12. TMP102 Fault Settings F1 F0 CONSECUTIVE FAULTS 0 0 1 0 1 2 1 0 4 1 1 6 7.5.3.5 Converter Resolution (R1/R0) The converter resolution bits, R1 and R0, are read-only bits. The TMP102 converter resolution is set at device start-up to 11 which sets the temperature register to a 12 bit-resolution. 7.5.3.6 One-Shot (OS) When the device is in Shutdown Mode, writing a 1 to the OS bit starts a single temperature conversion. During the conversion, the OS bit reads '0'. The device returns to the shutdown state at the completion of the single conversion. For more information on the one-shot conversion mode, see the One-Shot/Conversion Ready (OS) section. 7.5.3.7 EM Bit The Extended-Mode bit configures the device for Normal Mode operation (EM = 0) or Extended Mode operation (EM = 1). In normal mode, the temperature register, high-limit register, and low-limit register use a 12-bit data format. For more information on the extended mode, see the Extended Mode (EM) section. 18 Submit Documentation Feedback Copyright © 2007–2018, Texas Instruments Incorporated Product Folder Links: TMP102 TMP102 www.ti.com SBOS397H – AUGUST 2007 – REVISED DECEMBER 2018 7.5.3.8 Alert (AL Bit) The AL bit is a read-only function. Reading the AL bit provides information about the comparator mode status. The state of the POL bit inverts the polarity of data returned from the AL bit. When the POL bit equals 0, the AL bit reads as 1 until the temperature equals or exceeds T(HIGH) for the programmed number of consecutive faults, causing the AL bit to read as 0. The AL bit continues to read as 0 until the temperature falls below T(LOW) for the programmed number of consecutive faults, when it again reads as 1. The status of the TM bit does not affect the status of the AL bit.. 7.5.3.9 Conversion Rate (CR) The conversion rate bits, CR1 and CR0, configure the TMP102 device for conversion rates of 0.25 Hz, 1 Hz, 4 Hz, or 8 Hz. The default rate is 4 Hz. For more information on the conversion rate bits, see Table 5. 7.5.4 High- and Low-Limit Registers The temperature limits are stored in the T(LOW) and T(HIGH) registers in the same format as the temperature result, and their values are compared to the temperature result on every conversion. The outcome of the comparison drives the behavior of the ALERT pin, which operates as a comparator output or an interrupt, and is set by the TM bit in the configuration register. In Comparator mode (TM = 0), the ALERT pin becomes active when the temperature equals or exceeds the value in THIGH and generates a consecutive number of faults according to fault bits F1 and F0. The ALERT pin remains active until the temperature falls below the indicated TLOW value for the same number of faults. In Interrupt mode (TM = 1), the ALERT pin becomes active when the temperature equals or exceeds the value in THIGH for a consecutive number of fault conditions (as shown in Table 5). The ALERT pin remains active until a read operation of any register occurs, or the device successfully responds to the SMBus Alert Response address. The ALERT pin will also be cleared if the device is placed in Shutdown mode. When the ALERT pin is cleared, it becomes active again only when temperature falls below TLOW, and remains active until cleared by a read operation of any register or a successful response to the SMBus Alert Response address. When the ALERT pin is cleared, the above cycle repeats, with the ALERT pin becoming active when the temperature equals or exceeds THIGH. The ALERT pin can also be cleared by resetting the device with the General Call Reset command. This action also clears the state of the internal registers in the device, returning the device to Comparator mode (TM = 0). Both operational modes are represented in Figure 13. Table 13 through Table 16 describe the format for the THIGH and TLOW registers. Note that the most significant byte is sent first, followed by the least significant byte. Power-up reset values for THIGH and TLOW are: THIGH = +80°C and TLOW = +75°C. The format of the data for THIGH and TLOW is the same as for the Temperature Register. Table 13. Byte 1 Temperature Register (1) HIGH D7 D6 D5 D4 D3 D2 D1 D0 H11 H10 H9 H8 H7 H6 H5 H4 (H12) (H11) (H10) (H9) (H8) (H7) (H6) (H5) Extended mode 13-bit configuration shown in parenthesis. Table 14. Byte 2 Temperature Register HIGH D7 D6 D5 D4 D3 D2 D1 D0 H3 H2 H1 H0 0 0 0 0 (H4) (H3) (H2) (H1) (H0) (0) (0) (0) Table 15. Byte 1 Temperature Register (1) (1) LOW (1) D7 D6 D5 D4 D3 D2 D1 D0 L11 L10 L9 L8 L7 L6 L5 L4 (L12) (L11) (L10) (L9) (L8) (L7) (L6) (L5) Extended mode 13-bit configuration shown in parenthesis. Submit Documentation Feedback Copyright © 2007–2018, Texas Instruments Incorporated Product Folder Links: TMP102 19 TMP102 SBOS397H – AUGUST 2007 – REVISED DECEMBER 2018 www.ti.com Table 16. Byte 2 Temperature Register 20 LOW D7 D6 D5 D4 D3 D2 D1 D0 L3 L2 L1 L0 0 0 0 0 (L4) (L3) (L2) (L1) (L0) (0) (0) (0) Submit Documentation Feedback Copyright © 2007–2018, Texas Instruments Incorporated Product Folder Links: TMP102 TMP102 www.ti.com SBOS397H – AUGUST 2007 – REVISED DECEMBER 2018 8 Application and Implementation NOTE Information in the following applications sections is not part of the TI component specification, and TI does not warrant its accuracy or completeness. TI’s customers are responsible for determining suitability of components for their purposes. Customers should validate and test their design implementation to confirm system functionality. 8.1 Application Information The TMP102 device is used to measure the PCB temperature of the board location where the device is mounted. The programmable address options allow up to four locations on the board to be monitored on a single serial bus. 8.2 Typical Application Supply Voltage 1.4 V to 3.6 V Supply Bypass Capacitor Pullup Resistors 0.01 µF 5k TMP102 Two-Wire Host Controller 1 2 3 SCL SDA GND V+ ALERT 6 5 4 ADD0 Figure 14. Typical Connections 8.2.1 Design Requirements The TMP102 device requires pullup resistors on the SCL, SDA, and ALERT pins. The recommended value for the pullup resistors is 5-kΩ. In some applications the pullup resistor can be lower or higher than 5 kΩ but must not exceed 3 mA of current on any of those pins. A 0.01-μF bypass capacitor on the supply is recommended as shown in Figure 14. The SCL and SDA lines can be pulled up to a supply that is equal to or higher than V+ through the pullup resistors. To configure one of four different addresses on the bus, connect the ADD0 pin to either the GND, V+, SDA, or SCL pin. 8.2.2 Detailed Design Procedure Place the TMP102 device in close proximity to the heat source that must be monitored, with a proper layout for good thermal coupling. This placement ensures that temperature changes are captured within the shortest possible time interval. To maintain accuracy in applications that require air or surface temperature measurement, care must be taken to isolate the package and leads from ambient air temperature. A thermally-conductive adhesive is helpful in achieving accurate surface temperature measurement. Submit Documentation Feedback Copyright © 2007–2018, Texas Instruments Incorporated Product Folder Links: TMP102 21 TMP102 SBOS397H – AUGUST 2007 – REVISED DECEMBER 2018 www.ti.com Typical Application (continued) The TMP102 device is a very low-power device and generates very low noise on the supply bus. Applying an RC filter to the V+ pin of the TMP102 device can further reduce any noise that the TMP102 device might propagate to other components. R(F) in Figure 15 must be less than 5 kΩ and C(F) must be greater than 10 nF. Supply Voltage R(F) ≤ 5 kΩ Device SCL SDA GND V+ ALERT C(F) ≥ 10 nF ADD0 Figure 15. Noise Reduction Techniques 8.2.3 Application Curve Figure 16 shows the step response of the TMP102 device to a submersion in an oil bath of 100ºC from room temperature (27ºC). The time-constant, or the time for the output to reach 63% of the input step, is 0.8 s. The time-constant result depends on the printed circuit board (PCB) that the TMP102 device is mounted. For this test, the TMP102 device was soldered to a two-layer PCB that measured 0.375 inch × 0.437 inch. Temperature (qC) space 100 95 90 85 80 75 70 65 60 55 50 45 40 35 30 25 -1 1 3 5 7 9 11 Time (s) 13 15 17 19 Figure 16. Temperature Step Response 22 Submit Documentation Feedback Copyright © 2007–2018, Texas Instruments Incorporated Product Folder Links: TMP102 TMP102 www.ti.com SBOS397H – AUGUST 2007 – REVISED DECEMBER 2018 9 Power Supply Recommendations The TMP102 device operates with power supply in the range of 1.4 to 3.6 V. The device is optimized for operation at 3.3-V supply but can measure temperature accurately in the full supply range. A power-supply bypass capacitor is required for proper operation. Place this capacitor as close as possible to the supply and ground pins of the device. A typical value for this supply bypass capacitor is 0.01 μF. Applications with noisy or high-impedance power supplies may require additional decoupling capacitors to reject power-supply noise. 10 Layout 10.1 Layout Guidelines Place the power-supply bypass capacitor as close as possible to the supply and ground pins. The recommended value of this bypass capacitor is 0.01 μF. Additional decoupling capacitance can be added to compensate for noisy or high-impedance power supplies. Pull up the open-drain output pins (SDA , SCL and ALERT) through 5kΩ pullup resistors. 10.2 Layout Example Via to Power or Ground Plane Via to Internal Layer Pullup Resistors SCL SDA GND V+ Supply Voltage ALERT ADD0 Supply Bypass Capacitor Ground Plane for Thermal Coupling to Heat Source Serial Bus Traces Heat Source Figure 17. TMP102 Layout Example Submit Documentation Feedback Copyright © 2007–2018, Texas Instruments Incorporated Product Folder Links: TMP102 23 TMP102 SBOS397H – AUGUST 2007 – REVISED DECEMBER 2018 www.ti.com 11 Device and Documentation Support 11.1 Documentation Support 11.1.1 Related Documentation For related documentation see the following: • TMP175, TMP75 Data Sheet, SBOS288 • TMP275 Data Sheet, SBOS363 • Capacitive Touch Operated Automotive LED Dome Light with Haptics Feedback Design Guide 11.2 Receiving Notification of Documentation Updates To receive notification of documentation updates, navigate to the device product folder on ti.com. In the upper right corner, click on Alert me to register and receive a weekly digest of any product information that has changed. For change details, review the revision history included in any revised document. 11.3 Community Resources The following links connect to TI community resources. Linked contents are provided "AS IS" by the respective contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of Use. TI E2E™ Online Community TI's Engineer-to-Engineer (E2E) Community. Created to foster collaboration among engineers. At e2e.ti.com, you can ask questions, share knowledge, explore ideas and help solve problems with fellow engineers. Design Support TI's Design Support Quickly find helpful E2E forums along with design support tools and contact information for technical support. 11.4 Trademarks E2E is a trademark of Texas Instruments. SMBus is a trademark of Intel, Inc. All other trademarks are the property of their respective owners. 11.5 Electrostatic Discharge Caution These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates. 11.6 Glossary SLYZ022 — TI Glossary. This glossary lists and explains terms, acronyms, and definitions. 12 Mechanical, Packaging, and Orderable Information The following pages include mechanical, packaging, and orderable information. This information is the most current data available for the designated devices. This data is subject to change without notice and revision of this document. For browser-based versions of this data sheet, refer to the left-hand navigation. 24 Submit Documentation Feedback Copyright © 2007–2018, Texas Instruments Incorporated Product Folder Links: TMP102 PACKAGE OPTION ADDENDUM www.ti.com 6-Feb-2020 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Pins Package Drawing Qty Eco Plan Lead/Ball Finish MSL Peak Temp (2) (6) (3) Op Temp (°C) Device Marking (4/5) TMP102AIDRLR ACTIVE SOT-5X3 DRL 6 4000 Green (RoHS & no Sb/Br) NIPDAU | NIPDAUAG Level-1-260C-UNLIM -40 to 125 CBZ TMP102AIDRLRG4 ACTIVE SOT-5X3 DRL 6 4000 Green (RoHS & no Sb/Br) NIPDAU Level-1-260C-UNLIM -40 to 125 CBZ TMP102AIDRLT ACTIVE SOT-5X3 DRL 6 250 Green (RoHS & no Sb/Br) NIPDAU | NIPDAUAG Level-1-260C-UNLIM -40 to 125 CBZ TMP102AIDRLTG4 ACTIVE SOT-5X3 DRL 6 250 Green (RoHS & no Sb/Br) NIPDAU Level-1-260C-UNLIM -40 to 125 CBZ (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may reference these types of products as "Pb-Free". RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption. Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of
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TMP102AIDRLR
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