TMP821DR

Product Folder Sample & Buy Support & Community Tools & Software Technical Documents TMP821 SLDS152A – JANUARY 2008 – REVISED MAY 2015 TMP821 Two-Phase Half-Wave Motor Predriver 1 Features 3 Description • The TMP821 device is a two-phase half-wave motor predriver that is suited for fan motors, which has winding in push-pull configuration. It uses differential hall effect sensors for commutation signals for two of the switches in power circuit. The device has a very small pin count, making it very simple to use. 1 • • • Built-In Lock Detection and Rotational Speed Sensing Mechanisms Compact 8-Pin Package Reduces Number of External Components Required Automatic Restart When Motor Lock Is Undone Hall Amplifier Inputs Have Hysteresis Device Information(1) PART NUMBER 2 Applications TMP821 Small Server Fans PACKAGE SOIC (8) BODY SIZE (NOM) 4.90 mm × 3.91 mm (1) For all available packages, see the orderable addendum at the end of the data sheet. Block Diagram VCC 1 8 A2 Regulator Hall Amp H+ 2 + 7 A1 Logic – AL 3 H– 4 6 LD Lock Detect/ Auto Restart + – 5 GND + – 1 An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications, intellectual property matters and other important disclaimers. PRODUCTION DATA. TMP821 SLDS152A – JANUARY 2008 – REVISED MAY 2015 www.ti.com Table of Contents 1 2 3 4 5 6 7 Features .................................................................. Applications ........................................................... Description ............................................................. Revision History..................................................... Pin Configuration and Functions ......................... Specifications......................................................... 1 1 1 2 3 4 6.1 6.2 6.3 6.4 6.5 6.6 4 4 4 4 5 5 Absolute Maximum Ratings ...................................... ESD Ratings.............................................................. Recommended Operating Conditions....................... Thermal Information .................................................. Electrical Characteristics........................................... Typical Characteristics .............................................. Detailed Description .............................................. 6 7.1 Overview ................................................................... 6 7.2 Functional Block Diagram ......................................... 6 7.3 Feature Description................................................... 7 7.4 Device Functional Modes.......................................... 8 8 Application and Implementation .......................... 9 8.1 Application Information.............................................. 9 8.2 Typical Application .................................................... 9 9 Power Supply Recommendations...................... 11 10 Layout................................................................... 11 10.1 Layout Guidelines ................................................. 11 10.2 Layout Example .................................................... 11 10.3 Power Dissipation ................................................. 11 11 Device and Documentation Support ................. 13 11.1 11.2 11.3 11.4 Community Resource............................................ Trademarks ........................................................... Electrostatic Discharge Caution ............................ Glossary ................................................................ 13 13 13 13 12 Mechanical, Packaging, and Orderable Information ........................................................... 13 4 Revision History Changes from Original (January 2008) to Revision A • 2 Page Added ESD Ratings table, Feature Description section, Device Functional Modes, Application and Implementation section, Power Supply Recommendations section, Layout section, Device and Documentation Support section, and Mechanical, Packaging, and Orderable Information section ................................................................................................. 1 Submit Documentation Feedback Copyright © 2008–2015, Texas Instruments Incorporated Product Folder Links: TMP821 TMP821 www.ti.com SLDS152A – JANUARY 2008 – REVISED MAY 2015 5 Pin Configuration and Functions D Package 8-Pin SOIC Top View VCC 1 8 A2 H+ 2 7 A1 AL 3 6 LD H– 4 5 GND Pin Functions PIN NAME NO. I/O DESCRIPTION A1 7 O Driver output A2 8 O Driver output AL 3 O Speed indication GND 5 Power GND H+ 2 I Positive Hall input H– 4 I Negative Hall input LD 6 I Timing capacitor VCC 1 Power Supply Ground Power input (4 V to 28 V) Submit Documentation Feedback Copyright © 2008–2015, Texas Instruments Incorporated Product Folder Links: TMP821 3 TMP821 SLDS152A – JANUARY 2008 – REVISED MAY 2015 www.ti.com 6 Specifications 6.1 Absolute Maximum Ratings over operating free-air temperature range (unless otherwise noted) (1) MAX UNIT VCC Supply voltage MIN 30 V VAL Output voltage (AL) 30 V IOUT Continuous output current (A1, A2) 70 mA IAL Continuous output current (AL) 8 mA TJ Operating junction temperature –40 125 °C Tstg Storage temperature –55 150 °C (1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. 6.2 ESD Ratings VALUE V(ESD) (1) (2) Electrostatic discharge Human body model (HBM), per ANSI/ESDA/JEDEC JS-001, all pins (1) ±2000 Charged device model (CDM), per JEDEC specification JESD22-C101, all pins (2) ±1500 UNIT V JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process. JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process. 6.3 Recommended Operating Conditions over operating free-air temperature range (unless otherwise noted) MIN MAX VCC Supply voltage 4 28 UNIT VH Hall amplifier input voltage 1 VCC – 0.5 V TA Operating free-air temperature –40 100 °C V 6.4 Thermal Information TMP821 THERMAL METRIC (1) D (SOIC) UNIT 8 PINS RθJA Junction-to-ambient thermal resistance RθJC(top) RθJB (2) 97 °C/W Junction-to-case (top) thermal resistance 117.8 °C/W Junction-to-board thermal resistance 71.5 °C/W ψJT Junction-to-top characterization parameter 58.3 °C/W ψJB Junction-to-board characterization parameter 23.6 °C/W RθJC(bot) Junction-to-case (bottom) thermal resistance 57.8 °C/W (1) (2) 4 For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report, SPRA953. Package thermal impedance is calculated in accordance with JESD 51-7. Submit Documentation Feedback Copyright © 2008–2015, Texas Instruments Incorporated Product Folder Links: TMP821 TMP821 www.ti.com SLDS152A – JANUARY 2008 – REVISED MAY 2015 6.5 Electrical Characteristics VCC = 12 V, TA = 25°C (unless otherwise noted) PARAMETER TEST CONDITIONS MIN TYP ±3 MAX UNIT ±15 mV VHYS Hall amplifier input voltage hysteresis VAL Lock alarm signal low-level output voltage AL IAL = 5 mA IAL Lock alarm signal low-level output current AL VAL = 2 V 8 ILDC Lock Detection capacitor charge current LD VLD = 1.5 V 2 3.45 5.25 μA ILDD Lock Detection capacitor discharge current LD VLD = 1.5 V 0.35 0.8 1.45 μA rCD Lock Detection capacitor charge and discharge current ratio LD rCD = ILDC/ILDD 3 4.5 8 VLDCL Lock Detection capacitor clamp voltage LD 2.2 2.6 3 V VLDCP Lock Detection capacitor comparator voltage LD 0.4 0.6 0.8 V V7H High-level output voltage A1 IOH = –10 mA 10 10.5 V V8H High-level output voltage A2 IOH = –10 mA 10 10.5 V ICC Supply current 0.5 Output off V mA 3.2 5 mA 20 12 15 11.5 A1/A2 Output Voltage – V IAL – Current – mA 6.6 Typical Characteristics 10 5 0 0 2 4 6 8 10 12 14 16 VAL – Supply Voltage – V 18 20 Figure 1. AL Current Consumption vs AL Supply Voltage (VCC = 12 V) 11 10.5 10 0 20 40 60 A1/A2 Output Current – mA 80 Figure 2. A1/A2 Output Voltage vs A1/A2 Output Current Submit Documentation Feedback Copyright © 2008–2015, Texas Instruments Incorporated Product Folder Links: TMP821 5 TMP821 SLDS152A – JANUARY 2008 – REVISED MAY 2015 www.ti.com 7 Detailed Description 7.1 Overview The TMP821 device is a two phase half wave motor predriver suited for small fan applications. The two switches are controlled from the logic generated from differential hall sensors connected to the device. The drive logic operates in push-pull configuration. The TMP821 device is a very small package with minimum external components required, making the design very simple and easy. Speed information is available on a pin. The lock detect feature is also part of the features provided by the device whose timing is configured by connecting an external capacitor. 7.2 Functional Block Diagram VCC 1 8 A2 Regulator Hall Amp H+ 2 + 7 A1 Logic – AL 3 H– 4 6 LD Lock Detect/ Auto Restart + – 5 GND + – 6 Submit Documentation Feedback Copyright © 2008–2015, Texas Instruments Incorporated Product Folder Links: TMP821 TMP821 www.ti.com SLDS152A – JANUARY 2008 – REVISED MAY 2015 7.3 Feature Description 7.3.1 Lock Detection The TMP821 device comes with the built-in lock detect feature. If it's not able to rotate the rotor for a specific amount of time, the Lock Detection disables the drive and retries after some time. The timings are dependant on the capacitor connected at LD Pin. When a motor lock is detected, the TMP821 device automatically shuts down its output current. When the motor lock is removed, the TMP821 device automatically restarts. Motor lock is detected when the Hall signal stops switching, as shown in Figure 3. Motor Motor lock locked detected Motor lock cleared Return to normal operation Hall Input On Motor Output Off Clamp voltage LD Comparator voltage tON tOFF AL Figure 3. Motor Lock Diagram tON and tOFF are determined by the capacitor connected to LD: tON = (CLD × (VLD_CLAMP – VLD_COMP) / ILD_CHARGE (seconds) tOFF = (CLD × (VLD_CLAMP – VLD_COMP) / ILD_DISCHARGE (seconds) (1) where • • • • • CLD = capacitance of the external capacitor on LD VLD_CLAMP = LD clamp voltage VLD_COMP = LD comparator voltage ILD_CHARGE = LD charge current ILD_DISCHARGE = LD discharge current (2) Power AL A few hundred milliseconds Figure 4. Power-on to AL Delay 7.3.2 Speed Sensing The TMP821 device gives the speed information on the pin AL. This pin may remain high for few hundred milliseconds at the start-up. Once the motor attains some speed, the frequency can be observed at this pin. Submit Documentation Feedback Copyright © 2008–2015, Texas Instruments Incorporated Product Folder Links: TMP821 7 TMP821 SLDS152A – JANUARY 2008 – REVISED MAY 2015 www.ti.com Feature Description (continued) NOTE After power is supplied to the device, the Lock Detection pin (AL) may remain high for a few hundred milliseconds (see Figure 4). 7.4 Device Functional Modes 7.4.1 Lock Detection Pin When rotor is locked, the drive is enabled until the voltage at LD pin reaches a higher threshold. Once the voltage reaches a higher threshold, the drive is disabled until the LD capacitor discharges to a lower threshold. 7.4.2 Run If the motor is unlocked and hall sensor inputs and drive signals are connected properly, the motor starts spinning. 8 Submit Documentation Feedback Copyright © 2008–2015, Texas Instruments Incorporated Product Folder Links: TMP821 TMP821 www.ti.com SLDS152A – JANUARY 2008 – REVISED MAY 2015 8 Application and Implementation NOTE Information in the following applications sections is not part of the TI component specification, and TI does not warrant its accuracy or completeness. TI’s customers are responsible for determining suitability of components for their purposes. Customers should validate and test their design implementation to confirm system functionality. 8.1 Application Information The TMP821 device needs very few external components for the features described in Feature Description. The device needs a 1-µF or more capacitor connected at VCC. The Lock Detection capacitor decides the hiccup time. 8.2 Typical Application VCC 8 7 6 5 A2 A1 LD GND VCC H+ AL H– 1 2 3 4 Hall Figure 5. Typical Application Circuit 8.2.1 Design Requirements For this design example, use the following parameters: • Test setup input voltage: 12-V DC source • VCC capacitor: 1 µF or more • H Bridge top side: P-channel FETs • H Bridge bottom side: N-channel FETs Submit Documentation Feedback Copyright © 2008–2015, Texas Instruments Incorporated Product Folder Links: TMP821 9 TMP821 SLDS152A – JANUARY 2008 – REVISED MAY 2015 www.ti.com Typical Application (continued) 8.2.2 Detailed Design Procedure Pins: • Connect hall sensor differential inputs to IN+ and IN–. • Connect LD to Lock Detection capacitor. • Connect drive outputs to the gates of the H bridge switches. • Pull up on FG. Power Supply: • Make sure the power supply is set with sufficient current limit at the decided motor voltage (12 V and 1 A are shown in Application Curves). Build the circuit with recommended connections at the pins. Test the motor circuit with hardware connected to it. 8.2.3 Application Curves Figure 6. Start-up at 12 V (Soft Start) Figure 7. Motor Outputs and DC Current Figure 8. Lock Detection and Retries 10 Submit Documentation Feedback Copyright © 2008–2015, Texas Instruments Incorporated Product Folder Links: TMP821 TMP821 www.ti.com SLDS152A – JANUARY 2008 – REVISED MAY 2015 9 Power Supply Recommendations Connect a bulk capacitor of 1 µF or greater to VDD and GND. The maximum voltage applied must be less than 30 V. 10 Layout 10.1 Layout Guidelines A bulk capacitor at the VDD and GND LD capacitor can be connected near the device as shown in Figure 9. 10.2 Layout Example >1uF A2 VDD A1 H+ TMP821 AL LD H- GND Figure 9. Recommended Layout Example 10.3 Power Dissipation Figure 10 shows allowable power dissipation versus ambient temperature. PD – Power Dissipation – W 1 0.8 0.6 0.4 0.2 0 0 75 25 50 TA – Temperature – °C 100 Figure 10. Power Dissipation Use Equation 3 to calculate total power consumption. Ptotal = PC1 + PC2 + PC3 where • • • • • • PC1 = circuit power dissipation PC1 = VCC × ICC PC2 = output power dissipation PC2 = (VCC – VOH) × IO VOH = A1 and A2 high-level voltage PC2 can be reduced by increasing the external output transistor's hFE rank to reduce the IO consumption. Submit Documentation Feedback Copyright © 2008–2015, Texas Instruments Incorporated Product Folder Links: TMP821 11 TMP821 SLDS152A – JANUARY 2008 – REVISED MAY 2015 www.ti.com Power Dissipation (continued) • • 12 PC3 = AL power dissipation PC3 = VAL_LOW × IAL (3) Submit Documentation Feedback Copyright © 2008–2015, Texas Instruments Incorporated Product Folder Links: TMP821 TMP821 www.ti.com SLDS152A – JANUARY 2008 – REVISED MAY 2015 11 Device and Documentation Support 11.1 Community Resource The following links connect to TI community resources. Linked contents are provided "AS IS" by the respective contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of Use. TI E2E™ Online Community TI's Engineer-to-Engineer (E2E) Community. Created to foster collaboration among engineers. At e2e.ti.com, you can ask questions, share knowledge, explore ideas and help solve problems with fellow engineers. Design Support TI's Design Support Quickly find helpful E2E forums along with design support tools and contact information for technical support. 11.2 Trademarks E2E is a trademark of Texas Instruments. All other trademarks are the property of their respective owners. 11.3 Electrostatic Discharge Caution These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates. 11.4 Glossary SLYZ022 — TI Glossary. This glossary lists and explains terms, acronyms, and definitions. 12 Mechanical, Packaging, and Orderable Information The following pages include mechanical, packaging, and orderable information. This information is the most current data available for the designated devices. This data is subject to change without notice and revision of this document. For browser-based versions of this data sheet, refer to the left-hand navigation. Submit Documentation Feedback Copyright © 2008–2015, Texas Instruments Incorporated Product Folder Links: TMP821 13 PACKAGE OPTION ADDENDUM www.ti.com 10-Dec-2020 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Pins Package Drawing Qty Eco Plan (2) Lead finish/ Ball material MSL Peak Temp Op Temp (°C) Device Marking (3) (4/5) (6) TMP821DR ACTIVE SOIC D 8 2500 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 100 TMP821 (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may reference these types of products as "Pb-Free". RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption. Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of