TPA6041A4RHBR

TPA6041A4 www.ti.com SLOS542 – AUGUST 2007 2-W STEREO AUDIO POWER AMPLIFIER WITH DirectPath™ STEREO HEADPHONE DRIVE AND REGULATOR FEATURES 1 • • 23 • • • • • • DESCRIPTION Microsoft™ Windows Vista™ Compliant Fully Differential Architecture and High PSRR Provide Excellent RF Rectification Immunity 2.1-W, 1% THD+N Into 4-Ω Speakers and 85-mW, 1% THD+N Into 16-Ω Headphones From 5-V Supply DirectPath™ Headphone Amplifier Eliminates Output Capacitors (1) Internal 4-Step Speaker Gain Control: 10, 12, 15.6, 21.6 dB and Fixed –1.5-V/V Headphone 3.3-V Low Dropout Regulator for CODEC Independent Shutdown Controls for Speaker, Headphone Amplifier, and Low Dropout Regulator (LDO) Output Short-Circuit and Thermal Protection The TPA6041A4 is a stereo audio power amplifier and DirectPath™ headphone amplifier in a thermally enhanced, space-saving, 32-pin QFN package. The speaker amplifier is capable of driving 2.1 W per channel continuously into 4-Ω loads at 5 V. The headphone amplifier achieves a minimum of 85 mW at 1% THD+N from a 5-V supply. A built-in internal 4-step gain control for the speaker amplifier and a fixed –1.5 V/V gain for the headphone amplifier minimizes external components needed. Independent shutdown control and dedicated inputs for the speaker and headphone allow the TPA6041A4 to simultaneously drive both headphones and internal speakers. Differential inputs to the speaker amplifiers offer superior power-supply and common-mode noise rejection. APPLICATIONS • • Notebook Computers Portable DVD (1) US Patent Number 5289137 SIMPLIFIED APPLICATION CIRCUIT TPA6041A4 CODEC SPKR SPKR_RIN+ HPR SPKR_RIN– HPL SPKL VDD ROUT+ ROUT– LOUT+ LOUT– SPKR_LIN+ SPKR_LIN– SPVDD BYPASS SPGND GAIN0 Shutdown Control HP_EN SPKR_EN HP_INR SGND HP_INL 3 V – 5.5 V GAIN1 HPVDD CPVDD Gain Control OUTL OUTR HPVSS CPVSS CPGND VDD 4.5 V – 5.5 V Regulator Enable 4.5 V – 5.5 V C1P C1N REG_EN REG_OUT 3.3 V (To CODEC) 1 2 3 Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. DirectPath, PowerPAD are trademarks of Texas Instruments. Microsoft, Windows Vista are trademarks of Microsoft Corporation. PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. Copyright © 2007, Texas Instruments Incorporated TPA6041A4 www.ti.com SLOS542 – AUGUST 2007 These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates. Functional Block Diagram REG_EN BYPASS (3.3-V Output) REG_OUT SPKR_EN Bias Control 0.47 mF LDO HP_EN 1 mF VDD SPVDD 1 mF SPKR_RIN+ 1 mF + ROUT+ – + SPKR_RIN– ROUT– – 1 mF GAIN0 SPGND Gain Control GAIN1 SPVDD SPKR_LIN+ 1 mF SPKR_LIN– 1 mF 4.5 V – 5.5 V + – – + LOUT+ LOUT– SPVDD SPGND 1 mF HPVDD HP_INL – HP_OUTL 1 mF + HPVSS + HP_INR HP_OUTR – 3 V – 5.5 V 1 mF HPVDD HPVDD CPVDD 1 mF Charge Pump CPGND C1P C1N CPVSS GND HPVSS SPGND 1 mF 1 mF 2 Submit Documentation Feedback Copyright © 2007, Texas Instruments Incorporated Product Folder Link(s): TPA6041A4 TPA6041A4 www.ti.com SLOS542 – AUGUST 2007 AVAILABLE PACKAGE OPTIONS (1) TA PACKAGED DEVICE (1) (2) 32-Pin QFN (RHB) SYMBOL –40°C to 85°C TPA6041A4RHB RHB The RHB package is available taped and reeled. To order a taped and reeled part, add the suffix R to the part number (e.g., TPA6041A4RHBR). For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI website at www.ti.com. (2) GAIN1 GAIN0 VDD REG_OUT SGND HP_INL HP_INR REG_EN TPA6041A4RHB (TOP VIEW) 32 31 30 29 28 27 26 25 24 SPKR_RIN– 1 SPKR_RIN+ 2 23 SPKR_EN SPKR_LIN+ 3 22 HP_EN SPKR_LIN– 4 21 SPGND SPGND 5 20 ROUT+ LOUT+ 6 19 ROUT– LOUT– 7 18 SPVDD SPVDD 8 HPVDD 10 11 12 13 14 15 17 16 C1P CPGND CPVSS HPVSS HP_OUTR HP_OUTL C1N 9 CPVDD Thermal Pad BYPASS TERMINAL FUNCTIONS TERMINAL NAME NO. I/O/P DESCRIPTION SPKR_RIN– 1 I Right-channel negative differential audio input for speaker amplifier SPKR_RIN+ 2 I Right-channel positive differential audio input for speaker amplifier SPKR_LIN+ 3 I Left-channel positive differential audio input for speaker amplifier SPKR_LIN– 4 I Left-channel negative differential audio input for speaker amplifier SPGND 5, 21 P Speaker power ground LOUT+ 6 O Left-channel positive audio output LOUT– 7 O Left-channel negative audio output SPVDD 8, 18 P Supply voltage terminal for speaker amplifier CPVDD 9 P Charge pump positive supply, connect to HPVDD via star connection C1P 10 I/O CPGND 11 P C1N 12 I/O CPVSS 13 P Charge pump output (negative supply for headphone amplifier), connect to HPVSS HPVSS 14 P Headphone amplifier negative supply, connect to CPVSS HP_OUTR 15 O Right-channel capacitor-free headphone output HP_OUTL 16 O Left-channel capacitor-free headphone output HPVDD 17 P Headphone amplifier supply voltage, connect to CPVDD ROUT– 19 O Right-channel negative audio output Charge pump flying capacitor positive terminal Charge pump ground Charge pump flying capacitor negative terminal Submit Documentation Feedback Copyright © 2007, Texas Instruments Incorporated Product Folder Link(s): TPA6041A4 3 TPA6041A4 www.ti.com SLOS542 – AUGUST 2007 TERMINAL FUNCTIONS (continued) TERMINAL I/O/P DESCRIPTION NAME NO. ROUT+ 20 O Right-channel positive audio output HP_EN 22 I Headphone channel enable logic input; active high enable. HIGH=ENABLE. SPKR_EN 23 I Speaker channel enable logic input; active low enable. LOW=ENABLE. BYPASS 24 P Common-mode bias voltage for speaker preamplifiers REG_EN 25 I Enable pin (Active HIGH) for turning on/off LDO. HIGH=ENABLE HP_INR 26 I Headphone right-channel audio input HP_INL 27 I Headphone left-channel audio input SGND 28 P Signal ground, connect to CPGND and SPGND REG_OUT 29 O Regulated 3.3-V output VDD 30 P Positive power supply GAIN0 31 I Bit 0, MSB, of gain select bits GAIN1 32 I Bit 1, LSB, of gain select bits Die Pad P Solder the thermal pad on the bottom of the QFN package to the GND plane of the PCB. It is required for mechanical stability and will enhance thermal performance. Thermal Pad ABSOLUTE MAXIMUM RATINGS over operating free-air temperature range (unless otherwise noted) (1) Supply voltage VI HPVDD, VDD, SPVDD, CPVDD Input voltage VALUE UNIT –0.3 to 6 V SPKR_LIN+, SPKR_LIN-, SPKR_RIN+, SPKR_RIN-, HP_EN,GAIN0, GAIN1, SPK_EN, REG_EN –0.3 to 6.3 HP_INL, HP_INR HP Enabled –3.5 to 3.5 HP_INL, HP_INR HP not Enabled –0.3 to 3.5 Continuous total power dissipation V See Dissipation Rating Table TA Operating free-air temperature range –40 to 85 °C TJ Operating junction temperature range –40 to 150 °C Tstg Storage temperature range –65 to 150 °C 8 kV (1) Electrostatic discharge HBM for HP_OUTL and HP_OUTR Electrostatic discharge, all other pins CDM 500 V HBM 2 kV Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings only, and functional operations of the device at these or any other conditions beyond those indicated under recommended operating conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. DISSIPATION RATINGS (1) PACKAGE (1) TA ≤ 25°C DERATING FACTOR TA = 70°C TA = 85°C RHB 5.06 W 40 mW/°C 4.04 W 3.23 W The PowerPAD™ must be soldered to a thermal land on the printed-circuit board. Refer to the Texas Instruments document, PowerPAD™ Thermally Enhanced Package application report (literature number SLMA002) for more information regarding the PowerPAD™ package. RECOMMENDED OPERATING CONDITIONS VIH 4 MIN MAX UNIT Supply voltage VDD, SPVDD 4.5 5.5 V Supply voltage HPVDD, CPVDD 3 5.5 V High-level input voltage SPKR_EN, HP_EN, GAIN0, GAIN1, REG_EN 2 Submit Documentation Feedback V Copyright © 2007, Texas Instruments Incorporated Product Folder Link(s): TPA6041A4 TPA6041A4 www.ti.com SLOS542 – AUGUST 2007 RECOMMENDED OPERATING CONDITIONS (continued) MIN VIL Low-level input voltage TA Operating free-air temperature SPKR_EN, HP_EN, GAIN0, GAIN1, REG_EN MAX UNIT 0.8 V –40 85 °C GENERAL DC ELECTRICAL CHARACTERISTICS TA = 25°C, VDD = SPVDD = HPVDD = CPVDD = 5 V (unless otherwise noted) PARAMETER TEST CONDITIONS MIN TYP MAX UNIT 0.02 1 μA 0.02 1 μA IIH High-level input current SPKR_EN, HP_EN, GAIN0, GAIN1, REG_EN = VDD IIL Low-level input current SPKR_EN, HP_EN, GAIN0, GAIN1, REG_EN = 0 V IDD(Speaker) Supply current, speaker amplifier ONLY enabled SPKR_EN = 0 V, HP_EN = REG_EN = 0 V 5 12 mA IDD(HP) Supply current, headphone amplifier ONLY enabled SPKR_EN = HP_EN = 2 V, REG_EN = 0 V 7.5 14 mA IDD(REG) Supply current, regulator ONLY enabled SPKR_EN = REG_EN = 2 V, HP_EN = 0 V 0.65 1 mA IDD(SD) Supply current, shutdown mode SPKR_EN = 2 V, HP_EN = REG_EN = 0 V 2.5 5 μA TYP MAX 0.5 10 SPEAKER AMPLIFIER DC CHARACTERISTICS TA = 25°C, VDD = SPVDD = 5 V, RL = 4 Ω, Gain = 10 dB (unless otherwise noted) PARAMETER TEST CONDITIONS MIN | VOO | Output offset voltage (measured differentially) Inputs AC-coupled to GND, Gain = 10 dB PSRR Power supply rejection ratio VDD = SPVDD = 4.5 V to 5.5 V -60 –74 UNIT mV dB SPEAKER AMPLIFIER AC CHARACTERISTICS TA = 25°C, VDD = SPVDD = 5 V, RL = 4 Ω, Gain = 10 dB (unless otherwise noted) PARAMETER PO THD+N Output power Total harmonic distortion plus noise TEST CONDITIONS TYP 1.3 THD+N = 10%, f = 1 kHz, RL = 8 Ω 1.6 THD+N = 1%, f = 1 kHz, RL = 4 Ω 2.1 THD+N = 10%, f = 1 kHz, RL = 4 Ω 2.6 PO = 1 W, RL = 8 Ω, f = 20 Hz to 20 kHz 0.06% PO = 1 W, RL = 4 Ω, f = 20 Hz to 20 kHz 0.1% kSVR Supply ripple rejection ratio f = 1 kHz, CBYPASS = 0.47 μF, RL = 8 Ω VRIPPLE = 200 mVPP SNR Signal-to-noise rejection ratio Maximum output at THD+N